CN106058016B - The long-range fluorophor of double-layer structure, preparation method and remote LED device - Google Patents
The long-range fluorophor of double-layer structure, preparation method and remote LED device Download PDFInfo
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- CN106058016B CN106058016B CN201610597032.3A CN201610597032A CN106058016B CN 106058016 B CN106058016 B CN 106058016B CN 201610597032 A CN201610597032 A CN 201610597032A CN 106058016 B CN106058016 B CN 106058016B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 30
- 239000000843 powder Substances 0.000 claims abstract description 99
- 239000011521 glass Substances 0.000 claims abstract description 78
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 62
- 239000000741 silica gel Substances 0.000 claims abstract description 45
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 45
- 229910019990 cerium-doped yttrium aluminum garnet Inorganic materials 0.000 claims abstract description 36
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 28
- 238000001035 drying Methods 0.000 claims description 12
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 claims description 12
- 238000004020 luminiscence type Methods 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 8
- 229910003069 TeO2 Inorganic materials 0.000 claims description 7
- 229910052681 coesite Inorganic materials 0.000 claims description 7
- 229910052906 cristobalite Inorganic materials 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 229910052682 stishovite Inorganic materials 0.000 claims description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052905 tridymite Inorganic materials 0.000 claims description 7
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 2
- 238000004528 spin coating Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 3
- 239000002241 glass-ceramic Substances 0.000 abstract description 2
- 231100000252 nontoxic Toxicity 0.000 abstract description 2
- 230000003000 nontoxic effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 16
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 10
- 239000000156 glass melt Substances 0.000 description 10
- 239000004570 mortar (masonry) Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 8
- 238000009877 rendering Methods 0.000 description 6
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 5
- 230000005284 excitation Effects 0.000 description 5
- 238000000227 grinding Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 229910000029 sodium carbonate Inorganic materials 0.000 description 5
- 230000035882 stress Effects 0.000 description 5
- LAJZODKXOMJMPK-UHFFFAOYSA-N tellurium dioxide Chemical compound O=[Te]=O LAJZODKXOMJMPK-UHFFFAOYSA-N 0.000 description 5
- 238000005303 weighing Methods 0.000 description 5
- 238000000137 annealing Methods 0.000 description 3
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 3
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000011222 crystalline ceramic Substances 0.000 description 1
- 229910002106 crystalline ceramic Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001194 electroluminescence spectrum Methods 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004643 material aging Methods 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
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- Power Engineering (AREA)
- Luminescent Compositions (AREA)
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Abstract
The present invention relates to LED white-light illuminating technical fields, more particularly, to a kind of fluorophor that double-layer structure is long-range, preparation method and with the remote LED device of the double-layer structure fluorophor.The long-range fluorophor of this kind of double-layer structure, the devitrified glass including inlaying YAG:Ce yellow fluorescent powder, the devitrified glass surface for inlaying YAG:Ce yellow fluorescent powder are covered with one layer of layer of silica gel containing CASN:Eu red fluorescence powder.The long-range fluorophor of above-mentioned double-layer structure uniformly inlays the long-range fluorophor of double-layer structure of YAG:Ce yellow fluorescent powder and CASN:Eu red fluorescence powder, layer of silica gel smooth surface respectively in substrate glass and silica gel, and is tightly combined with glass-ceramic layer;Remote fluorescence preparation process is simple, low in cost, nontoxic and pollution-free, has good both thermally and chemically stability, the remote LED device of fluorophor building, the warm white of device emitting bright after energization.
Description
Technical field
The present invention relates to LED white-light illuminating technical fields, more particularly, to a kind of fluorophor that double-layer structure is long-range, preparation
Method and remote LED device with the double-layer structure fluorophor.
Background technique
As forth generation solid-state lighting light source white light LEDs have it is energy-efficient, environmentally protective, long service life etc. is excellent
Point has infiltrated into the every field of general illumination.Since it is with great economic and social benefit, countries in the world are one after another by it
It is included in national strategy plan.
