CN100389537C - Temperature compensating crystal oscillator structure and its manufacturing method - Google Patents
Temperature compensating crystal oscillator structure and its manufacturing method Download PDFInfo
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- CN100389537C CN100389537C CNB031540147A CN03154014A CN100389537C CN 100389537 C CN100389537 C CN 100389537C CN B031540147 A CNB031540147 A CN B031540147A CN 03154014 A CN03154014 A CN 03154014A CN 100389537 C CN100389537 C CN 100389537C
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Abstract
The present invention provides a temperature compensation crystal oscillator structure formed on a printed circuit board. Firstly, a plurality of crystal connection plates are arranged on a printed circuit board in a parallel arrangement mode, and then, a plurality of integrated circuits with temperature compensation functions are arranged between any two adjacent crystal connection plates; filler resin is used for sealing. When the seal is completed, the front upper part of each integrated circuit is pasted with a quartz crystal, and each quartz crystal is connected between two adjacent crystal connection plates in a bridge connection mode. Thereby, the corresponding integrated circuits are covered.
Description
Technical field
The invention relates to a kind of crystal oscillator device and manufacture method thereof, particularly about a kind of temperature compensating crystal oscillator device and manufacture method thereof.
Background technology
Crystal oscillator generally is to be used for the application apparatus that needs are stablized output frequency, for example is used for mobile phone, uses as the frequency reference source.Yet its output frequency of traditional crystal oscillator can present function along with the oscillator environment temperature.See also typical case shown in Figure 1 and do not compensate the performance curve chart of the frequency of oscillation of quartz crystal environment temperature.As shown in Figure 1, curve 100 has the shape as cubic curve, and it roughly can divide into three temperature provinces.In low temperature zone (35 ℃ to approximately+10 ℃), this curve has the linear segment of positive slope and the nonlinear area that the slope of curve changes.In the middle temperature province (+10 ℃ to+50 ℃), this curve has the linear segment for negative slope.In the high-temperature zone (+50 ℃ to+90 ℃), this curve has the non-linear partial for the linear segment of positive slope and slope of curve change.Wherein position, breakover point 102 place pact in middle temperature province is located for+28 ℃.
There are multiple technologies to can be used for this frequency change of compensated crystal, generally can utilize an integrated circuit to produce a compensated curve 104, this compensated curve 104 is anti-phase each other with curve 100, therefore can be by the compensation of compensated curve 104, revise the change output frequency, to produce stable output frequency.
Common this product is made up of a resonant element (quartz crystal slice) and an integrated circuit, and its structure roughly has two kinds, and first kind of structure is that resonant element and integrated circuit are encapsulated in the same ceramic vessel simultaneously.Yet, in this structure, owing to be to encapsulate resonant element and integrated circuit simultaneously, therefore when covering or weld integrated circuit, the residue that resin that it volatilized or welding stay can impact resonant element, and influences its characteristic as the reference frequency source.
Second kind of structure is that resonant element (quartz crystal slice) and integrated circuit are encapsulated in respectively in two ceramic vessels, at first resonant element is placed on a ceramic vessel and airtight good, again integrated circuit is placed in another ceramic vessel, again this two ceramic vessel is coupled together at last.Though this structure can be avoided as first kind of structure when encapsulated integrated circuit, the residue that causes the resin that volatilizes or welding to stay forms influence to resonant element, but it need use another ceramic vessel bearing integrated, this ceramic vessel is to be formed by low temperature co-fired technology manufacturing by multi-layer ceramics, have only a few company to produce in a large number, so cost is very high.
On the other hand, in above-mentioned two kinds of structures, all can have several on final products is used for integrated circuit is done the external electrode that program is imported, these electrodes promptly do not have other purposes after input is finished, but in use, these useless electrode pair clients can cause interference, for example must whether the possibility that cause short circuit with other circuit be arranged consideration, make product design complicated.On the other hand, because the more and more miniaturization of temperature compensated oscillator structure causes the distance between several external electrodes more and more littler, therefore want to make these external electrodes and control signal to keep excellent contact just more and more difficult.
