CN102571026A - Ceramic base packaging structure of patch-type crystal oscillator and production method thereof - Google Patents
Ceramic base packaging structure of patch-type crystal oscillator and production method thereof Download PDFInfo
- Publication number
- CN102571026A CN102571026A CN2012100300204A CN201210030020A CN102571026A CN 102571026 A CN102571026 A CN 102571026A CN 2012100300204 A CN2012100300204 A CN 2012100300204A CN 201210030020 A CN201210030020 A CN 201210030020A CN 102571026 A CN102571026 A CN 102571026A
- Authority
- CN
- China
- Prior art keywords
- ceramic
- resonator
- crystal
- oscillator
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The invention relates to a ceramic base packaging structure of a patch-type crystal oscillator and a production method of the ceramic base packaging structure. The ceramic base packaging structure comprises a ceramic-packaged crystal resonator and a crystal oscillator ceramic base; wherein a quartz vibrator is arranged in the crystal resonator; a compensation control circuit matched with the crystal resonator and electrically connected with the quartz vibrator is bonded in the crystal oscillator ceramic base; and the crystal resonator and the crystal oscillator ceramic base are connected in a stacking and adhering manner and are secondarily packaged. The packaging structure of a whole crystal oscillator is utilized a modularization design, and production processes are reasonably optimized, quality check links are inserted into different production key points, thus quality defects caused by blemishes of materials are avoided. Before the secondary package production, the crystal resonators are firstly subjected to a ceramic package production; and the crystal resonators are screened and sorted according to characteristic parameters of a TC (temperature coefficient) test, and are subjected to the secondary package production with the oscillator ceramic base bonded with the compensation control circuit matching with the crystal resonator, thus the quality of products is ensured, and the performance indexes of the products are improved.
Description
Technical field
The invention belongs to the Electronic Components Manufacturing technical field, specifically a kind of ceramic base encapsulating structure and production method thereof of SMD crystal oscillator.
Background technology
Crystal oscillator is widely used in systems such as computer, communication system, satellite navigation system, radar control owing to have higher frequency stability as a kind of high accuracy frequency source.Packing forms has at present: bakelite encapsulation, Plastic Package, glass bulb encapsulation, metal-back envelope, ceramic packaging etc.; Wherein ceramic packaging is day by day extensive with its good electrical characteristic, mechanical features, the application of calorifics characteristic in high-quality crystal oscillator packages, and characteristics such as its encapsulating structure is compact, volume is little, in light weight, good temp characteristic, reliability height highlight.But the crystal oscillator complicate fabrication process of ceramic packaging, manufacturing technique requirent are high, careless slightlyly in the encapsulation process all can influence product quality or cause product failure.
Usually the crystal oscillator of ceramic packaging is to be encapsulated on the ceramic base together by frequency modulation, the quartz vibrator (being commonly called as white) and the compensation control circuit of crystal oscillator after aging.Yet not packaged quartz vibrator can't become batch all to do parameter testing, can only pass through the sampling Detection analysis.In the process of bonding wire bonding, ultrasonic power, bonding temperature etc. can produce harmful effect to quartz vibrator, strengthen the frequency difference of quartz vibrator simultaneously.These all make the performance of crystal oscillator and quality can't be effectively controlled in process of production, can only after encapsulation, carry out product screening through detection.
Summary of the invention
The objective of the invention is to problem and shortage, a kind of ceramic base encapsulating structure and production method thereof of SMD crystal oscillator is provided to above-mentioned existence.Adopt this encapsulating structure and production method thereof, can effectively control product quality in process of production, improve the qualification rate of product, reduced raw-material loss in the production process, effectively enhance productivity.
Above-mentioned purpose of the present invention is achieved through following technical scheme:
A kind of ceramic base encapsulating structure of SMD crystal oscillator; The crystal resonator and crystal oscillator ceramic base two parts that comprise ceramic packaging; Be provided with quartz vibrator in the said crystal resonator, bonding has compensation control circuit suitable with crystal resonator and that is electrically connected with quartz vibrator in the crystal oscillator ceramic base, and said crystal resonator is connected through range upon range of bonding mode with crystal oscillator and carries out processing the SMD crystal oscillator of ceramic packaging after secondary encapsulates; During the secondary encapsulation; As the loam cake of crystal oscillator, both are range upon range of again for the base of ceramic of crystal resonator, form two cavitys independently each other.