Instantly, the packaging method of mainstream white light LEDs is mainly to use gluing process that will mix YAG:Ce yellow fluorescent powder
Silica gel is applied directly on blue light GaN chip, then heated curing molding.It is well known that LED light source is while luminous
Amount of heat is generated, in particular, with the increase of LED output power, forward current If increases, core for great power LED
The high temperature that piece generates is even up to 100-150 DEG C.Conventional encapsulant mainly uses the organic polymers such as silica gel, thermal conductivity
Low, thermostabilization and chemical stabilization are poor.In long-time use process, these drawbacks can gradually show --- and material aging becomes
Huang leads to the light decay and color drift of white light LEDs.How to solve this problem is to develop long-life, high power white LED technology
It is crucial.In recent years, it has been proposed that using phosphor, such as Y3Al5O12:Ce3+ crystalline ceramics, glass ceramics, fluorescent powder
Devitrified glass (PiG) replaces organic packaging materials.Due to glass/ceramic inorganic matrix have it is excellent both thermally and chemically stable
Property, it will be expected to substantially extend the service life of existing white light LEDs.Wherein, using low temperature co-fired method by fluorescent powder and low melting point glass
The devitrified glass that glass is uniformly mixed to prepare under less than 1000 degree melting conditions is considered as a kind of most promising inorganic encapsulated
Material.
To solve the above problems, the applied Chinese invention patent CN201310123356.X of Chinese Academy of Sciences's Fujian object structure
A kind of " the Ce:YAG devitrified glass and preparation method thereof for white light LEDs " is provided, PiG fluorescence conversion body has in the patent
The light efficiency of very excellent luminescent properties, the white light LED part of coupling blue chip building can reach 124 lumens/watts.So
And lacking red color light component in the emission spectrum of the fluorescent material, the colour temperature of corresponding device higher (6674K), colour rendering index are lower
(70), the demand being unable to satisfy in domestic light application.How to design and develops a kind of novel warm white LED and converted with inorganic light
Devitrified glass is the urgent problem to be solved that various countries researcher faces.
Summary of the invention
For overcome the deficiencies in the prior art, the present invention provides a kind of fluorophor that double-layer structure is long-range, preparation method
And the remote LED device with the double-layer structure fluorophor.
To achieve the above object, a kind of fluorophor that double-layer structure is long-range, it is characterised in that: including inlaying YAG:Ce yellow
The devitrified glass of fluorescent powder, the devitrified glass surface for inlaying YAG:Ce yellow fluorescent powder be covered with one layer containing CASN:Eu it is red
The layer of silica gel of color fluorescent powder.
It further, is the 10- of silica gel containing the content that CASN:Eu red fluorescence powder is CASN:Eu red fluorescence powder
50wt%.
It further, is CaAlSiN containing CASN:Eu red fluorescence powder3: Eu2+Red fluorescence powder.
A kind of preparation method for the fluorophor that double-layer structure is long-range makes the long-range fluorophor of above-mentioned double-layer structure, packet
Include following steps:
Step 1, the devitrified glass of YAG:Ce yellow fluorescent powder is inlayed in preparation;
Step 2, the silica gel containing CASN:Eu red fluorescence powder is prepared, by CASN:Eu red fluorescence powder and silica gel by certain
Ratio is mixed and stirred for uniformly, then removing bubble removing under vacuum conditions;
Step 3, the silica gel containing CASN:Eu red fluorescence powder is made in step 2 and inlays YAG coated in prepared by step 1:
On the devitrified glass of Ce yellow fluorescent powder, curing molding in drying box is then moved it into, obtains the remote of required double-layer structure
Journey fluorophor.
Further, the mass ratio of CASN:Eu red fluorescence powder and silica gel is 10-50:50-90 in step 2.
Further, the silica gel containing CASN:Eu red fluorescence powder in step 3 is brushed using spin coating, spraying or screen printing
It overlays on the devitrified glass for inlaying YAG:Ce yellow fluorescent powder.
Further, the solidification temperature of step 3 drying box is 100-200 DEG C, and curing time is 1-4 hours.
Further, the solidification temperature of step 3 drying box is 150 DEG C, and curing time is 2 hours.
A kind of remote LED device of the remote phosphor with double-layer structure, including shell and luminescence chip, feature exist
In: further include the above-mentioned remote phosphor of power, the luminescence chip is blue chip, and the blue chip, which is set to, inlays YAG:
Below the devitrified glass of Ce yellow fluorescent powder, the layer of silica gel containing CASN:Eu red fluorescence powder, which is covered in, inlays YAG:Ce yellow
The upper surface of the devitrified glass of fluorescent powder.
Optimization, luminescence chip is 460 nano blue light chips.
