CN101644406A - White light lens of light-emitting diode and light-emitting diode composed of lens - Google Patents
White light lens of light-emitting diode and light-emitting diode composed of lens Download PDFInfo
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- CN101644406A CN101644406A CN200910306435A CN200910306435A CN101644406A CN 101644406 A CN101644406 A CN 101644406A CN 200910306435 A CN200910306435 A CN 200910306435A CN 200910306435 A CN200910306435 A CN 200910306435A CN 101644406 A CN101644406 A CN 101644406A
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- lens
- emitting diode
- light emitting
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Abstract
The invention discloses a lens of a high-power light-emitting diode and a light-emitting diode composed of the lens, belonging to the technical field of photoelectric application. The white light lensof the light-emitting diode is formed by shaping the mixture of lens base material and fluorescent powder by injection-molding or die-casting or other techniques; the lens base material is any one ofpolycarbonate, polymethyl methacrylate, silica gel, Na2SiO3, CaSiO3, SiO2, Na2O-CaO-6SiO2; and the mass ratio of the lens base material and the fluorescent powder is equal to 0.1 to 1000:1. The application of the light-emitting diode of the lens lies in mixing the fluorescent powder and the lens base material and then forming instead of coating fluorescent powder resin on a chip surface layer; the fluorescent powder can be evenly distributed on the lens, the color difference of the light-emitting diode can be reduced obviously and the carbonification of heat to the fluorescent powder can be reduced.
Description
Technical field
The present invention relates to the led technology field, the lens that relate in particular to a kind of large-power light-emitting diodes reach by its light emitting diode of forming.
Background technology
Light emitting diode (Light Emitting Diode; LED) be the light-emitting component that semi-conducting material is made, electric energy can be changed into luminous energy, have characteristics such as power saving, energy-saving and environmental protection, long service life, can the total visible light ken produce at present, luminous efficiency exceeds 10 times than traditional incandescent lamp, the street lighting in public illumination field at first popularization and application light emitting diode.
The light emitting diode that is applied to the public illumination field is the integrated form light emitting diode, and each light-emitting diode structure mainly is made up of chip 5, heat conduction copper post 1, electrode circuit 2, support 3, gold thread 4, fluorescent material resin 8, lens 7 etc. as shown in Figure 1.In the support 3 that is provided with electrode circuit 2, inlay heat conduction copper post 1, with elargol chip 5 is fixed on the heat conduction copper post 1, connect support 3 and chip 5 with gold thread 4, form the chip epitaxial structure of a light emitting diode, at the top layer of chip 5 coating fluorescent material resin 8, the edge of lens 7 is embedded in the support 3, injects between lens 7 and support 3, chip 5, heat conduction copper post 1 and fills out the encapsulation of promptly finishing light emitting diode towards silica gel 6.When chip 5 sent blue light, the fluorescent material of chip 5 surface coating were stimulated and send gold-tinted with the blue light complementation, utilize lens 7 with gold-tinted, blue light again, can obtain the white light of finding of naked eye.
In public lighting system, adopt the integrated form light emitting diode to obtain high brightness, the integrated use of a plurality of light emitting diodes can cause the unit internal temperature to raise, because fluorescent coating is positioned at the top layer of chip 5 in the existing light emitting diode, make that fluorescent material can produce carbonization in the long-time use of light emitting diode, thereby influence the performance of light emitting diode.And a plurality of light emitting diodes integrate, and have color distortion between each light emitting diode easily, or there is color distortion in every street lamp.
Summary of the invention
The object of the present invention is to provide a kind of led lens, it can reduce the aberration between the light emitting diode effectively, reduces the carbonization of temperature to fluorescent material, improves the quality of light emitting diode.Another object of the present invention is to provide the light emitting diode that comprises these lens.
In order to realize the foregoing invention purpose, the inventor provides following technical scheme through production practices repeatedly:
A kind of light emitting diode white light lens, mixed after injection moulding or die casting or other technological formings form by lens substrate and fluorescent material, described lens substrate is polycarbonate (Polycarbonate), polymethyl methacrylate (Acrylic), silica gel (Silicon dioxide), Na
2SiO
3, CaSiO
3, SiO2, Na
2OCaO6SiO
2In any one, the mass ratio of described lens substrate and fluorescent material is a lens substrate: fluorescent material=0.1～1000: 1, or even the combination of arbitrary proportion.
The shape of described light emitting diode white light lens can arbitrary shape.
Described fluorescent material can be that present light emitting diode is employed any, as YAG fluorescent material or TAG fluorescent material.
Described lens substrate is any one of polycarbonate (Polycarbonate), polymethyl methacrylate (Acrylic), silica gel (Silicon dioxide), and the forming temperature of described injection moulding or die casting or other technologies is 10 ℃～200 ℃.
