CN102648667A - 互连构造中改善功率增益及损耗的插入板中的嵌入部件 - Google Patents

互连构造中改善功率增益及损耗的插入板中的嵌入部件 Download PDF

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CN102648667A
CN102648667A CN2010800515703A CN201080051570A CN102648667A CN 102648667 A CN102648667 A CN 102648667A CN 2010800515703 A CN2010800515703 A CN 2010800515703A CN 201080051570 A CN201080051570 A CN 201080051570A CN 102648667 A CN102648667 A CN 102648667A
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circuit board
main circuit
via hole
adjusting section
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CN102648667B (zh
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J.V.拉塞尔
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R&D Circuits Inc
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Abstract

本公开提供了用于将电容或电阻直接地附接和嵌入其后连接至主电路板的转接板或插入板中。转接板可以通过焊接、借助于导电弹性连接的电连接、弹性插脚或通过本领域公知的任何其它方式连接至主电路板。

Description

互连构造中改善功率增益及损耗的插入板中的嵌入部件
相关申请
该申请为James V.Russell于2009年9月15日提交的序列号为61/276,661的临时申请的非临时申请。
背景技术
在将电部件附接至印刷电路板(PCB)的底侧和/或顶侧时，由于电容距意图将其附接到的对应的集成电路(IC)上的点的距离导致了功率损耗的问题。将电容直接物理地设置到印刷电路上的接触垫是不可能的，其中印刷电路的接触垫对应于集成电路的输入输出点，或在测试板的情况下为测试插槽(test socket)的对应点。形似地，由于电阻距电部件的距离而导致了不充分的功率耗散的问题。同样，将电阻物理地定位到印刷电路板上的接触垫是不太可能的。
因此，需要一种方法和装置，其提供了最接近地设置被称为功率调节(modify)部件的电容或电阻，因为其可以为PCB上的电部件耗散功率(电阻)或更好地分布功率(电容)，以提供更好的功率分布(power distribution)或功率耗散(power dissipation)。而且更希望的是能够实现这些目标而不用在另外需要不同电路时替换主电路板。
发明内容
本公开提供了用于将电容或电阻直接地附接和嵌入其后连接至主电路板的转接板或插入板中。转接板可以通过焊接、借助于导电弹性连接的电连接、弹性插脚或通过本领域公知的任何其它方式连接至主电路板。
附图说明
图1为示出了根据本公开的设置在上方用于连接至主电路板的插入板中的嵌入部件的分解剖视图；
图2为本公开的另一个实施例，示出了为了获得较密的间距在彼此的顶部上竖直地对齐的过孔；
图3为本公开的另一个实施例，其中嵌入部件在转接板内竖直地对齐；
图4为本公开的一实施例，示出了转接板内的嵌入电阻和嵌入电容；
图5为本公开的另一个实施例的分解剖视图；
图6A为本公开的另一个实施例的分解剖视图，其中垫的数量不同于图5，8和9的实施例；
图6B示出了面向改进的印刷电路板(改进的pc板)侧的主电路板或转接板的接口侧中任一个上的线迹，其中根据本公开的图5、图6A，图8和图9的实施例，线迹可位于转接板的接口层上或主电路板的接口层上；
图7为图5的实施例的改进的PC板；
图8为本公开的另一个实施例，其中不需要改进的PC板，转接板具有涂覆有导电弹性材料的盘(land)；和
图9为本公开的另一个实施例，其中不需要改进的PC板，主电路板具有涂覆有导电弹性材料的盘。
具体实施方式
参考附图，图1示出了本公开的一个实施例，其中功率调节部件5被嵌入于转接板10中。如图1所示，嵌入部件5可以设置在过孔11之间。图1中，嵌入部件5设置在转接板10的顶部上的延伸垫(pad)之间，并且部件5嵌入转接板10内。连接材料7为导电材料，例如但不限于焊料、导电环氧树脂，或诸如铜、银等的传统的镀覆技术，导电材料将部件5的端部8连接至延伸垫9a的底侧。相似地，过孔11可以通过任何诸如铜、银等的传统的镀覆技术、导电环氧树脂或焊料金属化而制成。因此，延伸垫9a通过导电材料7连接至部件5的端部8，并且在接触主电路板15的过孔12之前从延伸穿过转接板10的过孔11偏置，主电路板15附接或连接至转接板10。通过这样的方式，当嵌入部件5用坏或主电路板15用于另一个电路构造时，主电路板15可重复利用而不用必须丢弃。主电路板15比较昂贵，通过使用嵌入部件5且同时还使主电路板15可以自由地供未来使用，这是减少电阻的功率损耗(耗散)(见图3和4)或改善电容器的功率增益(分布)的一种可行方式。转接板10可通过任何常规的方式连接至主电路板15，包括：焊接至主电路板、通过使用导电弹性连接、或弹性插脚或本领域公知的任意其它方式连接至主电路板。
