JP2011071407A - Light-emitting element and illumination apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting element having high luminous efficiency and superior long-term reliability. <P>SOLUTION: The light-emitting element 1 includes a substrate 2, which is provided with an LED chip 10 and electrodes 6a and 6b; a translucent glass substrate 4 which is opposed to the substrate 2; and a reflector 3 which is provided between the substrate 2 and the translucent glass substrate 4 so as to surround a region, where the LED chip 10 and the electrodes 6a and 6b are formed, and the surface of which is coated with a metal. A sealed region surrounded by the substrate 2, the reflector 3, and the translucent glass substrate 4 is filled with a translucent sealing resin 5. Thus, the light-emitting element has high luminous efficiency and superior long-term reliability. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a light emitting element and a lighting device including the light emitting element.

  A light emitting diode (hereinafter also referred to as “LED” or “light emitting element”) is a PN junction made of a compound semiconductor film such as GaAs (gallium arsenide) or GaN (gallium nitride), and forward current is applied to the semiconductor film. Thus, visible light, near ultraviolet light, or ultraviolet light is obtained.

  This LED is widely used as a backlight light source for illuminating a display panel such as a liquid crystal. In recent years, the LED is used as a light source of an illumination device such as an outdoor or indoor illumination lamp. For these applications, low power consumption and long-life LEDs are required, and high efficiency and high reliability are emphasized.

  If the light-emitting element can efficiently release the heat generated inside to the outside, each component in the light-emitting element is not easily damaged by heat, and the light-emitting efficiency decreases or the light-emitting element itself is damaged by heat. It is easy to prevent long-term reliability. Further, when the light emitted from the LED is reflected by the reflecting plate and guided to the outside, the surface of the reflecting plate can be subjected to metal plating to efficiently emit light.

  At this time, among metals, silver has a characteristic of high thermal conductivity and high reflectance in the visible light region. In particular, since silver has a high reflectance in the short wavelength region, which is the emission wavelength from an LED element using a compound semiconductor film such as GaN, the luminous efficiency of the LED element is increased by applying silver plating to the surface of the reflector. Can do. In view of such circumstances, for example, as disclosed in Patent Documents 1 and 2, various light-emitting elements have been developed so far. FIG. 5 is a perspective view showing the configuration of the light emitting element 50 of Patent Document 1, FIG. 6 is a cross-sectional view showing the structure of the light emitting element 50, and FIG. 7 is a cross section showing the configuration of the light emitting element 60 of Patent Document 2. FIG.

  As shown in FIGS. 5 and 6, the light-emitting element 50 of Patent Document 1 integrally forms a die bond area / electrode common portion 52 of the LED chip 51 with a reflector 53. Further, the die bond area / electrode common portion 52 of the LED chip 51 is metal-connected to the back electrode 54, so that heat generated in the LED chip 51 through the back electrode 54 is released to the outside. Further, in the light emitting element 50, silver plating 56 is applied to the upper surface of the reflection plate 53 and the inner peripheral surface 55.

  Further, as shown in FIG. 7, the light emitting element 60 of Patent Document 2 is filled with an insulating material 63 in a slit 62 formed vertically in a metal substrate 61, and has an anode potential and a cathode potential supplied to the LED chip 64. It has a separate electrode structure. The LED chip 64 with bumps is flip-chip connected to the metal substrate 61, and an underfill resin 65 is filled between the LED chip 64 and the metal substrate 61. Due to these configurations, heat generated in the LED chip 64 escapes to the outside through the lower surface of the metal substrate 61. In the light emitting element 60, a resin substrate 67 is bonded to the metal substrate 61 via an adhesive sheet 66, and a cover plate 70 made of translucent glass or resin is further attached to the upper surface of the resin substrate 67 via an adhesive sheet 69. The inside of the through hole 71 which is joined and uses air as a light medium is sealed. The side surface 68 of the resin substrate 67 functions as a reflection surface, and the light emitted from the LED chip 64 and the light reflected from the side surface 68 have a refractive index inside the through hole 71 sealed by the cover plate 70. Proceed unaffected.

