CN214675097U - Filter system-in-package module - Google Patents
Filter system-in-package module Download PDFInfo
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- CN214675097U CN214675097U CN202120908466.7U CN202120908466U CN214675097U CN 214675097 U CN214675097 U CN 214675097U CN 202120908466 U CN202120908466 U CN 202120908466U CN 214675097 U CN214675097 U CN 214675097U
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Abstract
The utility model belongs to the technical field of wave filter field and system level packaging, the utility model provides a wave filter system level mixes encapsulation module, it is big to have solved the integrated encapsulation degree of difficulty of different technical wave filters, and the wave filter of different grade type is in the problem of system level packaging module collaborative work mutual interference. The utility model provides a mixed encapsulation module of wave filter system level, the module includes: a first filter for filtering the received signal in a first frequency band; a second filter for filtering the received signal in a second frequency band different from the first frequency band; the filter comprises a substrate, wherein a bonding pad is arranged on one side of the substrate, a molding compound is arranged on the other side of the substrate, the film plastic provides a first space for a first filter, and the molding compound provides a second space different from the first space for a second filter; the molding compound is coated with metal paint on the surface, and the first space and the second space are separated by the metal paint; the substrate is provided with a wire which is connected with the first filter and the second filter.
Description
Technical Field
The utility model belongs to the technical field of wave filter field and system level packaging, be a wave filter system level mixes encapsulation module particularly.
Background
A common filter design is designed based on one of SAW (surface acoustic wave filter), BAW (bulk acoustic wave filter) or IPD (integrated passive device filter) technologies, and a common system-in-package filter module is also an integration of a plurality of filters of the same technology.
The three filters have different advantages, the SAW filter has stable performance and wide frequency band, is mainstream application below 1.6GHz, but has the problems of large insertion loss, serious heating of high-frequency signals and the like, so the applicability is poor when the high-frequency signals above 1.6GHz are processed; the BAW filter is low in insertion loss and insensitive to temperature change, and is commonly used for processing high-frequency signals above 2 GHz; the IPD filter can be used for medium-low and high frequency bands, has low insertion loss and wider bandwidth, but has the defects of low Q value (quality factor) and poor out-of-band rejection.
The three filters are made of different materials, the SAW filter is made based on lithium tantalate (LiTaO 3) or lithium niobate (LiNbO 3), the BAW filter is made based on aluminum nitride (AlN) or zinc oxide (ZnO), and the IPD filter is made based on high-resistance silicon (HR-Si); the three filters have different working conditions, the SAW filter needs to form a cavity structure in a package to ensure the transmission of surface acoustic waves, the BAW filter designs a cavity in a bare chip to ensure the transmission of bulk acoustic waves, the IPD filter does not relate to an acoustic wave technology, and the requirement on the package is not high. And the three filters will interfere with each other when working, and have a large influence on the performance. For these reasons, the filter design is based on one of SAW, BAW and IPD, and the multiple filters in the system-in-package filter module are based on the same technology, but this approach is difficult to fully take the advantages of various types of filters.
SUMMERY OF THE UTILITY MODEL
In order to overcome exist not enough among the prior art, the utility model provides a wave filter system level mixes encapsulation module, it is big to have solved the integrated encapsulation degree of difficulty of different technology wave filters, and the wave filter of different grade type is in the problem of system level encapsulation module collaborative work mutual interference.
The utility model provides a mixed encapsulation module of wave filter system level, the module includes:
a first filter that filters a received signal in a first frequency band;
a second filter that filters the received signal at a second frequency band different from the first frequency band;
the filter comprises a substrate, wherein a bonding pad is arranged on one side of the substrate, a molding compound is arranged on the other side of the substrate, the film plastic provides a first space for the first filter, and the molding compound provides a second space different from the first space for the second filter;
the surface of the molding compound is coated with a metal coating, and the first space and the second space are separated by the metal coating;
the substrate is provided with a wire, and the wire is connected with the first filter and the second filter.
The utility model discloses a technical scheme further sets up to, it is connected with matching circuit to walk the line, matching circuit passes through walk the line with first wave filter with the second wave filter electricity is connected.
The utility model discloses a technical scheme further sets up to, first wave filter is any one kind in surface acoustic wave filter, bulk acoustic wave filter, the integrated passive device wave filter.
The utility model discloses a technical scheme further sets up to, first wave filter is the surface acoustic wave filter, first wave filter is connected with the tin ball, the tin ball will first wave filter with the base plate is connected, first wave filter still is provided with the membrane, the membrane is located the tin ball is inboard, the membrane will first wave filter with the face that the base plate is relative encloses and closes vacuole formation.
