CN102789747B - 电子设备模块 - Google Patents
电子设备模块 Download PDFInfo
- Publication number
- CN102789747B CN102789747B CN201210152274.3A CN201210152274A CN102789747B CN 102789747 B CN102789747 B CN 102789747B CN 201210152274 A CN201210152274 A CN 201210152274A CN 102789747 B CN102789747 B CN 102789747B
- Authority
- CN
- China
- Prior art keywords
- alignment mark
- substrate
- panel
- electronic device
- device module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 177
- 238000001228 spectrum Methods 0.000 claims abstract description 9
- 238000005286 illumination Methods 0.000 claims description 14
- 239000004973 liquid crystal related substance Substances 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 description 20
- 238000000576 coating method Methods 0.000 description 20
- 238000000034 method Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 14
- 230000003287 optical effect Effects 0.000 description 10
- 238000009434 installation Methods 0.000 description 7
- 238000001514 detection method Methods 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 230000000007 visual effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000006059 cover glass Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 241001185540 Charissa ambiguata Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- -1 resistor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-110722 | 2011-05-17 | ||
JP2011110722A JP5739226B2 (ja) | 2011-05-17 | 2011-05-17 | 電子デバイスモジュールの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102789747A CN102789747A (zh) | 2012-11-21 |
CN102789747B true CN102789747B (zh) | 2016-04-13 |
Family
ID=47155140
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210152274.3A Expired - Fee Related CN102789747B (zh) | 2011-05-17 | 2012-05-10 | 电子设备模块 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9167695B2 (zh) |
JP (1) | JP5739226B2 (zh) |
CN (1) | CN102789747B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6129678B2 (ja) * | 2013-08-06 | 2017-05-17 | 宇部エクシモ株式会社 | 銅張積層板の判定方法及び銅張積層板 |
CN103943651B (zh) | 2013-08-29 | 2017-09-12 | 上海天马微电子有限公司 | 一种oled显示装置及相应的柔性电路板 |
US20150155211A1 (en) * | 2013-12-03 | 2015-06-04 | Kulicke And Soffa Industries, Inc. | Systems and methods for bonding semiconductor elements |
JP2015172682A (ja) * | 2014-03-12 | 2015-10-01 | 富士通オプティカルコンポーネンツ株式会社 | 光モジュール |
CN104536186B (zh) | 2015-01-13 | 2017-12-08 | 合肥鑫晟光电科技有限公司 | 一种识别装置和对位系统 |
KR102559170B1 (ko) * | 2015-12-15 | 2023-07-24 | 엘지디스플레이 주식회사 | 인쇄회로기판 및 이를 포함하는 표시장치 |
JP2019066750A (ja) * | 2017-10-04 | 2019-04-25 | 株式会社ジャパンディスプレイ | 表示装置 |
JP6920668B2 (ja) * | 2018-02-01 | 2021-08-18 | パナソニックIpマネジメント株式会社 | 加飾成形方法および加飾成形装置 |
JP2019200360A (ja) * | 2018-05-17 | 2019-11-21 | 日本電産サンキョー株式会社 | 振れ補正機能付き光学ユニット及びその製造方法 |
US11596058B2 (en) * | 2019-03-08 | 2023-02-28 | Qorvo Us, Inc. | Fiducials for laminate structures |
CN110018586B (zh) * | 2019-05-30 | 2022-01-18 | 京东方科技集团股份有限公司 | 一种显示面板及其对盒方法、显示装置、对盒装置 |
CN110504290B (zh) | 2019-08-27 | 2021-09-21 | 京东方科技集团股份有限公司 | 一种显示基板及其制备方法和显示面板 |
CN112505964B (zh) * | 2020-11-20 | 2022-08-30 | 合肥鑫晟光电科技有限公司 | 发光基板及其制备方法、显示装置 |
JP7439001B2 (ja) * | 2021-02-19 | 2024-02-27 | 矢崎総業株式会社 | フレキシブルプリント基板、フレキシブルプリント基板の製造方法 |
