CN102820413B - A kind of fluorescent resin component and manufacture method - Google Patents
A kind of fluorescent resin component and manufacture method Download PDFInfo
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- CN102820413B CN102820413B CN201210294014.XA CN201210294014A CN102820413B CN 102820413 B CN102820413 B CN 102820413B CN 201210294014 A CN201210294014 A CN 201210294014A CN 102820413 B CN102820413 B CN 102820413B
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- 239000000843 powder Substances 0.000 claims abstract description 31
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- 238000003825 pressing Methods 0.000 claims abstract description 10
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- 239000004417 polycarbonate Substances 0.000 claims description 47
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- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 12
- OCKPCBLVNKHBMX-UHFFFAOYSA-N butylbenzene Chemical compound CCCCC1=CC=CC=C1 OCKPCBLVNKHBMX-UHFFFAOYSA-N 0.000 claims description 12
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 7
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 5
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- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 8
- 238000002156 mixing Methods 0.000 description 6
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- 239000000758 substrate Substances 0.000 description 5
- 229920006778 PC/PBT Polymers 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 229920001610 polycaprolactone Polymers 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 3
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- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
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- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
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- 229920001634 Copolyester Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
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- 229920007019 PC/ABS Polymers 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
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- BTVWZWFKMIUSGS-UHFFFAOYSA-N dimethylethyleneglycol Natural products CC(C)(O)CO BTVWZWFKMIUSGS-UHFFFAOYSA-N 0.000 description 1
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- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
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- Led Device Packages (AREA)
Abstract
Mass ratio is that the powder of transparent or semitransparent resin of 100:1 ~ 100:150 fully mixes or granulation with the powder of fluorophor by the manufacture method of fluorescent resin component; The mixture of transparent or semitransparent resin and fluorophor or granulation are utilized heating and mould pressing, after cooling, just can obtain fluorescence resin sheet material.White light LED luminescent device comprises: base, blue-light LED chip and comprise the resin of fluorophor.Blue-light LED chip is arranged on base, and in the face of comprising the resin of fluorophor, and the contact conductor of blue-light LED chip passes base.Resin does not directly contact blue chip light-emitting area, alleviates luminescent device heat dissipation problem, and fluorophor also there will not be the emission wavelength caused because of device heat dissipation problem to drift about and degradation phenomenon under luminous efficiency.Fluorophor, away from blue chip, avoids light portion that fluorophor is excited to send and reenters chip and absorbed the luminescence caused and lose.
Description
Technical field
The present invention relates to a kind of fluorescent resin component, manufacture method and white light emitting device and manufacture method.
Background technology
LED white-light illuminating is a kind of efficient green lighting technology, has the plurality of advantages such as energy-saving and environmental protection and long-life, and its operation principle utilizes blue chip to obtain white light with yellow phosphor combination (or other compound mode).
The encapsulation of traditional white light LED part is directly coated in blue chip surface after silica gel or resin being mixed with fluorescent material, and this encapsulation technology has its inherent defect.Because silica gel (or resin) directly contacts with blue chip with fluorescent material, when causing blue chip to work, scattering is not smooth, and the working temperature that chip is higher makes the emission wavelength of fluorescent material to offset, and luminous intensity declines.On the other hand, fluorescent material is close to the light portion that blue chip surface causes fluorophor to be excited to send and is reentered chip and absorbed, and causes luminous loss, have impact on the light efficiency of device.
Summary of the invention
The object of the invention is to provide a kind of based on fluorescent resin component and preparation method, and this fluorescent resin component effectively can solve the white light LEDs produced problem of above-mentioned utilization conventional package technique.Form the vitals of white light emitting device.Use this resin can carry out contactless encapsulation to LED blue chip, structure novel white-light LED, effectively solves the problem of prior art.
Technical solution of the present invention is: fluorescent resin component, is that the powder of resin of 100:1 ~ 100:150 fully mixes with the powder of fluorophor by mass ratio; The mixture of transparent or semitransparent resin and fluorophor is utilized heating and mould pressing, after cooling, just can obtain the material of fluorescence resin sheet material or other shapes; Resin is acrylic (PMMA and acroleic acid resin), PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene or benzene sulphone resin.
The manufacture method of fluorescent resin component, comprises the following steps:
(1) be that the transparent or semitransparent resin of 100:1 ~ 100:150 fully mixes or granulation with the powder of fluorophor by mass ratio;
(2) mixture of powders of transparent or semitransparent resin and fluorophor or granulation are utilized heating and mould pressing, just can obtain after cooling or annealing and comprise the resin plate of fluorophor or the material of other shapes;
(3) the transparent or semitransparent resin in step (1) can be PMMA or the MS resin etc. that acrylic (PMMA), PMMA alloy resin, Merlon, PC alloy resin, epoxy, butylbenzene, benzene sulphone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC strengthen;
(4) particle diameter of the fluorophor powder in step (1) is between 1 micron to 60 microns;
(5) fluorophor in step (1) is LED yellow fluorescent powder; In order to improve the color rendering index of white light, fluorophor also can be the mixture of LED green emitting phosphor and LED red fluorescence powder, or the mixture of LED yellow fluorescent powder and a small amount of LED red fluorescence powder; Wherein the volume ratio of resin and fluorophor is 100:1 ~ 100:150.
