CN102656803B - 半导体继电器 - Google Patents

半导体继电器 Download PDF

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CN102656803B
CN102656803B CN201080045218.9A CN201080045218A CN102656803B CN 102656803 B CN102656803 B CN 102656803B CN 201080045218 A CN201080045218 A CN 201080045218A CN 102656803 B CN102656803 B CN 102656803B
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mosfet
conductive plate
conductive plates
driving element
light
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CN102656803A (zh
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星野就俊
藤原嘉宏
芝野贵史
高真祐
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Panasonic Intellectual Property Management Co Ltd
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Matsushita Electric Industrial Co Ltd
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Abstract

一种半导体继电器，具有：2个MOSFET；发光元件；受光驱动元件，根据所述发光元件的发光的有无，分别对所述2个MOSFET进行导通截止驱动；2个输出导电板，分别与所述2个MOSFET电连接；2个输入导电板，分别与所述发光元件电连接；以及密封树脂，将2个MOSFET、发光元件、受光驱动元件、2个输出导电板及2个输入导电板分别密封。所述2个输出导电板和所述2个输入导电板分别具有向所述密封树脂的外侧突出而被表面安装到彼此共用的印刷布线板上的端子部，所述2个输出导电板分别具有安装部，在安装部上分别安装所述2个MOSFET之中的各1个，或被连结各2个MOSFET的漏电极，所述各安装部分别以厚度方向相对于所述印刷布线板的厚度方向交叉的朝向被所述密封树脂密封。

Description

半导体继电器
技术领域
本发明涉及一种半导体继电器。
背景技术
以往，提供了一种被称之为MOSFET输出光电耦合器或光MOSFET的半导体继电器(例如参见专利文献1)。
图11～图14示出半导体继电器1的一个例子。该半导体继电器1具有2个输入端子部51和2个输出端子部61。此外，上述半导体继电器1具有：发光元件2，连接在输入端子部51之间；2个MOSFET3a、3b，彼此串联连接在输出端子部61之间；以及受光驱动元件4，根据发光元件2的发光的有无，分别对各MOSFET3a、3b进行导通截止驱动。
发光元件2具有一对端子，该一对端子分别与每个输入端子部51电连接，通过对该端子之间输入规定的电力(例如规定电压的直流电力)，发光元件2进行发光。作为发光元件2，能够使用例如发光二极管。
受光驱动元件4是将受光元件4a和驱动电路4b集成在1个芯片上而形成的，所述受光元件4a接受发光元件2的光而产生电力，例如由发光二极管阵列构成，所述驱动电路4b在受光元件4a产生电力的期间，通过该电力分别对各MOSFET3a、3b进行导通驱动，并且在受光元件4a不产生电力的期间，驱动电路4b分别对各MOSFET3a、3b进行截止驱动。如上所述的受光驱动元件4可以采用现有技术来实现，所以省略详细说明。
