CN205488219U - Prevent LED packaging structure that gold thread broke - Google Patents
Prevent LED packaging structure that gold thread broke Download PDFInfo
- Publication number
- CN205488219U CN205488219U CN201620015240.3U CN201620015240U CN205488219U CN 205488219 U CN205488219 U CN 205488219U CN 201620015240 U CN201620015240 U CN 201620015240U CN 205488219 U CN205488219 U CN 205488219U
- Authority
- CN
- China
- Prior art keywords
- gold thread
- chip
- routing
- box dam
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a prevent LED packaging structure that gold thread broke, including mirror aluminum substrate, chip, gold thread, box dam and fluorescence glue film, mirror aluminum substrate includes that the mirror surface is distinguished and the non -specular surface district, distinguishes at mirror surface district non -specular surface on every side and sets up routing gilding pad, the chip is located in the mirror surface district, mirror surface district series connection's chip pass through the gold thread respectively with the routing gilding solder connection that corresponds, the box dam is located around the routing gilding pad, the fluorescence glue film is located in the box dam, will the chip the gold thread reaches the cladding of routing gilding pad. The utility model discloses a gold thread all sets up in the box dam is glued, has avoided the gold thread to run through in the colloid that different materials watered, and then has effectively prevented the risk that the gold thread was pulled apart by harmomegathus power.
Description
Technical field
This utility model relates to the technical field of LED, particularly relates to the LED encapsulation structure that a kind of anti-gold thread is broken.
Background technology
Light emitting diode (LED), compared with conventional bulb, has the plurality of advantages such as volume is light and handy, power saving, low price, is used in the most widely on various luminaire.Produced by light emitting diode monomer, brightness is not as good as a conventional bulb, so multiple light emitting diodes are generally welded on circuit board in the way of array by user, to increase its luminosity, so, just can improve the shortcoming that illumination is not enough.For tradition, multiple light emitting diodes are welded on circuit board in the way of array, (Dual In-line Package is encapsulated generally by DIP, also dual-inline package technology it is) or SMT encapsulation (Surface MountTechnology, surface coating technique) light emitting diode is fixed on circuit boards, by COB(Chip on Board) technology is packaged, the above-mentioned COB practice is directly to be sticked by bare chip on circuit board or substrate, and combining three basic processing procedures: (1) chip sticks together (2) wire and connects (3) application sealing technology, effectively light emitting diode is installed on circuit board, seem street lamp etc. to form large-scale light fixture.
In prior art products, in COB encapsulation, wire connection is typically opening through in the sealing of different materials composition, and owing to the different materials coefficient of expansion is different, harmomegathus is different, causes wire (gold thread) to be easier to be torn.In view of this, the present inventor studies and devises the LED encapsulation structure that a kind of anti-gold thread is broken, and this case thus produces.
Utility model content
The purpose of this utility model is the LED encapsulation structure providing a kind of anti-gold thread to break, and is arranged on by gold thread in box dam glue, to solve the technical problem that gold thread in prior art products is easily torn.
To achieve these goals, the technical scheme in the invention for solving the technical problem is:
The LED encapsulation structure that a kind of anti-gold thread is broken, including mirror-surface aluminum base board, chip, gold thread, box dam and fluorescent adhesive layer, described mirror-surface aluminum base board includes mirror area and non-specular surface district, in non-specular surface district around mirror area, routing gold plated pads is set, described chip is located on described mirror area, in mirror area, the chip of series connection is connected with corresponding routing gold plated pads respectively by gold thread, described box dam is located at around described routing gold plated pads, described fluorescent adhesive layer is located in described box dam, described chip, described gold thread and described routing gold plated pads is coated with.
As the optimal way of embodiment, also include that reflecting layer, described reflecting layer are resistant to elevated temperatures white colloidal, cover on routing gold plated pads surface.
As the optimal way of embodiment, also include that crystal-bonding adhesive, described crystal-bonding adhesive are located at described chip bottom, described chip is fixed on described substrate.
The LED encapsulation structure broken due to a kind of anti-gold thread of this utility model is put and be have employed above-mentioned technical scheme, and it provides the benefit that:
1, in gold thread of the present utility model is arranged at box dam glue, it is to avoid gold thread is applied in the colloid that different materials waters, and then effectively prevent the risk that gold thread is pulled apart by harmomegathus power；
2, routing bond pad surface covers reflecting layer, improves light extraction efficiency, increases the life-span of packaging body.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is top view of the present utility model.
