CN114337587A - Filter system-level hybrid packaging module and packaging mode - Google Patents
Filter system-level hybrid packaging module and packaging mode Download PDFInfo
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- CN114337587A CN114337587A CN202110468684.8A CN202110468684A CN114337587A CN 114337587 A CN114337587 A CN 114337587A CN 202110468684 A CN202110468684 A CN 202110468684A CN 114337587 A CN114337587 A CN 114337587A
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Abstract
The invention belongs to the field of filters and the technical field of system-in-package, and provides a filter system-in-package module and a packaging mode, which solve the problems that filters in different technologies are difficult to integrate and package, and the filters in different types cooperatively work in the system-in-package module to interfere with each other. The invention provides a filter system-level mixed packaging module, which comprises: a first filter for filtering the received signal in a first frequency band; a second filter for filtering the received signal in a second frequency band different from the first frequency band; the filter comprises a substrate, wherein a bonding pad is arranged on one side of the substrate, a molding compound is arranged on the other side of the substrate, the film plastic provides a first space for a first filter, and the molding compound provides a second space different from the first space for a second filter; the molding compound is coated with metal paint on the surface, and the first space and the second space are separated by the metal paint; the substrate is provided with a wire which is connected with the first filter and the second filter.
Description
Technical Field
The invention belongs to the field of filters and the technical field of system-in-package, and particularly relates to a filter system-in-package module and a packaging mode.
Background
A common filter design is designed based on one of SAW (surface acoustic wave filter), BAW (bulk acoustic wave filter) or IPD (integrated passive device filter) technologies, and a common system-in-package filter module is also an integration of a plurality of filters of the same technology.
The three filters have different advantages, the SAW filter has stable performance and wide frequency band, is mainstream application below 1.6GHz, but has the problems of large insertion loss, serious heating of high-frequency signals and the like, so the applicability is poor when the high-frequency signals above 1.6GHz are processed; the BAW filter is low in insertion loss and insensitive to temperature change, and is commonly used for processing high-frequency signals above 2 GHz; the IPD filter can be used for medium-low and high frequency bands, has low insertion loss and wider bandwidth, but has the defects of low Q value (quality factor) and poor out-of-band rejection.
The three filters are made of different materials, the SAW filter is made based on lithium tantalate (LiTaO 3) or lithium niobate (LiNbO 3), the BAW filter is made based on aluminum nitride (AlN) or zinc oxide (ZnO), and the IPD filter is made based on high-resistance silicon (HR-Si); the three filters have different working conditions, the SAW filter needs to form a cavity structure in a package to ensure the transmission of surface acoustic waves, the BAW filter designs a cavity in a bare chip to ensure the transmission of bulk acoustic waves, the IPD filter does not relate to an acoustic wave technology, and the requirement on the package is not high. And the three filters will interfere with each other when working, and have a large influence on the performance. For these reasons, the filter design is based on one of SAW, BAW and IPD, and the multiple filters in the system-in-package filter module are based on the same technology, but this approach is difficult to fully take the advantages of various types of filters.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a filter system-level hybrid packaging module and a packaging mode, and solves the problems that the integrated packaging difficulty of filters in different technologies is high, and the filters of different types cooperatively work in the system-level packaging module to interfere with each other.
The invention provides a filter system-level hybrid packaging module, which comprises:
a first filter that filters a received signal in a first frequency band;
a second filter that filters the received signal at a second frequency band different from the first frequency band;
the filter comprises a substrate, wherein a bonding pad is arranged on one side of the substrate, a molding compound is arranged on the other side of the substrate, the film plastic provides a first space for the first filter, and the molding compound provides a second space different from the first space for the second filter;
the surface of the molding compound is coated with a metal coating, and the first space and the second space are separated by the metal coating;
the substrate is provided with a wire, and the wire is connected with the first filter and the second filter.
In one embodiment of the present invention, the trace is connected to a matching circuit, and the matching circuit is electrically connected to the first filter and the second filter through the trace.
In one embodiment of the present invention, the first filter is any one of a surface acoustic wave filter, a bulk acoustic wave filter, and an integrated passive device filter.
In one embodiment of the present invention, the first filter is a surface acoustic wave filter, the first filter is connected to a solder ball, the solder ball connects the first filter to the substrate, the first filter is further provided with a film, the film is located inside the solder ball, and the film encloses a surface of the first filter opposite to the substrate to form a cavity.
In an embodiment of the invention, the cavity is further configured to provide a propagation path for the sound wave of the first filter.
In one embodiment of the present invention, an interdigital transducer is formed on a surface of the first filter facing the cavity and opposite to the substrate, and the interdigital transducer is configured to convert an electrical signal and a sound wave into each other.