CN115240549B (zh) * | 2022-07-19 | 2023-11-10 | 武汉天马微电子有限公司 | 一种显示面板及显示装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006040978A (ja) * | 2004-07-22 | 2006-02-09 | Fuji Mach Mfg Co Ltd | 電子部品実装方法および装置 |
JP2006119321A (ja) * | 2004-10-21 | 2006-05-11 | Kofu Casio Co Ltd | 電気回路間の導通接続構造 |
JP2007273578A (ja) * | 2006-03-30 | 2007-10-18 | Optrex Corp | 電子部品接続構造 |
JP2010230808A (ja) * | 2009-03-26 | 2010-10-14 | Funai Electric Co Ltd | 液晶モジュール |
US7928591B2 (en) * | 2005-02-11 | 2011-04-19 | Wintec Industries, Inc. | Apparatus and method for predetermined component placement to a target platform |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3767393B2 (ja) * | 2001-02-07 | 2006-04-19 | セイコーエプソン株式会社 | 電気光学装置の製造方法、電気光学装置、電子機器、および圧着装置 |
JP2004317792A (ja) * | 2003-04-16 | 2004-11-11 | Citizen Watch Co Ltd | 液晶装置 |
US7450296B2 (en) * | 2006-01-30 | 2008-11-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and system for patterning alignment marks on a transparent substrate |
JP2008010450A (ja) * | 2006-06-27 | 2008-01-17 | Canon Inc | 電子機器パネル |
JP4207074B2 (ja) * | 2006-09-14 | 2009-01-14 | セイコーエプソン株式会社 | アライメント装置及びアライメント方法 |
JP2008112869A (ja) * | 2006-10-30 | 2008-05-15 | Fujitsu Ltd | 組立体モジュールの製造方法および組立体モジュール並びに電子機器 |
-
2011
- 2011-05-17 JP JP2011110722A patent/JP5739226B2/ja not_active Expired - Fee Related
-
2012
- 2012-04-30 US US13/459,768 patent/US9167695B2/en active Active
- 2012-05-10 CN CN201210152274.3A patent/CN102789747B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006040978A (ja) * | 2004-07-22 | 2006-02-09 | Fuji Mach Mfg Co Ltd | 電子部品実装方法および装置 |
JP2006119321A (ja) * | 2004-10-21 | 2006-05-11 | Kofu Casio Co Ltd | 電気回路間の導通接続構造 |
US7928591B2 (en) * | 2005-02-11 | 2011-04-19 | Wintec Industries, Inc. | Apparatus and method for predetermined component placement to a target platform |
JP2007273578A (ja) * | 2006-03-30 | 2007-10-18 | Optrex Corp | 電子部品接続構造 |
JP2010230808A (ja) * | 2009-03-26 | 2010-10-14 | Funai Electric Co Ltd | 液晶モジュール |
Also Published As
Publication number | Publication date |
---|---|
US9167695B2 (en) | 2015-10-20 |
JP5739226B2 (ja) | 2015-06-24 |
CN102789747A (zh) | 2012-11-21 |
JP2012243872A (ja) | 2012-12-10 |
US20120293974A1 (en) | 2012-11-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: JAPAN DISPLAY WEST INC. Free format text: FORMER OWNER: NANKAI UNIVERSITY Effective date: 20130301 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20130301 Address after: Aichi Prefecture, Japan Applicant after: Japan display West Co.,Ltd. Address before: Tokyo, Japan Applicant before: Sony Corp. |
|
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
CB02 | Change of applicant information |
Address after: Tokyo, Japan Applicant after: JAPAN DISPLAY Inc. Address before: Chiba County, Japan Applicant before: Japan Display East Inc. |
|
COR | Change of bibliographic data | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20151014 Address after: Chiba County, Japan Applicant after: Japan Display East Inc. Address before: Aichi Prefecture, Japan Applicant before: Japan display West Co.,Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160413 Termination date: 20180510 |
|
CF01 | Termination of patent right due to non-payment of annual fee |