CN203368961U - A SMT bridging structure - Google Patents
A SMT bridging structure Download PDFInfo
- Publication number
- CN203368961U CN203368961U CN 201320391041 CN201320391041U CN203368961U CN 203368961 U CN203368961 U CN 203368961U CN 201320391041 CN201320391041 CN 201320391041 CN 201320391041 U CN201320391041 U CN 201320391041U CN 203368961 U CN203368961 U CN 203368961U
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- shape pad
- smt
- bridging structure
- concave shape
- base plate
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Abstract
The utility model provides a SMT bridging structure. The SMT bridging structure comprises a soft substrate and a hard substrate. A U-shaped bonding pad is printed on the soft substrate and the hard substrate is arranged corresponding to the soft substrate. A T-shaped bonding pad corresponding to the U-shaped bonding pad is printed on the hard substrate and is soldered on the U-shaped bonding pad through reflow soldering technology. The SMT bridging structure enables firm and reliable electrical connection between the soft substrate and the hard substrate, prevents a case that the soft substrate is lifted by tin in a reflow soldering process, and may effectively prevent poor electrical connection caused by warped bonding pads.
Description
Technical field
The utility model relates to electronics mount technology field, is specifically related to a kind of SMT bridging structure.
Background technology
Electronics paster field, the application of soft base plate and hard substrate is very wide, the particularly application of soft base plate and aluminium base.To the welding of soft base plate and aluminium base, traditional handicraft is manual welding.But due to the perfect heat-dissipating of aluminium base, so that the heat of electric iron is shed very soon.And it is long to cause welding required time, welding effect is poor, the phenomenons such as tin point, Xi Dong usually occur.
At present, the welding of soft base plate and aluminium base, generally adopt solder reflow process to carry out.Soft base plate and aluminium base do not have specific structure, and direct splicing together.In practice, often occur that the electrical connection of soft base plate and aluminium base is smooth, soft base plate is by undesirable conditions such as tin jack-up, tin point, Xi Dong, and then has influence on the quality of electronic circuit.
The utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of SMT bridging structure, and for solving, prior art soft base plate and aluminium base electrical connection are smooth, soft base plate is by the problem of tin jack-up, tin point, Xi Dong.
Reach for achieving the above object other relevant purposes, the utility model provides a kind of SMT bridging structure, comprising: soft base plate is printed with the concave shape pad; Hard substrate, corresponding described soft base plate setting, be printed with the convex shape pad for the described concave shape pad of correspondence, and described convex shape pad welds mutually by solder reflow process and described concave shape pad.
Preferably, described hard substrate is aluminium base.Described soft base plate is without the reinforcement soft base plate.
Preferably, in described concave shape pad, the indent degree of depth equals the length of described convex shape pad evagination.
Preferably, the width of described concave shape pad is less than the width of described convex shape pad.
Preferably, in described concave shape pad, the indent region area is less than described convex shape pad evagination area.
As mentioned above, SMT bridging structure of the present utility model, have following beneficial effect: owing to being printed with the concave shape pad on soft base plate, on hard substrate, be printed with the convex shape pad for the described concave shape pad of correspondence, institute is so that soft base plate is more solid and reliable with hard substrate electrical connection; Again because the indent degree of depth in described concave shape pad equals the length of described convex shape pad evagination, so that not there will be soft base plate by the situation of tin jack-up in solder reflow process; Once large change tin area and bridge joint area be less than the width of described convex shape pad due to the width of described concave shape pad, so can effectively be avoided the perk of pad and cause being electrically connected undesirable condition again.
The accompanying drawing explanation
Fig. 1 is shown as SMT bridging structure the first embodiment schematic diagram of the present utility model;
Fig. 2 is shown as SMT bridging structure the second embodiment schematic diagram of the present utility model.
Embodiment
Below by particular specific embodiment, execution mode of the present utility model is described, person skilled in the art scholar can understand other advantages of the present utility model and effect easily by the disclosed content of this specification.
Refer to Fig. 1, Fig. 2.Notice, appended graphic the illustrated structure of this specification, ratio, size etc., equal contents in order to coordinate specification to disclose only, understand and read for person skilled in the art scholar, not in order to limit the enforceable qualifications of the utility model, therefore the technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under the effect that the utility model can produce and the purpose that can reach, all should still drop on the technology contents that the utility model discloses and obtain in the scope that can contain.Simultaneously, in this specification, quote as " on ", D score, " left side ", " right side ", " centre " reach the term of " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, under without essence change technology contents, when also being considered as the enforceable category of the utility model.
As shown in Figure 1, the utility model provides a kind of the first embodiment of SMT bridging structure, and the first embodiment of described SMT bridging structure comprises soft base plate 1 and hard substrate 2.
