CN102786909B - 一种led封装用的有机硅光固化封装胶及其应用 - Google Patents
一种led封装用的有机硅光固化封装胶及其应用 Download PDFInfo
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- CN102786909B CN102786909B CN201210129535.XA CN201210129535A CN102786909B CN 102786909 B CN102786909 B CN 102786909B CN 201210129535 A CN201210129535 A CN 201210129535A CN 102786909 B CN102786909 B CN 102786909B
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- coated plate
- led
- aluminium coated
- light source
- packaging plastic
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 41
- 239000003292 glue Substances 0.000 title claims abstract description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 14
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 14
- 239000010703 silicon Substances 0.000 title claims abstract description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 229920002050 silicone resin Polymers 0.000 claims abstract description 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000004721 Polyphenylene oxide Substances 0.000 claims abstract description 11
- 229920000570 polyether Polymers 0.000 claims abstract description 11
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 11
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 238000009792 diffusion process Methods 0.000 claims abstract description 9
- 238000005498 polishing Methods 0.000 claims abstract description 7
- 239000004411 aluminium Substances 0.000 claims description 42
- 229910052782 aluminium Inorganic materials 0.000 claims description 42
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 42
- -1 acrylic ester Chemical class 0.000 claims description 40
- 239000004033 plastic Substances 0.000 claims description 33
- 239000010410 layer Substances 0.000 claims description 27
- 238000000016 photochemical curing Methods 0.000 claims description 24
- 238000009413 insulation Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 238000005538 encapsulation Methods 0.000 claims description 11
- OCIFJWVZZUDMRL-UHFFFAOYSA-N 6-hydroxyhexyl prop-2-enoate Chemical compound OCCCCCCOC(=O)C=C OCIFJWVZZUDMRL-UHFFFAOYSA-N 0.000 claims description 10
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 claims description 10
- 239000002390 adhesive tape Substances 0.000 claims description 10
- UJVPXXKBKDRVTG-UHFFFAOYSA-N bis[1-(1-hydroxycyclohexa-2,4-dien-1-yl)cyclohexyl]methanone Chemical compound OC1(CC=CC=C1)C1(CCCCC1)C(=O)C1(CCCCC1)C1(CC=CC=C1)O UJVPXXKBKDRVTG-UHFFFAOYSA-N 0.000 claims description 10
- 229920001427 mPEG Polymers 0.000 claims description 10
- 229910052760 oxygen Inorganic materials 0.000 claims description 10
- 239000001301 oxygen Substances 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 9
- 229910002114 biscuit porcelain Inorganic materials 0.000 claims description 8
- 230000007797 corrosion Effects 0.000 claims description 6
- 238000005260 corrosion Methods 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000005030 aluminium foil Substances 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- 230000003628 erosive effect Effects 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract description 2
- 238000007711 solidification Methods 0.000 abstract description 2
- 230000008023 solidification Effects 0.000 abstract description 2
- 238000000605 extraction Methods 0.000 abstract 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 abstract 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract 1
- 239000002202 Polyethylene glycol Substances 0.000 abstract 1
- 125000005396 acrylic acid ester group Chemical group 0.000 abstract 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 abstract 1
- JJFFNQSUUAIWHB-UHFFFAOYSA-N carbamic acid;prop-2-enoic acid Chemical compound NC(O)=O.OC(=O)C=C JJFFNQSUUAIWHB-UHFFFAOYSA-N 0.000 abstract 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 abstract 1
- XCOLCZZTHJIBMT-UHFFFAOYSA-N hexane-1,1-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.CCCCCC(O)O XCOLCZZTHJIBMT-UHFFFAOYSA-N 0.000 abstract 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 abstract 1
- 229920001223 polyethylene glycol Polymers 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 4
- 238000004062 sedimentation Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 3
- 230000003712 anti-aging effect Effects 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 235000009470 Theobroma cacao Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 244000240602 cacao Species 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000007537 lampworking Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Abstract
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Claims (9)
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CN201210129535.XA CN102786909B (zh) | 2012-04-28 | 2012-04-28 | 一种led封装用的有机硅光固化封装胶及其应用 |
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CN201210129535.XA CN102786909B (zh) | 2012-04-28 | 2012-04-28 | 一种led封装用的有机硅光固化封装胶及其应用 |
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CN102786909B true CN102786909B (zh) | 2014-01-29 |
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Families Citing this family (7)
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CN103943761A (zh) * | 2014-04-22 | 2014-07-23 | 佛山佛塑科技集团股份有限公司 | 一种远程荧光粉配光薄膜及其制备方法 |
CN107722921A (zh) * | 2017-11-28 | 2018-02-23 | 安徽东耀建材有限公司 | 一种硅酮胶制备方法 |
US10763414B2 (en) * | 2017-12-18 | 2020-09-01 | Rohm Co., Ltd. | Semiconductor light-emitting device |
CN108395864A (zh) * | 2018-04-03 | 2018-08-14 | 安吉县安信信息有限公司 | 一种石墨烯掺杂导热灌封胶及其制备方法 |
TWI684293B (zh) * | 2018-06-29 | 2020-02-01 | 同泰電子科技股份有限公司 | 高反射背光電路板結構及其製作方法 |
CN112250030A (zh) * | 2020-09-25 | 2021-01-22 | 中芯集成电路(宁波)有限公司 | 元件组装方法及电子装置 |
CN112300750B (zh) * | 2020-11-18 | 2021-06-29 | 广州市高士实业有限公司 | 一种面板灯胶 |
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JP2544018B2 (ja) * | 1990-10-22 | 1996-10-16 | 信越化学工業株式会社 | 紫外線硬化性オルガノポリシロキサン組成物 |
CN101475779A (zh) * | 2009-01-01 | 2009-07-08 | 东莞市派乐玛胶粘化学品有限公司 | 一种用于按键粘接注模成型的光固化胶粘剂 |
CN101812278A (zh) * | 2010-05-20 | 2010-08-25 | 上海西怡新材料科技有限公司 | 紫外固化有机硅-丙烯酸树脂电子胶及其应用 |
CN202103090U (zh) * | 2011-06-17 | 2012-01-04 | 李铁军 | 新型led封装结构 |
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2012
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Non-Patent Citations (4)
Title |
---|
于秀梅等.改性气相法二氧化硅的发展及应用.《现代商贸工业》.2008,第20卷(第5期), |
改性气相法二氧化硅的发展及应用;于秀梅等;《现代商贸工业》;20080531;第20卷(第5期);第351-352页 * |
纳米二氧化硅的制备_表面改性和应用前景;芳明;《精细化工原料及中间体》;20110131(第1期);第19-23页 * |
芳明.纳米二氧化硅的制备_表面改性和应用前景.《精细化工原料及中间体》.2011,(第1期), |
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Application publication date: 20121121 Assignee: SHENZHEN COSLED LIGHTING CO., LTD. Assignor: He Zhongliang Contract record no.: 2014440020404 Denomination of invention: Organic silicon light-cured packaging glue used for LED packaging and application Granted publication date: 20140129 License type: Exclusive License Record date: 20141205 |
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Effective date of registration: 20170124 Address after: 518000 Guangdong province Shenzhen Guangming New District Office of Gongming Tianliao Village tenth Industrial Zone 2 Building 9 floor A District Patentee after: SHENZHEN COSLED LIGHTING CO., LTD. Address before: Baoan District Xinqiao Shajing Town Shenzhen city Guangdong province 518000 new industrial zone 3 row 7 Patentee before: He Zhongliang |