By the above-mentioned description of this invention it is found that the long-range fluorophor of double-layer structure provided by the invention, preparation method and
Remote LED device with the double-layer structure fluorophor;
The long-range fluorophor of double-layer structure uniformly inlayed respectively in substrate glass and silica gel YAG:Ce yellow fluorescent powder and
The long-range fluorophor of the double-layer structure of CASN:Eu red fluorescence powder, wherein layer of silica gel smooth surface, and with crystallite glass
Glass layer is tightly combined;
The long-range fluorescence preparation process of double-layer structure is simple, low in cost, nontoxic and pollution-free, have good calorifics and
Chemical stability can be applied to building remote LED device;
Remote LED device with double-layer structure fluorophor, the warm white of device emitting bright after energization, this long-range envelope
Assembling structure can extract the photon due to losing backwards to transmitting, so that whole light output and luminous efficiency are effectively improved, compared to
Short range coating processes, the design of long-range encapsulating structure efficiently separate two heat sources of LED chip and fluorescent powder, and it is folded to avoid heat
Add, improve the dissipating-heat environment of LED chip and fluorescent powder, to reduce LED lamp each component (mainly LED chip and fluorescence
Powder) operating temperature, so that light efficiency is greatly enhanced;Furthermore by adjusting concentration of the red fluorescence powder in silica gel, Ke Yishi
Existing different-colour demand.
Detailed description of the invention
Fig. 1 is the section structure scanning electron microscope (SEM) photograph of double-layer structure remote phosphor sample.
Fig. 2 is the process flow chart of the preparation method of double-layer structure remote phosphor.
Fig. 3 is the structural schematic diagram of the remote LED device for the remote phosphor that specific embodiment 1 to 5 has double-layer structure.
Fig. 4 is the electroluminescent map of the remote LED device for the remote phosphor that specific embodiment 1 has double-layer structure
Figure.
Specific embodiment
Below by way of specific embodiment, the invention will be further described.
Shown in referring to Fig.1, a kind of fluorophor that double-layer structure is long-range, the crystallite glass including inlaying YAG:Ce yellow fluorescent powder
Glass 1,1 surface of devitrified glass for inlaying YAG:Ce yellow fluorescent powder are covered with one layer of silicon containing CASN:Eu red fluorescence powder
Glue-line 2;
Component and the content (molar percentage) for inlaying the devitrified glass glass matrix of YAG:Ce yellow fluorescent powder are as follows:
SiO224-27mol%, TeO222-26mol%, ZnO 15-18mol%, Ae2O 6-9mol%, GeO212-15mol%,
B2O39-12mol%, BaO 2.1-0.9mol%, TiO22.7-3.1mol%, wherein Ae is selected from Li, Na or K.
YAG:Ce fluorescent powder in devitrified glass is Y3Al5O12: Ce3+Yellow fluorescent powder, Y3Al5O12: Ce3+Yellow fluorescent powder
Content (mass ratio) be substrate glass 5-8wt%;
CASN:Eu red fluorescence powder is CaAlSiN3: Eu2+Red fluorescence powder, CaAlSiN3: Eu2+Red fluorescence powder contains
Amount is the 10-50wt% of silica gel.
Referring to Fig.1, shown in 2, a kind of preparation method for the fluorophor that double-layer structure is long-range includes the following steps:
Step 1, the devitrified glass of YAG:Ce yellow fluorescent powder is inlayed in preparation;
Step 2, the silica gel containing CASN:Eu red fluorescence powder is prepared, by CASN:Eu red fluorescence powder and silica gel by certain
Ratio is mixed and stirred for uniformly, then removing bubble removing under vacuum conditions;
Step 3, the fluorescent powder silica gel that red fluorescence powder is mixed with made from step 2 is coated in crystallite glass prepared by step 1
It on glass surface, then moves it into drying box, solidifies under the conditions of 100-200 DEG C of temperature 1-4 hours and form, obtain required
Double-layer structure fluorophor.
Referring to shown in Fig. 3, a kind of remote LED device of the remote phosphor with double-layer structure, including shell, shine core
Piece and remote phosphor, the luminescence chip are blue chip, and the blue chip, which is set to, inlays YAG:Ce yellow fluorescent powder
Devitrified glass below, there is the layer of silica gel of CASN:Eu red fluorescence powder to be covered in the crystallite glass for inlaying YAG:Ce yellow fluorescent powder
The upper surface of glass.