In one embodiment of the present invention, the second filter is connected to the substrate through the solder ball.
In one embodiment of the present invention, the second filter is a bulk acoustic wave filter, and an inner cavity is formed in the second filter, and the inner cavity is used for providing a path for bulk acoustic wave propagation in the second filter.
The invention also provides a filter system-level hybrid packaging mode for packaging the filter system-level hybrid packaging module in the technical scheme, and the packaging method comprises the following steps:
a substrate preparation step: welding a welding pad at the bottom of the substrate, wherein the substrate is provided with a wire for connecting each filter;
a filter preparation step: selecting a corresponding filter and preprocessing the filter according to the design requirement of the filter system-level hybrid packaging module;
a filter mounting step: mounting the pretreated filter on the substrate;
and (3) a molding step: placing the substrate and the filter in a molding die cavity, heating a molding compound to melt the molding compound, filling the molding compound into the molding die cavity under the action of pressure, and cooling and curing; the molding step is temporally intermediate after the filter mounting step;
a zoning shielding step: and laser is used for penetrating the molding compound to expose the grounding copper foil on the substrate, the molding compounds coating different filters are separated from each other, and the surface of the molding compound is coated with metal paint for separating the filters and avoiding the mutual interference of the filters.
In one embodiment of the present invention, in the filter preparation step, the preprocessing includes attaching the solder balls to a surface of the substrate opposite to the filter, in the filter attachment step, the solder paste is applied to the pad of the substrate, the preprocessed filter is attached to the pad of the substrate, and the solder balls of the filter and the pad are soldered by reflow soldering.
The invention has the beneficial effects that:
(1) according to the packaging method, after the first filter and the second filter are attached to the other side of the substrate, the film plastic is heated, melted, cooled and solidified, and the first filter and the second filter are wrapped in the solidified molding plastic.
(2) By coating metal paint on different space surfaces (the surfaces in the figure refer to the upper surface of the molding compound in the figure 1, and also include gaps among different spaces, namely the interlayers of the molding compound), the molding compound in each space is closed by the metal paint and the upper surface of the substrate to form partition shielding, so that the problem of mutual interference of different filters is avoided, in addition, the mutual interference of the filters and external devices is isolated, and an excellent electromagnetic interference shielding effect is achieved.
(3) Through the packaging mode of the embodiment, various filters can cooperatively work in a module without problems (for example, the SAW cavity implementation mode provided by the invention can ensure normal operation of SAW, and the partitioned shielding mode can avoid mutual interference among the filters and between the filters and an external device), the filter packaging integration of different technologies can more fully exert the advantages of various filters (SAW, BAW and IPD filters respectively have application advantages in low-frequency band, medium-high frequency band and wide band) compared with a filter of a single technology, and the module based on the mixed packaging of various filters can be applied to different frequency band types such as low-frequency band, medium-high frequency band, narrow band and wide band), so that the performance is better, the flexibility is higher, and the application prospect is wider.
Drawings
FIG. 1 is a schematic diagram of an internal package structure of a SAW, BAW, IPD based system-in-package filter module according to the present invention;
FIG. 2 is a diagram of the overall dimensions of a SAW, BAW, IPD based system-in-package filter module according to the present invention;
FIG. 3 is a schematic diagram of an internal package structure of a system-in-package filter module based on SAW and IPD according to the present invention;
fig. 4 is a diagram of the external dimensions of a BGA package format of the system-in-package filter module of the present invention;
fig. 5 is a flow chart of the filter system-in-package method of the present invention.
Description of reference numerals:
100. a first filter; 110. a film; 120. a cavity; 130. an interdigital transducer; 200. a second filter; 210. tin balls; 220. an inner cavity; 230. a third filter; 300. a substrate; 400. a pad; 500. molding a plastic material; 600. a first space; 700. a second space; 710. a third space; 800. a metal coating; 900. and (6) routing.
Detailed Description
In order to facilitate an understanding of the invention, the invention will now be described more fully hereinafter with reference to the accompanying drawings, in which several embodiments of the invention are shown, but which may be embodied in many different forms and are not limited to the embodiments described herein, but rather are provided for the purpose of providing a more thorough disclosure of the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention; as used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Example one
The invention provides a filter system-level mixed packaging module, which comprises: a first filter 100 and a second filter 200. The first filter 100 filters the received signal in a first frequency band; the second filter 200 filters the received signal in a second frequency band different from the first frequency band. The first frequency band is different from the second frequency band, which means that the first frequency band and the second frequency band are completely different, and the first frequency band and the second frequency band may be different from each other, and the first frequency band and the second frequency band overlap each other in frequency band, considering that the frequency bands suitable for the first filter 100 and the second filter 200 overlap each other.