Summary of the invention
In view of all having its defective, above-mentioned conventional temperature compensated oscillator structure exists, cover or weld the residue that resin that integrated circuit volatilizes or welding stay resonant element is impacted as resonant element and integrated circuit being encapsulated in the same ceramic vessel simultaneously, can making.And,, can improve manufacturing cost because of need use another ceramic vessel bearing integrated in the structure that encapsulates resonant element and integrated circuit respectively.And above-mentioned two kinds of structures can have the electrode that several do not have effect on final products, in use can cause interference to the client.
Therefore, main purpose of the present invention is at above-mentioned shortcoming, proposes a kind of temperature compensated oscillator structure with low cost, and it has high stability output frequency in required temperature range.
Another object of the present invention is to provide a kind of temperature compensated oscillator structure, it does not have unnecessary electrode on final products, therefore can not cause interference to the user.
Another purpose of the present invention is to provide a kind of temperature compensated oscillator structure, it is all guided to employed electrode outside the temperature compensated oscillator structural detail, and the electrode that some signals are identical can link together, and therefore can not increase the difficulty in the signal contact that brings because floor space reduces.
According to temperature compensated oscillator structure of the present invention, it comprises a quartz crystal that has encapsulated and a temperature-compensating integrated circuit.Wherein this quartz crystal has the resonance frequency that changes in a specific range of temperatures, and this resonance frequency can be defined by a cubic curve; This temperature-compensating integrated circuit can produce a control signal, and this control signal roughly is inversely proportional to the cubic curve of quartz-crystal resonance frequency in this specific range of temperatures, therefore can make the whole output frequency of oscillator, and is roughly stable in whole temperature range.
Wherein this temperature-compensating integrated circuit is installed on the printed circuit board (PCB) (PCB), and it at first is connected on the printed circuit board (PCB) by welding or use conducting resinl in the mode that is arranged in parallel by some crystal connecting plates.The integrated circuit of following some tool temperature compensation functions is installed between any two adjacent crystal connecting plates, and uses potting resin to coat between any two adjacent connecting plates, and integrated circuit is encapsulated.After encapsulation is finished, installing one coccolith English crystal directly over each integrated circuit, wherein each coccolith English crystal cross-over connection on two adjacent crystal connecting plates, thereby cover corresponding integrated circuit.
The invention has the advantages that, temperature compensating crystal oscillator structure of the present invention is to have encapsulated quartz crystal and the integrated circuit with temperature compensation function of finishing by one to constitute, therefore can avoid the influence of impurity to the quartz crystal resonance characteristic, on the other hand, the part of bearing integrated is to be made by printed circuit board (PCB), therefore has low-cost and easy characteristic of producing.And if certain part gone bad (as integrated circuit), all the other good parts (as quartz crystal) also can be utilized again.Each employed electrode in encapsulation process is all guided to outside the element, and can be cut after encapsulation is finished, and does not therefore have unnecessary electrode on final products, and can not cause interference to the user.And because electrode is to guide to the temperature compensating crystal oscillator outside to connect, so temperature compensating crystal oscillator can do very for a short time, also can not cause the difficulty in the signal contact.
Brief Description Of Drawings
Below in conjunction with accompanying drawing,, will make technical scheme of the present invention and other beneficial effect apparent by detailed description to preferred embodiment of the present invention.In the accompanying drawing,
Fig. 1 does not compensate the performance curve chart of the frequency of oscillation of quartz crystal to environment temperature for existing typical case.
Fig. 2 is the temperature compensated oscillator schematic perspective view after finishing according to the present invention.
Fig. 3 A is the end view of the temperature compensating crystal oscillator array before not using the potting resin encapsulation.
Fig. 3 B is the vertical view of the temperature compensating crystal oscillator array before not using the potting resin encapsulation.
Fig. 4 A is the end view that carries out the temperature compensated oscillator array after potting resin encapsulates.