Further; Said crystal resonator comprises the crystal resonator base of ceramic and is arranged on the quartz vibrator in the crystal resonator base of ceramic; Wherein, The crystal resonator base of ceramic is cascaded by the resonator potsherd of resonator ceramic bottom board and middle hollow out, and every layer of resonator potsherd all is printed with the conducting metal circuit at upper and lower faces, and the conducting metal circuit of every layer of resonator potsherd upper and lower faces connects through metallic vias or the other hole of metal; Some resonator potsherds and resonator ceramic bottom board form the groove of placing quartz vibrator after high temperature sintering is bonding; Quartz vibrator is fixed on the crystal resonator base of ceramic support through conducting resinl, and forms good being electrically connected with the cloth line terminals, is provided with upper cover plate above the resonator potsherd.
Further; Said crystal oscillator comprises the crystal oscillator base of ceramic and is arranged on the compensation control circuit in the crystal oscillator base of ceramic; The crystal oscillator base of ceramic is cascaded by the oscillator potsherd of oscillator ceramic bottom board, middle hollow out; Every layer of oscillator potsherd all is printed with the conducting metal circuit at upper and lower faces; The conducting metal circuit of every layer of oscillator potsherd upper and lower faces connects through metallic vias or the other hole of metal; Some oscillator potsherds and oscillator ceramic bottom board form the groove of placing compensation control circuit after high temperature sintering is bonding, compensation control circuit forms good being electrically connected through bonding wire bonding mode with the cloth line terminals.
The production method of a kind of SMD crystal oscillator of the present invention, its step is following:
(1). make crystal resonator base of ceramic and crystal oscillator base of ceramic; Method is following: resonator potsherd and the oscillator potsherd of making the middle hollow out of resonator ceramic bottom board and oscillator ceramic bottom board and multi-disc earlier; Every layer of resonator potsherd and oscillator potsherd are all respectively at upper and lower faces printed conductive metal circuit; Resonator ceramic bottom board and oscillator ceramic bottom board carry out lamination, hot pressing respectively each layer resonator potsherd and oscillator potsherd again; The binder removal sintering flattens PROCESS FOR TREATMENT such as inspection, nickel plating, punching press sealing frame, soldering, gold-plated, cut-out again, and the qualified back of Integrated Checkout gets into subsequent processing;
(2). make quartz vibrator, the quartz wafer finished product cleans, just plates technologies such as basement membrane through initial survey, wafer, after single sampling inspection is qualified, shelve an adhesive curing, then quartz vibrator is carried out frequency trim, double sampling inspection;
(3). be fixedly mounted on quartz vibrator on the support of crystal resonator base of ceramic through conducting resinl, and form good being electrically connected with the cloth line terminals, qualified back adds upper cover plate on the resonator potsherd, and crystal resonator is processed in encapsulation;
(4). reveal test of inspection, normal temperature and TC temperature property test to packaged crystal resonator, and by the characterisitic parameter of test to the crystal resonator sifting sort;
(5). the compensation control circuit that matches with crystal resonator is installed on the crystal oscillator base of ceramic of making, is formed good being electrically connected through bonding wire bonding mode with the cloth line terminals again, carry out Integrated Checkout then;
(6). packaged crystal resonator with install that the crystal oscillator base of ceramic of compensation control circuit is range upon range of to obtain the SMD crystal oscillator of ceramic packaging after bonding;
(7). the SMD crystal oscillator of the ceramic packaging after secondary is packaged compensates parameter setting.
The present invention is a kind of ceramic base encapsulating structure and production method thereof of SMD crystal oscillator, because the crystal resonator of encapsulation quartz vibrator adopts encapsulation separately to produce, makes that the quartz vibrator quality is effectively ensured.Because the encapsulating structure of whole crystal oscillator adopts modularized design, makes production process be able to reasonably optimizing, on the different production key point, has inserted the quality inspection link, has stopped the mass defect that the material flaw causes.Because crystal resonator carried out ceramic packaging production earlier before the secondary encapsulation was produced; After the TC temperature property test is qualified; And by the test characterisitic parameter to the crystal resonator sifting sort; And have the oscillator base of ceramic of the compensation control circuit that matches with it to carry out secondary encapsulation with bonding to produce, not only product quality is guaranteed, and has also improved the performance of products index.