Detailed description of the invention
As shown in Figures 1 and 2, this utility model discloses the LED encapsulation structure that a kind of anti-gold thread is broken, including mirror-surface aluminum base board 1, chip 2, gold thread 3, box dam 4 and fluorescent adhesive layer 5, described mirror-surface aluminum base board includes mirror area and non-specular surface district, in non-specular surface district around mirror area, routing gold plated pads 6 is set, described chip is located on described mirror area, the chip 2 of series connection in mirror area is connected with corresponding routing gold plated pads 6 respectively by gold thread 3, described box dam 4 is located at described routing gold plated pads 6 around, described fluorescent adhesive layer 5 is located in described box dam 4, by described chip, described gold thread and described routing gold plated pads cladding.Certainly, in described fluorescent glue 5, it is also possible to hole is distributed, to improve anaclasis effect.
As the optimal way of embodiment, also include that reflecting layer 7, described reflecting layer are resistant to elevated temperatures white colloidal, cover on routing gold plated pads surface.Gold plated pads has the highest oxidation resistance, but reflectance is low, easy absorbing light, cause light loss, and white colloidal is covered on its surface, improve reflectance, improve light extraction efficiency, when covering white colloidal as reflecting layer, light output efficiency improves more than 2%, light output improves, and the heat of packaging body reduces, and improves the life-span.
As the optimal way of embodiment, also include that crystal-bonding adhesive, described crystal-bonding adhesive are located at described chip bottom, described chip is fixed on described substrate.
When using the technical solution of the utility model, common aluminium base designs circuit, improve the wiring motility of COB, within pad design and box dam, gold thread will not be covered by box dam glue, prevents harmomegathus difference from pulling apart gold thread, improve product reliability, cover welding disking area with high reflectance colloid after bonding wire, decrease the pad absorption to light, improve light emission rate.
The above, only this utility model preferred embodiment, therefore the scope that this utility model is implemented can not be limited according to this, the equivalence change i.e. made according to this utility model the scope of the claims and description with modify, all should still belong in the range of this utility model contains.
Claims (3)
1. the LED encapsulation structure that an anti-gold thread is broken, it is characterized in that: include mirror-surface aluminum base board, chip, gold thread, box dam and fluorescent adhesive layer, described mirror-surface aluminum base board includes mirror area and non-specular surface district, in non-specular surface district around mirror area, routing gold plated pads is set, described chip is located on described mirror area, in mirror area, the chip of series connection is connected with corresponding routing gold plated pads respectively by gold thread, described box dam is located at around described routing gold plated pads, described fluorescent adhesive layer is located in described box dam, by described chip, described gold thread and described routing gold plated pads cladding.
The LED encapsulation structure that a kind of anti-gold thread the most as claimed in claim 1 is broken, it is characterised in that: also include that reflecting layer, described reflecting layer are resistant to elevated temperatures white colloidal, cover on described routing gold plated pads surface.
The LED encapsulation structure that a kind of anti-gold thread the most as claimed in claim 1 is broken, it is characterised in that: also include that crystal-bonding adhesive, described crystal-bonding adhesive are located at described chip bottom, described chip is fixed on described substrate mirror area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620015240.3U CN205488219U (en) | 2016-01-09 | 2016-01-09 | Prevent LED packaging structure that gold thread broke |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620015240.3U CN205488219U (en) | 2016-01-09 | 2016-01-09 | Prevent LED packaging structure that gold thread broke |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205488219U true CN205488219U (en) | 2016-08-17 |
Family
ID=56665402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620015240.3U Expired - Fee Related CN205488219U (en) | 2016-01-09 | 2016-01-09 | Prevent LED packaging structure that gold thread broke |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205488219U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108267821A (en) * | 2018-03-12 | 2018-07-10 | 四川新易盛通信技术有限公司 | A kind of boxlike optical device structural member and optical device, the optical module using the optical device structural member |
-
2016
- 2016-01-09 CN CN201620015240.3U patent/CN205488219U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108267821A (en) * | 2018-03-12 | 2018-07-10 | 四川新易盛通信技术有限公司 | A kind of boxlike optical device structural member and optical device, the optical module using the optical device structural member |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20190109 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |