CN203617295U - LED light source device - Google Patents
LED light source device Download PDFInfo
- Publication number
- CN203617295U CN203617295U CN201320685761.6U CN201320685761U CN203617295U CN 203617295 U CN203617295 U CN 203617295U CN 201320685761 U CN201320685761 U CN 201320685761U CN 203617295 U CN203617295 U CN 203617295U
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- China
- Prior art keywords
- hole
- line layer
- light source
- source device
- led light
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Led Device Packages (AREA)
Abstract
The utility model discloses an LED light source device including a substrate, a reflection structure disposed on the substrate, a light emitting chip and a line layer arranged on the substrate in a coating manner. The line layer is provided with at least one through hole penetrating in the thickness direction. The reflection structure is composed of the wall of the through hole and a part of the substrate exposed in the hole. The line layer is provided with an electrode used for being connected with the chip. The light emitting chip is arranged on the part of the substrate exposed in the hole. The through hole is filled with a packaging glue body covering the light emitting chip. According to the utility model, the line layer covers the substrate from the upward side, so that a combined layer structure is formed. A certain height difference between the surface of the line layer at the position of the through hole and the surface of the substrate arises, so that packaging glue bonding interfacial area is increased. Possibilities of adhesive failures are reduced substantially. Therefore, structural stability of the LED light source device is improved and reliability of the LED light source device is enhanced.
Description
Technical field
The utility model relates to luminescent device, is specifically related to a kind of LED light source device.
Background technology
LED light source device, owing to having the features such as luminous efficiency is high, volume is little, pollution-free, is just being widely used in the fields such as TV is backlight, graphic display screen, decorative lighting.Along with the reduction of the raw material prices such as chip, encapsulation glue, support, the improving constantly of chip light emitting efficiency, LED light source device has started to enter the room lighting such as commercial lighting, lighting of home field.Required LED light source number of devices and LED light source device cost when reducing lamp assembled, make lamp assembled more simple and convenient, often adopt plurality of LEDs chip is positioned over to the form of carrying out integration packaging in single led light source device, improve power and the luminous flux of LED light source device, and in order to meet the radiating requirements of integration packaging form, LED light source device adopts the good material of the thermal conductivity such as metal or pottery as stent substrate more.The structure of a kind of support for LED light source device package extensively adopting is in the market the surface that metallic circuit is printed on metal or ceramic substrate, although the support of this kind of structure has good heat-sinking capability, but very little owing to being printed on difference in height between metallic circuit and the substrate surface of substrate surface, both height flush substantially, adopting the encapsulation glue of LED light source device and the bonding interface of support of this rack making is mainly the contact-making surface of encapsulation glue and substrate, bonding interface area is little, encapsulation glue come off and the probability peeled off high.
Utility model content
In view of this, provide a kind of constitutionally stable LED light source device, the defect of easily peeling off, coming off with the packaging plastic solving in existing LED light source device.
A kind of LED light source device, it comprises substrate, is positioned at catoptric arrangement, the luminescence chip on substrate and covers the line layer on described substrate, described line layer has the through hole that at least one through-thickness runs through, the hole wall of described through hole and the exposure of substrates part in hole forms described catoptric arrangement, described line layer is provided with the electrode for connecting chip, described luminescence chip is located at the part of exposure of substrates in hole, is filled with the packing colloid that covers luminescence chip in described through hole.
Preferably, described packing colloid conforms to line layer or via height.
Preferably, described through hole is cylindrical hole or the truncated cone-shaped hole of convergent from outside to inside.
Preferably, described electrode comprises the positive electrode and the negative electrode that are symmetricly set on line layer, described positive electrode comprises interior positive electricity end and the outer positive electricity end of being located at line layer surface, and described negative electrode comprises is located at that the interior negative electricity on line layer surface is extreme and outer negative electricity is extreme.
Preferably, described line layer comprises substrate, is located at the first circuit and second circuit of substrate interior, and described interior positive electricity end and outer positive electricity end are by the first connection, and described interior negative electricity is extreme and outer negative electricity is extreme by the second connection.
Preferably, described interior positive electricity end and the extreme mutually insulated of interior negative electricity compartment of terrain are arranged at described through hole peritreme, and described interior positive electricity end and interior negative electricity are curved and be combined into a untight circulus extremely respectively.