图2示出了本公开的另一个实施例，其中通过将盲孔11a在彼此的顶部上对齐可以获得较密的间距。在该实施例中，盲孔11a为竖直地对齐，并且一组延伸以使得垫可以从转接板10的顶部接触嵌入部件5的端点，另一组则是从转接板10的底部处的垫向上延伸，而不是采用如图1所示的使插入板的垫延伸并从过孔11偏置。通过这样的方式，可以获得较密的间距。盲孔11a可如所描述的图1中的实施例的连接材料7连接至端点。
图3示出了通过将电阻5a嵌入转接板10中以改善功率耗散的另一实施例。部件5a设置在垫9a和9b之间，并且实际上用作转接板10的过孔，使得电连接通过嵌入转接板10中的电阻5a。垫9通过分别位于电阻5a、垫9a及9b的端点处的开孔连接至电阻5a。该开口可填入焊料、金属镀覆物或导电环氧树脂。可以理解，转接板10可以是多层PC板。
图4示出了本公开的另一个实施例，其中图1的嵌入部件5以及图3的嵌入电阻5a一起位于相同的转接板10中。可以理解，转接板10可以是多层PC板。
图5示出了本公开的电连接器，其中连接器具有机械施压结构105、具有连接盘或垫107的转接板106(可以理解转接板内具有嵌入部件，图5中未示出)、和改进的PC板108以及主电路板110，PC板108具有分别形成在位于改进的PC板108的两个侧面上的连接盘109a和109b上的导电弹性材料109，主电路板110具有连接盘111。本公开使用的施压结构105为一个非限制的示意性示例，其包括位于施压结构105中的插槽105a，插槽105a适于容纳诸如集成电路(IC)芯片103的测试电路。插脚105b提供用于形成容纳在插槽105a中的IC芯片103与转接板106的垫107的电连接。当转接板106和改进的PC板108以及主电路板110被机械施压结构105压在一起时，转接板106的连接盘或垫107以及主电路板110的连接盘111被设置成与位于改进的PC板108的盘或垫109a及109b上的弹性材料109接触。所述弹性材料109可以是各向同性或各向异性的弹性材料。因此，通过将弹性材料109设置于其上改进的PC板108可用作为垫限定连接器108。可替代地，改进的PC板108可被各向异性片状弹性体所取代。
通过将各板压在一起，可以提供转接板106和主电路板110之间的电连接，从而适配施压结构105与主电路板110之间的间距和/或印痕(footprint)。通过使用位于改进的PC板108的两个侧面上的盘，仅借助于设置导电弹性材料，包括但并不限于在垫位置处设置各向同性弹性材料或通过在连接区域的整个表面上设置各向异性材料、如美国专利6,854,985中所述的，可建立良好的连接。利用垫位置处的各向同性弹性材料的优点在于可以实现较高的布线密度和较低的成本。
除通过将较密的垫连接至较疏的垫和较疏的垫连接至较密的垫来变换间距外，这又被称为间距转换(pitch translation)，本公开还提供了用于重新布线从连接至容纳在机械施压结构105插槽105a中的测试电路(例如IC芯片103)连接点104的插脚105b 1-6到转接板106的垫109和到主电路板110的垫111的电连接，这也被称为插脚映射置变(pin map scrambling)。如图6A所示，转接板106可以被重新布线，使得电路径112不用必须连接至主电路板110上的对应盘或垫111，也不必进行间距转换。因此，结构105上的插脚105b-1可以连接至转接板106的第一侧106a上的垫107-1，并且垫107-1经由电路径112重新布线连接至垫107-6而不是转接板106的第二侧106b上的第一盘107-5。接着，垫107-6连接至主电路板110的相对表面110a上的垫111-2。通过这样的方式可以实施任意可能的重新布线。通过这样的方式，本公开允许如期望的进行电路的重新布线。此外，转接板106和主电路板110的垫的数目可以根据需要变化。此外，图6A的该实施例中，并不需要图5中的改进的PC板108，图9的实施例中也具有相同的情况。
图6B示出了本公开的称为插脚映射置变的改良的迹线112的一个可能示例。由于导电弹性盘109被设置在改进的PC板108的每一侧上，因此，线迹112可以位于改进的PC板108与转接板106之间、以及改进的PC板108和主电路板110间接口层上的连接盘阵列中或附近。改进的PC板在图6A的示例中并未示出。然而可以理解，转接板106的重新布线特性适用于图5、图6A、图8和图9的实施例。
图7示出了根据本公开的改进的PC板108的一个可能实施例。PC板108通过将具有各向同性材料的盘设置在PC板108的两侧表面上而改进，如图所示。虽然图7示出一个表面，然而应当理解，另一个表面相似地布置。所述弹性材料可以是设置在改进的PC板108的两侧上的垫上的弹性膏剂。
图8示出第二实施例，其中不再需要转接板106和主电路板110之间的改进的PC板108。相反地，面向主电路板110的盘111a的转接板106的表面上的盘107b涂覆有导电弹性材料109。因此，不再如图5中的情况分别涂覆改进的PC板108的垫109a和109b，而是面向主电路板110的盘111a的转接板106的盘107b涂覆有弹性材料109。
图9示出第三实施例，其中不再需要转接板106和主电路板110之间的改进的PC板108。相反地，面向转接板106的盘107b的主电路板110的表面上的盘111a涂覆有导电弹性材料109。因此，不再如图5中的情况分别涂覆改进的PC板108的垫109a和109b，而是面向转接板106的盘107b的主电路板110的盘111a涂覆有弹性膏剂109。
尽管已经示出和描述了特定的实施例，但是可清楚地理解，本发明不限于此，而是可在所附权利要求的范围内实施。