The utility model discloses a technical scheme, further set up to, the cavity is used for doing the sound wave of first wave filter provides the propagation path.
The utility model discloses a technical scheme further sets up to, first wave filter orientation the cavity and with the one side of base plate opposition is formed with the interdigital transducer, the interdigital transducer is used for realizing the interconversion of signal of telecommunication and sound wave.
The utility model discloses a technical scheme further sets up to, the second wave filter passes through the tin ball with the base plate is connected.
The utility model discloses a technical scheme further sets up to, the second wave filter is the bulk acoustic wave filter, be formed with the inner chamber in the second wave filter, the inner chamber be used for doing bulk acoustic wave propagation in the second wave filter provides the route.
The beneficial effects of the utility model are that at least:
(1) through the utility model discloses a package, first wave filter and second wave filter subsides are adorned after the opposite side of base plate, and the membrane plastic solidifies through heating melting, cooling, with first wave filter and second wave filter cladding within the moulding compound of solidification, because base plate and moulding compound are the solid state material of closed (here closed perforation influence that indicates to walk the line is very little, neglects) first wave filter and second wave filter separate, each other do not influence.
(2) By coating metal paint on different space surfaces (the surfaces in the figure refer to the upper surface of the molding compound in the figure 1, and also include gaps among different spaces, namely the interlayers of the molding compound), the molding compound in each space is closed by the metal paint and the upper surface of the substrate to form partition shielding, so that the problem of mutual interference of different filters is avoided, in addition, the mutual interference of the filters and external devices is isolated, and an excellent electromagnetic interference shielding effect is achieved.
(3) Through the packaging mode of this embodiment, various types of wave filter can collaborative work in the module and can not the problem (for example the utility model provides a SAW cavity implementation can ensure SAW normal work, partition shielding mode can avoid between each wave filter, mutual interference between each wave filter and the external device), the wave filter encapsulation integration of different techniques compares in the wave filter of single technique more can full play the advantage of various types of wave filter (SAW, BAW, IPD wave filter respectively at the low band, respectively have application advantage in well high frequency range and broadband, the module based on mixed encapsulation of various types of wave filter then can be applied to different frequency channel types such as low-high, narrowband, broadband), the performance is more excellent, the flexibility is higher, application prospect is also more wide.
Drawings
Fig. 1 is a schematic diagram of the internal package structure of the system-in-package filter module based on SAW, BAW and IPD of the present invention;
fig. 2 is a diagram of the overall dimensions of the system-in-package filter module based on SAW, BAW and IPD of the present invention;
fig. 3 is a schematic diagram of the internal package structure of the system-in-package filter module based on SAW and IPD according to the present invention;
fig. 4 is a diagram of the external dimensions of the BGA package of the system-in-package filter module of the present invention.
Description of reference numerals:
100. a first filter; 110. a film; 120. a cavity; 130. an interdigital transducer; 200. a second filter; 210. tin balls; 220. an inner cavity; 230. a third filter; 300. a substrate; 400. a pad; 500. molding a plastic material; 600. a first space; 700. a second space; 710. a third space; 800. a metal coating; 900. and (6) routing.
Detailed Description
In order to facilitate understanding of the invention, the invention will be described more fully hereinafter with reference to the accompanying drawings, in which several embodiments of the invention are shown, but which can be embodied in many different forms and are not limited to the embodiments described herein, but which are provided so as to render the disclosure of the invention more thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention; as used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Example one
The utility model provides a filter system level mixes encapsulation module, the module includes: a first filter 100 and a second filter 200. The first filter 100 filters the received signal in a first frequency band; the second filter 200 filters the received signal in a second frequency band different from the first frequency band. The first frequency band is different from the second frequency band, which means that the first frequency band and the second frequency band are completely different, and the first frequency band and the second frequency band may be different from each other, and the first frequency band and the second frequency band overlap each other in frequency band, considering that the frequency bands suitable for the first filter 100 and the second filter 200 overlap each other.
The first filter 100 and the second filter 200 are of different filter types. The filter is any one of a surface acoustic wave filter, a bulk acoustic wave filter and an integrated passive device filter. Since the first filter 100 and the second filter 200 use different types of filters, the frequency bands of the signals received by the first filter 100 and the second filter 200 are all different, and the signals of the corresponding frequency bands are filtered respectively.
