CN102869236B - 用于功率模块的冷却装置及其相关方法 - Google Patents

用于功率模块的冷却装置及其相关方法 Download PDF

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Publication number
CN102869236B
CN102869236B CN201210323662.3A CN201210323662A CN102869236B CN 102869236 B CN102869236 B CN 102869236B CN 201210323662 A CN201210323662 A CN 201210323662A CN 102869236 B CN102869236 B CN 102869236B
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China
Prior art keywords
inlet
cooling
substrate
cooling medium
passage
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Chinese (zh)
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CN102869236A (zh
Inventor
R·A·博普雷
J·L·斯莫伦斯基
W·D·格斯特勒
申晓春
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General Electric Co
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General Electric Co
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling
    • Y10T29/49817—Disassembling with other than ancillary treating or assembling

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201210323662.3A 2011-06-24 2012-06-25 用于功率模块的冷却装置及其相关方法 Active CN102869236B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/168030 2011-06-24
US13/168,030 2011-06-24
US13/168,030 US8982558B2 (en) 2011-06-24 2011-06-24 Cooling device for a power module, and a related method thereof

Publications (2)

Publication Number Publication Date
CN102869236A CN102869236A (zh) 2013-01-09
CN102869236B true CN102869236B (zh) 2017-03-01

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CN201210323662.3A Active CN102869236B (zh) 2011-06-24 2012-06-25 用于功率模块的冷却装置及其相关方法

Country Status (6)

Country Link
US (1) US8982558B2 (https=)
EP (1) EP2538440B1 (https=)
JP (1) JP6050617B2 (https=)
CN (1) CN102869236B (https=)
BR (1) BR102012015581A2 (https=)
CA (1) CA2780658C (https=)

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EP2523215B1 (en) * 2011-05-13 2015-02-18 ABB Oy Liquid cooling element
TWI489741B (zh) * 2013-12-20 2015-06-21 Ind Tech Res Inst 具有散熱功能之馬達驅控器及其散熱方法
US20150195951A1 (en) * 2014-01-06 2015-07-09 Ge Aviation Systems Llc Cooled electronic assembly and cooling device
US10576589B2 (en) * 2014-09-30 2020-03-03 The Boeing Company Cooling system for use with a power electronics assembly and method of manufacturing thereof
US9865522B2 (en) 2014-11-18 2018-01-09 International Business Machines Corporation Composite heat sink structures
US9345169B1 (en) 2014-11-18 2016-05-17 International Business Machines Corporation Liquid-cooled heat sink assemblies
TWI590571B (zh) * 2014-12-08 2017-07-01 強生控制科技公司 可變速驅動器系統及冷卻系統
US9538691B2 (en) * 2015-04-15 2017-01-03 Ford Global Technologies, Llc Power inverter for a vehicle
US10265812B2 (en) 2015-08-12 2019-04-23 International Business Machines Corporation Liquid-cooled, composite heat sink assemblies
US9980415B2 (en) * 2015-08-20 2018-05-22 Toyota Motor Engineering & Manufacturing North America, Inc. Configurable double-sided modular jet impingement assemblies for electronics cooling
CN106785823A (zh) * 2017-03-24 2017-05-31 武汉大学 一种用于高功率光纤激光器的扰流式微通道散热器
CN107101358A (zh) * 2017-06-06 2017-08-29 广东美的暖通设备有限公司 空调器的电控箱及空调器
US10822096B2 (en) * 2018-03-30 2020-11-03 Ge Aviation Systems Llc Avionics cooling module
CN113437031B (zh) * 2021-06-17 2024-06-07 西北工业大学 一种基于液态金属的嵌入式微通道散热装置
US11723173B1 (en) * 2022-03-23 2023-08-08 Rolls-Royce Corporation Stacked cold plate with flow guiding vanes and method of manufacturing
CN115055952B (zh) * 2022-07-06 2024-03-08 珠海格力电器股份有限公司 用于功率器件装配的螺钉自动旋拧装置及旋拧方法

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US20100226093A1 (en) * 2009-03-09 2010-09-09 General Electric Company Methods for making millichannel substrate, and cooling device and apparatus using the substrate
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CN101103659A (zh) * 2004-11-24 2008-01-09 通用电气公司 带有用于功率器件的微槽道冷却的散热器
CN1942088A (zh) * 2005-09-29 2007-04-04 三星电子株式会社 散热组件
US20070153474A1 (en) * 2005-12-29 2007-07-05 Jesper Alexander Andersen Cooling system and method of use
CN101377392A (zh) * 2007-08-27 2009-03-04 Abb研究有限公司 热交换器
US20100226093A1 (en) * 2009-03-09 2010-09-09 General Electric Company Methods for making millichannel substrate, and cooling device and apparatus using the substrate
US20100302734A1 (en) * 2009-05-29 2010-12-02 General Electric Company Heatsink and method of fabricating same

Also Published As

Publication number Publication date
BR102012015581A2 (pt) 2013-10-29
JP2013016794A (ja) 2013-01-24
EP2538440A3 (en) 2017-12-27
CN102869236A (zh) 2013-01-09
CA2780658C (en) 2019-08-06
US20120327603A1 (en) 2012-12-27
EP2538440A2 (en) 2012-12-26
EP2538440B1 (en) 2020-05-06
JP6050617B2 (ja) 2016-12-21
US8982558B2 (en) 2015-03-17
CA2780658A1 (en) 2012-12-24

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