CN1520028A - Device of temperature compensated oscillator and manufacturing method - Google Patents
Device of temperature compensated oscillator and manufacturing method Download PDFInfo
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- CN1520028A CN1520028A CNA031029787A CN03102978A CN1520028A CN 1520028 A CN1520028 A CN 1520028A CN A031029787 A CNA031029787 A CN A031029787A CN 03102978 A CN03102978 A CN 03102978A CN 1520028 A CN1520028 A CN 1520028A
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- temperature compensated
- compensated oscillator
- crystal assembly
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Abstract
The device includes upper and lower parts. One part is a ceramics container containing quartz crystal, and the other is temp compensated IC encapsulated on printing circuit board.
Description
Technical field
The present invention relates to a kind of crystal oscillator device, relate in particular to a kind of temperature compensating crystal oscillator device.
Background technology
Crystal oscillator is generally used in to be needed to stablize in the application apparatus of output frequency, for example in mobile phone, as the usefulness in frequency reference source.Yet its output frequency of the crystal oscillator of prior art can present function along with the oscillator environment temperature.Fig. 1 is not for typically compensating the performance curve chart of the frequency of oscillation of quartz crystal to environment temperature.As shown in Figure 1, curve 100 has the shape as cubic curve, and it can divide into three temperature provinces haply.In low temperature zone (35 ℃ to approximately+10 ℃), this curve has the partly linear of positive slope and nonlinear area that the slope of curve changes.In the middle temperature province (+10 ℃ to+50 ℃), this curve has the linear part for negative slope.In the high-temperature zone (+50 ℃ to+90 ℃), this curve has the nonlinear element for the partly linear of positive slope and slope of curve change.Wherein breakover point 102 places then be arranged in temperature province approximately+28 ℃ locate.
There are multiple technologies to can be used for this kind frequency change of compensated crystal, generally can utilize an integrated circuit to produce a compensated curve 104, this compensated curve 104 is anti-phase each other with curve 100, therefore can be by the compensation of compensated curve 104, revise the change output frequency, to produce stable output frequency.
Common this product is made up of a resonant element (quartz crystal slice) and an integrated circuit, and its structure roughly has two kinds, and first kind of structure is packaged in resonant element and integrated circuit in the same ceramic vessel simultaneously.Yet, in this structure, owing to encapsulate resonant element and integrated circuit simultaneously, therefore cover or when welding integrated circuit glutinous, the residue that resin that it volatilized or welding stay can impact resonant element, and influences its characteristic as the reference frequency source.
Second kind of structure is to assemble resonant element (quartz crystal slice) and integrated circuit respectively.At first resonant element is placed on a ceramic vessel and airtight good, again integrated circuit is placed in another ceramic vessel, again this two ceramic vessel is coupled together at last.Though this structure can avoid as in first kind of structure when the encapsulated integrated circuit, cause the influence of residue that the resin that volatilizes or welding stay to resonant element, but it need use another ceramic vessel bearing integrated, this ceramic vessel is to be formed by low temperature co-fired technology manufacturing by multi-layer ceramics, have only a few company to produce in a large number, so cost is very high.
On the other hand, above-mentioned two kinds of structures, on final products, can have several external electrodes, it is to be used for integrated circuit is done the usefulness of burning program, after finishing, burning promptly becomes the electrode that does not have effect, but these useless electrode pair clients in use can cause puzzlement, for example must whether the possibility that cause short circuit with other circuit be arranged consideration, make product design complicated.On the other hand, because the more and more miniaturization of temperature compensated oscillator structure causes the distance between several external electrodes more and more littler, therefore want to make these external electrodes and control signal to keep excellent contact just more and more difficult.
In summary, the temperature compensated oscillator of described prior art on reality is used, obviously exists inconvenience and defective, so be necessary to be improved.
Summary of the invention
In view of all having its defective, above-mentioned prior art temperature compensated oscillator structure exists, as resonant element and integrated circuit are packaged in the same ceramic vessel simultaneously, can make and glutinous cover or weld the residue that resin that integrated circuit volatilizes or welding stay resonant element is impacted.And,, can improve manufacturing cost because of need use another ceramic vessel bearing integrated in the structure that encapsulates resonant element and integrated circuit respectively.And above-mentioned two kinds of structures can have the electrode that several do not have effect on final products, in use can cause puzzlement to the client.
Therefore, main purpose of the present invention promptly is at above-mentioned shortcoming, is to provide a kind of temperature compensated oscillator structure of cost economy, and it has high stability output frequency in required temperature range.
Two of purpose of the present invention is to provide a kind of temperature compensated oscillator structure, does not have unnecessary electrode on its final products, therefore can not cause puzzlement to the user.