The utility model discloses a module still includes base plate 300, and base plate 300 one side is provided with pad 400, and base plate 300 opposite side is provided with molding compound 500. After the first filter 100 and the second filter 200 are attached to the other side of the substrate 300, the molding compound 500 is heated, melted, cooled and solidified, and the first filter 100 and the second filter 200 are encapsulated in the solidified molding compound 500, because the substrate 300 and the molding compound 500 are both closed (where closed means that the through hole of the trace 900 has little influence and is ignored) solid substances, the first filter 100 and the second filter 200 are separated from each other and do not influence each other. The cured molding compound 500 provides a first space 600 for the first filter 100 and a second space 700 different from the first space 600 for the second filter 200, where the first space 600 is different from the second space 700 means that the two are separated from each other in three dimensions and are different from each other.
Since the first filter 100 is disposed in the first space 600, the second filter 200 is disposed in the second space 700, the molding compound 500 is disposed on the other side of the substrate 300, the surface of the molding compound 500 is coated with the metal coating 800, the first space 600 and the second space 700 are separated by the metal coating 800, the metal coating 800 is coated on the surfaces of different spaces accommodating different filters (the surfaces herein not only refer to the upper surface of the molding compound 500 in fig. 1, but also include gaps between different spaces, i.e., interlayer of the molding compound 500), and the molding compound 500 in each space is closed by the metal coating 800 and the upper surface of the substrate 300 to form a partition shield, thereby avoiding the problem of mutual interference between different filters. After the molding compound 500 is cured and molded on the other side of the filter, the module is welded on the element to be welded through the bonding pad 400, the periphery of the filter is communicated with the whole circuit system, various interference electric field magnetic fields exist among other elements in the circuit system, and as the metal coating 800 is coated on the surface of the molding compound 500 for accommodating the filter, each filter cannot be influenced by other elements in the circuit, and the filtering effect is stable.
The substrate 300 is provided with the trace 900, the trace 900 connects the first filter 100 and the second filter 200, the function of the trace 900 in the module of the present invention includes two aspects, on one hand, the electrical connection of the filters in different spaces is realized through the trace 900; on the other hand, the matching circuit is connected between the filters through the trace 900, and the matching circuit is electrically connected with the first filter 100 and the second filter 200 through the trace 900, so that the filters achieve the best performance, where the filter connection matching circuit is a conventional means of those skilled in the circuit field, here, as a simple example, the filter may cause impedance change of the filter port when being attached to the substrate 300 (originally, 50 ohms, impedance change may be caused when being attached to the substrate 300), the matching circuit may restore the impedance of the filter port to the original impedance value, the impedance of each filter port is consistent, so that the reflection phenomenon does not occur when the signal is transmitted, and the performance of the filter achieves the best performance.
Example two
With reference to fig. 1, fig. 2, and fig. 3, a second embodiment is further described on the basis of the first embodiment.
The first filter 100 is a surface acoustic wave filter, the surface acoustic wave filter is connected with solder balls 210, the solder balls 210 connect the surface acoustic wave filter with the substrate 300, the surface acoustic wave filter is further provided with a film 110, the film 110 is located on the inner side of the solder balls 210, the film 110 encloses the surface of the surface acoustic wave filter opposite to the substrate 300 to form a cavity 120, and the cavity 120 is used for providing a transmission path for the sound waves of the surface acoustic wave filter. The surface acoustic wave filter is provided with an interdigital transducer 130 on a surface facing the cavity 120 and facing the substrate 300, and the interdigital transducer 130 is used for converting an electric signal and an acoustic wave to each other. The transducer comprises an input end transducer and an output end transducer, wherein the input end transducer converts an electric signal into sound energy and emits surface acoustic waves, and the output end transducer converts the sound energy of the received surface acoustic waves into an electric signal and outputs the electric signal.
Specifically, the second filter 200 is connected to the substrate 300 through solder balls 210. In this embodiment, the second filter 200 is a bulk acoustic wave filter, an inner cavity 220 is formed in the bulk acoustic wave filter, and the inner cavity 220 is used for providing a path for acoustic wave propagation in the bulk acoustic wave filter.
In addition, the present embodiment further includes a third filter 230, and the molding compound 500 provides a third space 710 different from the first space 600 and the second space 700 for the third filter 230, in the same manner and structure as the first space 600 and the second space 700 are formed. The third filter 230 is any one of a bulk acoustic wave filter and an integrated passive device filter. In particular, there is no particular requirement on the type of filter, and the invention is only limited to the type of filter described in the embodiments of the present invention.
