CN102711370A - Warp-preventing rigid printed circuit board - Google Patents
Warp-preventing rigid printed circuit board Download PDFInfo
- Publication number
- CN102711370A CN102711370A CN2012101892219A CN201210189221A CN102711370A CN 102711370 A CN102711370 A CN 102711370A CN 2012101892219 A CN2012101892219 A CN 2012101892219A CN 201210189221 A CN201210189221 A CN 201210189221A CN 102711370 A CN102711370 A CN 102711370A
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- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- printed wiring
- areas
- main part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a warp-preventing rigid printed circuit board. Radios of auxiliary pattern areas on a discarded board and areas of gaps among auxiliary patterns are equal; areas of a main pattern area on a main body part of a printed circuit board and areas of the gaps among the auxiliary patterns are equal, therefore, copper residual rates on all layers of the main body part of the printed circuit board and the discarded board are basically equal, and when the temperature and the humidity change, the flexibilities of the main body part of the printed circuit board and the discarded board can be basically same, thus the warping and distorting of the printed circuit board can be greatly reduced.
Description
Technical field
The present invention relates to printed substrate and make field, especially a kind of anti-warping rigidity printed substrate.
Background technology
In recent years, because semiconductor technology is fast-developing, the packing density of printed wiring board constantly develops to the High Level direction; Along with densification is installed; At the installation procedure of printed wiring board, because the crooked or distortion that printed wiring board produces has seriously influenced the qualification rate of installing.
So, need a kind of new technical scheme to address the above problem.
Summary of the invention
The objective of the invention is deficiency, a kind of anti-warping rigidity printed substrate is provided to the prior art existence.
For realizing the foregoing invention purpose, the anti-warping rigidity printed substrate of the present invention can adopt following technical scheme:
A kind of anti-warping rigidity printed substrate comprises the discarded plate of printed wiring board main part and non-printed wiring plate portion, between the auxiliary pattern area on the said discarded plate and the auxiliary pattern apart from one another by the ratio of slit area equate; Between main graphic area on the printed wiring main part and the auxiliary pattern apart from one another by the ratio of slit area equate.
Compare with background technology, the present invention through between the auxiliary pattern area on the discarded plate and the auxiliary pattern apart from one another by the ratio of slit area equate; Between main graphic area on the printed wiring main part and the auxiliary pattern apart from one another by the ratio of slit area equate; The residual copper rate of each layer is equal basically on printed wiring board main part and the discarded plate like this; When humiture changes; The flexible of printed wiring board main part and discarded plate can be basic identical, then can reduce warpage, the distortion of printed wiring board significantly.
Description of drawings
Fig. 1 is the structural representation of the anti-warping rigidity printed substrate of the present invention.
Fig. 2 is the enlarged diagram of discarded plate among Fig. 1.
Embodiment
Below in conjunction with accompanying drawing and embodiment; Further illustrate the present invention; Should understand these execution modes only be used to the present invention is described and be not used in the restriction scope of the present invention; After having read the present invention, those skilled in the art all fall within the application's accompanying claims institute restricted portion to the modification of the various equivalent form of values of the present invention.
See also shown in Figure 1; The present invention discloses a kind of anti-warping rigidity printed substrate 1; Between the discarded plate 3 that comprises printed wiring board main part 2 and non-printed wiring plate portion, auxiliary pattern 31 areas on the said discarded plate 3 and auxiliary pattern 31 apart from one another by the ratio of slit area 32 equate; Between main graphic on the printed wiring main part (not shown) area and the auxiliary pattern 31 apart from one another by the ratio of slit area 32 equate; The residual copper rate of each layer is equal basically on printed wiring board main part 2 and the discarded plate 3 like this; When humiture changes; The flexible of printed wiring board main part 2 and discarded plate 3 can be basic identical, then can reduce warpage, the distortion of printed wiring board 1 significantly.Main graphic on the printed wiring board main part 2 is two-layer above figure.
