CN102611976B - 穿孔微型硅麦克风 - Google Patents
穿孔微型硅麦克风 Download PDFInfo
- Publication number
- CN102611976B CN102611976B CN201210085271.2A CN201210085271A CN102611976B CN 102611976 B CN102611976 B CN 102611976B CN 201210085271 A CN201210085271 A CN 201210085271A CN 102611976 B CN102611976 B CN 102611976B
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 88
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 88
- 239000010703 silicon Substances 0.000 title claims abstract description 88
- 230000004888 barrier function Effects 0.000 claims abstract description 157
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 230000015572 biosynthetic process Effects 0.000 claims description 13
- 239000012528 membrane Substances 0.000 abstract description 10
- 230000008859 change Effects 0.000 abstract description 7
- 238000009423 ventilation Methods 0.000 description 43
- 230000004044 response Effects 0.000 description 19
- 239000003990 capacitor Substances 0.000 description 12
- 230000035945 sensitivity Effects 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 6
- 229920005591 polysilicon Polymers 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000011148 porous material Substances 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000033558 biomineral tissue development Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000007850 degeneration Effects 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003319 supportive effect Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/222—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only for microphones
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Pressure Sensors (AREA)
Abstract
Description
Claims (2)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/169,065 US20120328132A1 (en) | 2011-06-27 | 2011-06-27 | Perforated Miniature Silicon Microphone |
US13/169,065 | 2011-06-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102611976A CN102611976A (zh) | 2012-07-25 |
CN102611976B true CN102611976B (zh) | 2015-08-05 |
Family
ID=46529088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210085271.2A Active CN102611976B (zh) | 2011-06-27 | 2012-03-19 | 穿孔微型硅麦克风 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20120328132A1 (zh) |
CN (1) | CN102611976B (zh) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8503699B2 (en) | 2011-06-01 | 2013-08-06 | Infineon Technologies Ag | Plate, transducer and methods for making and operating a transducer |
TWI512930B (zh) * | 2012-09-25 | 2015-12-11 | Xintex Inc | 晶片封裝體及其形成方法 |
CN103974182B (zh) * | 2013-01-28 | 2017-09-26 | 苏州敏芯微电子技术股份有限公司 | 电容式微硅麦克风的制造方法 |
CN103974181B (zh) * | 2013-01-28 | 2017-08-01 | 苏州敏芯微电子技术有限公司 | 电容式微硅麦克风的制造方法 |
JP6127595B2 (ja) * | 2013-03-11 | 2017-05-17 | オムロン株式会社 | 音響トランスデューサ |
US9338559B2 (en) * | 2013-04-16 | 2016-05-10 | Invensense, Inc. | Microphone system with a stop member |
US8921957B1 (en) | 2013-10-11 | 2014-12-30 | Robert Bosch Gmbh | Method of improving MEMS microphone mechanical stability |
US9363587B2 (en) | 2013-12-05 | 2016-06-07 | Apple Inc. | Pressure vent for speaker or microphone modules |
US9448126B2 (en) * | 2014-03-06 | 2016-09-20 | Infineon Technologies Ag | Single diaphragm transducer structure |
US9456284B2 (en) * | 2014-03-17 | 2016-09-27 | Google Inc. | Dual-element MEMS microphone for mechanical vibration noise cancellation |
CN105338458B (zh) * | 2014-08-01 | 2019-06-07 | 无锡华润上华科技有限公司 | Mems麦克风 |
KR101558393B1 (ko) * | 2014-10-17 | 2015-10-07 | 현대자동차 주식회사 | 마이크로폰 및 그 제조 방법 |
KR101610128B1 (ko) * | 2014-11-26 | 2016-04-08 | 현대자동차 주식회사 | 마이크로폰 및 그 제조방법 |
US9503823B2 (en) * | 2014-12-24 | 2016-11-22 | Infineon Technologies Ag | Capacitive microphone with insulated conductive plate |
CN105163208A (zh) * | 2015-08-05 | 2015-12-16 | 上海超彩通信科技有限公司 | 一种抗噪麦克风 |