  By the way, it has been described that light can be efficiently emitted by performing silver plating on the surface of the reflecting member. However, silver is generally highly reactive, for example, chlorine-based gas, sulfide-based gas, bromine-based gas, or nitrogen Deterioration such as discoloration and alteration due to corrosive gas such as oxidizing gas is severe. Therefore, when the surface of the reflecting member is subjected to silver plating, the initial luminous efficiency is high, but the surface deterioration is caused by the corrosive gas. In particular, it is difficult to maintain reliability when used over a long period of time in harsh environments such as outdoor lighting. Therefore, in the light emitting element 50 of Patent Document 1, the silver plating 56 is protected by filling the region where the silver plating 56 is applied, that is, the region where the reflection plate 53 is formed, with the translucent sealing body 57. Yes.

JP 2008-91354 A (published April 17, 2008) JP 2003-218398 A (published July 31, 2003)

  However, in the conventional method described above, the region where the LED chip and the reflector are provided is not sufficiently sealed, and the metal plating provided on the side surface of the reflector is deteriorated by the corrosive gas contained in the atmospheric gas. End up.

  That is, an LED using a compound semiconductor film such as GaN generally has a short emission wavelength and high radiation energy from the LED chip. For this reason, not only thermal degradation, which is a cause of degradation of conventional LEDs, but also each member in the light emitting element may be degraded by radiant energy from the LED chip.

  The modified silicone resin used for the translucent sealing body of Patent Document 1 does not have sufficient heat resistance and radiation energy durability. Therefore, the translucent sealing body is gradually contracted by the heat and radiant energy from the LED chip and peeled off from the silver plating. As a result, the silver plating surface reacts with the atmospheric gas and changes its quality, so that the reflectance gradually decreases, and long-term reliability cannot be obtained.

  In addition, as a translucent sealing body of an LED using a compound semiconductor film such as GaN, a dimethyl silicone resin having heat resistance and radiant energy resistance rather than a modified silicone resin may be used. Since it is a helical system, gas sealing performance is poor.

  On the other hand, in the light emitting element of Patent Document 2, in order to seal the inside of the through hole surrounded by the resin substrate in which the LED chip functions as a reflecting member, a cover plate for closing the through hole is installed on the resin substrate. Yes. However, in an atmosphere such as an outdoor illumination lamp, the adhesive sheet that joins the cover plate and the resin substrate is deteriorated by light and heat from the LED chip and easily peels off. As a result, the silver plating applied to the side surface of the resin substrate is denatured by reacting with the atmospheric gas containing the corrosive gas, and the reflectance is lowered.

  Further, in the light emitting element of Patent Document 2, air is filled in the sealed through hole. Therefore, in the reflow used when the light emitting element is mounted, the air sealed in the through hole is thermally expanded at a stretch. Thereby, the adhesive sheet which joins a cover board and a resin substrate upper surface peels, and the sealing performance in a through-hole will be broken. In this case, since long-term reliability cannot be obtained, reflow mounting cannot be performed.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a light-emitting element having high luminous efficiency and excellent long-term reliability.

  In order to solve the above problems, a light-emitting element according to the present invention includes a substrate provided with an LED chip and an electrode terminal, a light-transmitting substrate facing the substrate, and a space between the substrate and the light-transmitting substrate. And a reflective member having a surface covered with metal, and surrounded by the substrate, the reflective member, and the translucent substrate. The sealing region is filled with a light-transmitting sealing body.

  According to said structure, the light radiate | emitted from LED chip is reflected in the reflection member or the surface of a board | substrate directly, and is condensed on the light-projection surface of a light emitting element. In addition, since metal plating is applied to the surface of the substrate and the reflecting member in the sealing region, heat from the LED chip can be dispersed and efficiently released to the outside, and the reflectance can be improved. .