Described lens substrate is Na2SiO
3, CaSiO
3, SiO2, Na
2OCaO6SiO
2Deng in the glass baseplate any one, the forming temperature of described injection moulding or die casting or other technologies is 500 ℃～3000 ℃.
Use the light emitting diode that lens of the present invention are formed, mainly form by chip 5, heat conduction copper post 1, electrode circuit 2, support 3, gold thread 4, lens 7, filling gel 6, heat conduction copper post 1 is embedded in the support 3 that is provided with electrode circuit 2, chip 5 is fixed on the heat conduction copper post 1 by elargol, support 3 is connected by gold thread 4 with chip 5, form the chip epitaxial structure of a light emitting diode, the edge of lens 7 is embedded in the support 3, and it is fixing to inject filling gel 6.Be filled with filling gel 6 between lens 7 and support 3, chip 5, the heat conduction copper post 1, described lens 7 include light emitting diode white light lens 9.
Described lens 7 all are made up of light emitting diode white light lens.
The inner surface of described lens 7 is the white light lens.
The outer surface of described lens 7 is light emitting diode white light lens.
Compared with prior art, the beneficial effect of patent of the present invention is:
Light emitting diode of the present invention mainly is made up of chip 5, heat conduction copper post 1, electrode circuit 2, support 3, gold thread 4, fluorescent material resin 8, lens 7, potting resin 6 etc. in the prior art, fluorescent material resin 8 is coated the top layer of chip, make that fluorescent material can produce carbonization in the long-time use of light emitting diode, thereby influence the performance of light emitting diode; And because the density of fluorescent material in the fluorescent material resin and resin is inconsistent, precipitate and skewness in resin easily, fluorescent material can not be excited fully, makes every street lamp exist the colour-difference XOR to have yellow circle to produce; Especially when a plurality of light emitting diodes were integrated, the color distortion between each light emitting diode was more obvious.
Technical scheme provided by the invention has solved above-mentioned technical problem dexterously.The invention provides and a kind ofly mix after the light emitting diode white light lens of injection moulding or die casting or other technological formings, and these lens are applied in the light emitting diode by the base material that can be used as the lens raw material arbitrarily and fluorescent material.Use the light emitting diode of these lens, no longer in chip top layer coating fluorescent material resin, but with fluorescent material and lens substrate mixing aftershaping, fluorescent material can be distributed on the lens equably, and the colour-difference opposite sex of light emitting diode can obviously reduce.And the heat that chip sends reduces between the filling gel between white light lens and the chip, thereby will reduce the carbonization of heat to fluorescent material.
Below in conjunction with Figure of description patent of the present invention is done further introduction.
Description of drawings:
Fig. 1 is existing light-emitting diode structure schematic diagram;
Fig. 2 uses and is the light emitting diode construction schematic diagram of use white light lens of the present invention;
The cross sectional representation of white light rims of the lens in Fig. 3 patent specific embodiment 1 of the present invention;
A-A profile among Fig. 4 patent Fig. 3 of the present invention;
The specific embodiment 2 structural representations of Fig. 5 patent of the present invention;
The specific embodiment 2 B-B profiles of Fig. 6 patent of the present invention.
Mark among the figure: 1-heat conduction copper post, 2-electrode circuit, 3-support, 4-gold thread, 5-chip, 6-filling gel, 7-lens, 8-fluorescent material resin.
The specific embodiment
The present invention is described in further detail below in conjunction with the specific embodiment.But this should be interpreted as that the scope of the above-mentioned theme of the present invention only limits to following embodiment, allly all belong to scope of the present invention based on the technology that content of the present invention realized.
The light emitting diode white light lens of enumerating in the embodiment of the invention are that material forming forms by lens substrate and fluorescent material, and described lens substrate is polycarbonate, polymethyl methacrylate, silica gel, Na
2SiO
3, CaSiO
3, SiO2, Na
2OCaO6SiO
2In any one, the mass ratio of described lens substrate and fluorescent material is a lens substrate: fluorescent material=0.1～1000: 1.
Described lens substrate is any one of polycarbonate (Polycarbonate), polymethyl methacrylate (Acrylic), silica gel (Silicon dioxide), and the forming temperature of described injection moulding or die casting or other technologies is 10 ℃～200 ℃.
Described lens substrate is Na
2SiO
3, CaSiO
3, SiO2, Na
2OCaO6SiO
2Deng in the glass baseplate any one, the forming temperature of described injection moulding or die casting or other technologies is 500 ℃～3000 ℃.