Preferably, described interior positive electricity end and interior negative electricity are extremely respectively semicircular ring structure, and both merge into a untight circular ring structure.
Preferably, the extreme stack of described line layer and interior positive electricity end or interior negative electricity is highly 1/6th to 1/2nd of substrate thickness.
Preferably, the further indent cup-shaped of the part of described exposure of substrates in through hole or bowl, the hole wall of described pit and described through hole forms described catoptric arrangement, and the inclined-plane of described pit is connected with hole wall.
Preferably, described line layer also comprise be close to that via openings edge puts for blocking the gear dam of packaging plastic, the height of described packaging plastic conforms to the gear height of dam degree of described line layer.
In above-mentioned LED light source device, line layer is covered in to substrate top, form lamination layer structure, between the surface of lead to the hole site line layer and substrate surface, form certain difference in height, when the packing colloid of packaged chip is filled in catoptric arrangement, the combination interface of packing colloid comprises and is positioned at the substrate surface of catoptric arrangement bottom and the hole wall of through hole, significantly improve the bonding interface area of packing colloid, reduce widely the probability of peeling off, coming off of encapsulation glue, make LED light source device architecture more stable, improved the reliability of LED light source device.
Accompanying drawing explanation
The perspective view of the LED light source device that Fig. 1 provides for the utility model embodiment mono-.
Fig. 2 is the profile along the A-A line in Fig. 1.
Fig. 3 is the sectional structure chart that the LED light source device in Fig. 2 conceals packing colloid and chip.
The profile of the LED light source device that Fig. 4 provides for the utility model embodiment bis-.
Embodiment
Below with reference to the drawings and the specific embodiments, the utility model is elaborated.
Refer to Fig. 1 to Fig. 3, the utility model embodiment mono-provides a kind of LED light source device 10, it comprises substrate 11, be positioned at the catoptric arrangement on substrate 11, luminescence chip 14 and cover the line layer 12 on substrate 11, line layer 12 has the through hole 13 that at least one through-thickness runs through, the part that the hole wall of through hole 13 and substrate 11 are exposed in hole forms described catoptric arrangement, line layer 12 is provided with the electrode 15 for connecting chip 14, 16, described luminescence chip 14 is located at substrate 11 and is exposed to the part in hole, in through hole 13, be filled with the packing colloid 18 that covers luminescence chip 14.
Preferably, described through hole 13 is cylindrical hole or the truncated cone-shaped hole of convergent from outside to inside, and more preferably when truncated cone-shaped hole, like this, through hole 13 hole walls and substrate-exposing part form cup-shaped or bowl-shape catoptric arrangement.Electrode comprises the positive electrode 15 and the negative electrode 16 that are symmetricly set on line layer 12, described positive electrode 15 comprises interior positive electricity end 151 and the outer positive electricity end 152 of being located at line layer 13 surfaces, described negative electrode 16 comprise be located at the interior negative electricity extreme 161 on line layer 13 surfaces and outer negative electricity extreme 162, in positive electricity end 151, outer positive electricity end 152, interior negative electricity extreme 161 and outer negative electricity extreme 162 be all exposed to the surface of line layer 13.The quantity of through hole 13 can be selected as required, for example, can be two or more through holes, to can assemble multi-chip be integrated into the multi-point source device of one.
As shown in Figure 1, luminescence chip 14 has multiple, and integration packaging is in through hole 13, to improve power and the luminous flux of LED light source device 10.Multiple luminescence chips 14 are by the part that is necessarily ordered in substrate 11 and is exposed to through hole 13.Between luminescence chip 14, can adopt connection in series-parallel to mix connected mode, for example, in illustrated embodiment, luminescence chip 14 is divided into multiple row, every row have multiple, every row luminescence chip 14 is connected in series, and two of head and the tail are respectively by lead-in wire 17 and interior positive electricity end 151 or extreme 161 corresponding connection of interior negative electricity, is respectively listed as the lead-in wire 17 of drawing and is jointly connected in interior positive electricity end 151, interior negative electricity extreme 161 and formation parallel way.The arrangement mode, connected mode and the quantity that are appreciated that luminescence chip 14 can change according to the actual requirements, are not limited to above giving an example.Lead-in wire 17 is preferably gold thread, silver-colored line or alloy lead wire.