  Further, the LED chip and the electrode terminal are sealed by the substrate, the reflecting member, and the light transmitting substrate. Therefore, the translucent substrate can block the atmospheric gas, and the metal plating on the surface of the substrate and the reflecting member can be prevented from being deteriorated by the gas or the like.

  Further, since the sealing region is filled with a light-transmitting sealing body, air can be prevented from being mixed into the sealing region. The translucent substrate is unlikely to peel off due to thermal expansion. Therefore, the sealing performance in the sealing region is maintained, and long-term reliability is obtained.

  In the light-emitting element according to the present invention, a resin is provided in a region that is in contact with the reflective member and the translucent substrate and that is opposite to the sealing region through the reflective member. It is preferable.

  According to said structure, atmosphere gas is interrupted | blocked doubly by the translucent board | substrate and resin by the sealing area | region enclosed by the reflection member. Therefore, deterioration of the LED chip in the sealing region, the metal plating on the surface of the reflecting member, the electrode terminal, and the wire bond connecting the LED chip and the electrode terminal can be prevented more efficiently.

  Moreover, in the light emitting element which concerns on this invention, it is preferable that the said resin is provided in the surface which is not in contact with the said sealing area | region of the said translucent board | substrate.

  According to said structure, atmosphere gas is interrupted | blocked doubly by the translucent board | substrate and resin by the sealing area | region enclosed by the reflection member. Furthermore, by providing a resin on the surface of the translucent substrate that is not in contact with the sealing region, the shielding property of the atmospheric gas is increased. Therefore, deterioration of the LED chip in the sealing region, the metal plating on the surface of the reflecting member, the electrode terminal, and the wire bond connecting the LED chip and the electrode terminal can be prevented more efficiently.

  Moreover, in the light-emitting element according to the present invention, it is preferable that the material of the light-transmitting encapsulant includes a dimethyl silicone resin.

  According to said structure, since dimethyl silicone resin is excellent in heat resistance and radiation energy tolerance, it can prevent deterioration, such as discoloration or quality change of the resin by the heat | fever from a LED chip, and radiation energy. Therefore, a light-emitting element with excellent long-term reliability can be obtained.

  In the light emitting device according to the present invention, it is preferable that the translucent sealing body includes a fluorescent material.

  For example, when the LED chip emits blue light, if the light-transmitting sealing body contains a yellow phosphor, the yellow phosphor converts the blue light into yellow light. At this time, when the blue light emitted from the LED chip and the yellow light emitted from the yellow phosphor are combined, white light is synthesized. As a result, white light is emitted from the light emitting surface of the light emitting element. Thus, the light of a desired color can be obtained by containing a fluorescent substance in the translucent sealing body.

  In the light-emitting element according to the present invention, it is preferable that a cross-sectional area of the reflecting member in a direction horizontal to the substrate increases from the translucent substrate side toward the substrate side.

  According to said structure, since the light which reflected the reflection member is radiate | emitted efficiently in the direction of a light-projection surface, the intensity | strength of the emitted light from a light-projection surface can be raised. Therefore, light emission efficiency can be improved.

  In the light emitting device according to the present invention, the reflecting member is preferably plated with silver, palladium, or platinum. Thereby, the heat from the LED chip can be dispersed and efficiently released to the outside, and the reflectance can be improved.

  In the light emitting device according to the present invention, the resin preferably includes an epoxy resin or a modified silicone resin. Thereby, atmospheric gas can be interrupted | blocked suitably.

  In the light-emitting element according to the present invention, it is preferable to provide a film containing a fluorescent material on at least one of the surface facing the substrate of the light-transmitting substrate and the surface opposite to the surface facing the substrate. .

  For example, when the LED chip emits blue light, if a film containing a yellow phosphor is provided on at least one of the surface facing the substrate and the surface opposite to the surface facing the substrate, the yellow phosphor Converts blue light to yellow light. At this time, when the blue light emitted from the LED chip and the yellow light emitted from the yellow phosphor are combined, white light is synthesized. As a result, white light is emitted from the light emitting surface of the light emitting element. Thus, by providing a film containing a fluorescent material, light of a desired color can be obtained.