Use the light emitting diode that above-mentioned white light lens are formed, mainly by chip 5, heat conduction copper post 1, electrode circuit 2, support 3, gold thread 4, lens 7, filling gel 6 is formed, heat conduction copper post 1 is embedded in the support 3 that is provided with electrode circuit 2, chip 5 is fixed on the heat conduction copper post 1 by elargol, support 3 is connected by gold thread 4 with chip 5, form the chip epitaxial structure of a light emitting diode, the edge of lens 7 is embedded in the support 3, lens 7 and support 3, chip 5, be filled with filling gel 6 between the heat conduction copper post 1, described lens 7 include light emitting diode white light lens 9.
Embodiment 1
Shown in Fig. 2-4, originally execute the light emitting diode white light lens in the example, be that the fluorescent material of 580 nanometers is that material forming forms by lens substrate polycarbonate and wavelength, the mass ratio of described lens substrate and fluorescent material is a polycarbonate: fluorescent material=5: 1.The light emitting diode white light lens of present embodiment are after being mixed by the polycarbonate of aforementioned proportion and fluorescent material, it is semicircular lens that temperature transfer molding about 50 ℃ becomes section, the edge of these lens is symmetrically arranged with two apertures, when injecting filling gel 6, partially filled silica gel 6 overflows from this aperture, can make lens 7 more stable with being connected of support 3 after the curing.
Use the light emitting diode that the present embodiment lens are formed, mainly by chip 5, heat conduction copper post 1, electrode circuit 2, support 3, gold thread 4, lens 7, filling gel 6 is formed, heat conduction copper post 1 is embedded in the support 3 that is provided with electrode circuit 2, chip 5 is fixed on the heat conduction copper post 1 by elargol, support 3 is connected by gold thread 4 with chip 5, form the chip epitaxial structure of a light emitting diode, the edge of lens 7 is embedded in the support 3, lens 7 and support 3, chip 5, be filled with filling gel 6 between the heat conduction copper post 1, described lens 7 all are made up of light emitting diode white light lens 9.
Shown in Fig. 2-4, originally execute the light emitting diode white light lens in the example, be that the fluorescent material of 580 nanometers is that material forming forms by lens substrate silica gel and wavelength, the mass ratio of described lens substrate and fluorescent material is a silica gel: fluorescent material=500: 1.The light emitting diode white light lens of present embodiment are that it is semicircular lens that the temperature transfer molding about 200 ℃ becomes section after being mixed by the silica gel of aforementioned proportion and fluorescent material.
Use the light emitting diode that the present embodiment lens are formed, mainly by chip 5, heat conduction copper post 1, electrode circuit 2, support 3, gold thread 4, lens 7, filling gel 6 is formed, heat conduction copper post 1 is embedded in the support 3 that is provided with electrode circuit 2, chip 5 is fixed on the heat conduction copper post 1 by elargol, support 3 is connected by gold thread 4 with chip 5, form the chip epitaxial structure of a light emitting diode, the edge of lens 7 is embedded in the support 3, lens 7 and support 3, chip 5, be filled with filling gel 6 between the heat conduction copper post 1, the inner surface of described lens 7 is light emitting diode white light lens, and outer surface is an ordinary lens.
Embodiment 3
Originally executing the light emitting diode white light lens in the example, is that the fluorescent material of 620 nanometers is that material forming forms by lens substrate polymethyl methacrylate and wavelength, and the mass ratio of described lens substrate and fluorescent material is a polymethyl methacrylate: fluorescent material=4: 1.The light emitting diode white light lens of present embodiment are that becoming section at 150 ℃～200 ℃ temperature transfer moldings is semicircular white light lens after being mixed by the polycarbonate of aforementioned proportion and fluorescent material.
The light-emitting diode structure of using present embodiment lens composition is with embodiment 1.
As Fig. 2, Fig. 5, shown in Figure 6, originally execute the light emitting diode white light lens in the example, by lens substrate Na
2OmSiO
2With wavelength be that the YAG fluorescent material of 560 nanometers is that material forming forms, the mass ratio of described lens substrate and fluorescent material is Na
2OmSiO
2: fluorescent material=100: 1.The light emitting diode white light lens of present embodiment are the Na by aforementioned proportion
2OmSiO
2After the fluorescent material mixing, the temperature compacted under about 500 ℃ is hemispheric white light lens.
The light emitting diode construction that the light emitting diode white light lens of present embodiment are formed is with embodiment 1, and wherein the outer surface of lens 7 is the white light lens, and inner surface is an ordinary lens.
Embodiment 5
Originally execute the light emitting diode white light lens in the example, by lens substrate Na
2OCaO6SiO
2With wavelength be that the TAG fluorescent material of 550 nanometers is that material forming forms, the mass ratio of described lens substrate and fluorescent material is Na
2OCaO6SiO
2: fluorescent material=800: 1.The light emitting diode white light lens of present embodiment are the Na by aforementioned proportion
2OCaO6SiO
2After the fluorescent material mixing, the temperatures about 2500 ℃ is cast semicircle.
