CN102856393A - Chip-diode structure - Google Patents
Chip-diode structure Download PDFInfo
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- CN102856393A CN102856393A CN2012103764126A CN201210376412A CN102856393A CN 102856393 A CN102856393 A CN 102856393A CN 2012103764126 A CN2012103764126 A CN 2012103764126A CN 201210376412 A CN201210376412 A CN 201210376412A CN 102856393 A CN102856393 A CN 102856393A
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- small end
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Abstract
The invention relates to a chip-diode structure, comprising a chip, welding pieces and a pair of pins. The innovative points are that the upper pin and the lower pin are I-shaped; one end of the upper pin and one end of the lower pin are round-large end surfaces, and the other ends of the upper pin and the lower pin are round-small end surfaces; the round-small end surface of the lower pin is provided with a boss; the round-small end surface of the upper pin is of a planar structure; a P electrode of the chip is fixedly welded with the round-small end surface of the lower pin by one welding piece; an N electrode of the chip is fixedly welded with the round-small end surface of the upper pin by the other welding piece; the round-small end surface of the lower pin is provided with a boss, so that the incomplete contact of the P electrode of the welded chip and the round-small end surface of the lower pin is ensured to prevent from causing heating expansion and falling in the use process; and since the round-small end surface of the upper pin is of the planar structure and the welding pieces are melted in the welding process, under the action of liquid tension of the welding pieces, the round-small end surface of the upper pin is completely contacted and matched with the N electrode of the chip, and no offset of the upper pin is ensured, so that the concentricity is ensured.
Description
Technical field
The present invention relates to a kind of stamp-mounting-paper diode structure, the stamp-mounting-paper diode structure that particularly a kind of concentricity is high.
Background technology
Stamp-mounting-paper diode MINIMELF(DO-213AA), it is used for rectification and is particular about the circuit board space portable application.Its structure comprises a pair of upper and lower pin, and it is I-shaped, and an end of pin is circular large end face, and the other end is circular small end face, and the P of chip, the N utmost point are welded and fixed by weld tabs and this circular small end face to pin.Cause for the circular small end face that prevents pin after welding and the chip P utmost point fit like a glove that the extremely peripheral insulating barrier expanded by heating that arranges of P comes off in the use procedure, the circular small end face at pin arranges salient point usually.The shortcoming of this kind structure is: when welding, lower pin places first in the cylindrical die cavity of graphite boat, and its circular large end face props up cylindrical cavity bottom, can guarantee that the axis of lower pin is vertical; Because the circular small end face area of upper pin, makes its possibility run-off the straight, skew in graphite boat less than the cylindrical die cavity cross section of graphite boat, pin and the chip concentricity of diode are poor after the welding, affect product quality.
Summary of the invention
The technical problem to be solved in the present invention provides extremely peripheral insulating barrier difficult drop-off and the high stamp-mounting-paper diode structure of concentricity that arranges of a kind of P.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of stamp-mounting-paper diode structure, comprise chip, weld tabs and pair of pins, and its innovative point is: described upper and lower pin is I-shaped, one end of I-shaped upper and lower pin is circular large end face, and the other end is circular small end face; Be provided with projection on the circular small end face of described lower pin, the circular small end face of upper pin is planar structure; The P utmost point of described chip is welded and fixed by the circular small end face of weld tabs and lower pin, and the N utmost point of chip is welded and fixed by the circular small end face of weld tabs and upper pin.
The invention has the advantages that: before the welding, lower pin, lower weld tabs, chip, upper weld tabs and upper pin are from bottom to top successively in the overlapping cylindrical die cavity that places graphite boat, and the P of chip is extremely downward, the circular small end face end face of lower pin is provided with projection, the P utmost point of guaranteeing to weld rear chip and the circular small end face of lower pin can not contact fully and cause that expanded by heating comes off in the use procedure, and because the circular small end face of upper pin is planar structure, melt at weld tabs in the welding process, under the effect of weld tabs liquid tension, the circular small end face of upper pin contacts extremely fully with the N of chip and coincide, guarantee that upper pin can not be offset, and has guaranteed concentricity.
Description of drawings
Fig. 1 is stamp-mounting-paper diode structural representation of the present invention.
Fig. 2 is state diagram before the stamp-mounting-paper diode welding of the present invention.
Embodiment
As shown in Figure 1, 2, comprise pin 1, lower pin 2, projection 3, chip 4, lower weld tabs 5 and upper weld tabs 6.
