CN102779927B - 白光led及其封装方法 - Google Patents

白光led及其封装方法 Download PDF

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CN102779927B
CN102779927B CN201210290356.4A CN201210290356A CN102779927B CN 102779927 B CN102779927 B CN 102779927B CN 201210290356 A CN201210290356 A CN 201210290356A CN 102779927 B CN102779927 B CN 102779927B
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fluorescent material
silicate
white light
fluorescent
light leds
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CN102779927A (zh
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吉爱华
汪英杰
王凯敏
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INNER MONGOLIA HUAYAN XINGUANG TECHNOLOGY Co Ltd
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Abstract

一种白光LED及其封装方法，涉及半导体封装技术领域，包括支架，所述支架的上部设有散热杯，所述散热杯底部设有铜块和电极，所述铜块上设有蓝光芯片，所述蓝光芯片与所述电极之间连接有导线，所述散热杯内涂覆有荧光胶，所述荧光胶是由下列原料配制而成的，TMR-200647-380490荧光粉:硅酸盐05742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:硅胶6551AB=X:Y:Z:100，其中X=0.1～1，Y=1～10，Z=1～10。本发明所述白光LED及其封装方法提高了白光LED所发出光的还原性，可满足液晶电视所需要的背光，且生产成本低，可靠性高，可广泛的应用于液晶电视。