The light emitting diode construction that the light emitting diode white light lens of present embodiment are formed is with embodiment 1.
Claims (8)
1. light emitting diode white light lens, mix after injection moulding or die casting or other technological formings form by lens substrate and fluorescent material, described lens substrate is any one among polycarbonate, polymethyl methacrylate, silica gel, Na2SiO3, CaSiO3, SiO2, the Na2OCaO6SiO2, and the mass ratio of described lens substrate and fluorescent material is a lens substrate: fluorescent material=0.1～1000: 1.
2. light emitting diode white light lens according to claim 1, described fluorescent material are YAG fluorescent material or TAG fluorescent material.
3. light emitting diode white light lens according to claim 1 and 2, described lens substrate is any one in polycarbonate, polymethyl methacrylate, the silica gel, the forming temperature of described injection moulding or die casting or other technologies is 10 ℃～200 ℃.
4. light emitting diode white light lens according to claim 1 and 2, described lens substrate is any one among Na2SiO3, CaSiO3, SiO2, the Na2OCaO6SiO2, the forming temperature of described injection moulding or die casting or other technologies is 500 ℃～3000 ℃.
5. application rights requires the light emitting diode that 1 described white light lens are formed, mainly by chip (5), heat conduction copper post (1), electrode circuit (2), support (3), gold thread (4), lens (7), filling gel (6) is formed, heat conduction copper post (1) is embedded in the support (3) that is provided with electrode circuit (2), chip (5) is fixed on the heat conduction copper post (1) by elargol, support (3) is connected by gold thread (4) with chip (5), form the chip epitaxial structure of a light emitting diode, the edge of lens (7) is embedded in the support (3), lens (7) and support (3), chip (5), be filled with filling gel (6) between the heat conduction copper post (1), described lens (7) include light emitting diode white light lens (9).
6. light emitting diode according to claim 5 is characterized in that: described lens (7) all are made up of light emitting diode white light lens.
7. light emitting diode according to claim 5 is characterized in that: the inner surface of described lens (7) is the white light lens.
8. light emitting diode according to claim 5 is characterized in that: the outer surface of described lens (7) is light emitting diode white light lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910306435A CN101644406A (en) | 2009-09-01 | 2009-09-01 | White light lens of light-emitting diode and light-emitting diode composed of lens |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910306435A CN101644406A (en) | 2009-09-01 | 2009-09-01 | White light lens of light-emitting diode and light-emitting diode composed of lens |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101644406A true CN101644406A (en) | 2010-02-10 |
Family
ID=41656402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910306435A Pending CN101644406A (en) | 2009-09-01 | 2009-09-01 | White light lens of light-emitting diode and light-emitting diode composed of lens |
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| Country | Link |
|---|---|
| CN (1) | CN101644406A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102679199A (en) * | 2011-03-08 | 2012-09-19 | 威力盟电子股份有限公司 | Light-emitting diode bulb lamp and manufacturing method thereof |
| CN103511993A (en) * | 2012-06-19 | 2014-01-15 | 王树生 | Manufacturing method of LED lamp and LED lamp |
| CN106025006A (en) * | 2016-07-01 | 2016-10-12 | 邓天升 | Fluorescent cover or plate for color conversion excited by blue light and manufacturing method thereof |
| CN106439675A (en) * | 2016-08-30 | 2017-02-22 | 清华大学深圳研究生院 | LED automobile headlamp |
| CN118373674A (en) * | 2024-06-24 | 2024-07-23 | 华天慧创科技（西安）有限公司 | Silicon lens and preparation method thereof |
-
2009
- 2009-09-01 CN CN200910306435A patent/CN101644406A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102679199A (en) * | 2011-03-08 | 2012-09-19 | 威力盟电子股份有限公司 | Light-emitting diode bulb lamp and manufacturing method thereof |
| CN103511993A (en) * | 2012-06-19 | 2014-01-15 | 王树生 | Manufacturing method of LED lamp and LED lamp |
| CN106025006A (en) * | 2016-07-01 | 2016-10-12 | 邓天升 | Fluorescent cover or plate for color conversion excited by blue light and manufacturing method thereof |
| CN106439675A (en) * | 2016-08-30 | 2017-02-22 | 清华大学深圳研究生院 | LED automobile headlamp |
| CN118373674A (en) * | 2024-06-24 | 2024-07-23 | 华天慧创科技（西安）有限公司 | Silicon lens and preparation method thereof |
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Application publication date: 20100210 |