各MOSFET3a、3b分别是N通道型，源电极31彼此相互电连接，并且栅电极32和源电极31分别与受光驱动元件4的驱动电路4b电连接，漏电极33分别与一个输出端子部61电连接。也就是说，各MOSFET3a、3b的寄生二极管彼此反向，所以连接在2个MOSFET3a、3b的串联电路的各一端上的输出端子部61之间的电连接(导通)的接通断开取决于各MOSFET3a、3b的导通截止状态，而与向输出端子部61之间输入的电压的方向无关。
说明上述半导体继电器1的动作。在未向输入端子部51之间输入规定的电力而发光元件2熄灭的期间，各MOSFET3a、3b分别被维持在截止状态，所以输出端子部61之间的电连接断开。
通过向输入端子部51之间输入规定的电力而使发光元件2点亮时，受光驱动元件4分别对各MOSFET3a、3b进行导通驱动，从而输出端子部61之间的电连接导通。
另外，当发光元件2熄灭时，受光驱动元件4分别对各MOSFET3a、3b进行截止驱动，从而输出端子部61之间的电连接再次被断开。
在此，上述半导体继电器1具有将发光元件2、各MOSFET3a、3b以及受光驱动元件4分别密封的密封树脂10。在密封树脂10上，至少在被发光元件2和受光驱动元件4的受光元件4a夹持的部位使用能够使发光元件2的光通过的合成树脂。
此外，上述半导体继电器1具有2个输入导电板5，该2个输入导电板5分别由导电材料形成，在密封树脂10内具有与发光元件2的各端子电连接的连接部52。在其中一个输入导电板5的连接部52上表面安装(surfacemount)有发光元件2的一个端子，而另一个输入导电板5的连接部52通过引线接合(wire bonding)与发光元件2的另一个端子电连接。另外，各输入导电板5分别具有向密封树脂10外突出的输入端子部51。各输入导电板5分别通过例如对金属板实施冲压加工和弯曲加工而形成。
另外，上述半导体继电器1具备2个输出导电板6和中央导电板7，所述2个输出导电板6分别由导电材料构成，在密封树脂(封装体)10内具有1个安装部62，在安装部62上表面安装有各MOSFET3a、3b的漏电极33，所述中央导电板7由导电材料构成，为扁平的形状，在中央导电板7上表面安装有受光驱动元件4并被密封树脂10密封。各输出导电板6和中央导电板7也与输入导电板5同样地通过对金属板实施冲压加工和弯曲加工来形成。各MOSFET3a、3b的源电极31彼此通过引线接合相互电连接，并且栅电极32分别通过引线接合与受光驱动元件4电连接。另外，其中一个的MOSFET3a的源电极31和受光驱动元件4分别通过引线接合与中央导电板7电连接，从而各MOSFET3a、3b的源电极31分别经由中央导电板7与受光驱动元件4电连接。另外，各输出导电板6分别具有向密封树脂10外突出的输出端子部61。
如图13及图14所示，各输入端子部51及各输出端子部61分别被表面安装在设置于共用的印刷布线板P的安装面(图14中的上表面)上的导电图案P1、P2上。
在以往的技术中，使安装部62和中央导电板7各自的厚度方向与上述印刷布线板P的厚度方向一致。
专利文献1：日本特开2003-8050号公报
然而，在对输出端子部61之间传输高频信号的情况下，连接在各MOSFET3a、3b的源电极31上的中央导电板7作为所谓的分支(stub)电路发挥作用，所以也会向中央导电板7流入高频信号。
此外，在印刷布线板P上，有时以屏蔽例如电磁噪声为目的，在非安装面(图14中的下表面)的整个面上设置与地线同电位的导电图案P3。在该情况下，相互对置的各输出导电板6的安装部62及中央导电板7与接地图案P3之间产生寄生电容Cp。这样的话，会从各输出导电板6的安装部62和中央导电板7经由上述寄生电容Cp流出高频信号，从而插入损失(insertion loss)会增加。
发明内容
本发明是鉴于上述情况而提出的，提供一种能够降低插入损失的半导体继电器。
