CN113346865A - Wafer-level hybrid packaging module and method based on SAW and IPD - Google Patents
Wafer-level hybrid packaging module and method based on SAW and IPD Download PDFInfo
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- CN113346865A CN113346865A CN202110643619.4A CN202110643619A CN113346865A CN 113346865 A CN113346865 A CN 113346865A CN 202110643619 A CN202110643619 A CN 202110643619A CN 113346865 A CN113346865 A CN 113346865A
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
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Abstract
The invention provides a wafer level hybrid packaging module and a wafer level hybrid packaging method based on SAW and IPD. The module includes: a first filter for filtering the received signal in a first frequency band; a second filter for filtering the received signal in a second frequency band different from the first frequency band; the filter comprises an organic component and a molding compound, wherein the filter is arranged in the molding compound, the molding compound provides a first space for the first filter, and the molding compound provides a second space different from the first space for the second filter; the molding compound is connected with the organic component, and the signal bonding pad of the filter penetrates through the organic component to form an external pin outwards.
Description
Technical Field
The invention belongs to the field of hybrid packaging, and particularly relates to a wafer-level hybrid packaging module and a wafer-level hybrid packaging method based on SAW and IPD.
Background
With the rapid development of 5G communication technology, the requirements for integration and flexibility of the package are higher and higher. This phenomenon is particularly apparent on mobile phones. With the popularization of 5G technology, 5G mobile phone and electronic product manufacturers need to place more antennas in the compact space. It is well known that miniaturization and portability are the trends in almost all current mobile phones and electronic products. Then, the advent of the 5G era has brought about a further problem in that the space is originally compact.
The common filter design is designed based on one of SAW (surface acoustic wave filter) or IPD (integrated passive device filter) technology, and the common system-in-package filter module is also an integration of a plurality of filters of the same technology. Because the traditional SAW and IPD are products which are packaged separately and respectively have SAW chips and IPD chips, the occupied space is large, the space utilization rate is low, and the packaging period is long.
The filters have different advantages, the SAW filter has stable performance and wide frequency band, is the mainstream application below 1.6GHz, but has the problems of large insertion loss, serious heating of high-frequency signals and the like, so the applicability is poor when the high-frequency signals above 1.6GHz are processed; the IPD filter can be used for medium-low and high frequency bands, has low insertion loss and wider bandwidth, but has the defects of low Q value (quality factor) and poor out-of-band rejection.
The materials of the filters are different, the SAW filter is manufactured based on lithium tantalate (LiTaO 3) or lithium niobate (LiNbO 3), the BAW filter is manufactured based on aluminum nitride (AlN) or zinc oxide (ZnO), and the IPD filter is manufactured based on high-resistance silicon (HR-Si); the filters need different working conditions, the SAW filter needs to form a cavity structure in the package to ensure the propagation of the surface acoustic wave, and the IPD filter does not relate to the acoustic wave technology and has low requirements on the package. And the filters will interfere with each other when working, and the performance is greatly influenced. For these reasons, the filter design is based on one of SAW and IPD technology, and the multiple filters in the system-in-package filter module are based on the same technology, but this approach is difficult to fully take the advantages of various types of filters.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a wafer level hybrid packaging module and a wafer level hybrid packaging method based on SAW and IPD.
One technical scheme of the invention provides a wafer level hybrid packaging module based on SAW and IPD, which comprises:
a first filter that filters a received signal in a first frequency band;
a second filter that filters the received signal at a second frequency band different from the first frequency band;
the filter comprises an organic component and a molding compound, wherein the filter is arranged in the molding compound, the film plastic provides a first space for the first filter, and the molding compound provides a second space different from the first space for the second filter;
the molding compound is connected with the organic component, and the signal bonding pad of the filter penetrates through the organic component and is outwards formed with an external pin.
Preferably, the first filter is a surface acoustic wave filter, a closed cavity is formed between the first filter and the organic component, and the cavity is between the signal pads of the first filter.
Preferably, the cross section of the cavity is rectangular, and the length-width ratio of the rectangle is between 5:4 and 4: 3.