Fig. 4 B is the vertical view that carries out the temperature compensated oscillator array after potting resin encapsulates.
Fig. 5 is the schematic rear view of preceding whole temperature compensated oscillator (TCXO) substrate of cutting.
Fig. 6 is the schematic rear view of preceding whole temperature compensated oscillator (TCXO) substrate of cutting, and it adopts another kind of electronic pads design.
Embodiment
Under the situation that does not limit design of the present invention and range of application, below promptly introduce enforcement of the present invention with an embodiment; Those of ordinary skill in the art is after understanding design of the present invention, can in various application, use temperature compensated oscillator of the present invention, by means of structure of the present invention, can avoid because be packaged in the ceramic vessel influence that the formed impurity of the process that covers of integrated circuit causes resonant element simultaneously.In the structure of the present invention, integrated circuit is to be encapsulated on the tellite, need not use another ceramic vessel simultaneously, therefore can reduce manufacturing cost.And structure of the present invention is all guided to employed electrode outside the structural detail, makes the identical electrode of some signals to link together, and can increase the convenience of use.Application of the present invention should not only limit to the preferred embodiment of the following stated.
See also Fig. 2, single temperature compensated oscillator stereogram after it is depicted as and finishes according to the present invention, this single temperature compensated oscillator is mainly gone up temperature compensated oscillator (TCXO) substrate 208 that carries an integrated circuit 206 by the quartz crystal 202 of ceramic vessel encapsulation with it and is formed, wherein quartz crystal 202 is on the two crystal connecting plates 204 that are welded on the substrate 208, and this two crystal connecting plate 204 is to be connected with temperature compensated oscillator (TCXO) substrate 208 by welding or with conducting resinl, and each crystal connecting plate 204 has two connection gaskets (Pad) 210 that link to each other up and down, is used for the electrode of quartz crystal 202 is connected on temperature compensated oscillator (TCXO) substrate 208.Integrated circuit 206 is arranged in this two connecting plate 204 and temperature compensated oscillator (TCXO) substrate 208 formed sunk areas, and to fill gluing being affixed on temperature compensated oscillator (TCXO) substrate 208.
Temperature compensated oscillator (TCXO) substrate 208 is bilayer or multilayer board, this integrated circuit 206 is the circuit of a tool temperature compensation function, utilize the mode of bonding (Wire Bounding) or upside-down mounting welding (Flip-Chip) to be connected on temperature compensated oscillator (TCXO) substrate 208, and encapsulated with potting resin.Around temperature compensated oscillator (TCXO) substrate 208, have connection gasket (Pad) 210 respectively, be used for engaging with the quartz crystal 202 of ceramic vessel encapsulation.It should be noted that quartz crystal 202 used in the present invention for example is the quartz crystal after encapsulation is finished in employing.Wherein the resonance frequency that changes in a specific range of temperatures that has of 202 pairs of environment temperatures of quartz crystal can be defined by a cubic curve.And integrated circuit 206, can produce a control signal, this control signal roughly is inversely proportional to the cubic curve of quartz crystal in this specific range of temperatures, therefore work as in conjunction with this quartz crystal 202 and integrated circuit 206, can make the whole output frequency of oscillator, roughly stable in whole temperature range.The method of formation temperature compensated crystal oscillator is as follows on a circuit board.
Fig. 3 A is depicted as the end view of the temperature compensating crystal oscillator array 300 before not using the potting resin encapsulation, and Fig. 3 B is depicted as its vertical view, please consults Fig. 3 A and Fig. 3 B simultaneously.One temperature compensated oscillator array 300 is formed on a temperature compensated oscillator (TCXO) substrate 302, and wherein temperature compensated oscillator (TCXO) substrate 302 can be bilayer or multilayer board.When forming this compensated oscillator array 300, at first be connected on this temperature compensated oscillator (TCXO) substrate 302 by welding or use conducting resinl in the mode that is arranged in parallel by some crystal connecting plates 304.The integrated circuit 308 of following some tool temperature compensation functions is installed between any two adjacent crystal connecting plates 304, it utilizes the mode of bonding (WireBounding) or upside-down mounting welding (Flip-Chip) to be connected on temperature compensated oscillator (TCXO) substrate 302, and the temperature compensated oscillator array 300 of formation shown in Fig. 3 B, wherein on the adjacent crystal connecting plate 304 of each integrated circuit 308, in the zone 310 as shown in Fig. 3 B, all have two connection gaskets (Pad) 312 that link to each other up and down, it is used to provide the electrode of follow-up quartz crystal 306 and the usefulness of temperature compensated oscillator (TCXO) substrate 302 electric connections.