Three of purpose of the present invention, be to provide a kind of temperature compensated oscillator structure, it is all guided to employed electrode outside the temperature compensated oscillator construction unit, and the electrode that some signals are identical can link together, therefore the difficulty that can not contact owing to the signal that floor space reduces to bring.
According to temperature compensated oscillator structure of the present invention, comprise a quartz crystal that has encapsulated, it has the resonance frequency that changes in a specific range of temperatures, can be defined by a cubic curve.One temperature-compensating integrated circuit can produce a control signal, and this control signal roughly is inversely proportional to the cubic curve of quartz crystal in this specific range of temperatures, therefore can make the whole output frequency of oscillator, and is roughly stable in whole temperature range.Wherein this temperature-compensating integrated circuit is encapsulated on the printed circuit board (PCB) (PCB), owing to do not use the ceramic vessel carrying, and therefore with low cost; And owing to use the method for encapsulation respectively, if therefore certain part has been gone bad (as integrated circuit), all the other good parts (as quartz crystal) can also be utilized again.
Brief Description Of Drawings
Below in conjunction with accompanying drawing,, will make technical scheme of the present invention and other beneficial effects apparent by detailed description to preferred embodiment of the present invention.
In the accompanying drawing,
Fig. 1 is that the typical case does not compensate the performance curve chart of the frequency of oscillation of quartz crystal to environment temperature;
Fig. 2 is the temperature compensated oscillator schematic perspective view after the present invention finishes;
Fig. 3 is the perspective view of the crystal of ceramic vessel encapsulation of the present invention;
Fig. 4 is the front schematic view of whole printed circuit board (PCB) before the cutting of the present invention;
Fig. 5 is the schematic rear view of whole printed circuit board (PCB) before the cutting of the present invention;
Fig. 6 is the schematic diagram after several unit encapsulate with quartz crystal respectively on the whole printed circuit board (PCB) of the present invention.
Embodiment
Hereinafter, will describe the present invention in detail.
Do not limiting under spirit of the present invention and the range of application, below promptly with an embodiment, introduce enforcement of the present invention; Be familiar with this field skill person, after understanding spirit of the present invention, when using temperature compensating crystal oscillator of the present invention in various application, by structure of the present invention, can avoid because be packaged in the ceramic vessel simultaneously, integrated circuit glutinous covered the influence that the formed impurity of process causes resonant element.While structure of the present invention, its integrated circuit is packaged on the tellite, need not use another ceramic vessel, therefore can reduce manufacturing cost.And structure of the present invention is all guided to employed electrode outside the construction unit, makes the identical electrode of some signals to link together, and can increase the convenience of use.Application of the present invention is when the preferred embodiment that is not limited only to the following stated.
A kind of temperature compensated oscillator provided by the invention, as shown in Figure 2, its quartz crystal 202 by ceramic vessel encapsulation is gone up printed circuit board (PCB) 204 two parts that carry an integrated circuit 206 with it and is formed, wherein integrated circuit 206 is one to have the circuit of temperature compensation function, can be connected on the printed circuit board (PCB) 204 by the mode of lead-in wire bonding (WireBounding) or flip chip bonding (Flip-Chip), and encapsulated by potting resin.Around printed circuit board (PCB) 204, have connection gasket (Pad) 208 respectively, when the quartz crystal 202 with the ceramic vessel encapsulation engages, can on connection gasket 208, be coated with sealing to carry out involution.It should be noted that the quartz crystal after encapsulation is finished in quartz crystal 202 employings used in the present invention.
The quartz crystal 202 of ceramic vessel encapsulation, as shown in Figure 3, wherein the bottom of this crystal is not flat, but a square cavity that falls in 302 is arranged, and when being used for engaging up and down with printed circuit board (PCB) 204, holds integrated circuit 206.Same, also have connection gasket 300 respectively around the quartz crystal 202, when engaging, can on connection gasket 300, the coating sealing carry out involution again with printed circuit board (PCB) 204.Wherein quartz crystal 202, and environment temperature is had the resonance frequency that changes in a specific range of temperatures, can be defined by a cubic curve.And integrated circuit 206, can produce a control signal, this control signal roughly is inversely proportional to the cubic curve of quartz crystal in this specific range of temperatures, therefore in conjunction with quartz crystal 202 and integrated circuit 206, can make the whole output frequency of oscillator, roughly stable in whole temperature range.