Specific embodiment one:
Referring to figs. 1 to 4, the remote LED device of the remote phosphor with double-layer structure, including shell 100, hair
Optical chip 200 and remote phosphor 300, the luminescence chip 100 are nano blue light chip, double under the excitation of 460 nano blue lights
Layer structure fluorophor 300 emits yellow light and feux rouges, and yellow light, feux rouges are combined with chip blue light generates bright warm white, and shine effect
Fruit figure is with electroluminescence spectrum respectively such as Fig. 4, and chromaticity coordinate is (0.3490,0.3845), colour temperature 4959K, and colour rendering index is
69.8, light efficiency is 109.4 lumens/watts.
Wherein remote phosphor 300 is prepared using following methods:
Step 1, the devitrified glass of YAG:Ce yellow fluorescent powder is inlayed in preparation,
1.1 will analyze pure SiO2、TeO2、ZnO、Na2CO3、GeO2、H3BO3、BaO、TiO2Powder material, according to 26SiO2-
24TeO2-17ZnO-6Na2CO3-12GeO2-10H3BO3-2BaO-3TiO2The weighing of (molar percentage) proportion speed is placed on Ma
It in Nao mortar, mixes and grinds and be uniformly placed in crucible, be put into resistance furnace and keep the temperature 2 hours after being heated to 1250 DEG C and be allowed to molten
Melt, glass melt is taken out and is quickly poured into mold forming obtain blocky forerunner's glass,
The YAG:Ce fluorescence of 5wt% is added in the agate mortar after grinding uniformly in forerunner's glass breaking of acquisition by 1.2
Powder further grinds and is placed in crucible for 2 hours, is subsequently placed into resistance furnace and keeps the temperature 1 hour after being heated to 700 DEG C and be allowed to molten
Melt, glass melt is taken out and is quickly poured into mold forming obtain blocky devitrified glass,
1.3, the devitrified glass of acquisition is put into resistance furnace and is annealed to eliminate internal stress for 280 DEG C, and cuts polishing to it,
Obtain the devitrified glass of required size;
Step 2, the silica gel containing CASN:Eu red fluorescence powder is prepared, CASN:Eu red fluorescence powder and silica gel are pressed 10:
90 (mass ratio) ratios are mixed and stirred for uniformly, then removing bubble removing under vacuum conditions;
Step 3, the silica gel for being mixed with red fluorescence powder is coated on the devitrified glass surface of preparation using spin processes, with
After move it into drying box 2 hours curing moldings under the conditions of 150 DEG C, obtain the long-range fluorophor of required double-layer structure.
The section structure surface sweeping Electronic Speculum of double-layer structure fluorophor the result shows that, layer of silica gel smooth surface, and with it is micro-
Crystal glass layer is tightly combined.
Specific embodiment two:
Referring to shown in Fig. 2, Fig. 3, the remote LED device of the remote phosphor with double-layer structure, including shell 100, hair
Optical chip 200 and remote phosphor 300, the luminescence chip 100 are nano blue light chip, double under the excitation of 460 nano blue lights
Layer structure fluorophor 300 emits yellow light and feux rouges, and yellow light, feux rouges are combined with chip blue light generates bright warm white, and coloration is sat
It is designated as (0.3635,0.3888), colour temperature 4519K, colour rendering index 71.9, light efficiency is 105.0 lumens/watts.
Above-mentioned remote phosphor 300 is prepared using following methods:
Step 1, the devitrified glass of YAG:Ce yellow fluorescent powder is inlayed in preparation,
1.1 will analyze pure SiO2、TeO2、ZnO、Na2CO3、GeO2、H3BO3、BaO、TiO2Powder material, according to 24SiO2-
24TeO2-17ZnO-7Na2CO3-12GeO2-10H3BO3-3BaO-3TiO2The weighing of (molar percentage) proportion speed is placed on Ma
It in Nao mortar, mixes and grinds and be uniformly placed in crucible, be put into resistance furnace and keep the temperature 2 hours after being heated to 1300 DEG C and be allowed to molten
Melt, glass melt is taken out and is quickly poured into mold forming obtain blocky forerunner's glass,
1.2, the YAG:Ce fluorescence of 5wt% is added in the agate mortar after grinding uniformly in forerunner's glass breaking of acquisition
Powder further grinds and is placed in crucible for 2 hours, is subsequently placed into resistance furnace and keeps the temperature 1 hour after being heated to 690 DEG C and be allowed to molten
Melt, glass melt is taken out and is quickly poured into mold forming obtain blocky devitrified glass,
The devitrified glass of acquisition is put into resistance furnace 280 DEG C of annealing to eliminate internal stress by 1.3, and polishing is cut to it,
Obtain the devitrified glass of required size;
Step 2, the silica gel containing CASN:Eu red fluorescence powder is prepared, CASN:Eu red fluorescence powder and silica gel are pressed 20:
80 (mass ratioes) are mixed and stirred for uniformly, then removing bubble removing under vacuum conditions;
Step 3, the silica gel for being mixed with red fluorescence powder is coated on the devitrified glass surface of preparation using spin processes, with
After move it into drying box 2 hours curing moldings under the conditions of 150 DEG C, obtain the remote phosphor of required double-layer structure.