根据本发明的实施方式，提供一种半导体继电器，具有：2个MOSFET，以寄生二极管的朝向彼此相反的方式相互串联连接；发光元件，具有一对端子，在该端子之间输入规定的电力而进行发光；受光驱动元件，根据所述发光元件的发光的有无，分别对所述2个MOSFET进行导通截止驱动；2个输出导电板，分别由导电材料形成，分别与所述2个MOSFET的串联电路的各一端电连接；2个输入导电板，分别由导电材料形成，分别与所述发光元件的各1个端子电连接；以及密封树脂，分别将所述2个MOSFET、所述发光元件、所述受光驱动元件、所述2个输出导电板及所述2个输入导电板密封；所述2个输出导电板和所述2个输入导电板分别具有端子部，该端子部向所述密封树脂的外侧突出而被安装到彼此共用的印刷布线板上，所述2个输出导电板分别具有安装部，在该安装部上分别安装有所述2个MOSFET之中的各1个，或连结有各2个MOSFET的漏电极，所述各安装部分别以厚度方向与所述印刷布线板的厚度方向交叉的朝向被所述密封树脂密封。
并且，所述2个MOSFET可以被集成在1个芯片上。
并且，所述2个MOSFET分别被表面安装在各所述输出导电板上。
并且，所述2个MOSFET相互的连接点通过直接的引线接合与所述受光驱动元件电连接。
并且，可以具有中央导电板，该中央导电板由导电材料构成且呈扁平形状，所述受光驱动元件被固定在中央导电板上，中央导电板以厚度方向与所述印刷布线板的厚度方向交叉的朝向被所述密封树脂密封，所述2个MOSFET的相互的连接点和所述受光驱动元件分别通过引线接合与中央导电板电连接。
发明的效果：
根据本发明的实施方式，各安装部分别以厚度方向与各端子部各自所被安装的印刷布线板的厚度方向交叉的方向被密封树脂密封，所以与各安装部分别以厚度方向与上述印刷布线板的厚度方向平行的情况相比，在上述印刷布线板的导电图案与各安装部之间能够产生的寄生电容下降，从而能够降低插入损失。
附图说明
本发明的目的及特征将通过参照下面的附图说明的优选实施方式加以明确。
图1是示出本发明的第1实施方式的半导体继电器的主视图。
图2(a)(b)是示出分别从不同的视点看到的上述第1实施方式的半导体继电器的立体图。
图3是示出上述第1实施方式的半导体继电器的要部的左侧视图。
图4是分别表示上述第1实施方式的半导体继电器(曲线B)和现有例(曲线A)的频率特性的说明图。
图5是示出上述第1实施方式的半导体继电器的变形例的立体图。
图6是示出图5的例子的要部的左侧视图。
图7是示出上述第1实施方式的半导体继电器的其他变形例的立体图。
图8是示出图7的例子的要部的左侧视图。
图9是本发明的第2实施方式的半导体继电器的密封树脂(封装体)内部的立体图。
图10是上述第2实施方式的半导体继电器的剖视图。
图11是示出半导体继电器的电路框图。
图12是示出现有例的半导体继电器的立体图。
图13是示出上述现有例的一部分切断的俯视图。
图14是示出上述现有例的主视图。
具体实施方式
下面，参照构成本说明书的一部分的附图，详细说明本发明的实施方式。在整个附图中，对相同的或类似的部分赋予相同的参照符号，并省略说明。
本实施方式的基本构成与在图11～图14中说明的现有例是共用的，所以省略相同部分的说明。
(第1实施方式)
在本发明的第1实施方式中，如图1及图2所示，使中央导电板7和各安装部62各自的厚度方向与分别表面安装有各端子部51、61的印刷布线板P的厚度方向交叉(本例中为正交)。
具体地说，各输入导电板5和各输出导电板6分别在厚度方向上以直角折弯一次而形成为L字形状，在折弯部位的一侧分别形成有作为端子部的输入端子部51或输出端子部61，在另一侧形成有连接部52或安装部62。
另外，MOSFET3a的源电极31与受光驱动元件4的电连接如图3所示，通过直接的引线接合来实现，而不像以往那样经由中央导电板7来实现。由此，与像现有例那样将MOSFET3a的源电极31经由中央导电板7连接到受光驱动元件4上的情况相比，所需的引线接合的次数减少。
此外，各MOSFET3a、3b各自的漏电极33(参见图11)表面安装在输出导电板6的安装部62上。由此，与采用引线接合来实现各MOSFET3a、3b的漏电极33与安装部62之间的电连接的情况相比，能够增加电流容量，根据本发明人进行的实验，确认到能够使电流容量成为2倍以上。
