CN105578712A - 发光模组及其电路板 - Google Patents
发光模组及其电路板 Download PDFInfo
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 108
- 239000002184 metal Substances 0.000 claims abstract description 108
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 238000003466 welding Methods 0.000 claims description 15
- 230000004888 barrier function Effects 0.000 claims description 14
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- 239000003963 antioxidant agent Substances 0.000 claims description 8
- 230000003078 antioxidant effect Effects 0.000 claims description 8
- 235000006708 antioxidants Nutrition 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 7
- 238000004020 luminiscence type Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 239000006071 cream Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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Abstract
驱动覆晶发光晶片之电路板包含一金属基板具有一第一及一第二表面,该第一表面包含一第一电极区、一第二电极区以及一导热区;一第一金属电极形成于该第一电极区上,用以提供一第一电压;一第一绝缘层形成于该第一金属电极及该金属基板之间;一第二金属电极形成于该第二电极区上,用以提供一第二电压;一第二绝缘层形成于该第二金属电极及该金属基板之间;以及一防焊层覆盖于该第一表面上;其中该导热区是外露于该防焊层。
Description
技术领域
本发明涉及一种驱动覆晶发光晶片之电路板及发光模组,尤指一种可以提高散热效率之驱动覆晶发光晶片之电路板及发光模组。
背景技术
由于发光二极体(lightemittingdevice,LED)具有寿命长、体积小及耗电量低等优点,发光二极体已被广泛地应用于各种照明装置中。一般而言,当发光二极体的温度升高时,发光二极体的发光效率会显著下降,并缩短发光二极体的使用寿命。随着发光二极体逐渐被应用于各种照明用途中,发光二极体的散热问题更加重要。
在现有技术中,承载发光二极体的基板是由氧化铝(Al2O3)或其他具绝缘及高导热特性的材料所形成,以对发光二极体进行散热。然而氧化铝材料的导热系数仍较金属材料的导热系数低,因此现有技术并无法进一步提高发光二极体照明装置的散热效率。
发明内容
本发明之目的在于提供一种可以提高散热效率之驱动覆晶发光晶片之电路板及发光模组,以解决现有技术的问题。
本发明驱动覆晶发光晶片之电路板包含一金属基板,具有一第一表面,以及一第二表面相对于该第一表面,该第一表面包含一第一电极区、一第二电极区以及一导热区;一第一金属电极,形成于该第一电极区上,用以提供一第一电压;一第一绝缘层,形成于该第一金属电极及该金属基板之间;一第二金属电极,形成于该第二电极区上,用以提供一第二电压;一第二绝缘层,形成于该第二金属电极及该金属基板之间;以及一防焊层,覆盖于该金属基板的第一表面上;其中该导热区是外露于该防焊层。
本发明发光模组包含一覆晶发光晶片,以及一电路板。该覆晶发光晶片包含一第一电极及一第二电极。该电路板包含一金属基板,具有一第一表面,以及一第二表面相对于该第一表面,该第一表面包含一第一电极区、一第二电极区以及一导热区;一第一金属电极,形成于该第一电极区上,用以提供一第一电压至该覆晶发光晶片之该第一电极;一第一绝缘层,形成于该第一金属电极及该金属基板之间;一第二金属电极,形成于该第二电极区上,用以提供一第二电压至该覆晶发光晶片之该第二电极;一第二绝缘层,形成于该第二金属电极及该金属基板之间;以及一防焊层,覆盖于该金属基板的第一表面上;其中该导热区是外露于该防焊层,且该导热区是连接至该覆晶发光晶片。