Specific embodiment 3:
Referring to shown in Fig. 2, Fig. 3, the remote LED device of the remote phosphor with double-layer structure, including shell 100, hair
Optical chip 200 and remote phosphor 300, the luminescence chip 100 are nano blue light chip, double under the excitation of 460 nano blue lights
Layer structure fluorophor 300 emits yellow light and feux rouges, and yellow light, feux rouges are combined with chip blue light generates bright warm white, and coloration is sat
It is designated as (0.3883,0.3977), colour temperature 3947K, colour rendering index 74.8, light efficiency is 97.2 lumens/watts.
Above-mentioned remote phosphor 300 is prepared using following methods:
Step 1, the devitrified glass of YAG:Ce yellow fluorescent powder is inlayed in preparation,
1.1 will analyze pure SiO2、TeO2、ZnO、Na2CO3、GeO2、H3BO3、BaO、TiO2Powder material, according to 26SiO2-
24TeO2-15ZnO-6Na2CO3-13GeO2-10H3BO3-2BaO-4TiO2The weighing of (molar percentage) proportion speed is placed on Ma
It in Nao mortar, mixes and grinds and be uniformly placed in crucible, be put into resistance furnace and keep the temperature 2 hours after being heated to 1250 DEG C and be allowed to molten
Melt, then, glass melt is taken out and is quickly poured into mold forming obtain blocky forerunner's glass,
The YAG:Ce fluorescence of 5wt% is added in the agate mortar after grinding uniformly in forerunner's glass breaking of acquisition by 1.2
Powder further grinds and is placed in crucible for 2 hours, is subsequently placed into resistance furnace and keeps the temperature 1 hour after being heated to 650 DEG C and be allowed to molten
Melt, glass melt is taken out and is quickly poured into mold forming obtain blocky devitrified glass,
The devitrified glass of acquisition is put into resistance furnace 280 DEG C of annealing to eliminate internal stress by 1.3, and polishing is cut to it,
Obtain the devitrified glass of required size;
Step 2, the silica gel containing CASN:Eu red fluorescence powder is prepared, CASN:Eu red fluorescence powder and silica gel are pressed 30:
70 (mass ratioes) are mixed and stirred for uniformly, then removing bubble removing under vacuum conditions;
Step 3, the silica gel for being mixed with red fluorescence powder is coated on the devitrified glass surface of preparation using spin processes, with
After move it into drying box 2 hours curing moldings under the conditions of 150 DEG C, obtain required double-layer structure fluorophor.
Specific embodiment 4:
Referring to shown in Fig. 2, Fig. 3, the remote LED device of the remote phosphor with double-layer structure, including shell 100, hair
Optical chip 200 and remote phosphor 300, the luminescence chip 100 are nano blue light chip, double under the excitation of 460 nano blue lights
Layer structure fluorophor 300 emits yellow light and feux rouges, and yellow light, feux rouges are combined with chip blue light generates bright warm white, and coloration is sat
It is designated as (0.4183,0.4049), colour temperature 3346K, colour rendering index 77.3, light efficiency is 93.9 lumens/watts.