  In order to solve the above-described problems, an illumination device according to the present invention includes a light emitting element according to the present invention. According to said structure, since the sealing performance of the sealing area | region enclosed by the board | substrate, the reflection member, and the translucent board | substrate is high, the metal of the surface of a board | substrate and a reflection member does not deteriorate with corrosive gas. Therefore, a lighting device with high emission efficiency and excellent long-term reliability can be provided.

  A light emitting device according to the present invention includes a substrate provided with an LED chip and an electrode terminal, a light transmitting substrate facing the substrate, and the LED chip and the electrode terminal between the substrate and the light transmitting substrate. And a reflective member whose surface is covered with a metal, and in the sealing region surrounded by the substrate, the reflective member and the translucent substrate, The stop is filled. Therefore, a light-emitting element with high emission efficiency and excellent long-term reliability can be provided.

It is sectional drawing which shows schematic structure of the light emitting element which concerns on the 1st Embodiment of this invention. It is a perspective view which shows the structure of the light emitting element shown in FIG. It is sectional drawing which shows schematic structure of the light emitting element which concerns on the 2nd Embodiment of this invention. It is sectional drawing which shows schematic structure of the light emitting element which concerns on the 3rd Embodiment of this invention. It is a perspective view which shows the structure of the conventional light emitting element. It is sectional drawing which shows the structure of the conventional light emitting element. It is sectional drawing which shows the structure of the conventional light emitting element.

  One embodiment of a light emitting device according to the present invention will be described below with reference to FIGS.

[1. (Configuration of light emitting element)
FIG. 1 is a cross-sectional view showing a schematic configuration of the light emitting device according to the first embodiment of the present invention, and FIG. 2 is a perspective view showing the configuration of the light emitting device shown in FIG.

  As shown in FIG. 1, the light emitting device 1 according to the present embodiment mainly includes a substrate 2, a reflecting plate (reflecting member) 3, and a translucent glass substrate (translucent substrate) 4.

  The light emitting element 1 is an LED element including an LED chip 10. Specifically, the reflective plate 3 is provided on the substrate 2 on which the LED chip 10 is mounted so as to surround the LED chip 10, and the translucent glass substrate facing the substrate 2 on the reflective plate 3. 4 is provided. Since the reflecting plate 3 and the translucent glass substrate 4 are bonded without a gap, the region where the LED chip 10 is mounted is sealed by the reflecting plate 3 and the translucent glass substrate 4.

  In addition, the surfaces of the substrate 2 and the reflecting plate 3 are plated with metal, and a sealing region surrounded by the substrate 2, the reflecting plate 3 and the translucent glass substrate 4 has a translucent sealing resin (translucent resin). The optical sealing body) 5 is filled without a gap. Thus, in the light emitting element 1, since the sealing region is sealed by the translucent glass substrate 4, the external atmospheric gas can be blocked and deterioration of the metal plating can be prevented. Further, since the light-transmitting sealing resin 5 is filled in the sealing region, the air does not thermally expand during reflow and the sealing of the light-transmitting glass substrate 4 is not broken.

  In the present embodiment, the substrate 2 points to the surface region of the entire substrate, and a laminated structure is formed in a region below the substrate 2 although not shown. In the present specification, description of the stacked structure and the stacked method is omitted.

  The substrate 2 is separated into electrodes 6a and 6b and a metal base portion 7 by insulating portions 8a and 8b. Specifically, the region surrounded by the insulating portion 8a is separated in potential from the metal base portion 7 and functions as the anode electrode 6a. Similarly, the region surrounded by the insulating portion 8b is separated in potential from the metal base portion 7 and functions as the cathode electrode 6b.