As shown in Figure 2, preferably, described line layer 12 comprises substrate 122, is located at the first circuit 121 and second circuit 123 of substrate 122 inside, described interior positive electricity end 151 is connected by the first circuit 121 with outer positive electricity end 152, and described interior negative electricity extreme 161 is connected by the second circuit 123 with outer negative electricity extreme 162.Substrate 122 is preferably glass-fiber-plate or is made up of other insulation materials.
Preferably, the extreme 161 mutually insulated compartment of terrains of described interior positive electricity end 151 and interior negative electricity are arranged at the peritreme of described through hole 13, and described interior positive electricity end 151 and interior negative electricity extreme 161 are curved and be combined into a untight circulus respectively., described interior positive electricity end 151 and interior negative electricity extreme 161 are surrounded on described through hole 13 edge of opening.Described interior positive electricity end 151 and interior negative electricity extreme 161 are respectively semicircular ring structure, and both merge into a untight circular ring structure.
The stack of described line layer 12 and interior positive electricity end 151 or interior negative electricity extreme 161 is highly preferably 1/6th to 1/2nd of substrate 11 thickness.
Preferably, described outer positive electricity end 152 and outer negative electricity extreme 162 lay respectively on the Liang Ge diagonal angle, edge of described wiring board.Described outer positive electricity end 152 and outer negative electricity extreme 162 are respectively solder joint shape or welding pad structure, for being connected with external power source.
Refer to Fig. 4, show the cross-section structure of the LED light source device 20 of the utility model embodiment bis-, the LED light source device 20 of embodiment bis-is basic identical with embodiment mono-, difference is mainly, described substrate 11 is exposed to the further indent cup-shaped of part or the bowl 112 in through hole 13, and pit 112 forms described catoptric arrangement with the hole wall of through hole 13.Pit 112 can be regarded a microreflection structure as, contributes to improve the adhesion of packing colloid 18 and substrate 11, and increases reflective surface area, improves reflectivity, strengthens light extraction efficiency.In addition, the hole wall of through hole 13 is tilted shape, further strengthens structure reflective surface area, improves light extraction efficiency.Preferably, the inclined-plane of pit 112 (hole wall) can be to be directly connected continuously with the bottom (with hole wall) of through hole 13, and light is reflected efficiently.Luminescence chip 14 is located on the hole basal surface of pit 112.
Therefore, in above-mentioned LED light source device 10 and 20, by line layer 12 being covered in to substrate 11 tops, form lamination layer structure, between the surface of line layer 12 between the surface of through hole 13 position line layers and substrate surface and substrate 11 surfaces, form certain difference in height, when the packing colloid 18 of packaged chip is filled in catoptric arrangement, the combination interface of packing colloid 18 comprises and is positioned at substrate 11 surfaces of catoptric arrangement bottom and the hole wall 131 of through hole 13, in the time being provided with gear dam 19, also add the area on packing colloid 18 and through hole 13 edge surfaces and gear dam 19, thereby, significantly increase the bonding interface area of packing colloid 18, reduce widely the probability that packing colloid is peeled off and come off, make LED light source device architecture more stable, improve the reliability of LED light source device.
It should be noted that; the utility model is not limited to above-mentioned execution mode; according to creative spirit of the present utility model; those skilled in the art can also make other variations; the variation that these do according to creative spirit of the present utility model, within all should being included in the utility model scope required for protection.
Claims (10)
1. a LED light source device, it comprises substrate, is positioned at catoptric arrangement and luminescence chip on substrate, it is characterized in that, also comprise the line layer covering on described substrate, described line layer has the through hole that at least one through-thickness runs through, the hole wall of described through hole and the exposure of substrates part in hole forms described catoptric arrangement, described line layer is provided with the electrode for connecting chip, described luminescence chip is located at the part of exposure of substrates in hole, is filled with the packing colloid that covers luminescence chip in described through hole.
2. LED light source device as claimed in claim 1, is characterized in that, described packing colloid conforms to line layer or via height.
3. LED light source device as claimed in claim 1, is characterized in that, described through hole is cylindrical hole or the truncated cone-shaped hole of convergent from outside to inside.