Description

白光LED及其封装方法
技术领域
本发明涉及半导体封装技术领域，特别涉及一种白光LED及其封装方法。
背景技术
LED（发光二级管）是一种能够将电能转化为光能的半导体，它改变了白炽灯钨丝发光与节能灯三基色粉发光的原理，而采用电场发光。白光LED的光谱几乎全部集中于可见光频段，将白光LED与普通的白炽灯、螺旋节能灯及三基色荧光灯进行对比，LED的特点非常明显：寿命长、光效高、低辐射及低功耗，正是因为LED的这些优点，使得白光LED照明已进入了高速发展时期。白光LED通常采用两种方法来形成：一是采用多种单色光混合的方法形成白光；二是利用蓝光芯片与荧光粉配合形成白光。目前，第二种方法多是在蓝光芯片上涂上YAG荧光粉（Ce稀土荧光粉），由于单一的YAG荧光粉难以有效控制色坐标及色温，使得封装出的白光LED所发出的光还原性差，难以满足液晶电视对背光的要求；且现有的用于液晶电视背光的白光LED均是采用两个20mil*20mil（1mil=0.001英寸=0.0254mm）的蓝光芯片封装而成的，这种封装方式成本高，工艺步骤繁琐，而且封装出的白光LED的可靠性低。
发明内容
本发明所要解决的第一个技术问题是提供一种白光LED，此白光LED所发出的光还原性高，可满足液晶电视对背光的要求。
作为一个总的发明构思，本发明所要解决的第二个技术问题是提供一种白光LED的封装方法。
为解决上述第一个技术问题，本发明的技术方案是：一种白光LED，包括支架，所述支架的上部设有散热杯，所述散热杯底部设有铜块和电极，所述铜块上设有蓝光芯片，所述蓝光芯片与所述电极之间连接有导线，所述散热杯内涂覆有荧光胶，所述荧光胶是由下列原料配制而成的，TMR-200647-380490荧光粉:硅酸盐05742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:硅胶6551AB=X:Y:Z:100，其中X=0.1～1，Y=1～10，Z=1～10。
作为一种改进，所述荧光胶是由下列原料配制而成的，TMR-200647-380490荧光粉:硅酸盐05742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:硅胶6551AB=X:Y:Z:100，其中X=0.1～0.4，Y=2～5，Z=2～5。
作为进一步的改进，所述蓝光芯片尺寸为20mil*40mil，波长为440nm～450nm。
作为进一步的改进，所述铜块上还设有与所述蓝光芯片并联的齐纳管，所述齐纳管与所述电极之间设有导线。
为解决上述第二个技术问题，本发明的技术方案是：一种白光LED的封装方法，包括以下步骤：
1）固晶：将齐纳管固定在铜块上，送入170～190℃的烘箱内烘烤60±5分钟；然后再将蓝光芯片固定在所述铜块上，送入140～160℃的烘箱内烘烤120±5分钟；
2）键合：用焊线机从所述蓝光芯片和所述齐纳管上引出导线，将所述导线与所述电极焊合，并保证所述蓝光芯片与所述齐纳管并联；
3）点荧光胶：
按下列组分及重量份配制荧光胶，TMR-200647-380490荧光粉:硅酸盐05742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:硅胶6551AB=X:Y:Z:100，其中X=0.1～1，Y=1～10，Z=1～10；
将配制好的荧光胶进行脱泡抽真空，用点胶机均匀的涂在所述步骤2）完成的白光LED的散热杯中，然后送入140～160℃的烘箱内烘烤60±5分钟；即制得白光LED。
作为一种改进，所述步骤3）中涂的荧光胶与所述散热杯的杯口持平。
本发明的有益效果在于：由于本发明所述的白光LED是在蓝光芯片上涂有荧光胶，荧光胶是由下列原料配制而成的，TMR-200647-380490荧光粉:硅酸盐05742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:硅胶6551AB=X:Y:Z:100，其中X=0.1～1，Y=1～10，Z=1～10；与单一的YAG荧光粉相比，三种荧光粉的组合具有重量份比例调配灵活的特点，从而可灵活的调整各色光的比例，弥补各色光的不足，提高了光的还原性。通过加150mA电流的老化测试，可做出色坐标（x=0.2488，y=0.2188）的液晶电视用的白光，且适合大批量生产，可广泛应用于液晶电视。
由于蓝光芯片尺寸为20mil*40mil，波长为440nm～450nm；故可用一片蓝光芯片代替两片尺寸为20mil*20mil的蓝光芯片，降低了成本，减少了工艺步骤，且由于芯片数量减少，相应的连接导线也减少，从而降低了故障率，提高了封装后白光LED灯管的可靠性。
综上所述，本发明所述白光LED及其封装方法提高了白光LED所发出光的还原性，可满足液晶电视所需要的背光，且生产成本低，可靠性高，可广泛的应用于液晶电视。
附图说明
图1是本发明固晶后的结构示意图；
图2是本发明键合后的结构示意图；
图3是本发明点荧光胶后的结构示意图；
图中：1、支架，10、铜块，11、散热杯，2、蓝光芯片，3、齐纳管，4、绝缘胶，5、银胶，6、电极，7、导线，8、荧光胶。
具体实施方式
下面结合附图和实施例，进一步阐述本发明。
实施例一：
如图1、图2和图3共同所示，一种白光LED，这种白光LED为SMD5630灯管，包括支架1，支架1的上部设有散热杯11，散热杯11底部设有10和电极6，铜块10设有散热杯11底部的中心位置，铜块10上设有蓝光芯片2，蓝光芯片2与电极6之间连接有导线7，导线7为金丝，散热杯11内涂覆有荧光胶8，荧光胶8是由下列原料配制而成的，TMR-200647-380490荧光粉（深圳市图盟机电科技有限公司）:硅酸盐05742荧光粉（英特美光电(深圳)有限公司）:硅酸盐、氮化物BLT-2500-AB荧光粉（英特美光电(深圳)有限公司）:硅胶6551AB（道康宁6551硅胶，A胶和B胶的比例为1:1）=X:Y:Z:100，其中X=0.1，Y=3.7，Z=3.7。与单一的YAG荧光粉相比，三种荧光粉的组合具有重量份比例调配灵活的特点，从而可灵活的调整各色光的比例，弥补各色光的不足，提高了光的还原性。通过加150mA电流的老化测试，可做出色坐标（x=0.2488，y=0.2188）的液晶电视用的白光，且适合大批量生产，可广泛应用于液晶电视。
蓝光芯片2尺寸为20mil*40mil，波长为440nm～450nm，亮度为4000mcd（mcd为光能量单位，代表光源本身单位面积内的发光强度）。用一片蓝光芯片2代替两片尺寸为20mil*20mil的蓝光芯片，降低了成本，减少了工艺步骤，且由于芯片数量减少，相应的连接导线也减少，从而降低了故障率，提高了封装后SMD5630灯管的可靠性。
铜块10上还设有与蓝光芯片2并联的齐纳管3，齐纳管3与电极6之间设有导线7，齐纳管3的型号为SD-00866；齐纳管3是一个稳压二极管，可对蓝光芯片2起到保护作用。
对本发明所述的SMD5630灯管进行加150mA电流的老化测试，可做出色坐标（x=0.2488，y=0.2188）的液晶电视用的LED白光。
一种SMD5630灯管的封装方法，包括以下步骤：
固晶：在铜块10的左上角先点上银胶5，银胶5的型号为SMP-2800（日本信越），再将齐纳管3放在银胶5上固定，送入170～190℃的烘箱内烘烤1小时；取出固好齐纳管3的支架1，然后在铜块10的中心点上点上绝缘胶4，绝缘胶4的型号为KER-3000（日本信越），将蓝光芯片2放在绝缘胶4上固定，送入140～160℃的烘箱内烘烤2小时；
键合：用金丝球焊机从蓝光芯片2和齐纳管3上引出导线7，将导线7与电极6焊合，并保证蓝光芯片2与齐纳管3并联；
点荧光胶：将TMR-200647-380490荧光粉，硅酸盐05742荧光粉，硅酸盐、氮化物BLT-2500-AB荧光粉和硅胶6551AB按照0.1:3.7:3.7:100的重量份数比配制好荧光胶，将配制好的荧光胶进行脱泡抽真空，用点胶机均匀的涂在键合步骤完成的SMD5630灯管半成品支架1的散热杯中，荧光胶的量应正好与散热杯的杯口持平为宜，然后送入140～160℃的烘箱内烘烤1小时；
剥离：点荧光胶步骤完成的SMD5630灯管从整板上剥离下来；
分光分色：将剥离步骤完成的SMD5630灯管进行分光分色；
编带包装：将分光分色步骤完成的SMD5630灯管进行包装，并根据需要盘带，即完成了SMD5630灯管的整个封装过程。
实施例二：
如图1、图2和图3共同所示，一种白光LED，其结构与实施例一基本相同，不同之处在于荧光胶8中TMR-200647-380490荧光粉，硅酸盐05742荧光粉，硅酸盐、氮化物BLT-2500-AB荧光粉和硅胶6551AB的重量份比为：TMR-200647-380490荧光粉:硅酸盐05742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:硅胶6551AB=X:Y:Z:100，其中X=0.4，Y=2，Z=5。
实施例三：
如图1、图2和图3共同所示，一种白光LED，其结构与实施例一基本相同，不同之处在于荧光胶8中TMR-200647-380490荧光粉，硅酸盐05742荧光粉，硅酸盐、氮化物BLT-2500-AB荧光粉和硅胶6551AB的重量份比为：TMR-200647-380490荧光粉:硅酸盐05742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:硅胶6551AB=X:Y:Z:100，其中X=0.4，Y=5，Z=2。
实施例四：
如图1、图2和图3共同所示，一种白光LED，其结构与实施例一基本相同，不同之处在于荧光胶8中TMR-200647-380490荧光粉，硅酸盐05742荧光粉，硅酸盐、氮化物BLT-2500-AB荧光粉和硅胶6551AB的重量份比为：TMR-200647-380490荧光粉:硅酸盐05742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:硅胶6551AB=X:Y:Z:100，其中X=1，Y=5，Z=5。
实施例五：
如图1、图2和图3共同所示，一种白光LED，其结构与实施例一基本相同，不同之处在于荧光胶8中TMR-200647-380490荧光粉，硅酸盐05742荧光粉，硅酸盐、氮化物BLT-2500-AB荧光粉和硅胶6551AB的重量份比为：TMR-200647-380490荧光粉:硅酸盐05742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:硅胶6551AB=X:Y:Z:100，其中X=0.1，Y=1，Z=10。
实施例六：
如图1、图2和图3共同所示，一种白光LED，其结构与实施例一基本相同，不同之处在于荧光胶8中TMR-200647-380490荧光粉，硅酸盐05742荧光粉，硅酸盐、氮化物BLT-2500-AB荧光粉和硅胶6551AB的重量份比为：TMR-200647-380490荧光粉:硅酸盐05742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:硅胶6551AB=X:Y:Z:100，其中X=0.1，Y=10，Z=1。
本发明不局限于上述具体的实施方式，本领域的普通技术人员从上述构思出发，不经过创造性的劳动，所作出的种种变换，均落在本发明的保护范围之内。