  In addition, the upper surface of the substrate 2 has a metal plating portion 9 plated with metal, and an LED chip 10 is mounted on the die bond area of the metal base portion 7. The LED chip 10 includes an electrode terminal (not shown) including an anode electrode and a cathode electrode on an upper surface (a surface opposite to a surface die-bonded to the substrate 2). The anode electrode of the LED chip 10 is connected to the anode electrode 6 a of the substrate 2 by a wire bond 11, and the cathode electrode of the LED chip 10 is connected to the cathode electrode 6 b of the substrate 2 by a wire bond 11.

  The reflecting plate 3 reflects the light emitted from the LED chip 10 and focuses it on the light emitting surface 13 of the light emitting element 1. As shown in FIG. 2, the reflecting plate 3 is installed so as to surround the electrodes 6 a and 6 b and the LED chip 10. In addition, in order to increase the reflectance of the emitted light from the LED chip 10, the surface of the reflection plate 3 is provided with a metal plating part 9.

  The translucent glass substrate 4 is provided on the reflecting plate 3 in parallel with the light emitting surface 13 of the light emitting element 1, and seals a region surrounded by the reflecting plate 3. The joining surface of the reflecting plate 3 and the translucent glass substrate 4 is adhered without a gap, thereby preventing the atmospheric gas from entering. Furthermore, since the sealing region surrounded by the substrate 2, the reflecting plate 3 and the translucent glass substrate 4 is filled with the translucent sealing resin 5, the air inside the region does not thermally expand. So, reflow mounting can be done without problems.

  Next, the configuration of the sealing region of the light emitting device 1 according to this embodiment will be described in more detail.

(Sealing region of light-emitting element 1)
The light emitting element 1 of this embodiment has the sealing area | region enclosed by the board | substrate 2, the reflecting plate 3, and the translucent glass substrate 4 as mentioned above. An LED chip 10 is mounted in this sealing region, and light emitted from the LED chip 10 is reflected directly or on the surface of the reflecting plate 3 or the substrate 2 and collected on the light emitting surface 13 of the light emitting element 1. To be lighted.

  In the sealing area, the surfaces of the substrate 2 and the reflector 3 are plated with metal, so that the heat from the LED chip 10 can be dispersed and efficiently released to the outside. Further, the light emitted from the LED chip 10 can be reflected by the metal plating portion 9 and condensed on the light emitting surface 13. The material used for the LED chip 10 is not particularly limited, but the LED chip 10 of the present embodiment includes a GaN-based semiconductor material and emits blue light. Therefore, it is preferable to use a metal with high blue light reflectivity and high thermal conductivity for metal plating. Examples of such a metal include palladium and platinum, and it is particularly preferable to use silver having a high blue light reflectance and a high thermal conductivity. If the metal plating part 9 is silver-plated, there is little loss of light at the time of reflection in the metal plating part 9, and the heat from the LED chip 10 can be diffused efficiently, so that the highly efficient light-emitting element 1 Can be realized.

  The material of the reflecting plate 3 is not particularly limited, and for example, a metal or a resin material may be used in order to improve the heat dissipation within the light emitting element 1. Further, when connecting the reflector 3 to the substrate 2, an adhesive may be used depending on the material of the reflector 3. That is, when the reflecting plate 3 is formed of a metal, the substrate 2 and the reflecting plate 3 may be directly connected to bond the metals together in order to further improve heat dissipation. The adhesive resin 12 may be used as an adhesive between the two. Moreover, when the reflecting plate 3 is formed of a resin material, the adhesive resin 12 may be used in order to improve the adhesiveness between the substrate 2 and the reflecting plate 3. Examples of the adhesive resin 12 include an epoxy adhesive film.

  Although the shape of the reflecting plate 3 is not particularly limited, it is more preferable that the cross-sectional area of the reflecting plate 3 in the direction horizontal to the substrate 2 increases as it goes from the translucent glass substrate 4 side to the substrate 2 side. For example, as shown in FIG. 1, as the cross-sectional shape perpendicular to the light emitting surface 13 approaches the substrate 2, it may be a skirt shape that approaches the LED chip 10. Thereby, since the light reflected from the reflecting plate 3 is efficiently emitted in the direction of the light emitting surface 13, the intensity of the emitted light from the light emitting surface 13 can be increased. Therefore, light emission efficiency can be improved.