相较于现有技术,本发明是利用金属基板作为之覆晶发光晶片之电路基板,且金属基板具有一外露之导热区用以间接或直接连接至覆晶发光晶片,以快速地将覆晶发光晶片于发光时产生之热量经由导热区导引至金属基板,再藉由金属基板将热量散去。因此本发明覆晶发光晶片之电路板及发光模组具有较佳的散热效率。
附图说明
图1是本发明覆晶发光晶片之电路板的示意图。
图2是图1覆晶发光晶片之电路板的剖面图。
图3是本发明发光模组的第一实施例的示意图。
图4是本发明发光模组的第二实施例的示意图。
具体实施方式
请同时参考图1及图2。图1是本发明覆晶发光晶片之电路板的示意图。图2是图1覆晶发光晶片之电路板的剖面图。如图所示,本发明覆晶发光晶片之电路板100包含一金属基板110,一第一金属电极120,一第一绝缘层130,一第二金属电极140,一第二绝缘层150以及一防焊层160。金属基板110具有一第一表面170,以及一第二表面180相对于该第一表面170。第一表面170包含一第一电极区172、一第二电极区174以及一导热区176。第一电极区172及第二电极区174可以是在第一表面170上进行蚀刻所形成之凹陷区域,但本发明不以此为限。第一金属电极120是形成于第一电极区172上。第一绝缘层130是形成于第一金属电极120及金属基板110之间,以避免第一金属电极120和金属基板110导通。第二金属电极140是形成于第二电极区174上。第二绝缘层150是形成于第二金属电极140及金属基板110之间,以避免第二金属电极140和金属基板110导通。由于第一绝缘层130及第二绝缘层150之配置,导热区176是不电连接于第一金属电极120及第二金属电极140。防焊层160是覆盖于金属基板110的第一表面170上。防焊层360可以避免焊锡四处流动,且具有绝缘功能。导热区176是外露于防焊层160。
另外,本发明电路板100可另包含一第一电源电极192以及一第二电源电极194。第一电源电极192可电连接于第一金属电极120,用以接收一第一电压V1(例如一正电压),而第二电源电极194可电连接于第二金属电极140,用以接收相异于第一电压V1之一第二电压V2(例如一接地电压),如此第一金属电极120及第二金属电极140可分别提供第一电压V1及第二电压V2至一覆晶发光晶片,以驱动覆晶发光晶片发光。再者,本发明电路板100可另包含一第一抗氧化金属层122形成于第一金属电极120上,以及一第二抗氧化金属层142形成于第二金属电极140上。第一抗氧化金属层122和第二抗氧化金属层142可以是由金或银等材料所形成,以避免第一金属电极120和第二金属电极140氧化。
另一方面,本发明电路板可包含复数个第一金属电极120、第二金属电极140及导热区176,且复数个第一金属电极120、第二金属电极140及导热区176可以环状或矩阵型式均匀地分散于电路板上,如此当本发明电路板提供电源至复数个覆晶发光晶片以驱动复数个覆晶发光晶片发光时,本发明电路板可以快速且均匀地对复数个覆晶发光晶片进行散热。再者,当本发明电路板包含复数个第一金属电极120、第二金属电极140及导热区176时,第一金属电极120、第二金属电极140、第一电源电极192以及第二电源电极194之间的电连接方式(例如串联或并联)可以视设计需求而改变。
请参考图3。图3是本发明发光模组的第一实施例的示意图。如图3所示,本发明可以将一覆晶发光晶片200设置于电路板100上,以形成一发光模组10。图3的电路板100是相同于图2的电路板100,因此不再加以说明。覆晶发光晶片200包含一第一电极210及一第二电极220。电路板100之第一金属电极120可以经由锡膏202电连接至覆晶发光晶200片的第一电极210,以提供第一电压V1至覆晶发光晶片200之第一电极210。电路板100之第二金属电极140亦可以经由锡膏202电连接至覆晶发光晶片200的第二电极220,以提供第二电压V2至覆晶发光晶片200之第二电极220。另外,导热区176可以经由一散热材料204(例如锡膏或散热膏)连接至覆晶发光晶片200。在本发明其他实施例中,导热区176亦可以直接连接至覆晶发光晶片200。
依据上述配置,覆晶发光晶片200于发光时产生之热量可以快速地被导热区176导引至金属基板110,再藉由金属基板110将热量散去。在本发明一实施例中,金属基板110可以是一铜基板。由于铜材料的导热系数是高于氧化铝材料的导热系数,因此,本发明电路板100可以提高散热效率。再者,覆晶发光晶片200可另包含一金属散热片230,金属散热片230是不电连接于第一电极210及第二电极220,且导热区176是经由散热材料204连接(或直接连接)至覆晶发光晶片200之金属散热片230,如此可以进一步提高散热效率。
另一方面,防焊层160可以是由一反光材料所形成,用以反射覆晶发光晶片200所发出的光线,如此可以提高发光模组10的发光效率。在本发明一实施例中,覆晶发光晶片200是一覆晶发光二极体晶片,但本发明不以此为限。
请参考图4。图4是本发明发光模组的第二实施例的示意图。如图4所示,本发明发光模组20包含复数个覆晶发光晶片200以串联之方式设置于一电路板300上,进而形成一灯条。图4中的第一金属电极120、第二金属电极140及导热区176的配置可以参考图2。图4中的覆晶发光晶片200可以是相同于图3中的覆晶发光晶片200,但本发明不以此为限。值得注意的是,在图4的发光模组20中,只有头尾两个金属电极会分别用以耦接至一正电压源以及一接地电压源,且中间的金属电极是共用,以驱动覆晶发光晶片200发光。另外,导热区176可以经由散热材料连接至覆晶发光晶片200,或者,导热区176亦可以直接连接至覆晶发光晶片200。
依据上述配置,每一覆晶发光晶片200于发光时产生之热量亦可以快速地被相对应之导热区176导引至金属基板110,再藉由金属基板110将热量散去,如此可以提高散热效率。
相较于现有技术,本发明是利用金属基板作为之覆晶发光晶片之电路基板,且金属基板具有一外露之导热区用以间接或直接连接至覆晶发光晶片,以快速地将覆晶发光晶片于发光时产生之热量经由导热区导引至金属基板,再藉由金属基板将热量散去。因此本发明覆晶发光晶片之电路板及发光模组具有较佳的散热效率。
以上所述仅为本发明之较佳实施例,凡依本发明申请专利范围所做之均等变化与修饰,皆应属本发明之涵盖范围。
Claims (9)
1.一种电路板,用以驱动一覆晶发光晶片,其特征在于,该电路板包含:
一金属基板,具有一第一表面,以及一第二表面相对于该第一表面,该第一表面包含一第一电极区、一第二电极区以及一导热区;
一第一金属电极,形成于该第一电极区上,用以提供一第一电压;
一第一绝缘层,形成于该第一金属电极及该金属基板之间;
一第二金属电极,形成于该第二电极区上,用以提供一第二电压;
一第二绝缘层,形成于该第二金属电极及该金属基板之间;以及
一防焊层,覆盖于该金属基板的第一表面上;
其中该导热区是外露于该防焊层。
2.如权利要求1所述之电路板,其特征在于,该防焊层是由一反光材料所形成。
3.如权利要求1所述之电路板,其特征在于,还包含:
一第一抗氧化金属层,形成于该第一金属电极上;以及
一第二抗氧化金属层,形成于该第二金属电极上。
4.如权利要求1所述之电路板,其特征在于,该第一电极区及该第二电极区是于该第一表面上蚀刻所形成。
5.一种发光模组,其特征在于,包含:
一覆晶发光晶片,包含一第一电极及一第二电极;以及
一电路板,包含:
一金属基板,具有一第一表面,以及一第二表面相对于该第一表面,该第一表面包含一第一电极区、一第二电极区以及一导热区;
一第一金属电极,形成于该第一电极区上,用以提供一第一电压至该覆晶发光晶片之该第一电极;
一第一绝缘层,形成于该第一金属电极及该金属基板之间;
一第二金属电极,形成于该第二电极区上,用以提供一第二电压至该覆晶发光晶片之该第二电极;
一第二绝缘层,形成于该第二金属电极及该金属基板之间;以及
一防焊层,覆盖于该金属基板的第一表面上;
其中该导热区是外露于该防焊层,且该导热区是连接至该覆晶发光晶片。
6.如权利要求5所述之发光模组,其特征在于,该防焊层是由一反光材料所形成。
7.如权利要求5所述之发光模组,其特征在于,还包含:
一第一抗氧化金属层,形成于该第一金属电极上;以及
一第二抗氧化金属层,形成于该第二金属电极上。
8.如权利要求5所述之发光模组,其特征在于,该第一电极区及该第二电极区是于该第一表面上蚀刻所形成。
9.如权利要求5所述之发光模组,其特征在于,该覆晶发光晶片另包含一金属散热片,不电连接于该第一电极及该第二电极,该导热区是连接至该覆晶发光晶片之该金属散热片。
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TW103137687A TW201616699A (zh) | 2014-10-30 | 2014-10-30 | 驅動覆晶發光晶片之電路板及包含其之發光模組 |
TW103137687 | 2014-10-30 |
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TWI648871B (zh) * | 2017-09-22 | 2019-01-21 | 台灣愛司帝科技股份有限公司 | 發光模組的製作方法 |
TWI722857B (zh) * | 2020-04-06 | 2021-03-21 | 恆顥科技股份有限公司 | 發光裝置 |
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