Below in conjunction with accompanying drawing the present invention is further described.
Description of drawings
Fig. 1 is the isolating construction sketch map of the SMD crystal oscillator of ceramic packaging;
Fig. 2 is a ceramic packaging crystal resonator configurations sketch map;
Fig. 3 the has been bonding base of ceramic structural representation of compensation control circuit;
Fig. 4 is the production technology flow chart.
Embodiment
Shown in Fig. 1-3; The present invention is a kind of ceramic base encapsulating structure of SMD crystal oscillator; The crystal resonator I and crystal oscillator ceramic base II two parts that comprise ceramic packaging; Be provided with quartz vibrator 2 in the said crystal resonator I, bonding has compensation control circuit 4 suitable with the crystal resonator I and that be electrically connected with quartz vibrator 2 in the crystal oscillator ceramic base II, and the crystal resonator I is connected through range upon range of bonding mode with the crystal oscillator II carries out processing the SMD crystal oscillator of ceramic packaging after the secondary encapsulation; During the secondary encapsulation; As the loam cake of crystal oscillator, both are range upon range of again for the base of ceramic of crystal resonator I, form two cavitys independently each other.
As shown in Figure 2; Crystal resonator I of the present invention comprises crystal resonator base of ceramic 1 and is arranged on the quartz vibrator 2 in the crystal resonator base of ceramic 1; Wherein, Crystal resonator base of ceramic 1 is cascaded by the resonator potsherd 12 of resonator ceramic bottom board 11 and middle hollow out, and every layer of resonator potsherd 12 all is printed with conducting metal circuit 5 at upper and lower faces, and the conducting metal circuit 5 of every layer of resonator potsherd 12 upper and lower faces connects through metallic vias or the other hole of metal; Some resonator potsherds 12 form the groove of placing quartz vibrator 2 with resonator ceramic bottom board 11 after high temperature sintering is bonding; Quartz vibrator 2 is fixed on crystal resonator base of ceramic 1 support through conducting resinl 6, and forms good being electrically connected with the cloth line terminals, is provided with upper cover plate 7 above the resonator potsherd 12.
As shown in Figure 3; Crystal oscillator II of the present invention comprises crystal oscillator base of ceramic 3 and is arranged on the compensation control circuit 4 in the crystal oscillator base of ceramic 3; Crystal oscillator base of ceramic 3 is cascaded by the oscillator potsherd 32 of oscillator ceramic bottom board 31, middle hollow out; Every layer of oscillator potsherd 32 all is printed with conducting metal circuit 5 at upper and lower faces; The conducting metal circuit 5 of every layer of oscillator potsherd 32 upper and lower faces connects through metallic vias or the other hole of metal; Some oscillator potsherds 32 form the groove of placing compensation control circuit 4 with oscillator ceramic bottom board 31 after high temperature sintering is bonding, compensation control circuit 4 forms good being electrically connected through bonding wire 8 bonding modes with the cloth line terminals.