The first filter 100 and the second filter 200 are of different filter types. The filter is any one of a surface acoustic wave filter, a bulk acoustic wave filter and an integrated passive device filter. Since the first filter 100 and the second filter 200 use different types of filters, the frequency bands of the signals received by the first filter 100 and the second filter 200 are all different, and the signals of the corresponding frequency bands are filtered respectively.
The module of the present invention further includes a substrate 300, wherein a bonding pad 400 is disposed on one side of the substrate 300, and a molding compound 500 is disposed on the other side of the substrate 300. By the packaging method of the present invention, after the first filter 100 and the second filter 200 are attached to the other side of the substrate 300, the molding compound 500 is heated, melted, cooled and solidified, so as to encapsulate the first filter 100 and the second filter 200 in the solidified molding compound 500, and since the substrate 300 and the molding compound 500 are both closed (where closed means that the through hole of the trace 900 has little influence and is ignored) solid substances, the first filter 100 and the second filter 200 are separated from each other and do not affect each other. The cured molding compound 500 provides a first space 600 for the first filter 100 and a second space 700 different from the first space 600 for the second filter 200, where the first space 600 is different from the second space 700 means that the two are separated from each other in three dimensions and are different from each other.
Since the first filter 100 is disposed in the first space 600, the second filter 200 is disposed in the second space 700, and the molding compound 500 is disposed on the other side of the substrate 300, in combination with the packaging method of the present invention, it can be known that the surface of the molding compound 500 is coated with the metal coating 800, the first space 600 and the second space 700 are separated by the metal coating 800, the molding compound 500 in each space is closed by the metal coating 800 and the upper surface of the substrate 300 to form a partition shield by coating the metal coating 800 on the different space surfaces (the surfaces herein refer to not only the upper surface of the molding compound 500 in fig. 1, but also the gaps between the different spaces, i.e., the interlayer of the molding compound 500), which forms a partition shield, so as to avoid the mutual interference between the different filters, and in addition, isolate the mutual interference between the filters and external devices, and play a good role in shielding electromagnetic interference (EMI). After the molding compound 500 is cured and molded on the other side of the filter, the module is welded on the element to be welded through the bonding pad 400, the periphery of the filter is communicated with the whole circuit system, various interference electric field magnetic fields exist among other elements in the circuit system, and as the metal coating 800 is coated on the surface of the molding compound 500 for accommodating the filter, each filter cannot be influenced by other elements in the circuit, and the filtering effect is stable.
The substrate 300 is provided with the trace 900, the trace 900 connects the first filter 100 and the second filter 200, and the function of the trace 900 in the module of the present invention includes two aspects, on one hand, the electrical connection of the filters in different spaces is realized through the trace 900; on the other hand, the matching circuit is connected between the filters through the trace 900, and the matching circuit is electrically connected with the first filter 100 and the second filter 200 through the trace 900, so that the filters achieve the best performance, where the filter connection matching circuit is a conventional means of those skilled in the circuit field, here, as a simple example, the filter may cause impedance change of the filter port when being attached to the substrate 300 (originally, 50 ohms, impedance change may be caused when being attached to the substrate 300), the matching circuit may restore the impedance of the filter port to the original impedance value, the impedance of each filter port is consistent, so that the reflection phenomenon does not occur when the signal is transmitted, and the performance of the filter achieves the best performance.
Example two
With reference to fig. 1, fig. 2, and fig. 3, a second embodiment is further described on the basis of the first embodiment.
The first filter 100 is a surface acoustic wave filter, the surface acoustic wave filter is connected with solder balls 210, the solder balls 210 connect the surface acoustic wave filter with the substrate 300, the surface acoustic wave filter is further provided with a film 110, the film 110 is located on the inner side of the solder balls 210, the film 110 encloses the surface of the surface acoustic wave filter opposite to the substrate 300 to form a cavity 120, and the cavity 120 is used for providing a transmission path for the sound waves of the surface acoustic wave filter. The surface acoustic wave filter is provided with an interdigital transducer 130 on a surface facing the cavity 120 and facing the substrate 300, and the interdigital transducer 130 is used for converting an electric signal and an acoustic wave to each other. The transducer comprises an input end transducer and an output end transducer, wherein the input end transducer converts an electric signal into sound energy and emits surface acoustic waves, and the output end transducer converts the sound energy of the received surface acoustic waves into an electric signal and outputs the electric signal.