  A translucent glass substrate 4 is bonded and fixed on the reflecting plate 3 so that there is no gap between the reflecting plate 3 and the reflecting plate 3. For this adhesion, translucent sealing resin 5 filled in the sealing region is used. For example, a portion surrounded by the substrate 2 and the reflecting plate 3 is filled with the translucent sealing resin 5 and heated while pressing the translucent glass substrate 4 on the reflecting plate 3 under reduced pressure. The sealing resin 5 is cured. Thereby, since the sealing region is filled with the translucent sealing resin 5 without containing air and is filled to the same position as the height of the upper surface of the reflecting plate 3, the translucent glass substrate 4 is translucent. The adhesive sealing resin 5 is bonded without a gap. Therefore, the translucent glass substrate 4 can block the atmospheric gas, and the metal plating on the surfaces of the substrate 2 and the reflecting plate 3 can be prevented from being deteriorated by corrosive gas or the like.

  Furthermore, since the sealing region is filled with the light-transmitting sealing resin 5 without including air, the light-transmitting glass substrate 4 due to the thermal expansion of air even when reflow is performed when the light-emitting element 1 is mounted. Is unlikely to occur. Therefore, the sealing performance in the sealing region is maintained, and long-term reliability is obtained.

  Examples of the material of the light-transmitting glass substrate 4 include quartz soda, soda glass, and heat-resistant glass. However, the material is not particularly limited as long as it is colorless and transparent and has process resistance such as reflow.

  The translucent sealing resin 5 may be, for example, dimethyl silicone resin, modified silicone resin (resin with improved gas sealing property of dimethyl silicone resin), epoxy resin, or the like, but is not particularly limited.

  Among these resins, it is preferable that the translucent sealing resin 5 of the light emitting device 1 according to the present embodiment contains a dimethyl silicone resin. As described above, in the light emitting element 1, the atmospheric gas can be blocked by the translucent glass substrate 4, and therefore, the translucent sealing resin 5 itself is not necessarily required to block the atmospheric gas. Therefore, by using a dimethyl silicone resin having excellent heat resistance and radiant energy resistance, it is possible to prevent deterioration such as discoloration or alteration of the resin due to heat from the LED chip 10 and radiant energy. Therefore, a light-emitting element with excellent long-term reliability can be obtained. In general, the superiority of gas sealing property is epoxy resin> modified silicone resin> dimethylsilicone resin, and the superiority of heat resistance and radiant energy resistance is dimethylsilicone resin> modified silicone resin> epoxy resin. .

  Further, the translucent sealing resin 5 may contain a phosphor. For example, when the LED chip 10 emits blue light, the yellow phosphor converts blue light into yellow light if the translucent sealing resin 5 contains a yellow phosphor. At this time, when the blue light emitted from the LED chip 10 and the yellow light emitted from the yellow phosphor are combined, white light is synthesized. As a result, white light is emitted from the light emitting surface 13 of the light emitting element 1. In this way, light of a desired color can be obtained by including the phosphor in the translucent sealing resin 5.

  The phosphor is not limited to a yellow phosphor. For example, when white light is synthesized in combination with blue light, a green phosphor and a red phosphor may be used in combination. Thus, the blue light emitted from the LED chip 10 is converted into green light and red light by the green phosphor and the red phosphor, respectively, and when these lights are combined, white light is synthesized.

  Moreover, you may provide the film | membrane containing a fluorescent substance in at least one among the surface of the side in contact with the sealing area | region of the translucent glass substrate 4, and the surface on the opposite side to the said surface. For example, by providing a fluorescent sheet (not shown) in which a yellow phosphor is kneaded on the surface of the translucent glass substrate 4 that is in contact with the sealing region, the blue light emitted from the LED chip 10 is converted into yellow light. Can be converted. Therefore, white light can be synthesized from blue light and yellow light.

