CN102881686A - Light-emitting diode (LED) light source module - Google Patents
Light-emitting diode (LED) light source module Download PDFInfo
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- CN102881686A CN102881686A CN201210388144XA CN201210388144A CN102881686A CN 102881686 A CN102881686 A CN 102881686A CN 201210388144X A CN201210388144X A CN 201210388144XA CN 201210388144 A CN201210388144 A CN 201210388144A CN 102881686 A CN102881686 A CN 102881686A
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- mounting groove
- led mounting
- led
- source module
- light source
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Abstract
The invention discloses a light-emitting diode (LED) light source module. The LED light source module comprises a substrate and a plurality of LEDs, wherein a plurality of LED mounting grooves are formed on the substrate; a circuit layer is arranged among the LED mounting grooves on the upper end surface of the substrate; the LEDs are arranged on the bottom surfaces of the LED mounting grooves, are electrically connected with the circuit layer by wire bonding and are in direct contact with the substrate, so that a radiating effect is good; the LED mounting grooves are bowl-shaped, inverted cone-shaped or pyramid-shaped; the areas of the bottom surfaces of the LED mounting grooves are smaller than those of the upper end surfaces of the LED mounting grooves; the side wall surfaces of the LED mounting grooves are reflecting surfaces which are arc surfaces or inclined surfaces inclined to the bottom surfaces of the LED mounting grooves; and the reflecting angles of the reflecting surfaces are 110 to 130 degrees according to light emitting angles of the LEDs. Light emitted to the periphery by the LEDs can be gathered and reflected, the light emitting efficiency of the LEDs is improved, and the emitted light is uniform and soft.
Description
Technical field
The present invention relates to the LED lighting field, particularly a kind of led light source module of integrated packaging.
Background technology
At present, the led light source module of integrated packaging uses individual layer or Double-layer aluminum substrate as heat sink usually, one single chip or a plurality of chip directly are fixed on the aluminium base (or copper base) with crystal-bonding adhesive, two electrodes of the p of led chip and n then are bonded on the sheet copper on aluminium base top layer, and determine on the base to arrange the number of led chip according to the size of power demand, peripheral regional to form embedding by pressing one circle plastic packaging material, the material that re-uses high index of refraction encapsulates formation by the shape of optical design to integrated LED, the 1W that is packaged into capable of being combined, 2W, the high-power LED light source module of the high brightness such as 3W, it is low to have a cost, the advantages such as volume is little.But because substrate surface is plane layout, led chip all is positioned at substrate surface, and its exiting surface adopts planar structure, does not have catoptric arrangement, and it is bad to go out light effect, and light efficiency is low.
Summary of the invention
Main purpose of the present invention provides a kind of led light source module of integrated packaging, is intended to improve the light extraction efficiency of LED, makes the light that sends even, soft.
The present invention proposes a kind of led light source module, comprise substrate and some LED, offer several LED mounting grooves in described substrate upper surface, be provided with circuit layer in described substrate upper surface, described circuit layer is arranged on the position at interval between each described LED mounting groove, each described LED is installed on the bottom surface of each described LED mounting groove, described LED mounting groove is bowl-shape, inverted round table-like or prism-frustum-shaped, the base area of described LED mounting groove is less than the upper surface area of described LED mounting groove, the side wall surface of described LED mounting groove is reflecting surface, and the reflection angle of described reflecting surface is designed to 110 ° ~ 130 ° according to the beam angle of described LED.
Preferably, described LED mounting groove is inverted positive prism-frustum-shaped.
Preferably, the bottom surface of described LED mounting groove is circle or regular polygon.
Preferably, described LED is by routing and the electrical connection of described circuit layer.
Preferably, described LED mounting groove evenly is arranged on the described substrate, and described LED mounting groove is concentric circles or ranks are arranged, and described LED places described LED mounting groove to form the luminous zone.
Preferably, be provided with the insulating wall that arranges around edge, described luminous zone at described substrate, described insulating wall adopts the plastic packaging material pressing to form.
Preferably, be filled with fluorescent glue in described LED mounting groove, embedding has packaging plastic in described luminous zone.
The substrate of led light source module of the present invention is provided with several LED mounting grooves, the upper surface of interval location is provided with circuit layer between each LED mounting groove, and LED is installed on the bottom surface of LED mounting groove, and LED is by routing and circuit layer electrical connection, direct and the substrate contacts of LED, good heat dissipation effect; This LED mounting groove be shaped as inverted round platform or prism-frustum-shaped, the base area of LED mounting groove is less than the area of its upper surface, the side wall surface of LED mounting groove is reflecting surface, reflecting surface be cambered surface or with the inclined plane of LED mounting groove inclined bottom surface, the reflection angle of reflecting surface is designed to 110 ° ~ 130 ° according to the beam angle of LED, the light-ray condensing that LED can be sent to periphery, and reflect away, improve the light extraction efficiency of LED, make the light that sends even, soft.
Description of drawings
Fig. 1 is the structural representation of led light source module among the embodiment of led light source module of the present invention;
Fig. 2 is that the LED mounting groove is bowl-shape, the cutaway view of the led light source module when not filling fluorescent glue and packaging plastic among the embodiment of led light source module of the present invention;
Fig. 3 is that the LED mounting groove is inverted round table-like, the cutaway view of the led light source module when not filling fluorescent glue and packaging plastic among the embodiment of led light source module of the present invention;
Fig. 4 is that the LED mounting groove is inverted round table-like among the embodiment of led light source module of the present invention, fills the cutaway view of the led light source module behind fluorescent glue and the packaging plastic;
Fig. 5 is the structural representation of the LED mounting groove of quadrangular frustum pyramid shaped among the embodiment of led light source module of the present invention;
Fig. 6 is that the bottom surface is the structural representation of orthohexagonal six prism-frustum-shaped LED mounting grooves among the embodiment of led light source module of the present invention;
Fig. 7 is that the bottom surface is the structural representation of six circular prism-frustum-shaped LED mounting grooves among the embodiment of led light source module of the present invention.
The realization of the object of the invention, functional characteristics and advantage are described further with reference to accompanying drawing in connection with embodiment.
Embodiment
Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
Referring to figs. 1 through Fig. 7, an embodiment of led light source module of the present invention is proposed, comprise substrate 10 and some led chips 30, substrate 10 is aluminium base, heat conduction is quick.Offer several LED mounting grooves 20 in substrate 10 upper surfaces, be provided with circuit layer 300 in substrate 10 upper surfaces, circuit layer 300 is arranged on the upper surface of interval location between each LED mounting groove 20, each led chip 30 is installed on the bottom surface 201 of a corresponding LED mounting groove 20, led chip 30 connects by gold thread series, parallel or connection in series-parallel between several led chips 30 by routing and circuit layer 300 electrical connections.Led chip 30 places on the bottom surface 201 of LED mounting groove 20, directly contacts with substrate 10, has avoided the insulating barrier on the conventional substrate 10, good heat dissipation effect.
As Fig. 2,3 and Fig. 5,6,7 shown in, LED mounting groove 20 is inverted round table-like, positive prism-frustum-shaped or bowl-shape, bottom surface 201 areas of LED mounting groove 20 are less than the upper surface area of LED mounting groove 20, the side wall surface of LED mounting groove 20 is reflecting surface 200, and the bottom surface 201 of LED mounting groove 20 is circle or polygon.LED mounting groove 20 is inverted when round table-like, and reflecting surface 200 is the curved surface that tilts from the top down, and LED mounting groove 20 forms the structure of a reflection shield; When LED mounting groove 20 was inverted positive prism-frustum-shaped, reflecting surface 200 was the inclined plane that tilts from the top down, and LED mounting groove 20 can be positive three terrace with edges, positive truncated rectangular pyramids, positive five terrace with edges etc.; The reflection angle of the reflecting surface 200 of LED mounting groove 20 is designed to 110 ° ~ 130 ° according to the beam angle of LED, the light that led chip 30 is dispersed to periphery fully can be assembled, and reflect away, can improve the light utilization of led chip 30, greatly improve light extraction efficiency.
That substrate 10 can be set to is square, circular or other are polygon-shaped, LED mounting groove 20 evenly is arranged on the substrate 10, substrate 10 is made as when square, LED mounting groove 20 is ranks and is arranged on the substrate 10; When substrate 10 was made as circle, LED mounting groove 20 was concentric circles and is arranged on the substrate 10, and led chip 30 places LED mounting groove 20 to form luminous zone 100.Be provided with the insulating wall 101 that arranges around the luminous zone frontside edge at substrate 10, insulating wall 101 adopts the plastic packaging material pressing to form, can prevent from producing when luminous zone 100 from carrying out package potting and leak the glue phenomenon, also can prevent from having guaranteed air-tightness and the physical strength of encapsulation in the moisture and the luminous zone 100 after the pernicious gas infiltration encapsulation in the environment.
In LED mounting groove 20, be filled with fluorescent glue 40, in order to led chip 30 compound generation white lights; 40 need of fluorescent glue are filled in the perforate and get final product, and have avoided the consumption of fluorescent glue 40 can be saved in the fluorescent glue 40 large-area surfaces that cover luminous zone 100, reduce production costs.100 interior embeddings have packaging plastic 400 in the luminous zone, in order to led chip 30 and gold thread are carried out seal protection.The light that led chip 30 sends converges and reflects through reflecting surface 200, improves light extraction efficiency, and through packaging plastic 400 refractions, divergence of beam makes the light that sends even, soft to the light that sends again.
The above only is the preferred embodiments of the present invention; be not so limit claim of the present invention; every equivalent structure transformation that utilizes specification of the present invention and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (7)
1. led light source module, comprise substrate and some LED, it is characterized in that, offer several LED mounting grooves in described substrate upper surface, be provided with circuit layer in described substrate upper surface, described circuit layer is arranged on the position at interval between each described LED mounting groove, each described LED is installed on the bottom surface of each described LED mounting groove, described LED mounting groove is bowl-shape, inverted round table-like or prism-frustum-shaped, the base area of described LED mounting groove is less than the upper surface area of described LED mounting groove, the side wall surface of described LED mounting groove is reflecting surface, and the reflection angle of described reflecting surface is designed to 110 ° ~ 130 ° according to the beam angle of described LED.
2. led light source module according to claim 1 is characterized in that, described LED mounting groove is inverted positive prism-frustum-shaped.
3. led light source module according to claim 2 is characterized in that, the bottom surface of described LED mounting groove is circle or regular polygon.
4. led light source module according to claim 1 is characterized in that, described LED is by routing and the electrical connection of described circuit layer.
5. each described led light source module in 4 according to claim 1 is characterized in that described LED mounting groove evenly is arranged on the described substrate, and described LED mounting groove is concentric circles or ranks are arranged, and described LED places described LED mounting groove to form the luminous zone.
6. led light source module according to claim 5 is characterized in that, is provided with the insulating wall that arranges around edge, described luminous zone at described substrate, and described insulating wall adopts the plastic packaging material pressing to form.
7. led light source module according to claim 6 is characterized in that, is filled with fluorescent glue in described LED mounting groove, and embedding has packaging plastic in described luminous zone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210388144XA CN102881686A (en) | 2012-10-15 | 2012-10-15 | Light-emitting diode (LED) light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210388144XA CN102881686A (en) | 2012-10-15 | 2012-10-15 | Light-emitting diode (LED) light source module |
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| Publication Number | Publication Date |
|---|---|
| CN102881686A true CN102881686A (en) | 2013-01-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210388144XA Pending CN102881686A (en) | 2012-10-15 | 2012-10-15 | Light-emitting diode (LED) light source module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109869647A (en) * | 2019-03-05 | 2019-06-11 | 东莞中之光电股份有限公司 | A kind of LED lamp bead of double-side |
Citations (6)
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| CN101207050A (en) * | 2006-12-21 | 2008-06-25 | Lg电子株式会社 | Light emitting device package and method for manufacturing the same |
| EP2323182A2 (en) * | 2009-11-17 | 2011-05-18 | Stanley Electric Co., Ltd. | Light emitting device and method for manufacturing the same |
| CN201887075U (en) * | 2010-09-25 | 2011-06-29 | 弘凯光电(深圳)有限公司 | Led |
| CN202049998U (en) * | 2011-04-30 | 2011-11-23 | 徐泓 | Light-emitting diode (LED) light source packaging support |
| CN202076265U (en) * | 2011-04-29 | 2011-12-14 | 深圳市瑞丰光电子股份有限公司 | LED module encapsulating structure and lighting device |
| CN202888232U (en) * | 2012-10-15 | 2013-04-17 | 王向东 | Led light source module |
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2012
- 2012-10-15 CN CN201210388144XA patent/CN102881686A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101207050A (en) * | 2006-12-21 | 2008-06-25 | Lg电子株式会社 | Light emitting device package and method for manufacturing the same |
| EP2323182A2 (en) * | 2009-11-17 | 2011-05-18 | Stanley Electric Co., Ltd. | Light emitting device and method for manufacturing the same |
| CN201887075U (en) * | 2010-09-25 | 2011-06-29 | 弘凯光电(深圳)有限公司 | Led |
| CN202076265U (en) * | 2011-04-29 | 2011-12-14 | 深圳市瑞丰光电子股份有限公司 | LED module encapsulating structure and lighting device |
| CN202049998U (en) * | 2011-04-30 | 2011-11-23 | 徐泓 | Light-emitting diode (LED) light source packaging support |
| CN202888232U (en) * | 2012-10-15 | 2013-04-17 | 王向东 | Led light source module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109869647A (en) * | 2019-03-05 | 2019-06-11 | 东莞中之光电股份有限公司 | A kind of LED lamp bead of double-side |
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Application publication date: 20130116 |