Fig. 4 A is depicted as the end view that carries out the temperature compensated oscillator array 300 after potting resin encapsulates, and Fig. 4 B is depicted as its vertical view, please consults Fig. 4 A and Fig. 4 B simultaneously.After finishing being connected of integrated circuit 308 and temperature compensated oscillator (TCXO) substrate 302, use potting resin 314 to coat between any two adjacent connecting plates 304, thereby integrated circuit 308 is encapsulated.After encapsulation is finished, directly over each integrated circuit 308, install a coccolith English crystal 3 06 again.Quartz crystal 306 used in the present invention for example is the quartz crystal after encapsulation is finished in employing, wherein each coccolith English crystal 3 06 cross-over connection is on two adjacent crystal connecting plates 304, thereby cover corresponding integrated circuit 308, and quartz crystal 306 is to utilize the connection gasket 312 (shown in Fig. 3 B) on the crystal connecting plate 304 of scolding tin and institute's cross-over connection to engage, and finish temperature compensated oscillator array 300 of the present invention.
Figure 5 shows that the schematic rear view of preceding whole temperature compensated oscillator (TCXO) substrate 302 of cutting, it comprises temperature compensated oscillator array 300 of the present invention, around each temperature compensated oscillator 318, have and offer the electronic pads 316 that the user uses, wherein these electronic padses 316 are all to be formed on the temperature compensated oscillator 318, then can cut and obtain single temperature compensated oscillator, and after having cut, carry out temperature-compensating again, the method has the advantage that can preferentially cut, yet, but can stay some unwanted electronic padses 316 at the back side of temperature compensated oscillator (TCXO) substrate 302.
Figure 6 shows that the another kind of design diagram of temperature compensated oscillator (TCXO) substrate 302 backplate pads, in the present embodiment, the electronic pads 320 and 322 of required use in the encapsulation process is all guided to outside the temperature compensated oscillator 318, therefore the identical electronic pads 320 and 322 of some signals can link together, and can reduce the quantity of tie point like this or increase the reliability that contacts.The area of whole temperature compensated oscillator 318 is reduced, but, therefore can't cause the difficulty in the signal contact because electrode is to guide to outside the temperature compensated oscillator 318 to connect again.Part outside the temperature compensated oscillator 318 finish with quartz crystal encapsulation after can be cut, in other words, employed electronic pads 320 and 322 is after finishing with the quartz crystal encapsulation in the encapsulation process, can't appear on the bulk temperature compensated oscillator, therefore it does not have unnecessary electrode on final products, so can not cause interference to the user yet.
Because temperature compensating crystal oscillator structure of the present invention is to have encapsulated the quartz crystal finished and the integrated circuit of its tool temperature compensation function is constituted by one, therefore can avoid the influence of impurity to the quartz crystal resonance characteristic, and on the other hand, the part of bearing integrated is to be made by printed circuit board (PCB), therefore has low-cost and easy characteristic of producing, if and certain part gone bad (as integrated circuit), all the other good parts (as quartz crystal) can also be utilized again.Each employed electrode in encapsulation process is all guided to outside the element, and can be cut after encapsulation is finished, so it does not have unnecessary electrode on final products, so can not cause interference to the user.And because electrode is to guide to the temperature compensating crystal oscillator outside to connect, so its area can do very for a short time, also can not cause the difficulty in the signal contact.