Be illustrated in figure 4 as the technological process of production figure of a kind of SMD crystal oscillator of the present invention, its step is following:
(1). make crystal resonator base of ceramic 1 and crystal oscillator base of ceramic 3; Method is following: resonator potsherd 12 and the oscillator potsherd 32 of making resonator ceramic bottom board 11 and oscillator ceramic bottom board 31 and the middle hollow out of multi-disc earlier; Every layer of resonator potsherd 12 and oscillator potsherd 32 are all respectively at upper and lower faces printed conductive metal circuit 5; Again each layer resonator potsherd 12 and oscillator potsherd 32 respectively resonator ceramic bottom board 11 carry out lamination, hot pressing with oscillator ceramic bottom board 31; The binder removal sintering; Flatten PROCESS FOR TREATMENT such as inspection, nickel plating, punching press sealing frame, soldering, gold-plated, cut-out again, the qualified back of Integrated Checkout gets into subsequent processing;
(2). make quartz vibrator 2, the quartz wafer finished product cleans, just plates technologies such as basement membrane through initial survey, wafer, after single sampling inspection is qualified, shelve an adhesive curing, then quartz vibrator 2 is carried out frequency trim, double sampling inspection;
(3). be fixedly mounted on quartz vibrator 2 on the support of crystal resonator base of ceramic 1 through conducting resinl 6, and form good being electrically connected with the cloth line terminals, qualified back adds upper cover plate 7 on resonator potsherd 12, and crystal resonator is processed in encapsulation;
(4). reveal test of inspection, normal temperature and TC temperature property test to packaged crystal resonator, and by the characterisitic parameter of test to the crystal resonator sifting sort;
(5). the compensation control circuit 4 that matches with crystal resonator is installed on the crystal oscillator base of ceramic of making 3, is formed good being electrically connected through bonding wire 8 bonding modes with the cloth line terminals again, carry out Integrated Checkout then;
(6). packaged crystal resonator I with install that the crystal oscillator base of ceramic II of compensation control circuit 4 is range upon range of to obtain the SMD crystal oscillator of ceramic packaging after bonding;
(7). the SMD crystal oscillator of the ceramic packaging after secondary is packaged compensates parameter setting.
The foregoing description is a preferred implementation of the present invention; But execution mode of the present invention is not restricted to the described embodiments; Other any do not deviate from change, the modification done under spirit of the present invention and the principle, substitutes, combination, simplify; All should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (4)
1. the ceramic base encapsulating structure of a SMD crystal oscillator; It is characterized in that: the crystal resonator (I) and crystal oscillator ceramic base (II) two parts that comprise ceramic packaging; Be provided with quartz vibrator (2) in the said crystal resonator (I); The interior bonding of crystal oscillator ceramic base (II) has compensation control circuit (4) suitable with crystal resonator (I) and that be electrically connected with quartz vibrator (2), and said crystal resonator (I) and crystal oscillator (II) are connected through range upon range of bonding mode and carry out processing the SMD crystal oscillator of ceramic packaging after the secondary encapsulation.
2. ceramic base encapsulating structure according to claim 1; It is characterized in that: said crystal resonator (I) comprises crystal resonator base of ceramic (1) and is arranged on the quartz vibrator (2) in the crystal resonator base of ceramic (1); Wherein, Said crystal resonator base of ceramic (1) is cascaded by the resonator potsherd (12) of resonator ceramic bottom board (11) and middle hollow out; Every layer of resonator potsherd (12) all is printed with conducting metal circuit (5) at upper and lower faces; The conducting metal circuit (5) of every layer of resonator potsherd (12) upper and lower faces connects through metallic vias or the other hole of metal; Some resonator potsherds (12) form the groove of placing quartz vibrator (2) with resonator ceramic bottom board (11) after high temperature sintering is bonding; Said quartz vibrator (2) is fixed on the crystal resonator base of ceramic (1) through conducting resinl (6), and forms good being electrically connected with the cloth line terminals, is provided with upper cover plate (7) above the resonator potsherd (12).
3. ceramic base encapsulating structure according to claim 1 and 2; It is characterized in that: said crystal oscillator ceramic base (II) comprises crystal oscillator base of ceramic (3) and is arranged on the compensation control circuit (4) in the crystal oscillator base of ceramic (3); Said crystal oscillator base of ceramic (3) is cascaded by the oscillator potsherd (32) of oscillator ceramic bottom board (31), middle hollow out; Every layer of oscillator potsherd (32) all is printed with conducting metal circuit (5) at upper and lower faces; The conducting metal circuit (5) of every layer of oscillator potsherd (32) upper and lower faces connects through metallic vias or the other hole of metal; Some oscillator potsherds (32) form the groove of placing compensation control circuit (4) with oscillator ceramic bottom board (31) after high temperature sintering is bonding, compensation control circuit (4) forms good being electrically connected through bonding wire (8) bonding mode with the cloth line terminals.