Above-mentioned upper pin 1 and lower pin 2 are I-shaped, and an end of I-shaped upper pin 1 and lower pin 2 is circular large end face, and the other end is circular small end face.Wherein, the circular small end face of upper pin 1 is planar structure, and the circular small end face end face of lower pin 2 is provided with projection 3.
The P utmost point of chip 4 is welded and fixed by the circular small end face of lower weld tabs 5 with lower pin 2, and the N utmost point of chip 4 is welded and fixed by the circular small end face of upper weld tabs 6 with upper pin 1.
Operation principle: before the welding, as shown in Figure 2, lower pin 2, lower weld tabs 5, chip 4, upper weld tabs 6 and upper pin 1 are from bottom to top successively in the overlapping cylindrical die cavity that places graphite boat 7, and the P of chip 4 is extremely downward, the circular small end face end face of lower pin 2 is provided with projection, the P utmost point of guaranteeing to weld rear chip 4 and the circular small end face of lower pin 2 can not contact fully and cause that expanded by heating comes off in the use procedure, and because the circular small end face of upper pin 1 is planar structure, melt at weld tabs in the welding process, under the effect of weld tabs liquid tension, upper pin 1 circular small end face contacts extremely fully with the N of chip 4 and coincide, and guarantees that upper pin can not be offset, and has guaranteed concentricity.
Claims (1)
1. a stamp-mounting-paper diode structure comprises chip, weld tabs and pair of pins, it is characterized in that: described upper and lower pin is I-shaped, and an end of I-shaped upper and lower pin is circular large end face, and the other end is circular small end face; Be provided with projection on the circular small end face of described lower pin, the circular small end face of upper pin is planar structure; The P utmost point of described chip is welded and fixed by the circular small end face of weld tabs and lower pin, and the N utmost point of chip is welded and fixed by the circular small end face of weld tabs and upper pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103764126A CN102856393A (en) | 2012-10-08 | 2012-10-08 | Chip-diode structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103764126A CN102856393A (en) | 2012-10-08 | 2012-10-08 | Chip-diode structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102856393A true CN102856393A (en) | 2013-01-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103764126A Pending CN102856393A (en) | 2012-10-08 | 2012-10-08 | Chip-diode structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102856393A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109712900A (en) * | 2018-12-28 | 2019-05-03 | 安徽龙芯微科技有限公司 | Semiconductor weld tabs arrangement apparatus |
| CN113451234A (en) * | 2021-05-14 | 2021-09-28 | 上海维攀微电子有限公司 | Paster TVS diode |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5234865A (en) * | 1991-03-28 | 1993-08-10 | Robert Bosch Gmbh | Method of soldering together two components |
| CN201156541Y (en) * | 2008-02-20 | 2008-11-26 | 苏州固锝电子股份有限公司 | Novel lead wire of electrode of semiconductor diode |
| CN201518319U (en) * | 2009-09-21 | 2010-06-30 | 常州佳讯光电产业发展有限公司 | Special axial high-power solar diode |
| CN202917498U (en) * | 2012-10-08 | 2013-05-01 | 如皋市易达电子有限责任公司 | Chip-diode structure |
-
2012
- 2012-10-08 CN CN2012103764126A patent/CN102856393A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5234865A (en) * | 1991-03-28 | 1993-08-10 | Robert Bosch Gmbh | Method of soldering together two components |
| CN201156541Y (en) * | 2008-02-20 | 2008-11-26 | 苏州固锝电子股份有限公司 | Novel lead wire of electrode of semiconductor diode |
| CN201518319U (en) * | 2009-09-21 | 2010-06-30 | 常州佳讯光电产业发展有限公司 | Special axial high-power solar diode |
| CN202917498U (en) * | 2012-10-08 | 2013-05-01 | 如皋市易达电子有限责任公司 | Chip-diode structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109712900A (en) * | 2018-12-28 | 2019-05-03 | 安徽龙芯微科技有限公司 | Semiconductor weld tabs arrangement apparatus |
| CN109712900B (en) * | 2018-12-28 | 2020-06-19 | 安徽龙芯微科技有限公司 | Semiconductor soldering lug arranging device |
| CN113451234A (en) * | 2021-05-14 | 2021-09-28 | 上海维攀微电子有限公司 | Paster TVS diode |
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Application publication date: 20130102 |