Though content of the present invention has been exposed in the above-mentioned preferred embodiment; yet it is not to be used for limiting the present invention; any those of ordinary skill of this area is not in breaking away from design of the present invention and scope; all can be used for various modifications and improvements, so protection scope of the present invention should be as the criterion with claim institute restricted portion.
Claims (16)
1. temperature-compensating oscillation device is characterized in that it comprises at least:
Article two, the crystal connecting plate is arranged on the printed circuit board (PCB);
One compensation mechanism between these two crystal connecting plates, and it has a temperature-compensating integrated circuit that is encapsulated on this printed circuit board (PCB) and electrically connects with this printed circuit board (PCB); And
One is positioned at the crystal assembly on this compensation mechanism, and it electrically connects by these two crystal connecting plates and this printed circuit board (PCB), wherein have several connection gaskets on these two crystal connecting plates, and also have several connection gaskets on this crystal assembly, when this crystal assembly and this compensation mechanism encapsulated, the connection gasket of these two crystal connecting plates can engage with the connection gasket on this crystal assembly.
2. temperature-compensating oscillation device as claimed in claim 1 is characterized in that: this crystal assembly is a quartz crystal.
3. temperature-compensating oscillation device as claimed in claim 1, it is characterized in that: have several connection gaskets on this printed circuit board (PCB), when these two crystal connecting plates and this printed circuit board (PCB) encapsulated, the connection gasket of this printed circuit board (PCB) can engage with the connection gasket on these two crystal connecting plates.
4. temperature-compensating oscillation device as claimed in claim 3 is characterized in that: the part connection gasket on this printed circuit board (PCB) is positioned at outside this temperature-compensating oscillation device opposite position.
5. temperature-compensating oscillation device as claimed in claim 1 is characterized in that: these two crystal connecting plates are connected by conducting resinl or scolding tin with printed circuit board (PCB).
6. temperature-compensating oscillation device as claimed in claim 1 is characterized in that this printed circuit board (PCB) is bilayer or multilayer board.
7. temperature-compensating oscillation device as claimed in claim 1 is characterized in that: this crystal assembly has the resonance frequency with the cubic curve definition in specific range of temperatures.
8. temperature-compensating oscillation device as claimed in claim 7 is characterized in that: this compensation mechanism can be exported a control signal in this specific range of temperatures, and wherein this control signal and this cubic curve are inversely proportional to.
9. temperature-compensating oscillation device as claimed in claim 1 is characterized in that: the temperature-compensating integrated circuit between these two crystal connecting plates is to use the potting resin mode to be encapsulated.
10. temperature compensated oscillator manufacture method, it is characterized in that: this method comprises at least:
Two crystal connecting plates are set on a printed circuit board (PCB);
Between these two crystal connecting plates a compensation mechanism is set, this compensation mechanism has a temperature-compensating integrated circuit that is encapsulated on this printed circuit board (PCB) and electrically connects with this printed circuit board (PCB); And
One crystal assembly is set on this compensation mechanism, wherein this crystal assembly can electrically connect this printed circuit board (PCB) by these two crystal connecting plates, wherein have several connection gaskets on these two crystal connecting plates, and also have several connection gaskets on this crystal assembly, when this crystal assembly and this compensation mechanism encapsulated, the connection gasket of these two crystal connecting plates can engage with the connection gasket on this crystal assembly.
11. temperature compensated oscillator manufacture method as claimed in claim 10 is characterized in that: this temperature-compensating integrated circuit is connected with this printed circuit board (PCB) in the mode of bonding or upside-down mounting welding.
