CN102870243B - 具有圆角正方形透镜的led封装 - Google Patents

具有圆角正方形透镜的led封装 Download PDF

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Publication number
CN102870243B
CN102870243B CN201180022974.4A CN201180022974A CN102870243B CN 102870243 B CN102870243 B CN 102870243B CN 201180022974 A CN201180022974 A CN 201180022974A CN 102870243 B CN102870243 B CN 102870243B
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China
Prior art keywords
lens
led die
width
led
package
Prior art date
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Active
Application number
CN201180022974.4A
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English (en)
Chinese (zh)
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CN102870243A (zh
Inventor
M.布特沃思
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Lumileds LLC
Original Assignee
Koninklijke Philips Electronics NV
Philips Lumileds Lighing Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of CN102870243A publication Critical patent/CN102870243A/zh
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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0009Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
    • G02B19/0014Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/853Encapsulations characterised by their shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/8506Containers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
CN201180022974.4A 2010-05-07 2011-04-27 具有圆角正方形透镜的led封装 Active CN102870243B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/775593 2010-05-07
US12/775,593 US8431942B2 (en) 2010-05-07 2010-05-07 LED package with a rounded square lens
PCT/IB2011/051851 WO2011138712A1 (en) 2010-05-07 2011-04-27 Led package with a rounded square lens

Publications (2)

Publication Number Publication Date
CN102870243A CN102870243A (zh) 2013-01-09
CN102870243B true CN102870243B (zh) 2015-12-16

Family

ID=44310361

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180022974.4A Active CN102870243B (zh) 2010-05-07 2011-04-27 具有圆角正方形透镜的led封装

Country Status (7)

Country Link
US (1) US8431942B2 (enExample)
EP (1) EP2567412B1 (enExample)
JP (1) JP6085555B2 (enExample)
KR (1) KR101811466B1 (enExample)
CN (1) CN102870243B (enExample)
TW (1) TWI528594B (enExample)
WO (1) WO2011138712A1 (enExample)

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US8967838B1 (en) * 2004-03-13 2015-03-03 David Christopher Miller Flexible LED substrate capable of being formed into a concave LED light source, concave light sources so formed and methods of so forming concave LED light sources
US10008637B2 (en) * 2011-12-06 2018-06-26 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
US9000466B1 (en) 2010-08-23 2015-04-07 Soraa, Inc. Methods and devices for light extraction from a group III-nitride volumetric LED using surface and sidewall roughening
US9583678B2 (en) 2009-09-18 2017-02-28 Soraa, Inc. High-performance LED fabrication
US10147850B1 (en) 2010-02-03 2018-12-04 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US8896235B1 (en) 2010-11-17 2014-11-25 Soraa, Inc. High temperature LED system using an AC power source
JP5814947B2 (ja) * 2011-01-20 2015-11-17 シャープ株式会社 発光装置、照明装置、表示装置及び発光装置の製造方法
US10211380B2 (en) 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
JP2014525146A (ja) 2011-07-21 2014-09-25 クリー インコーポレイテッド 発光デバイス、パッケージ、部品、ならびに改良された化学抵抗性のための方法および関連する方法
US10686107B2 (en) 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
US8686431B2 (en) 2011-08-22 2014-04-01 Soraa, Inc. Gallium and nitrogen containing trilateral configuration for optical devices
US9646827B1 (en) 2011-08-23 2017-05-09 Soraa, Inc. Method for smoothing surface of a substrate containing gallium and nitrogen
US8912025B2 (en) 2011-11-23 2014-12-16 Soraa, Inc. Method for manufacture of bright GaN LEDs using a selective removal process
US9496466B2 (en) 2011-12-06 2016-11-15 Cree, Inc. Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
US9240530B2 (en) 2012-02-13 2016-01-19 Cree, Inc. Light emitter devices having improved chemical and physical resistance and related methods
US9343441B2 (en) 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
TWI459600B (zh) * 2012-07-06 2014-11-01 隆達電子股份有限公司 發光二極體封裝體及其製造方法
US9978904B2 (en) 2012-10-16 2018-05-22 Soraa, Inc. Indium gallium nitride light emitting devices
US9761763B2 (en) 2012-12-21 2017-09-12 Soraa, Inc. Dense-luminescent-materials-coated violet LEDs
US8994033B2 (en) 2013-07-09 2015-03-31 Soraa, Inc. Contacts for an n-type gallium and nitrogen substrate for optical devices
US9419189B1 (en) 2013-11-04 2016-08-16 Soraa, Inc. Small LED source with high brightness and high efficiency
KR101583647B1 (ko) * 2013-12-10 2016-01-11 희성전자 주식회사 발광다이오드용 광 편향 렌즈
KR102107526B1 (ko) * 2014-03-13 2020-05-07 엘지이노텍 주식회사 발광 소자 패키지
KR101668353B1 (ko) * 2014-11-03 2016-10-21 (주)포인트엔지니어링 칩 기판 및 칩 패키지 모듈
JP6183487B2 (ja) * 2015-03-31 2017-08-23 日亜化学工業株式会社 発光装置とそれを用いた発光モジュール
US10411173B2 (en) 2015-03-31 2019-09-10 Nichia Corporation Light emitting device and light emitting module using the same
KR102409961B1 (ko) 2015-06-26 2022-06-16 삼성전자주식회사 광학소자 및 이를 포함하는 발광소자 패키지
JP7417067B2 (ja) * 2020-01-30 2024-01-18 日亜化学工業株式会社 発光装置
CN112614925A (zh) * 2020-12-24 2021-04-06 广东晶科电子股份有限公司 一种发光装置及模组

