CN203553135U

CN203553135U - Transistor electrode cooling fin

Info

Publication number: CN203553135U
Application number: CN201320668781.2U
Authority: CN
Inventors: 李伟强
Original assignee: Acbel Electronics Dongguan Co Ltd
Current assignee: Acbel Electronics Dongguan Co Ltd
Priority date: 2013-10-28
Filing date: 2013-10-28
Publication date: 2014-04-16
Anticipated expiration: 2023-10-28

Abstract

The utility model relates to a transistor electrode cooling fin. One electrode of a transistor is electrically connected onto a circuit board and the transistor electrode cooling fin comprises a cooling plate and a welding pin with a notch; when the cooling fin is welded on the circuit board, the contact area of the welding pin with the notch and welding tin is larger than the contact area of a welding pin without a notch and welding tin; the adhesive force between the welding pin with the notch and welding tin is then large; when the welding tin is solidified, the solidified welding tin is embedded in the notch of the welding pin and is clamped with the notch, stability of the cooling fin fixedly connected to the circuit board is further enhanced, and thus, when the cooling fin is shaken due to an external force, tin cracking or tin falling phenomenon is not likely to happen to the welding tin at the welding place.

Description

Transistorized electrode fin

Technical field

The utility model is a kind of fin, espespecially a kind of transistorized electrode fin.

Background technology

Printed circuit board (PCB) is one of assembly indispensable in present all electronic products, and on printed circuit board (PCB), is welded with electronic building brick miscellaneous, similarly is resistance, electric pole, electric capacity, diode or three polar bodys.When various electronic building bricks are welded on printed circuit board (PCB), first by corresponding welding hole in the welding foot insertion printed circuit board (PCB) of each electronic building brick, re-use scolding tin the copper ring on printed circuit board (PCB) is electrically connected mutually with the welding foot of this electronic building brick, and this electronic building brick is fixed on printed circuit board (PCB).

But some electronic building brick, when power-on servicing, can produce high temperature, if heat energy cannot leave in real time, to reduce temperature, this electronic building brick will Yin Gaowen and damage, therefore conventionally can set up a fin on this type of electronic building brick.But some fin volume is excessive or preponderance, and cannot depend merely on electronic building brick welding foot support time, those fin also can include welding foot simultaneously, are welded on circuit board with electronic building brick simultaneously, affixed with circuit board.In addition, fin is that metal is made, therefore also there is the function that a wherein electrode of electronic building brick is electrically connected to circuit board, this fin is to be electrically connected with a wherein electrode of electronic building brick, and its welding foot is in this circuit board electrical connection, to reach the object that the electrode of electronic building brick is electrically connected to circuit board.

Refer to shown in Fig. 5, the fin 40 of prior art has heating panel 41 and a welding foot 42, its welding foot 42 is the wherein sidewalls that form in this heating panel 41, and the side wall surface of this welding foot 42 is respectively a plane, therefore when being soldered to a circuit board 20, can only rely on the adhesive force between scolding tin 30 and welding foot 42, fin 40 is fixed on this circuit board 20, and the contact-making surface between scolding tin 30 and welding foot 42 is a plane, easily relative sliding, adhesive force between scolding tin 30 and this welding foot 42 makes fin 40 be subject to after external force dandle not simultaneously, firm being welded on circuit board unceasingly, as shown in Figure 4, the contact area of this welding foot 42 and scolding tin 30 only has the surface area of welding foot 42, contact area determines the key of adhesive force size, make after this fin 40 is being rocked, this weld easily has the situation of splitting tin or get loose to occur, therefore the welding foot 42 of prior art fin 40 is necessary further improvement.

Summary of the invention

Because the shortcoming of aforementioned prior art, the utility model object is to provide a kind of transistorized electrode fin, while making this transistorized electrode fin be soldered on a circuit board, this welding foot can have more and contact area scolding tin, allow being welded on this circuit board that fin can be more firm, be difficult for getting loose.

For reaching above-mentioned utility model object, the technological means system that the utility model adopts makes this transistorized electrode fin include:

One heating panel;

At least one welding foot, a sidewall of this heating panel stretches out certainly, and a wherein side wall surface indent of each welding foot is formed with a breach.

The utility model has the advantage of, a wherein side wall surface indent at the welding foot of fin is formed with a breach, increased the surface area of this welding foot, while allowing this welding foot be soldered on a circuit board, can there is more contact area with scolding tin, and then strengthen the adhesive force between scolding tin and welding foot, fin can be more firmly welded on this circuit board.In addition, after scolding tin solidifies, this scolding tin after solidifying chimeric enter the breach of this welding foot, engage with this breach, further strengthen fin and be fixed in the stability of circuit board, thus, weld tactile scolding tin and be not easy produce solder crack or come off.