(6) in step (2), the temperature of mold pressing is 90
oc is to 270
obetween C; But lower than the decomposition temperature of transparent or semitransparent resin;
Resin in step (1) can adopt Powdered, and particle diameter is between 1 micron to 60 microns;
In step (2), heated mould end finger thermoplastic or thermosetting technology, also comprise the method such as injection moulding or extrusion molding, do not get rid of other moulding processs, but need consider fluorophor powder poor fluidity in hot-forming process;
In step (2), because fluorophor powder does not have mobility or a poor fluidity, other molding mode may cause phosphor particle skewness in resin;
Consider described situation, after step (2) completes, mould can be used to carry out post forming, the device of the shape required for acquisition to the fluorescence resin sheet material obtained.
In order to strengthen the mixed effect of light, appropriate SiO can be added in step (1)
2, or ZrO
2, or Al
2o
3deng ceramic particle; Wherein the volume ratio of fluorophor and ceramic particle is 100:1 ~ 100:150.
In order to strengthen the ageing resistace of transparent or semitransparent resin in step (1), appropriate UV absorbers (as UV-327, UV326, UV328, UV531, UV-9 etc.) or antioxidant (as antioxidant 1076, antioxidant 2246, antioxidant 245, antioxidant 1010 and auxiliary antioxidant 168 etc.) can be added; The mass ratio of resin and ultra-violet absorber and resin and antioxidant is 100:0.01 ~ 100:0.7.
LED blue chip 4 can be jewel (Al
2o
3) blue chip of Grown, also can be the blue chip that SiC substrate grows, or the blue chip of Si Grown, or any one in above-mentioned three kinds of substrates is transferred on other substrates after growth.Described LED blue chip 4 can use single LEDs chip, also can use many or organize LED chip more, its objective is and provide blue light emitting light source.
Switch on power to LED blue chip 4 by electrode 5 and 6, LED blue chip 4 just can send blue light.Fluorophor in the blue-light excited transparent or semitransparent resin that chip 4 sends sends the light of another wavelength, and the wavelength of the light inspired depends on the character of fluorophor itself.Fluorophor can obtain the light of various colour temperature after mixing with the some blue light that blue chip sends by the blue-light excited light sent.
Mass ratio is that the resin of 100:1 ~ 100:150 fully mixes with the powder of fluorophor by fluorescent resin component; By the mixture of transparent or semitransparent resin and fluorophor powder or utilize heating and mould pressing after making material, after cooling, just fluorescence resin sheet material or fluorescent resin component can be obtained; Transparent or semitransparent resin is PMMA or the MS resin that acrylic (PMMA), PMMA alloy resin, Merlon, PC alloy resin, epoxy, butylbenzene, benzene sulphone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC strengthen.The geometry of fluorescent resin component can also play the function of light regulating transmission path, and its distance leaving blue chip can also regulate the radiating effect of luminescent device.For this reason, fluorescence resin can be processed into the cover of various possible geometry, need design according to specific needs and process (related application see the applicant).
The present invention preferably adopts above-mentioned transparent resin or substantially translucent resin, about the technology of alloy resin is as following: as PC alloy and modification PC/ABS alloy: PC and ABS blend can the premium properties of comprehensive PC and ABS, improve the thermal endurance of ABS, shock resistance and hot strength, reduce PC cost and melt viscosity, improve processing characteristics, minimizing goods internal stress and impact strength are to the sensitiveness of products thickness; Impact modifier MBS is added in PC and ABS; PC/PS alloy: this alloy is that part is compatible, amorphous/amorphous system.In PC, add PS can reduce PC viscous flow activation energy, thus improve the processing fluidity of PC, adding a small amount of PS can make PC melt viscosity significantly decline, PS can play the effect of Rigid Organic Fillers in PC, PC and PS is transparent material, the two refractive index closely, therefore PC/PS alloy is transparent, there is good optical characteristics, PC/PS alloy composition alloy mechanical property, hot property and processing characteristics affect larger, along with the increase of PS content, the mobility of PC/PS system increases, hardness, hot strength and impact strength improve, and heat distortion temperature declines.
When PS content in a certain value time, there is maximum in impact strength and hot strength.By causing double bond graft phenylethene at PC end, obtaining graft polymers has compatibilization to PC/PS co-mixing system, greatly can improve PC and PS compatible.PC/PBT alloy: PBT has the features such as excellent mechanical property, resistance to chemical attack and easy-formation, and blended for PBT and PC obtained alloy material can be improved PC mobility, improves processing characteristics and chemical proofing.In PC/PBT, add ethylene/vinyl acetate can strengthen compatibility further and improve impact strength; There is esterification between PC and PBT, its compatibility can be improved; With PC and PBT under ester exchange catalyst exists, obtained PC/PBT blend, combination property is good, and has the better transparency; The available glass fiber reinforcement PC/PBT close with PC index of refraction.PC/PET alloy: PET has good mechanical property and chemical proofing, and the rigidity of the existing PC of PC/PET and thermal endurance, have again the solvent resistance of PET, and PET add the processing fluidity that can also improve PC.In PC/PET co-mixing system, add elastomer as butyl polyacrylate.Other is as polyester blend modification PC, as PET/PCL (multi-block copolyesters by ethylene glycol, low-molecular-weight polycaprolactone and terephthalic acid (TPA) copolymerization) and PC blending and modifying; By polyester and the PC blending and modifying of Isosorbide-5-Nitrae-cyclohexane dimethyl carbinol, ethylene glycol and terephthalic acid (TPA), the PC modulus of elasticity in static bending, hot strength etc. can be significantly improved; With ester exchange catalyst, polycaprolactone, using glass fibre as reinforcing material, promotes that polycaprolactone and PC carry out blending and modifying, can obtain the transparent material of good processability, high rigidity; Poly-(Isosorbide-5-Nitrae-cyclohexane cyclohexanedimethanodibasic-Isosorbide-5-Nitrae-cyclohexanedimethanol) ester modified PC, obviously can improve the transparency and the anti-yellowing property of PC; PMMA alloy resin, PMMA and PC alloy resin.
The invention has the beneficial effects as follows: in luminescent device constructed in accordance, due to fluorophor not with silica gel or the direct sealing-in of mixed with resin on blue chip surface, chip cooling problem is effectively alleviated, the ambient temperature of fluorophor is low, and therefore the problems such as the luminescent properties deterioration caused because of the elevated operating temperature of device can not occur.Fluorophor reenters chip away from the light portion that luminescence chip can avoid fluorophor to be excited to send and is lost by the luminescence that absorption causes.PMMA in use has stronger anti-aging effect in addition, is beneficial to and keeps the light efficiency of luminescent device not degenerate.Avoid using in the LED of conventional art encapsulation and turn to be yellow and the reflective device light efficiency decline problem caused because silica gel or resin go bad.Light efficiency can significantly improve.
accompanying drawing illustrates:
Fig. 1 is the structural representation of fluorescence resin.
Fig. 2 is the structural representation of the luminescent device using fluorescence resin to prepare.
embodiment:
Below in conjunction with accompanying drawing, the present invention is described in detail.
Structure and the preparation method of the fluorescence resin cover that the present invention relates to comprise, and comprise ultra-violet absorber powder and other additive powders fully mix, obtain through hot press mold shaping by fluorophor powder 2 and toner 1, separately.Wherein resin can be acrylic (PMMA, acrylic resin) or Merlon (PC) or other transparent resin (comprising epoxy, butylbenzene or benzene sulphone resin etc.); Without obviously difference.
Wherein fluorophor powder can be LED yellow fluorescent powder.In order to improve the color rendering index of white light, fluorophor also can be the mixture of LED green emitting phosphor and LED red fluorescence powder, or the mixture of LED yellow fluorescent powder and a small amount of LED red fluorescence powder.
The structural representation of the luminescent device obtained according to described manufacture method is as shown in Figure 2:
Said elements, for forming luminescent device, includes heat sink 3, LED blue chips 4, the contact conductor 7 of chip, electrode 5 and 6, fluorophor resin components 1.
embodiment 1:be described in detail to manufacturing the method comprising the resin of fluorophor with Fig. 1.Resin raw material is optical grade acrylic (PMMA VH001), and particle diameter is 5 microns.Fluorescent material is YAG yellow fluorescent powder, and particle diameter is 5 microns.Ultra-violet absorber is UV-327, and antioxidant is antioxidant 1010.
The volume ratio of acrylic and fluorophor is 100:15%; The mass ratio of acrylic and ultra-violet absorber UV-327 is 100:0.25; The mass ratio of acrylic and antioxidant 1010 is 100:0.25.
After phosphor powder is fully mixed with acrylic powder, 160
oc is molded into the sheet material that thickness is 0.4 millimeter, is cooled to room temperature and namely obtains fluorescence resin.The fluorescence resin smooth surface obtained, impulse-free robustness.
Afterwards, by obtain fluorescence resin again 130
oc mold pressing post forming to be wall thickness the be hollow cubic body of 0.4 millimeter.