Claims (6)

1.白光LED，其特征在于，包括支架，所述支架的上部设有散热杯，所述散热杯底部设有铜块和电极，所述铜块上设有蓝光芯片，所述蓝光芯片与所述电极之间连接有导线，所述散热杯内涂覆有荧光胶，所述荧光胶是由下列原料配制而成的，TMR-200647-380490荧光粉:硅酸盐O5742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:硅胶6551AB＝X:Y:Z:100，其中X＝0.1～1，Y＝2～10，Z＝2～10。
2.根据权利要求1所述的白光LED，其特征在于，所述荧光胶是由下列原料配制而成的，TMR-200647-380490荧光粉:硅酸盐O5742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:硅胶6551AB＝X:Y:Z:100，其中X＝0.1～0.4，Y＝2～5，Z＝2～5。
3.根据权利要求1所述的白光LED，其特征在于，所述蓝光芯片尺寸为20mil*40mil，波长为440nm～450nm。
4.根据权利要求1所述的白光LED，其特征在于，所述铜块上还设有与所述蓝光芯片并联的齐纳管，所述齐纳管与所述电极之间设有导线。
5.权利要求1所述的白光LED的封装方法，其特征在于，包括以下步骤：
1)固晶：将齐纳管固定在铜块上，送入170～190℃的烘箱内烘烤60±5分钟；然后再将蓝光芯片固定在所述铜块上，送入140～160℃的烘箱内烘烤120±5分钟；
2)键合：用焊线机从所述蓝光芯片和所述齐纳管上引出导线，将所述导线与所述电极焊合，并保证所述蓝光芯片与所述齐纳管并联；
3)点荧光胶：
按下列组分及重量份配制荧光胶，TMR-200647-380490荧光粉:硅酸盐O5742荧光粉:硅酸盐、氮化物BLT-2500-AB荧光粉:硅胶6551AB＝X:Y:Z:100，其中X＝0.1～1，Y＝2～10，Z＝2～10；
将配制好的荧光胶进行脱泡抽真空，用点胶机均匀的涂在所述步骤2)完成的白光LED的散热杯中，然后送入140～160℃的烘箱内烘烤60±5分钟；即制得白光LED。
6.根据权利要求5所述的白光LED的封装方法，其特征在于，所述步骤3)中涂的荧光胶与所述散热杯的杯口持平。
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