CN102830342B - 芯片测试方法以及芯片制造方法 - Google Patents
芯片测试方法以及芯片制造方法 Download PDFInfo
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- CN102830342B CN102830342B CN201210312727.4A CN201210312727A CN102830342B CN 102830342 B CN102830342 B CN 102830342B CN 201210312727 A CN201210312727 A CN 201210312727A CN 102830342 B CN102830342 B CN 102830342B
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CN102830342B true CN102830342B (zh) | 2017-05-10 |
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CN1581063A (zh) * | 2003-08-01 | 2005-02-16 | 上海华园微电子技术有限公司 | Cpu卡芯片的测试方法 |
JP4519571B2 (ja) * | 2004-08-26 | 2010-08-04 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその検査方法と検査装置並びに半導体装置の製造方法 |
CA2753890A1 (en) * | 2009-03-10 | 2010-09-16 | Johnstech International Corporation | Electrically conductive pins for microcircuit tester |
JP2011059021A (ja) * | 2009-09-11 | 2011-03-24 | Tokyo Electron Ltd | 基板検査装置及び基板検査装置における位置合わせ方法 |
CN101968739A (zh) * | 2010-09-27 | 2011-02-09 | 福建新大陆通信科技股份有限公司 | 一种基于flash技术机顶盒体系框架的实现方法 |
CN101963933B (zh) * | 2010-09-29 | 2012-11-14 | 清华大学 | 仪器测试中适应多通信协议的仪器静态匹配方法 |
CN102291274B (zh) * | 2011-07-11 | 2016-09-21 | 北京天融信科技股份有限公司 | 一种实现网络测试仪表自动适配的系统及方法 |
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Legal Events
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20140508 |
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Effective date of registration: 20140508 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Applicant after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201203 Shanghai Guo Shou Jing Road, Pudong New Area Zhangjiang hi tech Park No. 818 Applicant before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |
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