CN102775612B - 一种乙烯基mq硅树脂及其制备方法 - Google Patents
一种乙烯基mq硅树脂及其制备方法 Download PDFInfo
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- CN102775612B CN102775612B CN201210258607.0A CN201210258607A CN102775612B CN 102775612 B CN102775612 B CN 102775612B CN 201210258607 A CN201210258607 A CN 201210258607A CN 102775612 B CN102775612 B CN 102775612B
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- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 title claims abstract description 33
- 229920002554 vinyl polymer Polymers 0.000 title claims abstract description 32
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- 229920005989 resin Polymers 0.000 title abstract description 4
- 239000011347 resin Substances 0.000 title abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract 2
- 229910052710 silicon Inorganic materials 0.000 title abstract 2
- 239000010703 silicon Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 claims abstract description 74
- 238000006243 chemical reaction Methods 0.000 claims abstract description 56
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 47
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims abstract description 33
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 claims abstract description 26
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 22
- 238000009833 condensation Methods 0.000 claims abstract description 22
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- 239000007787 solid Substances 0.000 claims description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 4
- 239000005977 Ethylene Substances 0.000 claims description 4
- 239000003643 water by type Substances 0.000 claims description 3
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- 238000010438 heat treatment Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 7
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 8
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- 210000003298 dental enamel Anatomy 0.000 description 6
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- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 4
- -1 siloxane unit Chemical group 0.000 description 4
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 4
- 239000004115 Sodium Silicate Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
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- 229910052911 sodium silicate Inorganic materials 0.000 description 3
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
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- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910018557 Si O Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
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- 239000013530 defoamer Substances 0.000 description 1
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- 229920001971 elastomer Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- JEWCZPTVOYXPGG-UHFFFAOYSA-N ethenyl-ethoxy-dimethylsilane Chemical compound CCO[Si](C)(C)C=C JEWCZPTVOYXPGG-UHFFFAOYSA-N 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
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- 239000003063 flame retardant Substances 0.000 description 1
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- 235000013305 food Nutrition 0.000 description 1
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- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
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- 238000004806 packaging method and process Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
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- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000002444 silanisation Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
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- Silicon Polymers (AREA)
Abstract
Description
原料名称 | 规格(%) | 配方(kg) |
1、正硅酸乙酯 | ≥98 | 1220 |
2、六甲基二硅氧烷 | ≥99 | 270+500 |
3、乙烯基单封头 | ≥99 | 75.5 |
4、HCL | AR | 120 |
5、水 | 1000 | |
6、氢氧化钾 | 固体 | 0.45 |
Claims (52)
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CN201210258607.0A CN102775612B (zh) | 2012-07-24 | 2012-07-24 | 一种乙烯基mq硅树脂及其制备方法 |
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CN201210258607.0A CN102775612B (zh) | 2012-07-24 | 2012-07-24 | 一种乙烯基mq硅树脂及其制备方法 |
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Families Citing this family (8)
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CN103709756B (zh) * | 2013-12-19 | 2016-07-06 | 中昊晨光化工研究院有限公司 | Pc/abs合金用阻燃剂及其制备方法 |
CN105585714B (zh) * | 2015-12-16 | 2019-04-19 | 东莞兆舜有机硅科技股份有限公司 | 一种抗紫外线的有机硅树脂、制备方法及其用途 |
CN107722864B (zh) * | 2017-10-27 | 2020-08-18 | 广东可逸智膜科技有限公司 | 一种中离型力且高残余粘着率的离型膜及其制备方法 |
CN109608640B (zh) * | 2018-12-27 | 2020-09-29 | 浙江新安化工集团股份有限公司 | 一种高分子量mq硅树脂及其合成方法、应用 |
CN110498925A (zh) * | 2019-09-16 | 2019-11-26 | 南昌大学 | 一种补强硅橡胶用mq树脂的制备方法 |
CN110982073A (zh) * | 2019-12-25 | 2020-04-10 | 四川晨光博达新材料有限公司 | 一种制备单一分子量mq硅树脂的方法 |
CN113265052B (zh) * | 2021-05-11 | 2022-08-30 | 江苏众合硅基新材料有限公司 | 一种稳定性好的乙烯基mt树脂的制备方法 |
CN114262438A (zh) * | 2021-12-30 | 2022-04-01 | 合盛硅业股份有限公司 | 一种用于制备粉末mq硅树脂的方法 |
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CN101875725A (zh) * | 2010-07-14 | 2010-11-03 | 广州市高士实业有限公司 | 有机硅灌封胶补强用乙烯基硅树脂及其制备方法 |
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CN101875725A (zh) * | 2010-07-14 | 2010-11-03 | 广州市高士实业有限公司 | 有机硅灌封胶补强用乙烯基硅树脂及其制备方法 |
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Owner name: DONGGUAN MEGASUN SILICONE TECHNOLOGY CO., LTD. Free format text: FORMER NAME: DONGGUAN ZHAOSHUN ORGANOSILICON NEW MATERIAL TECHNOLOGY CO., LTD . |
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Address after: Two street 523233 Guangdong province Dongguan City Chudo Zhen Dong Bo Cun Da Xin Wei Lu Daxin Road No. 1 Patentee after: Dongguan million Shun's organosilicon Science and Technology Co., Ltd. Address before: Tang Zhen Dong Da Bo Cun Xin Wei Lu new two street 523233 Guangdong city of Dongguan province No. 1 Patentee before: Dongguan Zhaoshun Organosilicon New Material Technology Co., Ltd . |
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Denomination of invention: Vinyl MQ silicon resin and preparation method thereof Effective date of registration: 20181025 Granted publication date: 20140827 Pledgee: LED One (Hangzhou) Co.,Ltd. Pledgor: Dongguan million Shun's organosilicon Science and Technology Co., Ltd. Registration number: 2018990000978 |
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Date of cancellation: 20190604 Granted publication date: 20140827 Pledgee: LED One (Hangzhou) Co.,Ltd. Pledgor: Dongguan million Shun's organosilicon Science and Technology Co., Ltd. Registration number: 2018990000978 |
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Address after: Two street 523233 Guangdong province Dongguan City Chudo Zhen Dong Bo Cun Da Xin Wei Lu Daxin Road No. 1 Patentee after: Zhaoshun Technology (Guangdong) Co., Ltd Address before: Two street 523233 Guangdong province Dongguan City Chudo Zhen Dong Bo Cun Da Xin Wei Lu Daxin Road No. 1 Patentee before: Dongguan million Shun's organosilicon Science and Technology Co., Ltd. |
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