Specifically, the second filter 200 is connected to the substrate 300 through solder balls 210. In this embodiment, the second filter 200 is a bulk acoustic wave filter, an inner cavity 220 is formed in the bulk acoustic wave filter, and the inner cavity 220 is used for providing a path for acoustic wave propagation in the bulk acoustic wave filter.
In addition, the present embodiment further includes a third filter 230, and the molding compound 500 provides a third space 710 different from the first space 600 and the second space 700 for the third filter 230, in the same manner and structure as the first space 600 and the second space 700 are formed. The third filter 230 is any one of a bulk acoustic wave filter and an integrated passive device filter. In particular, there is no particular requirement on the type of filter, and the selection of the filter is only limited in the present invention to illustrate the implementation of different filters in the present invention.
In this embodiment, the third filter 230 is an integrated passive device filter, and the solder balls 210 are mounted on the substrate 300. The barrier layer between the third space 710 and the second space 700 and the upper surface and the outer surface (the surface layer exposed to the air) of the third space 710 are coated with the metallic paint 800 to form a shielding layer, so as to prevent the integrated passive device filter from interfering with the first filter 100 and the second filter 200, and prevent the integrated passive device filter from interfering with external devices.
EXAMPLE III
As shown in fig. 5, the present invention further provides a filter system-in-package method for packaging the filter system-in-package module according to the first embodiment, where the packaging method includes the following steps:
a filter preparation step: selecting a corresponding filter and preprocessing the filter according to the design requirement of the filter system-level hybrid packaging module;
a filter mounting step: mounting the pretreated filter on a substrate 300;
and (3) a molding step: placing the substrate 300 and the filter (attached to the substrate) in a molding die cavity, heating the molding plastic 500 to melt the molding plastic 500, filling the molding die cavity with the molding plastic under the action of pressure, and cooling and curing; the molding step is temporally intermediate after the filter mounting step;
a zoning shielding step: the molding compound 500 is penetrated by laser to expose the grounding copper foil on the substrate 300, the molding compounds 500 coating different filters are separated from each other, and the surface of the molding compound 500 is coated with the metallic paint 800 for separating the filters to avoid the mutual interference of the filters.
Preferably, in the filter preparation step, the pretreatment includes mounting the solder balls 210 on the surface of the filter opposite to the substrate 300, in the filter mounting step, the solder paste is coated on the pads 400 of the substrate 300, the pretreated filter is mounted on the pads 400 of the substrate 300 processed in the preparation step of the substrate 300, and the solder balls 210 and the pads 400 of the filter are soldered by reflow soldering.
Preferably, in the filter preparation step, the preprocessing further includes:
a bare chip preparation step: the three filter wafer raw materials of SAW, BAW and IPD are ground to a proper thickness, then the solder balls 210 are pasted at the bottom of a bare chip, and finally each wafer is cut into a single bare chip.
SAW cavity manufacturing: a film 110 (a photo-etching film 110) is attached to the SAW package region of the substrate 300, and a cavity is formed for propagation of surface acoustic waves by the film 110 leaving a useful region using an exposure and development technique.
Manufacturing a BAW inner cavity: the BAW internal cavity is designed by a chip designer through simulation, and an internal cavity structure can be formed in the BAW when a Foundry processes according to given chip data;
through the packaging mode of the embodiment, various filters can cooperatively work in a module without problems (for example, the SAW cavity implementation mode provided by the invention can ensure normal operation of SAW, and the partitioned shielding mode can avoid mutual interference between each filter and an external device), the filter packaging integration of different technologies can more fully exert the advantages of various filters (SAW, BAW and IPD filters have application advantages in low-frequency band, medium-high frequency band and wide band respectively, and the module based on the mixed packaging of various filters can be applied to different frequency band types such as low-frequency band, medium-high frequency band, narrow band and wide band), the performance is better, the flexibility is higher, and the application prospect is wider.
Preferably, in the filter system-in-package method of the present invention, the required product identifier may be printed on the package module by printing (e.g., laser printing) on the upper surface of the module, so as to improve the recognition degree of the product.
The method can also comprise the following steps of cutting, testing and shipping: the module product printed with the product identification is cut into single modules, the performance test is completed in the test fixture, and the product is delivered after the quality detection, so that the performance stability of the product is improved.
Modification example 1
As shown in fig. 3, the present embodiment is different from the second embodiment in that the second filter 200 is a surface acoustic wave filter. Accordingly, the packaging process of connecting the trace 900 of the second filter 200 and the second filter 200 is adjusted accordingly.