CN105502274B (zh) * | 2015-11-24 | 2017-10-27 | 宋月琴 | Mems中的弹簧结构、麦克风器件及加速度传感器 |
US9900677B2 (en) | 2015-12-18 | 2018-02-20 | International Business Machines Corporation | System for continuous monitoring of body sounds |
GB2546827B (en) * | 2016-01-28 | 2020-01-29 | Cirrus Logic Int Semiconductor Ltd | MEMS device and process |
JP6132047B1 (ja) * | 2016-03-28 | 2017-05-24 | 国立大学法人東北大学 | 圧力センサとその製造方法 |
KR101698312B1 (ko) * | 2016-06-24 | 2017-01-23 | (주)이미지스테크놀로지 | 멤스 마이크로폰 및 그 제조방법 |
CN206533541U (zh) * | 2017-01-25 | 2017-09-29 | 歌尔股份有限公司 | 一种mems麦克风 |
KR102322257B1 (ko) * | 2017-05-11 | 2021-11-04 | 현대자동차 주식회사 | 마이크로폰 및 그 제조 방법 |
CN108419193B (zh) * | 2018-05-22 | 2024-03-08 | 上饶市经纬自动化科技有限公司 | 具有频率选择功能的电容式mems麦克风及其制作方法 |
DE112019005283T5 (de) * | 2018-10-23 | 2021-07-15 | Ams Ag | Sensoren mit gewellten membranen |
CN109660927B (zh) * | 2018-12-29 | 2024-04-12 | 华景科技无锡有限公司 | 一种麦克风芯片及麦克风 |
US10981780B2 (en) | 2019-08-19 | 2021-04-20 | Infineon Technologies Ag | Membrane support for dual backplate transducers |
US11509980B2 (en) * | 2019-10-18 | 2022-11-22 | Knowles Electronics, Llc | Sub-miniature microphone |
CN111711904B (zh) * | 2020-06-24 | 2021-06-25 | 歌尔微电子有限公司 | 微型麦克风防尘装置及mems麦克风 |
CN115868670A (zh) * | 2021-09-22 | 2023-03-31 | 通用微(深圳)科技有限公司 | 电学结构、电子烟开关及电子烟 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1874616A (zh) * | 2005-06-03 | 2006-12-06 | 瑞声声学科技(深圳)有限公司 | 电容式微机电结构声音传感器 |
CN101107879A (zh) * | 2004-10-29 | 2008-01-16 | 新晶源微机电(私人)有限公司 | 无背极板的硅传声器 |
CN101867858A (zh) * | 2000-08-11 | 2010-10-20 | 诺利斯电子公司 | 用于硅基器件的凸微观部件 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060280319A1 (en) * | 2005-06-08 | 2006-12-14 | General Mems Corporation | Micromachined Capacitive Microphone |
-
2011
- 2011-06-27 US US13/169,065 patent/US20120328132A1/en not_active Abandoned
-
2012
- 2012-03-19 CN CN201210085271.2A patent/CN102611976B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101867858A (zh) * | 2000-08-11 | 2010-10-20 | 诺利斯电子公司 | 用于硅基器件的凸微观部件 |
CN101107879A (zh) * | 2004-10-29 | 2008-01-16 | 新晶源微机电(私人)有限公司 | 无背极板的硅传声器 |
CN1874616A (zh) * | 2005-06-03 | 2006-12-06 | 瑞声声学科技(深圳)有限公司 | 电容式微机电结构声音传感器 |
Also Published As
Publication number | Publication date |
---|---|
CN102611976A (zh) | 2012-07-25 |
US20120328132A1 (en) | 2012-12-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: WUXI NEOMEMS TECHNOLOGIES, INC. Free format text: FORMER OWNER: US GEN MICROELECTROMECHANICAL SYSTEM Effective date: 20120627 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; TO: 214064 WUXI, JIANGSU PROVINCE |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20120627 Address after: YONGGU road Binhu District 214064 Jiangsu city of Wuxi province No. 1 Applicant after: Wuxi Xinao Micro Sensor Technology Co.,Ltd. Address before: The United States of California Sunnyvale East arques Avenue 810 Applicant before: US GEN MICROELECTROMECHANICAL |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Perforated micro silicon microphone Effective date of registration: 20160526 Granted publication date: 20150805 Pledgee: Wuxi Industrial Development Group Pledgor: Wuxi Xinao Micro Sensor Technology Co.,Ltd. Registration number: 2016320000007 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240117 Address after: 214000 No. 15, Xinzhou Road, Xinwu District, Wuxi City, Jiangsu Province Patentee after: Jinri Technology (Wuxi) Co.,Ltd. Address before: No.1 YONGGU Road, Binhu District, Wuxi City, Jiangsu Province Patentee before: Wuxi Xinao Micro Sensor Technology Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
DD01 | Delivery of document by public notice | ||
DD01 | Delivery of document by public notice |
Addressee: Wuxi Industrial Development Group|Yao Chunlei Document name: Review Business Specific Letter |