Claims (22)

1.一种用于为附接至印刷电路板(PCB)的电部件提供改善的功率分布或功率耗散的方法，该方法包括以下步骤：
将功率调节部件嵌入至少一个转接板内并位于所述转接板的过孔之间；
将所述转接板连接或附接至主电路板；
将所述一个或多个嵌入的部件设置成在所述主电路板的过孔或盲孔之上延伸并且延伸到所述过孔或盲孔外，使得包含嵌入功率调节部件的转接板的一部分位于设置所述过孔或盲孔的位置外，以允许过孔通过开口导电，从而使得所述功率调节部件具有与所述电部件更为接近的接触点，由此分别增加功率分布或功率耗散。
2.根据权利要求1所述的方法，其中所述功率调节部件为电容。
3.根据权利要求1所述的方法，其中所述功率调节部件为电阻。
4.根据权利要求1所述的方法，其中所述过孔在彼此的顶部上竖直地对齐以提供较密的间距。
5.一种用于为附接至主电路板的电部件提供改善的功率分布或功率耗散的装置，该装置包括：
功率调节部件，该功率调节部件嵌入至少一个转接板内，并位于所述插入板的过孔之间；
所述转接板设置在电部件和主电路板之间，并且所述转接板连接或附接至主电路板；
将所述一个或多个嵌入部件设置成延伸在所述主电路板的过孔或盲孔之上，并延伸到所述主电路板的过孔或盲孔外，使得包含嵌入功率调节部件的转接板的一部分位于设置所述过孔或盲孔的位置外，以允许过孔通过开口导电，从而使得所述功率调节部件具有与所述电部件更为接近的接触点，由此分别增加功率分布或功率耗散。
6.根据权利要求5所述的装置，其中所述功率调节部件为电容。
7.根据权利要求5所述的装置，其中所述功率调节部件为电阻。
8.根据权利要求5所述的装置，其中开口取代过孔或盲孔存在于所述转接板内，所述功率调节部件为电阻，其设置在所述转接板的受影响层之间的所述开口内并且与所述开口竖直地对齐，所述电阻连接至所述转接板的所述顶部表面上的垫和所述底部表面上的垫。
9.根据权利要求8所述的装置，其中所述开口填充有焊料、镀铜或导电环氧树脂。
10.根据权利要求5所述的装置，其中所述盲孔在彼此的顶部上竖直地对齐以提供较密的间距。
11.根据权利要求5所述的装置，其中所述装置通过间距转换以改变其间距构造。
12.根据权利要求11所述的装置，其中没有间距转换，因此转接板和主电路板的过孔彼此对齐。
13.根据权利要求5所述的装置，其中所述装置通过插脚映射置变改变其插脚构造。
14.根据权利要求5所述的装置，其中导电弹性体提供了所述转接板与所述主电路板之间的电连接，其中所述弹性体设置在所述主电路板的至少一个表面上。
15.根据权利要求5所述的装置，其中导电弹性体提供了所述转接板与所述主电路板之间的电连接，其中所述弹性体设置在所述转接板的至少一个表面上。
16.根据权利要求5所述的装置，其中导电弹性体提供了所述转接板与所述主电路板之间的电连接，其中所述弹性体设置在配置于所述主电路板和所述转接板之间的印刷电路板的至少两个表面上。
17.根据权利要求5所述的装置，其中所述嵌入转接板焊接至主电路板。
18.根据权利要求5所述的装置，进一步包括用于将所述转接板电连接至所述主电路板的弹性插脚。
19.根据权利要求5所述的装置，进一步包括用于提供转接板和主电路板之间的电连接的电连接器，其中
具有导电弹性片的互连介质提供了所述转接板和所述主电路板之间的电连接，并且所述弹性体片设置在所述转接板和所述主电路板之间。
20.根据权利要求5所述的装置，其中所述电部件是容纳IC的IC测试插槽。
21.根据权利要求5所述的装置，其中所述转接板是多层PC板。
22.根据权利要求5所述的装置，其中所述转接板为双面PC板。
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US20140268613A1 (en) 2014-09-18
US20140283379A1 (en) 2014-09-25
MY165331A (en) 2018-03-21
SG179125A1 (en) 2012-04-27
SG10201405623QA (en) 2014-11-27
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TW201112545A (en) 2011-04-01
WO2011034555A1 (en) 2011-03-24
TWI563752B (en) 2016-12-21
US9107330B2 (en) 2015-08-11
CN102648667B (zh) 2016-09-07
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