4. the production method of a SMD crystal oscillator, its step is following:
(1). make crystal resonator base of ceramic (1) and crystal oscillator base of ceramic (3); Method is following: resonator potsherd (12) and the oscillator potsherd (32) of making the middle hollow out of resonator ceramic bottom board (11) and oscillator ceramic bottom board (31) and multi-disc earlier; Every layer of resonator potsherd (12) and oscillator potsherd (32) are all respectively at upper and lower faces printed conductive metal circuit (5); Be connected through hole by metallic vias and the metal during conducting metal circuit (5) UNICOM of upper and lower faces printing; Resonator ceramic bottom board (11) and oscillator ceramic bottom board (31) carry out lamination, hot pressing respectively each layer resonator potsherd (12) and oscillator potsherd (32) again; The binder removal sintering; Flatten PROCESS FOR TREATMENT such as inspection, nickel plating, punching press sealing frame, soldering, gold-plated, cut-out again, the qualified back of Integrated Checkout gets into subsequent processing;
(2). make quartz vibrator (2), the quartz wafer finished product cleans, just plates technologies such as basement membrane through initial survey, wafer, after single sampling inspection is qualified, shelve an adhesive curing, then quartz vibrator (2) is carried out frequency trim, double sampling inspection;
(3). be fixedly mounted on quartz vibrator (2) on the support of crystal resonator base of ceramic (1) through conducting resinl (6); And form good being electrically connected with the cloth line terminals; Qualified back adds upper cover plate (7) on resonator potsherd (12), crystal resonator is processed in encapsulation;
(4). reveal test of inspection, normal temperature and TC temperature property test to packaged crystal resonator, and by the characterisitic parameter of test to the crystal resonator sifting sort;
(5). go up installation and the compensation control circuit (4) that crystal resonator matches at the crystal oscillator base of ceramic of making (3), form good being electrically connected through bonding wire (8) bonding mode with the cloth line terminals again, carry out Integrated Checkout then;
Packaged crystal resonator (I) with install that the crystal oscillator base of ceramic (II) of compensation control circuit (4) is range upon range of to obtain the SMD crystal oscillator of ceramic packaging after bonding;
The SMD crystal oscillator of ceramic packaging after secondary is packaged compensates parameter setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100300204A CN102571026A (en) | 2012-02-12 | 2012-02-12 | Ceramic base packaging structure of patch-type crystal oscillator and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100300204A CN102571026A (en) | 2012-02-12 | 2012-02-12 | Ceramic base packaging structure of patch-type crystal oscillator and production method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102571026A true CN102571026A (en) | 2012-07-11 |
Family
ID=46415616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100300204A Pending CN102571026A (en) | 2012-02-12 | 2012-02-12 | Ceramic base packaging structure of patch-type crystal oscillator and production method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102571026A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107834993A (en) * | 2017-12-26 | 2018-03-23 | 东晶锐康晶体（成都）有限公司 | A kind of H types temperature compensating type quartz oscillator |
| CN108900174A (en) * | 2018-08-23 | 2018-11-27 | 应达利电子股份有限公司 | A kind of quartz oscillator and the method for manufacturing the quartz oscillator |
| CN111641389A (en) * | 2020-05-13 | 2020-09-08 | 北京无线电计量测试研究所 | Surface-mounted temperature compensation crystal oscillator design method |
| CN111900947A (en) * | 2020-07-16 | 2020-11-06 | 顾丽旺 | Fine adjustment device for mounting quartz crystal frequency chip |
| WO2021012380A1 (en) * | 2019-07-19 | 2021-01-28 | 中芯集成电路（宁波）有限公司上海分公司 | Packaging method and packaging structure for bulk acoustic resonator |
| CN117498825A (en) * | 2023-12-29 | 2024-02-02 | 合肥矽迈微电子科技有限公司 | Semiconductor packaging structure and packaging method |