Claims (2)
1. anti-warping rigidity printed substrate is characterized in that: comprise the discarded plate of printed wiring board main part and non-printed wiring plate portion, between the auxiliary pattern area on the said discarded plate and the auxiliary pattern apart from one another by the ratio of slit area equate; Between main graphic area on the printed wiring main part and the auxiliary pattern apart from one another by the ratio of slit area equate.
2. anti-warping rigidity printed substrate as claimed in claim 1 is characterized in that: the main graphic on the printed wiring board main part is two-layer above figure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101892219A CN102711370A (en) | 2012-06-08 | 2012-06-08 | Warp-preventing rigid printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101892219A CN102711370A (en) | 2012-06-08 | 2012-06-08 | Warp-preventing rigid printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102711370A true CN102711370A (en) | 2012-10-03 |
Family
ID=46903867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101892219A Pending CN102711370A (en) | 2012-06-08 | 2012-06-08 | Warp-preventing rigid printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102711370A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582285A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Method for manufacturing printed circuit board low in warping degree and high in flatness |
| CN107567182A (en) * | 2017-09-14 | 2018-01-09 | 广州兴森快捷电路科技有限公司 | Board-splicing process side and board joint method |
| CN109121302A (en) * | 2018-09-28 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | Edges of boards design method, the design method of wiring board and the wiring board of wiring board |
| CN110913583A (en) * | 2019-10-23 | 2020-03-24 | 广州陶积电电子科技有限公司 | Method for improving warping of asymmetric copper thick substrate and substrate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1630454A (en) * | 2003-12-19 | 2005-06-22 | 三井金属矿业株式会社 | Printed wiring board and semiconductor device |
| US20100132993A1 (en) * | 2008-12-02 | 2010-06-03 | Shinko Electric Industries Co., Ltd. | Wiring board and electronic component device |
| JP2011171473A (en) * | 2010-02-18 | 2011-09-01 | Fujikura Ltd | Printed wiring board |
| CN202634880U (en) * | 2012-06-08 | 2012-12-26 | 镇江华印电路板有限公司 | Anti-warping rigid printed circuit board |
-
2012
- 2012-06-08 CN CN2012101892219A patent/CN102711370A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1630454A (en) * | 2003-12-19 | 2005-06-22 | 三井金属矿业株式会社 | Printed wiring board and semiconductor device |
| US20100132993A1 (en) * | 2008-12-02 | 2010-06-03 | Shinko Electric Industries Co., Ltd. | Wiring board and electronic component device |
| JP2011171473A (en) * | 2010-02-18 | 2011-09-01 | Fujikura Ltd | Printed wiring board |
| CN202634880U (en) * | 2012-06-08 | 2012-12-26 | 镇江华印电路板有限公司 | Anti-warping rigid printed circuit board |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582285A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Method for manufacturing printed circuit board low in warping degree and high in flatness |
| CN104582285B (en) * | 2014-12-31 | 2018-01-30 | 广州兴森快捷电路科技有限公司 | The preparation method of the printed circuit board (PCB) of low warpage high-flatness |
| CN107567182A (en) * | 2017-09-14 | 2018-01-09 | 广州兴森快捷电路科技有限公司 | Board-splicing process side and board joint method |
| WO2019052091A1 (en) * | 2017-09-14 | 2019-03-21 | 广州兴森快捷电路科技有限公司 | Panelization processing edge and panelization method |
| CN109121302A (en) * | 2018-09-28 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | Edges of boards design method, the design method of wiring board and the wiring board of wiring board |
| CN109121302B (en) * | 2018-09-28 | 2020-03-06 | 广州兴森快捷电路科技有限公司 | Circuit board edge design method and circuit board design method |
| CN110913583A (en) * | 2019-10-23 | 2020-03-24 | 广州陶积电电子科技有限公司 | Method for improving warping of asymmetric copper thick substrate and substrate |
| CN110913583B (en) * | 2019-10-23 | 2021-06-18 | 广州陶积电电子科技有限公司 | Method for improving warping of asymmetric copper thick substrate and substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20121003 |