另外，密封树脂10整体形成为长方体形状，半导体继电器1以密封树脂10的一个面(图1中的下表面)朝向印刷布线板P的方式被表面安装到印刷布线板P上。
下面，上下左右是以图1为基准，与图1的纸面正交的方向之中的跟前方向(图2(a)中箭头表示的左下方向)称为前方向。另外，上述方向是为了便于说明而定义的，并不一定与实际的使用状态中的方向一致。
中央导电板7是将厚度方向朝向左右方向的扁平形状，具有从上端部向前后两侧突设的臂部71。制造时，在通过密封树脂10进行密封时，中央导电板7及受光驱动元件4分别被支承在臂部71上。
另外，各输入端子部51和各输出端子部61分别使厚度方向的两个面之中的、连接部52和安装部62未突出一侧的面与密封树脂10的下表面大致对齐。此外，各输入端子部51分别在密封树脂10的左面的下端部上前后排列且向左方突出，各输出端子部61分别在密封树脂10的右面的下端部上前后排列且向右方突出。
此外，中央导电板7和各安装部62以各自的表里两面平行于与密封树脂10的面之中的上述一个面正交的面、即左右的面的朝向被密封。也就是说，中央导电板7和各安装部62各自的厚度方向朝向与印刷布线板P的厚度方向正交的方向。
根据上述构成，与各安装部62的厚度方向相对于各端子部51、61各自所被安装的印刷布线板P的厚度方向平行的情况相比，在上述印刷布线板P的导电图案P3与各安装部62之间产生的寄生电容下降，从而能够抑制插入损失。在图4中，曲线A表示在图12～图14中说明的现有例中的插入损失的解析结果，曲线B表示本实施方式中的插入损失的解析结果。由图4可知，本实施方式相比于现有例，插入损失得到抑制。
另外，如图5及图6所示，也可以与现有例相同，将MOSFET3a的源电极31经由中央导电板7与受光驱动元件4电连接。也就是说，MOSFET3a的源电极31(即2个MOSFET3a、3b彼此的连接点)和受光驱动元件4分别通过引线接合与中央导电板7电连接。在该情况下，在中央导电板7上也通过引线接合安装有各MOSFET3a、3b的源电极31，所以在输出端子部61之间传输的高频信号会流入到中央导电板7。然而，由于中央导电板7的厚度方向与印刷布线板P的厚度方向正交，所以即使有如上所述的高频信号的流入，也能够抑制插入损失的增加。若采用上述构成，则与图1～图3的例子相比，虽然制造时所需的引线接合的次数增加，但能够加快各MOSFET3a、3b的栅极-源极间电压的下降速度，所以能够缩短半导体继电器1的关闭(turnoff)时间。根据本发明人的实验，在图5及图6的例子中，与图1～图3的例子相比，能够使关闭时间成为二分之一以下。
另外，如图7及图8所示，也可以使用将2个MOSFET3a、3b集成到1个芯片上的开关元件3。这种开关元件3能够采用公知技来术实现，所以省略详细的图示及说明。在图7及图8的例子中，开关元件3在中央导电板7上被固定在与受光驱动元件4相同侧的面上。另外，开关元件3所包含的各MOSFET3a、3b各自的源电极31(即2个MOSFET3a、3b相互的连接点)通过引线接合安装在中央导电板7上，栅电极32通过直接的引线接合与受光驱动元件4电连接，漏电极33通过引线接合与各输出导电板6的安装部62连结。如上所述，只要适当地进行集成化，就能够削减部件数量。
此外，替代各端子部51、61分别被表面安装在厚度方向的一个面上的方式，也可采用各端子部51、61以各自的厚度方向朝向左右方向的方式被表面安装在下端面上的构成。在该情况下，各输入导电板5和各输出导电板6能够分别形成为不具有弯曲部位的扁平形状。
(第2实施方式)
下面，参照图9和图10，说明本发明的第2实施方式。另外，本实施方式的基本构成与第1实施方式相同，对相同的构成要素赋予相同的符号，省略说明。
本实施方式的半导体继电器1也像第1实施方式中所述那样，中央导电板7的安装有受光驱动元件4的安装面、输出导电板6的分别安装有MOSFET3a、3b的安装面(安装部62)、以及输入导电板5的安装有发光元件2的安装面分别朝向与密封树脂(封装体)10的下端部10a垂直的方向。
