CN102842027B - 摄像装置 - Google Patents

摄像装置 Download PDF

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Publication number
CN102842027B
CN102842027B CN201210076879.9A CN201210076879A CN102842027B CN 102842027 B CN102842027 B CN 102842027B CN 201210076879 A CN201210076879 A CN 201210076879A CN 102842027 B CN102842027 B CN 102842027B
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CN
China
Prior art keywords
light
substrate
lens
imaging device
diameter
Prior art date
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Expired - Fee Related
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CN201210076879.9A
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English (en)
Chinese (zh)
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CN102842027A (zh
Inventor
石黑英人
土屋仁
江口司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Publication of CN102842027A publication Critical patent/CN102842027A/zh
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Publication of CN102842027B publication Critical patent/CN102842027B/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Studio Devices (AREA)
CN201210076879.9A 2011-03-23 2012-03-21 摄像装置 Expired - Fee Related CN102842027B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011063926A JP5742348B2 (ja) 2011-03-23 2011-03-23 撮像装置
JP2011-063926 2011-03-23

Publications (2)

Publication Number Publication Date
CN102842027A CN102842027A (zh) 2012-12-26
CN102842027B true CN102842027B (zh) 2016-12-14

Family

ID=46877065

Family Applications (1)

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CN201210076879.9A Expired - Fee Related CN102842027B (zh) 2011-03-23 2012-03-21 摄像装置

Country Status (3)

Country Link
US (1) US8665357B2 (https=)
JP (1) JP5742348B2 (https=)
CN (1) CN102842027B (https=)

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JP6074981B2 (ja) 2012-09-26 2017-02-08 セイコーエプソン株式会社 撮像装置
JP6044239B2 (ja) 2012-10-01 2016-12-14 セイコーエプソン株式会社 撮像装置および医療機器
US9692251B2 (en) 2014-07-03 2017-06-27 Intel Corporation Apparatus, system and method of wireless power transfer
JP2016115862A (ja) * 2014-12-17 2016-06-23 セイコーエプソン株式会社 画像取得装置、生体情報取得装置、電子機器
CN107451518A (zh) * 2016-05-30 2017-12-08 深圳印象认知技术有限公司 一种显示屏
CN106022324B (zh) * 2016-08-04 2019-04-30 京东方科技集团股份有限公司 一种纹路识别显示装置
CN108573191B (zh) * 2017-03-07 2021-12-17 固安翌光科技有限公司 用作指纹识别装置光源的oled屏体及光学指纹识别装置
CN106886341B (zh) * 2017-03-28 2022-02-25 京东方科技集团股份有限公司 显示基板及显示装置
CN106971173B (zh) * 2017-04-13 2021-01-26 京东方科技集团股份有限公司 触控基板及显示面板
KR102350605B1 (ko) * 2017-04-17 2022-01-14 삼성전자주식회사 이미지 센서
FR3075465B1 (fr) 2017-12-15 2020-03-27 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
FR3075466B1 (fr) * 2017-12-15 2020-05-29 Stmicroelectronics (Grenoble 2) Sas Couvercle de boitier de circuit electronique
SE1751613A1 (en) 2017-12-21 2019-06-22 Fingerprint Cards Ab Biometric imaging device and method for manufacturing the biometric imaging device
KR102593949B1 (ko) * 2018-07-25 2023-10-27 삼성전자주식회사 이미지 센서
WO2020061823A1 (zh) * 2018-09-26 2020-04-02 深圳市汇顶科技股份有限公司 光学图像采集单元、光学图像采集装置和电子设备
JP7293791B2 (ja) * 2019-03-26 2023-06-20 富士フイルムビジネスイノベーション株式会社 光学装置、画像読取装置、および画像形成装置
CN110471572B (zh) * 2019-06-10 2021-09-10 惠科股份有限公司 一种显示装置和触控器
US11462580B2 (en) * 2019-06-27 2022-10-04 Semiconductor Components Industries, Llc Image sensor packages and related methods
US11844236B2 (en) 2019-07-12 2023-12-12 Semiconductor Energy Laboratory Co., Ltd. Functional panel, display device, input/output device, and data processing device
KR20220035438A (ko) * 2019-07-23 2022-03-22 쓰리엠 이노베이티브 프로퍼티즈 컴파니 마이크로렌즈 및 차광 구조체를 포함하는 광학 시스템
JP6835920B2 (ja) * 2019-08-23 2021-02-24 浜松ホトニクス株式会社 光検出装置
US11997766B2 (en) 2019-10-11 2024-05-28 Semiconductor Energy Laboratory Co., Ltd. Functional panel, display device, input/output device, and data processing device
WO2021176704A1 (ja) * 2020-03-06 2021-09-10 オリンパス株式会社 光学ユニット、光学ユニットの製造方法、および、内視鏡
US12277892B2 (en) * 2021-06-22 2025-04-15 Beijing Boe Sensor Technology Co., Ltd. Texture recognition device and display apparatus
CN115616832A (zh) * 2021-07-16 2023-01-17 宏碁股份有限公司 照明模块及电子装置
CN114255673A (zh) * 2021-12-31 2022-03-29 浙江全视通科技有限公司 制程优化的屏下摄像装置
WO2025187218A1 (ja) * 2024-03-04 2025-09-12 Ａｇｃ株式会社 光学素子

Citations (1)

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CN101361095A (zh) * 2006-10-12 2009-02-04 株式会社理光 图像输入设备、图像输入方法、个人身份验证设备以及电子设备

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JPH09171154A (ja) * 1995-12-19 1997-06-30 Nippon Sheet Glass Co Ltd 画像入力光学系及びこの光学系を用いた画像入力装置
US6995800B2 (en) * 2000-01-27 2006-02-07 Canon Kabushiki Kaisha Image pickup apparatus utilizing a plurality of converging lenses
US7068432B2 (en) * 2004-07-27 2006-06-27 Micron Technology, Inc. Controlling lens shape in a microlens array
US7728902B2 (en) 2006-08-04 2010-06-01 Hitachi Maxell, Ltd. Imaging device and biometrics authentication apparatus
JP5007082B2 (ja) 2006-08-04 2012-08-22 日立マクセル株式会社 撮像装置および生体認証装置
US7999853B2 (en) 2007-10-15 2011-08-16 Canon Kabushiki Kaisha Moving image reproducing apparatus and processing method therefor
JP5072524B2 (ja) 2007-10-15 2012-11-14 キヤノン株式会社 動画像再生装置，およびその処理方法およびそのプログラム
JP2009272488A (ja) * 2008-05-08 2009-11-19 Sharp Corp 撮像デバイスおよび撮像デバイスの製造方法
JP2010094499A (ja) * 2008-09-16 2010-04-30 Hitachi Maxell Ltd 画像取得装置及び生体情報取得装置
JP2010093124A (ja) * 2008-10-09 2010-04-22 Hitachi Maxell Ltd 光学部品、撮像装置、生体情報取得装置、及び光学部品の製造方法
JP6055167B2 (ja) 2011-04-07 2016-12-27 セイコーエプソン株式会社 撮像装置
JP5828371B2 (ja) 2011-04-07 2015-12-02 セイコーエプソン株式会社 画像取得装置、生体認証装置、電子機器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101361095A (zh) * 2006-10-12 2009-02-04 株式会社理光 图像输入设备、图像输入方法、个人身份验证设备以及电子设备

Also Published As

Publication number Publication date
US8665357B2 (en) 2014-03-04
JP2012199868A (ja) 2012-10-18
US20120242884A1 (en) 2012-09-27
CN102842027A (zh) 2012-12-26
JP5742348B2 (ja) 2015-07-01

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