[2. Second embodiment of light emitting device according to the present invention]
Next, a second embodiment of the light emitting device according to the present invention will be described. In the present embodiment, the same members as those in the first embodiment are denoted by the same reference numerals.

  FIG. 3 is a cross-sectional view showing a schematic configuration of a light emitting device according to the second embodiment of the present invention. The light-emitting element 1 of the present embodiment is different from the first embodiment only in that the size of the translucent glass substrate 4 and the adhesive resin 13 are provided, and the others are the light-emitting elements shown in the first embodiment. Since the configuration is the same as that of FIG.

  As shown in FIG. 3, the light-emitting element 1 of the present embodiment is provided large so that the translucent glass substrate 4 protrudes beyond the contact position with the reflector 3. Further, the protruding portion is a region that is in contact with the reflecting plate 3 and the translucent glass substrate 4 and that is opposite to the sealing region through the reflecting plate 3, that is, the reflecting plate 3. An adhesive resin 13 is provided along the outer peripheral side. In other words, the adhesive resin 13 is provided in a region including a point where the reflecting plate 3 and the translucent glass substrate 4 are in contact with each other and located on the outermost side of the reflecting plate 3.

  Thus, in the light emitting element 1 of this embodiment, the contact area | region of the reflecting plate 3 and the translucent glass substrate 4 is sealed from the outer side. As a result, the atmosphere gas in the sealing region surrounded by the reflecting plate 3 is cut off twice by the translucent glass substrate 4 and the adhesive resin 13. Therefore, the LED chip 10 in the sealing region, the metal plating part 9 on the surface of the reflector 3, the electrode terminal, and the wire bond 11 connecting the LED chip 10 and the electrode terminal can be prevented more efficiently. Can do.

  As the adhesive resin 13, for example, a modified silicone resin or a dimethyl silicone resin can be used, but it is more preferable to use an epoxy resin excellent in gas sealing property. Since the adhesive resin 13 is provided outside the sealing region, the adhesive resin 13 does not directly receive the radiant energy from the LED chip 10, and the distance from the LED chip 10 that is a heat source is large. Therefore, the adhesive resin 13 is not required to have heat resistance or radiant energy resistance, and a resin excellent in gas sealing property that can shut off atmospheric gas can be used.

  Although the formation method of the adhesive resin 13 is not specifically limited, The method of coat | covering the adhesive resin 13 on the light emitting element 1 is preferable, for example, dispensing is mentioned. However, when coating the adhesive resin 13, it is necessary to manage the coating amount during dispensing so that the adhesive resin 13 is not coated on the upper surface (the surface not in contact with the sealing region) of the translucent glass substrate 4. The coating amount is controlled according to the variation in the structure of the plate 3.

[3. Third Embodiment of Light Emitting Element According to the Present Invention]
Next, a third embodiment of the light emitting device according to the present invention will be described. In the present embodiment, the same members as those in the first embodiment are denoted by the same reference numerals.

  FIG. 4 is a cross-sectional view showing a schematic configuration of a light emitting device according to the third embodiment of the present invention. The light emitting element 1 of the present embodiment is different from the first embodiment only in that the adhesive resin 14 is provided, and the other structure is the same as that of the light emitting element 1 shown in the first embodiment. Is omitted.

  As shown in FIG. 4, the light-emitting element 1 of the present embodiment is a region that is in contact with the reflective plate 3 and the translucent glass substrate 4 and is a region on the opposite side of the sealing region through the reflective plate 3. That is, the adhesive resin 14 is provided along the outer peripheral side of the reflecting plate 3. Furthermore, the adhesive resin 14 is also provided on the surface of the translucent glass substrate 4 that is not in contact with the sealing region.