输入导电板5如图9所示，由第1端子片5a和第2端子片5b构成，所述第1端子片5a形成为从左右方向观看时呈L字状的细长的矩形板，所述第2端子片5b形成为细长的矩形板。而且，第1及第2端子片5a、5b以彼此的长度方向朝向上下方向的状态，在封装体10内的下端部10a上方以立起的方式配设。第1及第2端子片5a、5b的下端部穿过在下端部10a左侧的前后端贯通设置的插通孔(未图示)露出到封装体10的外部。另外，所述露出的部位分别与封装体10的外表面对齐。
如图9及图10所示，中央导电板7由导电性材料形成为大致平板状，设置有从下方周缘部向下侧以大致棒状突出的凸部7a，还配设有从上端前后两端部向外侧以方筒状延伸的臂部71。而且，中央导电板7以使凸部7a的前端部或臂部71的前端部的任意一个或双方与封装体10内的下端部10a或前后端部抵接且在下端部10a下方立起的方式配设。另外，臂部71经由接合引线与受光驱动元件4的电极连接。
如图9及图10所示，分别由导电性材料形成的带板向下方弯折，从而形成输出导电板6。而且，输出导电板6以在封装体10的下端部10a右侧的前后两端分别立起的方式配设。输出导电板6的下端部穿过在封装体10的下端部10a右侧的前后端贯通设置的插通孔(未图示)露出到封装体10的外部。另外，所述露出的部位分别与封装体10的外表面对齐。
根据上述构成，从左右方向观看时，凸部7被配置在输出导电板6之间的缝隙12中。而且，MOSFET3a、3b的栅电极32分别经由接合引线11a、11b连接到受光驱动元件4上。并且，源电极31经由接合引线11c～11f与凸部7a连接，从而源电极31彼此电连接。此外，通过经由接合引线11g与受光驱动元件4连接，源电极31与受光驱动元件4电气地共同连接。
也就是说，输出导电板6及中央导电板7的安装面与输入导电板5的安装面相互对置，且这些安装面相对于封装体10的下端部10a，像第1实施方式所述那样朝向垂直方向。
以上，说明了本发明的优选实施方式，然而本发明不限于这些特定实施方式，在不超过权利要求书的范围内，能够进行各种变更及修改，自不必说这些也包括在本发明的范围内。

Claims (5)

1.一种半导体继电器，具有：
2个MOSFET，以寄生二极管的朝向彼此相反的方式相互串联连接；
发光元件，具有一对端子，在该端子之间输入规定的电力而进行发光；
受光驱动元件，根据所述发光元件的发光的有无，分别对所述2个MOSFET进行导通截止驱动；
2个输出导电板，分别由导电材料形成，分别与所述2个MOSFET的串联电路的各一端电连接；
2个输入导电板，分别由导电材料形成，分别与所述发光元件的各1个端子电连接；以及
密封树脂，分别将所述2个MOSFET、所述发光元件、所述受光驱动元件、所述2个输出导电板及所述2个输入导电板密封；
所述2个输出导电板和所述2个输入导电板分别具有端子部，该端子部向所述密封树脂的外侧突出并被安装到彼此共用的印刷布线板上，
所述2个输出导电板分别具有安装部，在该安装部上分别安装有所述2个MOSFET之中的各1个，或连结有2个MOSFET各自的漏电极，
所述各安装部分别以厚度方向与所述印刷布线板的厚度方向交叉的朝向被所述密封树脂密封，
所述2个MOSFET被密封在所述受光驱动元件和所述印刷布线板之间的位置，
能够减小由在所述受光驱动元件与所述印刷布线板之间产生的寄生电容引起的插入损失，能够减小安装面积。
2.根据权利要求1所述的半导体继电器，
所述2个MOSFET被集成在1个芯片上。
3.根据权利要求1所述的半导体继电器，
所述2个MOSFET分别被表面安装在各所述输出导电板上。
4.根据权利要求1所述的半导体继电器，
所述2个MOSFET相互的连接点通过直接的引线接合与所述受光驱动元件电连接。
5.根据权利要求1所述的半导体继电器，
具有中央导电板，该中央导电板由导电材料构成且呈扁平形状，所述受光驱动元件被固定在所述中央导电板上，所述中央导电板以厚度方向与所述印刷布线板的厚度方向交叉的朝向被所述密封树脂密封，
所述2个MOSFET的相互的连接点和所述受光驱动元件分别通过引线接合与所述中央导电板电连接。
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