Accompanying drawing explanation

Fig. 1 is the stereo appearance figure of the utility model preferred embodiment.

Fig. 2 is the stereo appearance figure of the utility model preferred embodiment while being equiped with transistor.

Fig. 3 is the part sectioned view of the utility model preferred embodiment while being soldered to circuit board.

Fig. 4 is the part sectioned view of prior art fin while being soldered to circuit board.

Fig. 5 is the stereo appearance figure of prior art fin.

Embodiment

Below coordinate accompanying drawing and preferred embodiment of the present utility model, further set forth the technological means that the utility model is taked for reaching predetermined utility model object.

Refer to shown in Fig. 1, the utility model includes a fin 10, it has a heating panel 11, at least one welding foot 12 and a fixing hole 13, this welding foot 12 is a wherein sidewall that forms in this heating panel 11, and each welding foot 12 has respectively at least one breach 121, another sidewall of this heating panel 11 wears and is formed with this fixing hole 13, and this welding foot wherein relative two side wall surfaces is broad side walls face, and other two relative side wall surfaces are narrow side wall surface.In this preferred embodiment, this sidewall that is formed with welding foot 11 is the diapire of this heating panel 11, and this fin 10 has two welding foots 12, and each welding foot 12 has respectively two breach 121; And each welding foot is flat, two breach concave respectively in the narrow side wall surface of welding foot.

Refer to shown in Fig. 2, when a transistor 14 is wanted when affixed with this fin 10, after corresponding the fixing hole 13 of the fixing hole of this transistor 14 and this fin 10, this transistor 14 is fitted with this fin and is used screw and nut to see through the corresponding fixing hole 13 of this fin 10 and the fixing hole of this transistor 14 by sealed this fin 10 of this transistor AND gate, allows this transistor be fixed on this fin 10.

Refer to shown in Fig. 3, when this fin 10 is soldered to a circuit board 20, this welding foot 12 inserts in the welding hole of this circuit board 20, and will after scolding tin 30 meltings, flow into this welding hole, and this welding foot 12 and circuit board 20 make scolding tin 30 cooling curings after being full of the scolding tin 30 of melting between welding hole, compared with prior art, because welding foot 12 of the present utility model has this breach 121, make to have larger surface area compared with the welding foot 42 of this welding foot 12 and prior art, therefore and have more contact area between scolding tin 30, and larger adhesive force, when being subject to after external force dandle, this fin 10 can continue firm affixed with this circuit board 20, be difficult for the situation that solder crack occurs or come off.In this preferred embodiment, this breach 121 is seen fashionable from the broad side walls face of welding foot 12, can be rectangle, circular arc or polygon.

Furthermore, the breach 121 that the utility model heat radiation pin 12 has can make to flow into wherein after scolding tin 30 meltings, after this scolding tin 30 solidifies, chimeric enter the breach 121 of this heat radiation pin 12, engage 121 with the breach of this heat radiation pin 12, fin 10 is subject to after external force dandle, can also be firmly affixed with circuit board 20, to reach the purpose of this utility model.

The above is only preferred embodiment of the present utility model, not the utility model is done to any pro forma restriction, although the utility model discloses as above with preferred embodiment, but not in order to limit the utility model, any those skilled in the art, not departing from the scope of technical solutions of the utility model, when can utilizing the technology contents of above-mentioned announcement to make a little change or being modified to the equivalent embodiment of equivalent variations, in every case be the content that does not depart from technical solutions of the utility model, any simple modification of above embodiment being done according to technical spirit of the present utility model, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.

Claims

1. a transistorized electrode fin, is characterized in that including:

One heating panel;

2. transistorized electrode fin according to claim 1, is characterized in that: described each welding foot has two relative broad side walls face and two relative narrow side wall surfaces, and wherein this breach is formed at the narrow side wall surface of one.

3. transistorized electrode fin according to claim 2, is characterized in that: another relative narrow side wall surface indent is formed with a breach.

4. transistorized electrode fin according to claim 2, is characterized in that: the described breach side wall surface of comforting oneself is seen into being rectangle, circular arc or polygon.

5. according to the transistorized electrode fin described in any one in claim 1 to 4, it is characterized in that: on described heating panel, there is a fixing hole.