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070029569A1 (en) * 2005-08-04 2007-02-08 Peter Andrews Packages for semiconductor light emitting devices utilizing dispensed encapsulants and methods of packaging the same
US20080157114A1 (en) * 2004-11-15 2008-07-03 Philips Lumileds Lighting Company, Llc Multiple Lenses Molded Over LED Die
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
EP2065948A2 (en) * 2007-11-28 2009-06-03 Stanley Electric Co., Ltd. Semiconductor light emitting device and lighting device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001077425A (ja) * 1999-08-31 2001-03-23 Yoshinobu Suehiro 発光素子
JP3905343B2 (ja) 2001-10-09 2007-04-18 シチズン電子株式会社 発光ダイオード
US7452737B2 (en) 2004-11-15 2008-11-18 Philips Lumileds Lighting Company, Llc Molded lens over LED die
DE102006050880A1 (de) 2006-06-30 2008-04-17 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Beleuchtungseinrichtung
USD598871S1 (en) 2006-11-06 2009-08-25 Koninklijke Philips Electronics N.V. Et Al. LED package
US7964888B2 (en) 2007-04-18 2011-06-21 Cree, Inc. Semiconductor light emitting device packages and methods
TWM332938U (en) 2007-08-17 2008-05-21 Lighthouse Technology Co Ltd Surface mount type light emitting diode package device
US20090065792A1 (en) 2007-09-07 2009-03-12 3M Innovative Properties Company Method of making an led device having a dome lens
JP2010050236A (ja) 2008-08-20 2010-03-04 Mitsubishi Chemicals Corp 半導体発光装置およびその製造方法
WO2010021346A1 (ja) * 2008-08-20 2010-02-25 三菱化学株式会社 半導体発光装置およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080157114A1 (en) * 2004-11-15 2008-07-03 Philips Lumileds Lighting Company, Llc Multiple Lenses Molded Over LED Die
US20070029569A1 (en) * 2005-08-04 2007-02-08 Peter Andrews Packages for semiconductor light emitting devices utilizing dispensed encapsulants and methods of packaging the same
US20090108281A1 (en) * 2007-10-31 2009-04-30 Cree, Inc. Light emitting diode package and method for fabricating same
EP2065948A2 (en) * 2007-11-28 2009-06-03 Stanley Electric Co., Ltd. Semiconductor light emitting device and lighting device

Also Published As

Publication number Publication date
EP2567412B1 (en) 2019-06-26
KR101811466B1 (ko) 2017-12-21
JP2013526075A (ja) 2013-06-20
KR20130098886A (ko) 2013-09-05
US20110272721A1 (en) 2011-11-10
CN102870243A (zh) 2013-01-09
TWI528594B (zh) 2016-04-01
TW201205889A (en) 2012-02-01
WO2011138712A1 (en) 2011-11-10
JP6085555B2 (ja) 2017-02-22
EP2567412A1 (en) 2013-03-13
US8431942B2 (en) 2013-04-30

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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: Eindhoven, Netherlands

Co-patentee after: LUMILEDS LLC

Patentee after: KONINKLIJKE PHILIPS N.V.

Address before: Eindhoven, Netherlands

Co-patentee before: Philips Ramildes Lighting Equipment Co.,Ltd.

Patentee before: KONINKLIJKE PHILIPS ELECTRONICS N.V.

CP01 Change in the name or title of a patent holder
TR01 Transfer of patent right

Effective date of registration: 20200901

Address after: Holland Schiphol

Patentee after: KONINKLIJKE PHILIPS NV

Address before: Eindhoven, Netherlands

Co-patentee before: LUMILEDS LLC

Patentee before: KONINKLIJKE PHILIPS N.V.

TR01 Transfer of patent right