12. a temperature-compensating oscillation device, it is characterized in that: it comprises at least:
Some are arranged on crystal connecting plate on the printed circuit board (PCB) in the mode that is arranged in parallel;
Several modes with arrayed are arranged in the compensation mechanism on this printed circuit board (PCB), wherein all corresponding with two the crystal connecting plate adjacency of each compensation mechanism, and each compensation mechanism has a temperature-compensating integrated circuit that is encapsulated on this printed circuit board (PCB) and electrically connects with this printed circuit board (PCB); And
Several lay respectively at the crystal assembly on the corresponding compensation mechanism, and it electrically connects by two crystal connecting plates and this printed circuit board (PCB) with this compensation mechanism adjacency, wherein have a plurality of connection gaskets that link to each other up and down on each crystal connecting plate, and also have a plurality of connection gaskets on this crystal assembly and this printed circuit board (PCB) respectively, when this crystal assembly, this crystal connecting plate and this printed circuit board (PCB) encapsulate, the connection gasket on each crystal connecting plate can be respectively with this crystal assembly and this printed circuit board (PCB) on connection gasket electrically connect.
13. temperature-compensating oscillation device as claimed in claim 12 is characterized in that: the connection gasket on this crystal assembly is to utilize the connection gasket on the crystal connecting plate of scolding tin and institute's cross-over connection to engage.
14. temperature-compensating oscillation device as claimed in claim 12 is characterized in that: two adjacent crystal connecting plates and the temperature-compensating integrated circuit between it use the potting resin mode to be encapsulated.
15. temperature-compensating oscillation device as claimed in claim 12 is characterized in that: also comprise a plurality of electronic padses.
16. temperature-compensating oscillation device as claimed in claim 15 is characterized in that: in encapsulation process this electronic pads is guided to outside the temperature-compensating oscillation device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031540147A CN100389537C (en) | 2003-08-08 | 2003-08-08 | Temperature compensating crystal oscillator structure and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031540147A CN100389537C (en) | 2003-08-08 | 2003-08-08 | Temperature compensating crystal oscillator structure and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1581677A CN1581677A (en) | 2005-02-16 |
| CN100389537C true CN100389537C (en) | 2008-05-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB031540147A Expired - Fee Related CN100389537C (en) | 2003-08-08 | 2003-08-08 | Temperature compensating crystal oscillator structure and its manufacturing method |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102332890B (en) * | 2011-08-29 | 2017-12-29 | 应达利电子股份有限公司 | A kind of quartz crystal oscillator pasted on surface and its manufacture method of PCB pedestals |
| CN104811144A (en) * | 2015-05-20 | 2015-07-29 | 中国电子科技集团公司第十三研究所 | Novel hybrid integrated circuit used for improving Terahertz mixer micropackage |
| WO2017015835A1 (en) * | 2015-07-27 | 2017-02-02 | 广东大普通信技术有限公司 | Direct temperature measurement oven controlled crystal oscillator |
| CN106712737A (en) * | 2016-12-20 | 2017-05-24 | 广东大普通信技术有限公司 | Crystal oscillator and production method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1139500A (en) * | 1994-11-29 | 1997-01-01 | 摩托罗拉公司 | Low power temperature compensated crystal oscillator |
| CN2259717Y (en) * | 1995-12-28 | 1997-08-13 | 西安电子科技大学 | Quartz crystal oscillator with temperature compensation |
| CN1364335A (en) * | 2000-03-17 | 2002-08-14 | 旭化成微系统株式会社 | Temperature-compensated crystal oscillator and method of temperature compensation |
| CN1428927A (en) * | 2001-12-27 | 2003-07-09 | 三星电机株式会社 | Temp. compensating crystal oscillator and its mfg. method |
-
2003
- 2003-08-08 CN CNB031540147A patent/CN100389537C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1139500A (en) * | 1994-11-29 | 1997-01-01 | 摩托罗拉公司 | Low power temperature compensated crystal oscillator |
| CN2259717Y (en) * | 1995-12-28 | 1997-08-13 | 西安电子科技大学 | Quartz crystal oscillator with temperature compensation |
| CN1364335A (en) * | 2000-03-17 | 2002-08-14 | 旭化成微系统株式会社 | Temperature-compensated crystal oscillator and method of temperature compensation |
| CN1428927A (en) * | 2001-12-27 | 2003-07-09 | 三星电机株式会社 | Temp. compensating crystal oscillator and its mfg. method |
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| CN1581677A (en) | 2005-02-16 |
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