Be printed with concave shape pad 11 on described soft base plate 1, the rectangular shape of described concave shape pad 11 inner fovea part.In the present embodiment, described soft base plate is without the reinforcement soft base plate.
The corresponding described soft base plate 1 of described hard substrate 2 arranges, be printed with the convex shape pad 22 for the described concave shape pad 11 of correspondence on described hard substrate 2, the concave shape pad 11 of the rectangular shape of corresponding above-mentioned inner fovea part, described convex shape pad 22 male part are rectangular shape also, so can guarantee when described convex shape pad 22 welds with described concave shape pad 11 mutually by solder reflow process the high fastness of combination between the two.
In the present embodiment, in described concave shape pad 11, the indent degree of depth equals the evagination length of described convex shape pad 22, the width of described concave shape pad 11 is less than the width of described convex shape pad 22, in described concave shape pad 11, the indent region area is less than described convex shape pad 22 evagination areas, so can guarantee that the two electrical connection quality formed is good, more reliable in solder reflow process.
In the present embodiment, described hard substrate 2 is aluminium base, but is not limited to this, and in other execution mode, described hard substrate also can rigid materials such as alloy, copper.
As shown in Figure 2, the utility model provides a kind of the second embodiment of SMT bridging structure, and the second embodiment of described SMT bridging structure comprises soft base plate 1 and hard substrate 2.
Be printed with concave shape pad 11 on described soft base plate 1, described concave shape pad 11 inner fovea parts are the semiellipse shape.In the present embodiment, soft base plate is without the reinforcement soft base plate.
The corresponding described soft base plate 1 of described hard substrate 2 arranges, be printed with the convex shape pad 22 for the described concave shape pad 11 of correspondence on described hard substrate 2, corresponding above-mentioned inner fovea part is the concave shape pad 11 of semiellipse shape, described convex shape pad 22 male part also are the semiellipse shape, so can guarantee when described convex shape pad 22 welds with described concave shape pad 11 mutually by solder reflow process the high fastness of combination between the two.
In the present embodiment, in described concave shape pad 11, the indent degree of depth equals the evagination length of described convex shape pad 22, the width of described concave shape pad 11 is less than the width of described convex shape pad 22, in described concave shape pad 11, the indent region area is less than described convex shape pad 22 evagination areas, so can guarantee that the two electrical connection quality formed is good, more reliable in solder reflow process.
In the present embodiment, described hard substrate 2 is aluminium base, but is not limited to this, and in other execution mode, described hard substrate also can rigid materials such as alloy, copper.
In the utility model, the inner fovea part of described concave shape pad can also be other shapes, as triangle, semicircle etc.; Described convex shape pad can also be for other shapes corresponding with described convex shape pad, as triangle, semicircle etc.
In sum, the utility model, simple in structure, good fixing effect, the electrical connection quality is good, makes solder reflow process more reliable etc.So the utility model has effectively overcome various shortcoming of the prior art and the tool high industrial utilization.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all can, under spirit of the present utility model and category, be modified or be changed above-described embodiment.Therefore, have in technical field under such as and usually know that the knowledgeable modifies or changes not breaking away from all equivalences that complete under spirit that the utility model discloses and technological thought, must be contained by claim of the present utility model.
Claims (6)
1. a SMT bridging structure, is characterized in that, comprising:
Soft base plate, be printed with the concave shape pad;
Hard substrate, corresponding described soft base plate setting, be printed with the convex shape pad for the described concave shape pad of correspondence, and described convex shape pad welds mutually by solder reflow process and described concave shape pad.
2. SMT bridging structure according to claim 1, it is characterized in that: described hard substrate is aluminium base.
3. SMT bridging structure according to claim 1 is characterized in that: described soft base plate is for without the reinforcement soft base plate.
4. SMT bridging structure according to claim 1, it is characterized in that: in described concave shape pad, the indent degree of depth equals the length of described convex shape pad evagination.
5. according to the described SMT bridging structure of claim 1 or 4, it is characterized in that: the width of described concave shape pad is less than the width of described convex shape pad.
6. according to the described SMT bridging structure of claim 1 or 4, it is characterized in that: in described concave shape pad, the indent region area is less than described convex shape pad evagination area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320391041 CN203368961U (en) | 2013-07-02 | 2013-07-02 | A SMT bridging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320391041 CN203368961U (en) | 2013-07-02 | 2013-07-02 | A SMT bridging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203368961U true CN203368961U (en) | 2013-12-25 |
Family
ID=49816668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320391041 Expired - Lifetime CN203368961U (en) | 2013-07-02 | 2013-07-02 | A SMT bridging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203368961U (en) |
-
2013
- 2013-07-02 CN CN 201320391041 patent/CN203368961U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131225 |