CN202917498U - Chip-diode structure - Google Patents
Chip-diode structure Download PDFInfo
- Publication number
- CN202917498U CN202917498U CN 201220511318 CN201220511318U CN202917498U CN 202917498 U CN202917498 U CN 202917498U CN 201220511318 CN201220511318 CN 201220511318 CN 201220511318 U CN201220511318 U CN 201220511318U CN 202917498 U CN202917498 U CN 202917498U
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- CN
- China
- Prior art keywords
- small end
- pin
- chip
- round
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The utility model relates to a chip-diode structure, comprising a chip, welding pieces and a pair of pins. The innovative points are that the upper pin and the lower pin are I-shaped; one end of the upper pin and one end of the lower pin are round-large end surfaces, and the other ends of the upper pin and the lower pin are round-small end surfaces; the round-small end surface of the lower pin is provided with a boss; the round-small end surface of the upper pin is of a planar structure; a P electrode of the chip is fixedly welded with the round-small end surface of the lower pin by one welding piece; an N electrode of the chip is fixedly welded with the round-small end surface of the upper pin by the other welding piece; the round-small end surface of the lower pin is provided with a boss, so that it is ensured to prevent the incomplete contact of the P electrode of the welded chip and the round-small end surface of the lower pin from causing heating expansion and falling in the use process; and since the round-small end surface of the upper pin is of the planar structure and the welding pieces are melted in the welding process, under the action of liquid tension of the welding pieces, the round-small end surface of the upper pin is completely contacted and matched with the N electrode of the chip, and no offset of the upper pin is ensured, so that the concentricity is ensured.
Description
Technical field
The utility model relates to a kind of stamp-mounting-paper diode structure, the stamp-mounting-paper diode structure that particularly a kind of concentricity is high.
Background technology
Stamp-mounting-paper diode MINIMELF(DO-213AA), it is used for rectification and is particular about the circuit board space portable application.Its structure comprises a pair of upper and lower pin, and it is I-shaped, and an end of pin is circular large end face, and the other end is circular small end face, and the P of chip, the N utmost point are welded and fixed by weld tabs and this circular small end face to pin.Cause for the circular small end face that prevents pin after welding and the chip P utmost point fit like a glove that the extremely peripheral insulating barrier expanded by heating that arranges of P comes off in the use procedure, the circular small end face at pin arranges salient point usually.The shortcoming of this kind structure is: when welding, lower pin places first in the cylindrical die cavity of graphite boat, and its circular large end face props up cylindrical cavity bottom, can guarantee that the axis of lower pin is vertical; Because the circular small end face area of upper pin, makes its possibility run-off the straight, skew in graphite boat less than the cylindrical die cavity cross section of graphite boat, pin and the chip concentricity of diode are poor after the welding, affect product quality.
Summary of the invention
The technical problems to be solved in the utility model provides extremely peripheral insulating barrier difficult drop-off and the high stamp-mounting-paper diode structure of concentricity that arranges of a kind of P.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of stamp-mounting-paper diode structure, comprise chip, weld tabs and pair of pins, its innovative point is: described upper and lower pin is I-shaped, one end of I-shaped upper and lower pin is circular large end face, and the other end is circular small end face; Be provided with projection on the circular small end face of described lower pin, the circular small end face of upper pin is planar structure; The P utmost point of described chip is welded and fixed by the circular small end face of weld tabs and lower pin, and the N utmost point of chip is welded and fixed by the circular small end face of weld tabs and upper pin.
The utility model has the advantage of: before the welding, lower pin, lower weld tabs, chip, upper weld tabs and upper pin are from bottom to top successively in the overlapping cylindrical die cavity that places graphite boat, and the P of chip is extremely downward, the circular small end face end face of lower pin is provided with projection, the P utmost point of guaranteeing to weld rear chip and the circular small end face of lower pin can not contact fully and cause that expanded by heating comes off in the use procedure, and because the circular small end face of upper pin is planar structure, melt at weld tabs in the welding process, under the effect of weld tabs liquid tension, the circular small end face of upper pin contacts extremely fully with the N of chip and coincide, guarantee that upper pin can not be offset, and has guaranteed concentricity.
Description of drawings
Fig. 1 is the utility model stamp-mounting-paper diode structural representation.
Fig. 2 is state diagram before the welding of the utility model stamp-mounting-paper diode.
Embodiment
As shown in Figure 1, 2, comprise pin 1, lower pin 2, projection 3, chip 4, lower weld tabs 5 and upper weld tabs 6.
Above-mentioned upper pin 1 and lower pin 2 are I-shaped, and an end of I-shaped upper pin 1 and lower pin 2 is circular large end face, and the other end is circular small end face.Wherein, the circular small end face of upper pin 1 is planar structure, and the circular small end face end face of lower pin 2 is provided with projection 3.
The P utmost point of chip 4 is welded and fixed by the circular small end face of lower weld tabs 5 with lower pin 2, and the N utmost point of chip 4 is welded and fixed by the circular small end face of upper weld tabs 6 with upper pin 1.
Operation principle: before the welding, as shown in Figure 2, lower pin 2, lower weld tabs 5, chip 4, upper weld tabs 6 and upper pin 1 are from bottom to top successively in the overlapping cylindrical die cavity that places graphite boat 7, and the P of chip 4 is extremely downward, the circular small end face end face of lower pin 2 is provided with projection, the P utmost point of guaranteeing to weld rear chip 4 and the circular small end face of lower pin 2 can not contact fully and cause that expanded by heating comes off in the use procedure, and because the circular small end face of upper pin 1 is planar structure, melt at weld tabs in the welding process, under the effect of weld tabs liquid tension, upper pin 1 circular small end face contacts extremely fully with the N of chip 4 and coincide, and guarantees that upper pin can not be offset, and has guaranteed concentricity.
Claims (1)
1. a stamp-mounting-paper diode structure comprises chip, weld tabs and pair of pins, it is characterized in that: described upper and lower pin is I-shaped, and an end of I-shaped upper and lower pin is circular large end face, and the other end is circular small end face; Be provided with projection on the circular small end face of described lower pin, the circular small end face of upper pin is planar structure; The P utmost point of described chip is welded and fixed by the circular small end face of weld tabs and lower pin, and the N utmost point of chip is welded and fixed by the circular small end face of weld tabs and upper pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220511318 CN202917498U (en) | 2012-10-08 | 2012-10-08 | Chip-diode structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220511318 CN202917498U (en) | 2012-10-08 | 2012-10-08 | Chip-diode structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202917498U true CN202917498U (en) | 2013-05-01 |
Family
ID=48165782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220511318 Expired - Fee Related CN202917498U (en) | 2012-10-08 | 2012-10-08 | Chip-diode structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202917498U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856393A (en) * | 2012-10-08 | 2013-01-02 | 如皋市易达电子有限责任公司 | Chip-diode structure |
-
2012
- 2012-10-08 CN CN 201220511318 patent/CN202917498U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856393A (en) * | 2012-10-08 | 2013-01-02 | 如皋市易达电子有限责任公司 | Chip-diode structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130501 Termination date: 20151008 |
|
| EXPY | Termination of patent right or utility model |