CN201312447Y

CN201312447Y - Multilayer circuit board

Info

Publication number: CN201312447Y
Application number: CNU2008201469666U
Authority: CN
Inventors: 方涛; 周成军
Original assignee: AAC Acoustic Technologies Shenzhen Co Ltd
Current assignee: AAC Technologies Holdings Shenzhen Co Ltd; AAC Technologies Holdings Changzhou Co Ltd; AAC Technologies Holdings Inc
Priority date: 2008-08-29
Filing date: 2008-08-29
Publication date: 2009-09-16
Anticipated expiration: 2018-08-29

Abstract

Disclosed is a multilayer circuit board, which comprises a first substrate, a second substrate, a first circuit layer and a second circuit layer, wherein the first circuit layer arranged on the first substrate is far away from the second the second substrate and the second circuit layer arranged on the second substrate is far away from the first substrate. The multilayer circuit board is characterized by further comprising a third circuit layer between the first substrate and the second substrate, the third circuit layer consists of a plurality of third path lines, and the smallest projecting area of the third circuit layer to the first substrate is a complement of a union of a projecting area of the first circuit layer to the first substrate and a projecting area of the second circuit layer to the first substrate. The third circuit layer can shield electromagnetic interference between the first circuit layer and the second circuit layer.

Description

Multilayer circuit board

[technical field]

The utility model relates to a kind of circuit board, relates in particular to a kind of multilayer circuit board.

[background technology]

Flourish along with electronic industry, electronic product also develop towards light, thin, short, little, high integration, multi-functional, high-performance direction gradually.The integrated level of electronic component is more and more higher.For satisfying semiconductor package part high integration and microminiaturized encapsulation requirement, provide the design of the circuit board that a plurality of main passive devices and circuit connect particularly important.

The circuit board 100 ' of correlation technique, it comprises one deck base material 1 ' and the line layer 2 ' that is distributed in base material 1 ' two sides at least, described line layer 2 ' is made up of some traces (not shown).

Computing in response to high-effect chips such as microprocessor, chipset, drawing chips needs, the layout that line layer 2 ' is gone up trace becomes increasingly complex, make the layout of trace of line layer 2 ' on base material 1 ' two sides be not quite similar, so easy appearance, the situation of trace is not all arranged on the two sides of base material 1 ' on a certain position, makes the line layer 2 ' on base material 1 ' two sides have electromagnetic interference each other.

Therefore, be necessary to provide a kind of new multilayer circuit board to overcome the problems referred to above.

[utility model content]

The purpose of this utility model is to provide a kind of multilayer circuit board that prevents that interior trace from interfering with each other.

The purpose of this utility model is achieved in that a kind of multilayer circuit board, it comprises first, second base material, place on first base material first line layer away from second base material, place on second base material second line layer away from first base material, wherein, described multilayer circuit board also is provided with the tertiary circuit layer between between first and second base materials, this tertiary circuit layer is made up of some the 3rd traces, and the Minimum Area that described tertiary circuit layer projects to first substrate is the supplementary set that first line layer projects to the union in the zone of first substrate and the zone that second line layer projects to first substrate.

Compared with prior art, the utlity model has following advantage: the tertiary circuit layer is set in the middle of first, second base material, and the Minimum Area that the tertiary circuit layer projects to first substrate is the supplementary set that first line layer projects to the union in the zone of first substrate and the zone that second line layer projects to first substrate, and the tertiary circuit layer of the multilayer circuit board of this structure can shield first line layer and the mutual electromagnetic interference of second line layer.

[description of drawings]

Fig. 1 is the generalized section of the multilayer circuit board of correlation technique.

Fig. 2 is the generalized section of multilayer circuit board of the present utility model.

[embodiment]

Describe the concrete structure of the utility model multilayer circuit board in detail below in conjunction with accompanying drawing.

Multilayer circuit board 100 comprises first base material 1, second base material 2, place on first base material 1 first line layer 3 away from second base material 2, place on second base material 2 away from second line layer 4 of first base material 1 with between the tertiary circuit layer 5 of 1,2 of first, second base materials.

First line layer 3 is made up of some first traces (not shown), and this first trace can be arranged to Any shape; Second line layer is made up of some second traces (not shown), and this second trace also can be arranged to Any shape; Tertiary circuit layer 5 is made up of some the 3rd traces, and the Minimum Area that described tertiary circuit layer 5 projects to first substrate 1 is the supplementary set that first line layer 3 projects to the union in the zone of first substrate 1 and the zone that second line layer 4 projects to first substrate 1.

The material of first,

second base material

1,2 can be selected the material of the base material of any circuit board manufacturing in the industry.

In the middle of first,

second base material

1,2, tertiary circuit layer 5 is set, and the Minimum Area that tertiary circuit layer 5 projects to first substrate 1 is the supplementary set that first line layer 3 projects to the union in the zone of first substrate 1 and the zone that second line layer 4 projects to first substrate 1, and tertiary circuit layer 5 can shield first line layer 3 and the mutual electromagnetic interference of second line layer 4 like this.

The above only is a better embodiment of the present utility model; protection range of the present utility model does not exceed with above-mentioned execution mode; as long as the equivalence that those of ordinary skills do according to the utility model institute disclosure is modified or changed, all should include in the protection range of putting down in writing in claims.

Claims

1. multilayer circuit board, it comprises first, second base material, place on first base material first line layer away from second base material, place on second base material second line layer away from first base material, it is characterized in that: described multilayer circuit board also is provided with the tertiary circuit layer between between first and second base materials, this tertiary circuit layer is made up of some the 3rd traces, and the Minimum Area that described tertiary circuit layer projects to first substrate is the supplementary set that first line layer projects to the union in the zone of first substrate and the zone that second line layer projects to first substrate.