  Thus, also in the light emitting element 1 of the present embodiment, the contact area between the reflector 3 and the translucent glass substrate 4 is sealed from the outside as in the second embodiment. As a result, the atmosphere gas in the sealing region surrounded by the reflecting plate 3 is cut off twice by the translucent glass substrate 4 and the adhesive resin 14. Furthermore, by providing the adhesive resin 14 on the surface of the translucent glass substrate 4 that is not in contact with the sealing region, the barrier property of the atmospheric gas is increased. Therefore, the LED chip 10 in the sealing region, the metal plating part 9 on the surface of the reflector 3, the electrode terminal, and the wire bond 11 connecting the LED chip 10 and the electrode terminal can be prevented more efficiently. Can do.

  For example, a modified silicone resin or a dimethyl silicone resin can be used as the adhesive resin 14, but it is more preferable to use an epoxy resin excellent in gas sealing performance. Since the adhesive resin 14 is provided outside the sealing region, it does not directly receive the radiant energy from the LED chip 10 and is separated from the LED chip 10 that is a heat source. Therefore, the adhesive resin 14 is not required to have heat resistance or radiant energy resistance, and a resin excellent in gas sealing property that can shut off atmospheric gas can be used.

  A method for forming the adhesive resin 14 is not particularly limited, but a method of coating the adhesive resin 14 on the light emitting element 1 is more preferable, and examples thereof include dispensing or dipping. In this embodiment, when the adhesive resin 14 is coated, it is necessary to manage the coating amount at the time of dispensing so that the adhesive resin 13 is not coated on the upper surface (the surface not in contact with the sealing region) of the translucent glass substrate 4. Absent. Further, it is more preferable to coat the adhesive resin 14 using dipping because productivity is improved.

  The present invention may be an illumination device including the light emitting element according to the present invention. Accordingly, it is possible to provide a lighting device that has high luminous efficiency and excellent long-term reliability.

  Moreover, in each embodiment mentioned above, as shown in FIGS. 1-4, although the example which mounted one LED chip per one light emitting element 1 was shown, this invention is not limited to this, It is per one light emitting element. Two or more LED chips can be mounted. In this case, a plurality of anode electrodes 6a, cathode electrodes 6b, and insulating portions 8a and 8b may exist.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The present invention can be used for backlight light sources such as liquid crystal display devices or display panels, and light sources for illumination devices such as indoor lighting or outdoor lighting.

DESCRIPTION OF SYMBOLS 1 Light emitting element 2 Board | substrate 3 Reflector (reflective member)
4 Translucent glass substrate (translucent substrate)
5 Translucent sealing resin (translucent sealing body)
6a Anode electrode 6b Cathode electrode 7 Metal base portion 8a, 8b Insulating portion 9 Metal plating portion 10 LED chip

Claims (10)

A substrate provided with LED chips and electrode terminals;
A translucent substrate facing the substrate;
A reflection member provided between the substrate and the translucent substrate so as to surround a region where the LED chip and the electrode terminal are formed, and having a surface covered with a metal;
A light-emitting element, wherein a sealing region surrounded by the substrate, the reflection member, and the light-transmitting substrate is filled with a light-transmitting sealing body.   The resin is provided in a region that is in contact with the reflective member and the translucent substrate and that is opposite to the sealing region with the reflective member interposed therebetween. The light emitting element as described in.   The light emitting element according to claim 2, wherein the resin is provided on a surface of the translucent substrate that is not in contact with the sealing region.   The light emitting element according to any one of claims 1 to 3, wherein the material of the translucent sealing body includes a dimethyl silicone resin.   The light-emitting element according to claim 1, wherein the light-transmitting sealing body includes a fluorescent material.   6. The light-emitting element according to claim 1, wherein a cross-sectional area of the reflecting member in a direction horizontal to the substrate increases from the translucent substrate side toward the substrate side. .   The light-emitting element according to claim 1, wherein the reflecting member is plated with silver, palladium, or platinum.   The light-emitting element according to claim 2, wherein the resin includes an epoxy resin or a modified silicone resin.   9. A film containing a fluorescent material is provided on at least one of a surface facing the substrate and a surface opposite to the surface facing the substrate of the translucent substrate. 2. A light emitting device according to item 1.   An illumination device comprising the light emitting element according to claim 1.

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