4. LED light source device as claimed in claim 1, it is characterized in that, described electrode comprises the positive electrode and the negative electrode that are symmetricly set on line layer, described positive electrode comprises interior positive electricity end and the outer positive electricity end of being located at line layer surface, and described negative electrode comprises is located at that the interior negative electricity on line layer surface is extreme and outer negative electricity is extreme.
5. LED light source device as claimed in claim 4, it is characterized in that, described line layer comprises substrate, is located at the first circuit and second circuit of substrate interior, described interior positive electricity end and outer positive electricity end are by the first connection, and described interior negative electricity is extreme and outer negative electricity is extreme by the second connection.
6. LED light source device as claimed in claim 4, it is characterized in that, described interior positive electricity end and the extreme mutually insulated of interior negative electricity compartment of terrain are arranged at described through hole peritreme, and described interior positive electricity end and interior negative electricity are curved and be combined into a untight circulus extremely respectively.
7. LED light source device as claimed in claim 6, is characterized in that, described interior positive electricity end and interior negative electricity are extremely respectively semicircular ring structure, and both merge into a untight circular ring structure.
8. LED light source device as claimed in claim 4, is characterized in that, the extreme stack of described line layer and interior positive electricity end or interior negative electricity is highly 1/6th to 1/2nd of substrate thickness.
9. LED light source device as claimed in claim 3, it is characterized in that, the further indent cup-shaped of the part of described exposure of substrates in through hole or bowl, the hole wall of described pit and described through hole forms described catoptric arrangement, and the inclined-plane of described pit is connected with hole wall.
10. LED light source device as claimed in claim 1, is characterized in that, described line layer also comprise be close to that via openings edge puts for blocking the gear dam of packing colloid, the height of described packing colloid conforms to the gear height of dam degree of described line layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320685761.6U CN203617295U (en) | 2013-10-31 | 2013-10-31 | LED light source device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320685761.6U CN203617295U (en) | 2013-10-31 | 2013-10-31 | LED light source device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203617295U true CN203617295U (en) | 2014-05-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320685761.6U Expired - Fee Related CN203617295U (en) | 2013-10-31 | 2013-10-31 | LED light source device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203617295U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104332550A (en) * | 2014-10-30 | 2015-02-04 | 天水华天科技股份有限公司 | COB type LED packing piece based on beryllium oxide ceramic substrate and production method |
| TWI566677B (en) * | 2014-07-10 | 2017-01-11 | 遠東科技大學 | Thermal radiation of the substrate and the light-emitting element |
| CN107622997A (en) * | 2017-09-29 | 2018-01-23 | 姜研 | A kind of transparent colloid and LED light source component |
| WO2020094100A1 (en) * | 2018-11-08 | 2020-05-14 | 佛山市国星光电股份有限公司 | Led device, display screen and packaging process therefor |
-
2013
- 2013-10-31 CN CN201320685761.6U patent/CN203617295U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI566677B (en) * | 2014-07-10 | 2017-01-11 | 遠東科技大學 | Thermal radiation of the substrate and the light-emitting element |
| CN104332550A (en) * | 2014-10-30 | 2015-02-04 | 天水华天科技股份有限公司 | COB type LED packing piece based on beryllium oxide ceramic substrate and production method |
| CN104332550B (en) * | 2014-10-30 | 2017-03-01 | 天水华天科技股份有限公司 | COB formula LED encapsulation piece based on beryllium oxide ceramics substrate and production method |
| CN107622997A (en) * | 2017-09-29 | 2018-01-23 | 姜研 | A kind of transparent colloid and LED light source component |
| WO2020094100A1 (en) * | 2018-11-08 | 2020-05-14 | 佛山市国星光电股份有限公司 | Led device, display screen and packaging process therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Baoan District Shiyan street Shenzhen city Guangdong province 518000 White Pine Road in Yuntai technology industrial plant building 6, 8, 9 floor Patentee after: SHENZHEN SMALITE OPTO-ELECTRONIC CO., LTD. Address before: Baoan District Shiyan street Shenzhen city Guangdong province 518000 White Pine Road in Yuntai technology industrial plant building 6, 8, 9 floor Patentee before: Shenzhen Smalite Optoelectronics Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140528 Termination date: 20181031 |
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| CF01 | Termination of patent right due to non-payment of annual fee |