Modification example two
As shown in fig. 4 (bottom view of BGA package form when three filters of SAW, BAW and IPD are packaged in hybrid form), the difference between this embodiment and the second embodiment is that BGA is adopted as package form of filter, and the solder ball size of BGA is smaller than that of LGA pad, so that the package method is suitable for application with many pins of filter module.
In the present invention, TOP, bottom and SIDE views of the dimension diagrams of the filter module are shown in TOP, bottom and SIDE views, respectively.
The above-mentioned embodiments only express a certain implementation mode of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention; it should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which are within the protection scope of the present invention; therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A filter system-in-package module, the module comprising:
a first filter that filters a received signal in a first frequency band;
a second filter that filters the received signal at a second frequency band different from the first frequency band;
the filter comprises a substrate, wherein a bonding pad is arranged on one side of the substrate, a molding compound is arranged on the other side of the substrate, the film plastic provides a first space for the first filter, and the molding compound provides a second space different from the first space for the second filter;
the surface of the molding compound is coated with a metal coating, and the first space and the second space are separated by the metal coating;
the substrate is provided with a wire, and the wire is connected with the first filter and the second filter.
2. The filter system-in-package module according to claim 1, wherein the trace is connected to a matching circuit, and the matching circuit is electrically connected to the first filter and the second filter through the trace.
3. The filter system-in-hybrid package module of claim 1, wherein the first filter is any one of a surface acoustic wave filter, a bulk acoustic wave filter, and an integrated passive device filter.
4. The filter system-in-package module of claim 3, wherein the first filter is a surface acoustic wave filter, a solder ball is connected to the first filter, the solder ball connects the first filter and the substrate, the first filter is further provided with a film, the film is located inside the solder ball, and the film encloses the opposite surfaces of the first filter and the substrate to form a cavity.
5. The filter system-in-package module according to claim 4, wherein the cavity is configured to provide a propagation path for the sound wave of the first filter.
6. The filter system-in-package module according to claim 5, wherein a surface of the first filter facing the cavity and opposite to the substrate is formed with an interdigital transducer for mutual conversion of electrical signals and acoustic waves.
7. The filter system-in-hybrid package module of claim 4, wherein the second filter is connected to the substrate through the solder balls.
8. The filter system-in-package module according to claim 7, wherein the second filter is a bulk acoustic wave filter, and an inner cavity is formed in the second filter and is used for providing a path for bulk acoustic wave propagation in the second filter.
9. A filter system-in-hybrid package for packaging the filter system-in-hybrid package module of claim 6 or 8, wherein the packaging method comprises the following steps:
a substrate preparation step: welding a welding pad at the bottom of the substrate, wherein the substrate is provided with a wire for connecting each filter;
a filter preparation step: selecting a corresponding filter and preprocessing the filter according to the design requirement of the filter system-level hybrid packaging module;
a filter mounting step: mounting the pretreated filter on the substrate;
and (3) a molding step: placing the substrate and the filter in a molding die cavity, heating a molding compound to melt the molding compound, filling the molding compound into the molding die cavity under the action of pressure, and cooling and curing; the molding step is temporally intermediate after the filter mounting step;
a zoning shielding step: and laser is used for penetrating the molding compound to expose the grounding copper foil on the substrate, the molding compounds coating different filters are separated from each other, and the surface of the molding compound is coated with metal paint for separating the filters and avoiding the mutual interference of the filters.
10. The filter system-in-package system of claim 9, wherein the pre-processing step comprises attaching the solder balls to the surface of the substrate opposite to the filter, and the attaching step comprises coating solder paste on the pads of the substrate, attaching the pre-processed filter to the pads of the substrate, and soldering the solder balls of the filter to the pads by reflow soldering.
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| CN202110468684.8A CN114337587A (en) | 2021-04-28 | 2021-04-28 | Filter system-level hybrid packaging module and packaging mode |
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| CN202110468684.8A CN114337587A (en) | 2021-04-28 | 2021-04-28 | Filter system-level hybrid packaging module and packaging mode |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114884483A (en) * | 2022-05-09 | 2022-08-09 | 上海芯波电子科技有限公司 | SAW and BAW mixed laminated filter chip and manufacturing process thereof |
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2021
- 2021-04-28 CN CN202110468684.8A patent/CN114337587A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114884483A (en) * | 2022-05-09 | 2022-08-09 | 上海芯波电子科技有限公司 | SAW and BAW mixed laminated filter chip and manufacturing process thereof |
| CN114884483B (en) * | 2022-05-09 | 2024-01-30 | 上海芯波电子科技有限公司 | Mixed laminated filter chip of SAW and BAW and manufacturing process thereof |
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