Above-mentioned remote phosphor 300 is prepared using following methods:
Step 1, the devitrified glass of YAG:Ce yellow fluorescent powder is inlayed in preparation,
1.1 will analyze pure SiO2、TeO2、ZnO、Na2CO3、GeO2、H3BO3、BaO、TiO2Powder material, according to 26SiO2-
22TeO2-17ZnO-6Na2CO3-12GeO2-11H3BO3-3BaO-3TiO2The weighing of (molar percentage) proportion speed is placed on Ma
It in Nao mortar, mixes and grinds and be uniformly placed in crucible, be put into resistance furnace and keep the temperature 2 hours after being heated to 1300 DEG C and be allowed to molten
Melt, then, glass melt is taken out and is quickly poured into mold forming obtain blocky forerunner's glass,
The YAG:Ce fluorescence of 5wt% is added in the agate mortar after grinding uniformly in forerunner's glass breaking of acquisition by 1.2
Powder further grinds and is placed in crucible for 2 hours, is subsequently placed into resistance furnace and keeps the temperature 1 hour after being heated to 700 DEG C and be allowed to molten
Melt, glass melt is taken out and is quickly poured into mold forming obtain blocky devitrified glass,
The devitrified glass of acquisition is put into resistance furnace 280 DEG C of annealing to eliminate internal stress by 1.3, and polishing is cut to it,
Obtain the devitrified glass of required size;
Step 2, the silica gel containing CASN:Eu red fluorescence powder is prepared, CASN:Eu red fluorescence powder and silica gel are pressed 40:
60 (mass ratioes) are mixed and stirred for uniformly, then removing bubble removing under vacuum conditions;
Step 3, the silica gel for being mixed with red fluorescence powder is coated on the devitrified glass surface of preparation using spin processes, with
After move it into drying box 2 hours curing moldings under the conditions of 150 DEG C, obtain required double-layer structure fluorophor.
Specific embodiment 5,
Referring to shown in Fig. 2, Fig. 3, the remote LED device of the remote phosphor with double-layer structure, including shell 100, hair
Optical chip 200 and remote phosphor 300, the luminescence chip 100 are nano blue light chip, double under the excitation of 460 nano blue lights
Layer structure fluorophor 300 emits yellow light and feux rouges, and yellow light, feux rouges are combined with chip blue light generates bright warm white, and coloration is sat
It is designated as (0.4572,0.4139), colour temperature 2763K, colour rendering index 80.2, light efficiency is 78.7 lumens/watts.
Above-mentioned remote phosphor 300 is prepared using following methods:
Step 1, the devitrified glass of YAG:Ce yellow fluorescent powder is inlayed in preparation,
1.1 will analyze pure SiO2、TeO2、ZnO、Na2CO3、GeO2、H3BO3、BaO、TiO2Powder material, according to 25SiO2-
24TeO2-16ZnO-6Na2CO3-12GeO2-10H3BO3-3BaO-4TiO2The weighing of (molar percentage) proportion speed is placed on Ma
It in Nao mortar, mixes and grinds and be uniformly placed in crucible, be put into resistance furnace and keep the temperature 2 hours after being heated to 1250 DEG C and be allowed to molten
Melt, then, glass melt is taken out and is quickly poured into mold forming obtains blocky forerunner's glass;
The YAG:Ce fluorescence of 5wt% is added in the agate mortar after grinding uniformly in forerunner's glass breaking of acquisition by 1.2
Powder further grinds and is placed in crucible for 2 hours, is subsequently placed into resistance furnace and keeps the temperature 1 hour after being heated to 680 DEG C and be allowed to molten
Melt, glass melt is taken out and is quickly poured into mold forming obtains blocky devitrified glass;
1.3 devitrified glasses obtained are put into resistance furnace and anneal to eliminate internal stress for 280 DEG C, and polishing is cut to it, obtain
To the devitrified glass of required size;
Step 2, the silica gel containing CASN:Eu red fluorescence powder is prepared, CASN:Eu red fluorescence powder and silica gel are pressed 50:
50 (mass ratioes) are mixed and stirred for uniformly, then removing bubble removing under vacuum conditions;
Step 3, the silica gel for being mixed with red fluorescence powder is coated on the devitrified glass surface of preparation using spin processes, with
After move it into drying box 2 hours curing moldings under the conditions of 150 DEG C, obtain required double-layer structure fluorophor.
The above is only a specific embodiment of the present invention, but the design concept of the present invention is not limited to this, all to utilize this
Design makes a non-material change to the present invention, and should all belong to behavior that violates the scope of protection of the present invention.
Claims (10)
1. a kind of fluorophor that double-layer structure is long-range, it is characterised in that: the devitrified glass including inlaying YAG:Ce yellow fluorescent powder,
The devitrified glass surface for inlaying YAG:Ce yellow fluorescent powder is covered with one layer of layer of silica gel containing CASN:Eu red fluorescence powder;
The component of the devitrified glass glass matrix for inlaying YAG:Ce yellow fluorescent powder and the molar percentage of content are as follows:
SiO224-27mol%, TeO222-26mol%, ZnO 15-18mol%, Ae2O 6-9mol%, GeO212-15mol%,
B2O39-12mol%, BaO 2.1-0.9mol%, TiO22.7-3.1mol%, wherein Ae is selected from Li, Na or K.