Use the blue chip of the SiC grown on substrates of 1W, the blue light that blue chip sends, after the fluorescence resin that internal irradiation is above-mentioned, obtains bright white light (126 lm/W).
Embodiment 2: the temperature of first time injection moulding mold pressing is 190
oc, secondary mould pressing temperature is 150
oc.
embodiment 3:resin raw material is not limit, as optical grade polycarbonate PC.Carry out injection moulding again after first granulation, different resins can adopt different Shooting Technique conditions.
Use the blue chip of the SiC grown on substrates of 1W, the blue light that blue chip sends, after the fluorescence resin that internal irradiation is above-mentioned, obtains bright white light (118-135 lm/W).
PMMA or the MS resin that in embodiment, resin can adopt acrylic (PMMA), PMMA alloy resin, Merlon, PC alloy resin, epoxy, butylbenzene, benzene sulphone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC to strengthen all can obtain good result.
Volume ratio according to different requirement resins and fluorophor is not generally limit, as being 100:1 ~ 100:150, general 100:20 ~ 100:50.
Claims (2)
1. fluorescent resin component forms a manufacture method for luminescent device, and it is characterized in that, luminescent device includes heat sink, LED blue chip and fluorescent resin component; Fluorescent resin component is placed in LED blue chip top; Fluorescent resin component is processed into the cover of various geometry, with light regulating transmission path and improve radiating effect;
Fluorescent resin component manufacture method comprises the following steps:
1) be that the transparent or semitransparent resin of 100:1 ~ 100:150 fully mixes or granulation with the powder of fluorophor by mass ratio; 2) mixture of resin and fluorophor or granulation are utilized heating and mould pressing, after cooling, just can obtain fluorescence resin sheet material or device; Transparent or semitransparent resin is PMMA or the MS resin that acrylic PMMA, PMMA alloy resin, polycarbonate, PC alloy resin, epoxy, butylbenzene, benzene sulphone resin, CR-39, MS, NAS, polyurethane optical resin, nylon or PC strengthen;
The particle diameter of fluorophor is between 1 micron to 60 microns; Fluorophor is the mixture of LED yellow fluorescent powder, LED green emitting phosphor and LED red fluorescence powder or the mixture of LED yellow fluorescent powder and a small amount of LED red fluorescence powder; Wherein the volume ratio of transparent or semitransparent resin and fluorophor is 100:1 ~ 100:150;
A small amount of ultra-violet absorber or antioxidant is added to prevent resin aging in the mixed-powder of fluorophor and resin;
Appropriate SiO is added in step 1)
2, ZrO
2or Al
2o
3ceramic particle; Strengthen the mixed effect of light; Wherein the volume ratio of fluorophor and ceramic particle is 100:1 ~ 100:150;
Take the method for post forming to prepare fluorescence resin, first the mixed-powder of transparent or semitransparent resin and fluorophor is hot pressed into sheet material, then sheet material second heat is shaped to the fluorescence resin device of required form.
2. fluorescent resin component according to claim 1 forms the manufacture method of luminescent device, it is characterized in that, in step 2) in, the temperature of mold pressing is between 90-270 DEG C; But lower than the decomposition temperature of resin.
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|---|---|---|---|
| CN201210294014.XA CN102820413B (en) | 2012-08-17 | 2012-08-17 | A kind of fluorescent resin component and manufacture method |
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|---|---|---|---|
| CN201210294014.XA CN102820413B (en) | 2012-08-17 | 2012-08-17 | A kind of fluorescent resin component and manufacture method |
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| Publication Number | Publication Date |
|---|---|
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| CN102820413B true CN102820413B (en) | 2015-08-12 |
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| CN103059329B (en) * | 2012-12-21 | 2014-06-18 | 厦门理工学院 | Preparation method of polymethyl methacrylate (PMMA)/ poly carbonate (PC) long-distance fluorescent screen |
| CN103594610A (en) * | 2013-11-21 | 2014-02-19 | 东华大学 | Remote fluorescence piece used for LED and manufacturing method |
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|---|---|---|---|---|
| CN101737723A (en) * | 2009-12-28 | 2010-06-16 | 南京工业大学 | LED light conversion plate and manufacturing method thereof |
| CN102623613A (en) * | 2012-03-16 | 2012-08-01 | 中山市共炫光电科技有限公司 | White-light LED lamp and preparation method thereof |
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| CN102020851B (en) * | 2009-09-16 | 2013-10-16 | 大连路明发光科技股份有限公司 | Light conversion flexible high molecular material and application thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101737723A (en) * | 2009-12-28 | 2010-06-16 | 南京工业大学 | LED light conversion plate and manufacturing method thereof |
| CN102623613A (en) * | 2012-03-16 | 2012-08-01 | 中山市共炫光电科技有限公司 | White-light LED lamp and preparation method thereof |
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