Fig. 4 is the front view of the preceding whole printed circuit board (PCB) 400 of cutting, wherein this printed circuit board (PCB) 400 can be bilayer or multilayer printed circuit board, can form several unit 402 on it, and each unit 402 can be in order to carry an integrated circuit, encapsulate with a quartz crystal of finishing encapsulation respectively again, can form temperature compensated oscillator of the present invention.Wherein each unit 402 around have four connection gaskets 404 that are connected with crystal.And the center of each unit 402, in order to carry a temperature-compensating integrated circuit, this temperature-compensating integrated circuit can be connected on the printed circuit board (PCB) 400 by the mode of lead-in wire bonding or flip chip bonding, and seals by potting resin.On the other hand, the electrode 406 and 408 of required use in the encapsulation process is all guided to outside the unit 402, so the identical electrode 408 of some signals can link together, and can reduce the quantity of tie point like this and increase the reliability of contact.Even the area of whole unit 402 reduces, but, therefore can't cause the difficulty in the signal contact because electrode is guided to outside the unit 402 and connected.Part outside the unit 402 finish with quartz crystal encapsulation after can be cut, in other words, employed electrode 406 and 408 in the encapsulation process, after finishing with the quartz crystal encapsulation, can't come across on the bulk temperature compensated oscillator, therefore it does not have unnecessary electrode on final products, so can not cause puzzlement to the user.
Fig. 5 for cutting before the schematic rear view of whole printed circuit board (PCB) 400, it comprises several unit 402, and each unit 402 around have the employed electronic pads 410 of the user of offering.And the electrode 406 and 408 of required use in the encapsulation process all is positioned at outside the unit 402.
After several unit 402 encapsulate with quartz crystal respectively on the whole printed circuit board (PCB) 400, as shown in Figure 6, part outside these several unit 402 can be cut, promptly form structure as shown in Figure 2, wherein employed electrode 406 and 408 all can not come across on the bulk temperature compensated oscillator in the encapsulation process, and only be in around the bottom of each unit 402, offer the electronic pads 410 (as shown in Figure 5) that the user uses.
Because structure of the present invention is made of printed circuit board (PCB) two parts that a quartz crystal and carry compensation integrated circuits on it, therefore it has low-cost and easy characteristic of producing, if and certain part gone bad (as integrated circuit), all the other good parts (as quartz crystal) can also be utilized again.Each employed electrode in encapsulation process is all guided to outside the unit, and can be cut after encapsulation is finished, so it does not have unnecessary electrode on final products, so can not cause puzzlement to the user.
Temperature compensated oscillator structure of the present invention has following advantage, because it adopts and encapsulates the quartz crystal of finishing, does not promptly encapsulate with integrated circuit, therefore can avoid the influence of other impurity to the quartz crystal resonance characteristic.On the other hand, the part of bearing integrated is made of tellite, and its technology is ripe and with low cost.Final products do not have unnecessary electrode can not cause puzzlement to the user yet.In addition, because electrode guides to the temperature compensating crystal oscillator outside and connect, so its area can do very for a short time, and can not cause the difficulty in the signal contact.
Be understandable that; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to technical scheme of the present invention and technical conceive, and all these changes and distortion all should belong to the protection range of accompanying Claim of the present invention.
Claims (19)
1. a temperature compensated oscillator device is characterized in that, comprises at least:
One crystal assembly; And
One compensation mechanism is packaged on this crystal assembly to form this temperature compensated oscillator device, and wherein this compensation mechanism has a compensation integrated circuits that is packaged on the printed circuit board (PCB).
2. temperature compensated oscillator device according to claim 1 is characterized in that this crystal assembly is packaged in the ceramic vessel.
3. temperature compensated oscillator device according to claim 1 is characterized in that, this crystal assembly is a quartz crystal.
4. temperature compensated oscillator device according to claim 1 is characterized in that, has several connection gaskets on this printed circuit board (PCB), and when this crystal assembly and this printed circuit board (PCB) encapsulated, this connection gasket can engage with the connection gasket on the crystal assembly.
5. temperature compensated oscillator device according to claim 4 is characterized in that, this crystal assembly is connected by scolding tin with connection gasket on the printed circuit board (PCB).
6. temperature compensated oscillator device according to claim 1 is characterized in that, the square cavity that this crystal assembly bottom has a depression.
7. temperature compensated oscillator device according to claim 6 is characterized in that, this compensation integrated circuits is arranged in this square cavity when this crystal assembly and this compensation mechanism encapsulate.
8. temperature compensated oscillator device according to claim 1 is characterized in that, this compensation integrated circuits is connected on the printed circuit board (PCB) in the mode of lead-in wire bonding or flip chip bonding.
9. temperature compensated oscillator device according to claim 1 is characterized in that, this temperature compensating crystal oscillation device has a resonance frequency with the cubic curve definition in specific range of temperatures.