In this embodiment, the third filter 230 is an integrated passive device filter, and the solder balls 210 are mounted on the substrate 300. The barrier layer between the third space 710 and the second space 700 and the upper surface and the outer surface (the surface layer exposed to the air) of the third space 710 are coated with the metallic paint 800 to form a shielding layer, so as to prevent the integrated passive device filter from interfering with the first filter 100 and the second filter 200, and prevent the integrated passive device filter from interfering with external devices.
Through the encapsulation of this embodiment, various types of wave filter can collaborative work in the module and can not the problem (for example the utility model provides a SAW cavity implementation can ensure SAW normal work, district shielding mode can avoid each wave filter, mutual interference between each wave filter and the external device), the wave filter encapsulation integration of different techniques compares in the wave filter of single technique more can full play the advantage of various types of wave filter (SAW, BAW, IPD wave filter has the application advantage respectively on low band, well high frequency range and broadband, the module based on the mixed encapsulation of various types of wave filter then can be applied to different frequency channel types such as low or high, narrowband, broadband), the performance is more excellent, the flexibility is higher, application prospect is also more wide.
Modification example 1
As shown in fig. 3, the present embodiment is different from the second embodiment in that the second filter 200 is a surface acoustic wave filter. Accordingly, the packaging process of connecting the trace 900 of the second filter 200 and the second filter 200 is adjusted accordingly.
Modification example two
As shown in fig. 4 (bottom view of BGA package form when three filters of SAW, BAW and IPD are packaged in hybrid form), the difference between this embodiment and the second embodiment is that BGA is adopted as package form of filter, and the solder ball size of BGA is smaller than that of LGA pad, so that the package method is suitable for application with many pins of filter module.
In the present invention, TOP, bottom and SIDE views of the contour dimension diagram of the filter module are respectively shown in TOP, bottom and SIDE views of the drawing.
The above-mentioned embodiments only express a certain implementation manner of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention; it should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the protection scope of the present invention; therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (8)
1. A filter system-in-package module, the module comprising:
a first filter that filters a received signal in a first frequency band;
a second filter that filters the received signal at a second frequency band different from the first frequency band;
the filter comprises a substrate, wherein a bonding pad is arranged on one side of the substrate, a molding compound is arranged on the other side of the substrate, the film plastic provides a first space for the first filter, and the molding compound provides a second space different from the first space for the second filter;
the surface of the molding compound is coated with a metal coating, and the first space and the second space are separated by the metal coating;
the substrate is provided with a wire, and the wire is connected with the first filter and the second filter.
2. The filter system-in-package module according to claim 1, wherein the trace is connected to a matching circuit, and the matching circuit is electrically connected to the first filter and the second filter through the trace.
3. The filter system-in-hybrid package module of claim 1, wherein the first filter is any one of a surface acoustic wave filter, a bulk acoustic wave filter, and an integrated passive device filter.
4. The filter system-in-package module of claim 3, wherein the first filter is a surface acoustic wave filter, a solder ball is connected to the first filter, the solder ball connects the first filter and the substrate, the first filter is further provided with a film, the film is located inside the solder ball, and the film encloses the opposite surfaces of the first filter and the substrate to form a cavity.
5. The filter system-in-package module according to claim 4, wherein the cavity is configured to provide a propagation path for the sound wave of the first filter.
6. The filter system-in-package module according to claim 5, wherein a surface of the first filter facing the cavity and opposite to the substrate is formed with an interdigital transducer for mutual conversion of electrical signals and acoustic waves.
7. The filter system-in-hybrid package module of claim 4, wherein the second filter is connected to the substrate through the solder balls.
8. The filter system-in-package module according to claim 7, wherein the second filter is a bulk acoustic wave filter, and an inner cavity is formed in the second filter and is used for providing a path for bulk acoustic wave propagation in the second filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120908466.7U CN214675097U (en) | 2021-04-28 | 2021-04-28 | Filter system-in-package module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120908466.7U CN214675097U (en) | 2021-04-28 | 2021-04-28 | Filter system-in-package module |
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| Publication Number | Publication Date |
|---|---|
| CN214675097U true CN214675097U (en) | 2021-11-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120908466.7U Active CN214675097U (en) | 2021-04-28 | 2021-04-28 | Filter system-in-package module |
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| CN (1) | CN214675097U (en) |
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- 2021-04-28 CN CN202120908466.7U patent/CN214675097U/en active Active
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