2. the long-range fluorophor of double-layer structure according to claim 1, it is characterised in that: described to contain CASN:Eu red
Fluorescent powder is that the content of CASN:Eu red fluorescence powder is the 10-50wt% of silica gel.
3. the long-range fluorophor of double-layer structure according to claim 1 or 2, it is characterised in that: described red containing CASN:Eu
Color fluorescent powder is CaAlSiN3: Eu2+Red fluorescence powder.
4. a kind of preparation method for the fluorophor that double-layer structure is long-range, which is characterized in that production claim 1-3 any one institute
The long-range fluorophor of the double-layer structure stated, includes the following steps:
Step 1, the devitrified glass of YAG:Ce yellow fluorescent powder is inlayed in preparation;
Step 2, the silica gel containing CASN:Eu red fluorescence powder is prepared, by a certain percentage by CASN:Eu red fluorescence powder and silica gel
It is mixed and stirred for uniformly, then removing bubble removing under vacuum conditions;
Step 3, the silica gel containing CASN:Eu red fluorescence powder is made in step 2 and inlays YAG:Ce Huang coated in prepared by step 1
On the devitrified glass of color fluorescent powder, curing molding in drying box is then moved it into, obtains the long-range glimmering of required double-layer structure
Body of light.
5. the preparation method of the long-range fluorophor of double-layer structure according to claim 4, it is characterised in that: in step 2
The mass ratio of CASN:Eu red fluorescence powder and silica gel is 10-50:50-90.
6. the preparation method of the long-range fluorophor of double-layer structure according to claim 4, it is characterised in that: the step 3
In the silica gel containing CASN:Eu red fluorescence powder YAG:Ce yellow fluorescence inlayed using spin coating, spraying or screen-printing deposition
On the devitrified glass of powder.
7. the preparation method of the long-range fluorophor of double-layer structure according to claim 4, it is characterised in that: the step 3
The solidification temperature of drying box is 100-200 DEG C, and curing time is 1-4 hours.
8. the preparation method of the long-range fluorophor of double-layer structure according to claim 5, it is characterised in that: the step 3
The solidification temperature of drying box is 150 DEG C, and curing time is 2 hours.
9. a kind of remote LED device of the remote phosphor with double-layer structure, including shell and luminescence chip, feature exist
In: it further include remote phosphor described in claim 1-3 any one, the luminescence chip is blue chip, the blue light
Chip is set to below the devitrified glass for inlaying YAG:Ce yellow fluorescent powder, and the layer of silica gel containing CASN:Eu red fluorescence powder is covered
It is placed on the upper surface for inlaying the devitrified glass of YAG:Ce yellow fluorescent powder.
10. the remote LED device of the remote phosphor according to claim 9 with double-layer structure, it is characterised in that: institute
Stating luminescence chip is 460 nano blue light chips.
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101080823A (en) * | 2004-12-17 | 2007-11-28 | 宇部兴产株式会社 | Photo-conversion structure and light-emitting device using same |
CN102384383A (en) * | 2010-08-03 | 2012-03-21 | 日东电工株式会社 | Light-emitting device |
CN103183473A (en) * | 2013-04-10 | 2013-07-03 | 中国科学院福建物质结构研究所 | Ce:YAG microcrystalline glass used for white light LED and preparation method of Ce:YAG microcrystalline glass |
CN206003824U (en) * | 2016-07-27 | 2017-03-08 | 福建省德化县腾兴陶瓷有限公司 | The long-range fluorophor of double-decker and remote LED device |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101080823A (en) * | 2004-12-17 | 2007-11-28 | 宇部兴产株式会社 | Photo-conversion structure and light-emitting device using same |
CN102384383A (en) * | 2010-08-03 | 2012-03-21 | 日东电工株式会社 | Light-emitting device |
CN103183473A (en) * | 2013-04-10 | 2013-07-03 | 中国科学院福建物质结构研究所 | Ce:YAG microcrystalline glass used for white light LED and preparation method of Ce:YAG microcrystalline glass |
CN206003824U (en) * | 2016-07-27 | 2017-03-08 | 福建省德化县腾兴陶瓷有限公司 | The long-range fluorophor of double-decker and remote LED device |
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