10. temperature compensated oscillator device according to claim 9, it is characterized in that, this compensation mechanism is an exportable control signal in this specific range of temperatures, wherein this control signal and this cubic curve are inversely proportional to, make the output frequency of this temperature compensated oscillator device, stable in this specific range of temperatures.
11. a temperature compensated oscillator device is characterized in that, this device comprises at least:
One crystal assembly, wherein this crystal assembly has a caveli body; And
One compensation mechanism, has a compensation integrated circuits that is packaged on the printed circuit board (PCB), this compensation integrated circuits is arranged in this cavity when this crystal assembly and this compensation mechanism encapsulate, wherein required electrode all is positioned at outside this compensation mechanism during the encapsulation of this crystal assembly and this compensation mechanism.
12. a temperature compensated oscillator manufacture method, this method comprises at least:
Formation has the crystal assembly of a caveli body;
Form at least one compensation integrated circuits on a printed circuit board (PCB), and corresponding to the position of this compensation integrated circuits, this printed circuit board (PCB) have several connection gasket that is connected with this crystal assembly and several compensating electrodes; And
Encapsulate this printed circuit board (PCB) and this crystal assembly, and this compensation integrated circuits is placed this cavity and carries out compensation process.
13. temperature compensated oscillator manufacture method according to claim 12 is characterized in that this crystal assembly is packaged in the ceramic vessel.
14. temperature compensated oscillator manufacture method according to claim 12 is characterized in that, this crystal assembly is a quartz crystal.
15. temperature compensated oscillator manufacture method according to claim 12 is characterized in that it also comprises a step, promptly finishes compensation back excision redundance and unnecessary electrode, and is obtaining a temperature compensating crystal oscillator that separates.
16. temperature compensated oscillator manufacture method according to claim 15 is characterized in that, this crystal assembly is connected by scolding tin with connection gasket on the printed circuit board (PCB).
17. temperature compensated oscillator manufacture method according to claim 12 is characterized in that, this compensation integrated circuits is connected on the printed circuit board (PCB) in the mode of lead-in wire bonding or flip chip bonding.
18. temperature compensated oscillator manufacture method according to claim 12 is characterized in that, this crystal oscillator has a resonance frequency with the cubic curve definition in specific range of temperatures.
19. temperature compensated oscillator manufacture method according to claim 18, it is characterized in that, this compensation mechanism is an exportable control signal in this specific range of temperatures, wherein this control signal and this cubic curve are inversely proportional to, make the output frequency of this temperature compensated oscillator device, stable in this specific range of temperatures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031029787A CN1520028A (en) | 2003-01-23 | 2003-01-23 | Device of temperature compensated oscillator and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031029787A CN1520028A (en) | 2003-01-23 | 2003-01-23 | Device of temperature compensated oscillator and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1520028A true CN1520028A (en) | 2004-08-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA031029787A Pending CN1520028A (en) | 2003-01-23 | 2003-01-23 | Device of temperature compensated oscillator and manufacturing method |
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| Country | Link |
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| CN (1) | CN1520028A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104967419A (en) * | 2015-07-15 | 2015-10-07 | 廊坊中电熊猫晶体科技有限公司 | TCXO and design method |
| CN104993823A (en) * | 2015-06-03 | 2015-10-21 | 西安电子科技大学 | Totally integrated high-precision oscillator frequency generating circuit |
| CN106537781A (en) * | 2014-06-18 | 2017-03-22 | 微型模拟系统公司 | Method and integrated circuit for temperature compensation of oscillator, and temperature-compensated oscillator unit |
| CN106712737A (en) * | 2016-12-20 | 2017-05-24 | 广东大普通信技术有限公司 | Crystal oscillator and production method thereof |
-
2003
- 2003-01-23 CN CNA031029787A patent/CN1520028A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106537781A (en) * | 2014-06-18 | 2017-03-22 | 微型模拟系统公司 | Method and integrated circuit for temperature compensation of oscillator, and temperature-compensated oscillator unit |
| CN106537781B (en) * | 2014-06-18 | 2019-06-11 | 微型模拟系统公司 | The method and integrated circuit and temperature compensated oscillator unit of the temperature-compensating of oscillator |
| CN104993823A (en) * | 2015-06-03 | 2015-10-21 | 西安电子科技大学 | Totally integrated high-precision oscillator frequency generating circuit |
| CN104967419A (en) * | 2015-07-15 | 2015-10-07 | 廊坊中电熊猫晶体科技有限公司 | TCXO and design method |
| CN106712737A (en) * | 2016-12-20 | 2017-05-24 | 广东大普通信技术有限公司 | Crystal oscillator and production method thereof |
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