| CN117579014B (en) * | 2023-12-11 | 2024-05-14 | 东晶电子金华有限公司 | Packaging equipment of quartz crystal resonator |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004088533A (en) * | 2002-08-28 | 2004-03-18 | Nippon Dempa Kogyo Co Ltd | Surface mounting crystal oscillator |
| CN1909367A (en) * | 2005-08-02 | 2007-02-07 | 珠海粤科清华电子陶瓷有限公司 | Ceramic packaging piece for crystal oscillator and its preparation method |
-
2012
- 2012-02-12 CN CN2012100300204A patent/CN102571026A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004088533A (en) * | 2002-08-28 | 2004-03-18 | Nippon Dempa Kogyo Co Ltd | Surface mounting crystal oscillator |
| CN1909367A (en) * | 2005-08-02 | 2007-02-07 | 珠海粤科清华电子陶瓷有限公司 | Ceramic packaging piece for crystal oscillator and its preparation method |
Non-Patent Citations (2)
| Title |
|---|
| 林勇，陈桦: "《石英晶体谐振器生产工艺流程综述》", 《电讯技术》 * |
| 贾铁钢: "《晶体谐振器陶瓷基座的生产工艺设计》", 《电子元器件应用》 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107834993A (en) * | 2017-12-26 | 2018-03-23 | 东晶锐康晶体（成都）有限公司 | A kind of H types temperature compensating type quartz oscillator |
| CN108900174A (en) * | 2018-08-23 | 2018-11-27 | 应达利电子股份有限公司 | A kind of quartz oscillator and the method for manufacturing the quartz oscillator |
| CN108900174B (en) * | 2018-08-23 | 2024-04-30 | 深圳市深汕特别合作区应达利电子科技有限公司 | Quartz crystal oscillator and method for manufacturing same |
| WO2021012380A1 (en) * | 2019-07-19 | 2021-01-28 | 中芯集成电路（宁波）有限公司上海分公司 | Packaging method and packaging structure for bulk acoustic resonator |
| CN111641389A (en) * | 2020-05-13 | 2020-09-08 | 北京无线电计量测试研究所 | Surface-mounted temperature compensation crystal oscillator design method |
| CN111900947A (en) * | 2020-07-16 | 2020-11-06 | 顾丽旺 | Fine adjustment device for mounting quartz crystal frequency chip |
| CN117579014B (en) * | 2023-12-11 | 2024-05-14 | 东晶电子金华有限公司 | Packaging equipment of quartz crystal resonator |
| CN117498825A (en) * | 2023-12-29 | 2024-02-02 | 合肥矽迈微电子科技有限公司 | Semiconductor packaging structure and packaging method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102571026A (en) | Ceramic base packaging structure of patch-type crystal oscillator and production method thereof | |
| US8941017B2 (en) | Electronic apparatus, method of manufacturing substrate, and method of manufacturing electronic apparatus | |
| US6456168B1 (en) | Temperature compensated crystal oscillator assembled on crystal base | |
| US20200343151A1 (en) | Module with built-in component and method for manufacturing the same | |
| JP4545004B2 (en) | Piezoelectric oscillator | |
| JP2002164740A (en) | Method for coupling component to double-sided oscillator package | |
| CN103219967A (en) | Piezoelectric module | |
| CN100568747C (en) | Signal receiving device | |
| CN102621470A (en) | Method for testing performance of semiconductor microwave power chip packaging shell | |
| US20130107467A1 (en) | Circuit substrate, electronic device, electronic apparatus, and method of manufacturing circuit substrate | |
| JP3926000B2 (en) | Piezoelectric vibrator and manufacturing method thereof | |
| US8499443B2 (en) | Method of manufacturing a piezoelectric vibrator | |
| CN1764595B (en) | Micro-electro-mechanical systems (MEMS) device and system and method of producing the same | |
| CN108449063A (en) | A kind of Plastic Package quartz-crystal resonator and preparation method thereof | |
| CN102545823B (en) | Surface mount crystal oscillator and substrate sheet | |
| CN103001600A (en) | Surface-mounted crystal oscillator and manufacturing method thereof | |
| CN101388654A (en) | Manufacturing method for complete quartz crystal resonator and quartz crystal resonator | |
| CN100378967C (en) | Ceramic package and fabrication method thereof | |
| US20070024161A1 (en) | Piezoelectric device and method of manufacturing piezoelectric device | |
| CN201383796Y (en) | Base structure of quartz resonator | |
| CN114337587A (en) | Filter system-level hybrid packaging module and packaging mode | |
| CN100550617C (en) | Vibration ceramic resonance of independent flake thickness-changing and manufacture method thereof | |
| CN100389537C (en) | Temperature compensating crystal oscillator structure and its manufacturing method | |
| JP2008035486A (en) | Method of manufacturing electronic component | |
| CN100477512C (en) | Method for manufacturing and mounting crystal resonator in voltage controlled crystal oscillator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120711 |