Preferably, the ratio of the height of the signal pads of the first filter to the height of the molding compound is between 1:5 and 1: 4.
Preferably, the second filter is an integrated passive device filter, the second filter is connected to the organic component through a signal pad, and the signal pad penetrates through the organic component and is formed with an external pin.
Another technical solution of the present invention provides a wafer level hybrid packaging method based on SAW and IPD, including the steps of:
a substrate carrier plate preparation step: taking an artificial wafer as a substrate carrier plate, and manufacturing a cavity on the substrate carrier plate by adopting a photoetching process;
a filter mounting step: attaching a first filter to the cavity region and attaching a second filter to a region other than the cavity region;
and (3) a molding step: enclosing a molding die cavity and the substrate carrier plate, wherein the filter is positioned in the enclosed space, filling molding plastic into the space, heating the molding plastic to melt the molding plastic, filling the molding plastic into the molding die cavity under the action of pressure, and cooling and curing;
removing the loading plate: removing the substrate carrier plate part processed by the molding step to expose the surface of the signal bonding pad of the filter;
redistribution and bump process steps: and the other side of the substrate carrier plate, which is far away from the filter, is connected with an organic assembly, the substrate carrier plate processed by the step of unloading is subjected to redistribution and bump processes, and the signal bonding pad is led out of the outer side of the organic assembly to form an external pin.
The invention has the beneficial effects that:
(1) according to the invention, different filters (different frequency bands for filtering signals are different) are arranged in different spaces of the molding compound, the different filters are not interfered with each other and respectively filter corresponding signals, since the signal bonding pad of the filter penetrates through the organic component to form an external pin outwards, the external pin is connected with external equipment, the module enters a working state, the different filters are packaged in the same module to form a multiplexer shared by multiple frequency band antennas, so that the number of the antennas is reduced, the filtering effect is realized, the space is saved, the space utilization rate is improved, and the packaging mode is more flexible.
(2) Because of the filtering characteristic of the surface acoustic wave filter, a cavity is required to be arranged between the filter and the substrate carrier plate, the requirement that sound waves are transmitted in the cavity is met, the molding compound is combined with the surface acoustic wave filter, the module is subjected to adaptive structural change (the cavity is manufactured on the substrate carrier plate by adopting a photoetching process), and the requirement that the cavity is formed between the surface acoustic wave filter and an organic component to achieve smooth filtering is met.
Drawings
FIG. 1 is a side view of the wafer level hybrid package module based on SAW and IPD of the present invention;
FIG. 2 is a side view of a SAW and IPD based wafer level hybrid package module in accordance with a variation of the present invention;
FIG. 3 is a flowchart of a SAW and IPD based wafer level hybrid packaging method according to the present invention.
Description of reference numerals:
1-molding a mold cavity; 2-a first filter; 3-a second filter; 4-signal pads; 5-a cavity; 6-a molding compound; 7-external pins; 8-organic component.
Detailed Description
In order to facilitate an understanding of the invention, the invention will now be described more fully hereinafter with reference to the accompanying drawings, in which several embodiments of the invention are shown, but which may be embodied in many different forms and are not limited to the embodiments described herein, but rather are provided for the purpose of providing a more thorough disclosure of the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention; as used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Examples
As shown in fig. 1, the present invention provides a wafer level hybrid package module based on SAW and IPD, the module includes: a first filter 2, the first filter 2 filtering the received signal in a first frequency band; a second filter 3, the second filter 3 filtering the received signal in a second frequency band different from the first frequency band; the filter comprises an organic component 8 and a molding compound 6, wherein the filter is arranged in the molding compound 6, the molding compound provides a first space for the first filter 2, and the molding compound 6 provides a second space different from the first space for the second filter 3; the molding compound 6 is connected to the organic member 8, and the signal pad 4 of the filter is formed with an external pin 7 through the organic member 8. Different filters are arranged in different spaces of the molding compound 6 (different frequencies of filtering signals refer to different frequencies), the different filters do not interfere with each other and respectively filter corresponding signals, the signal bonding pad 4 of the filter penetrates through the organic component 8 to form the external pin 7 outwards, the external pin 7 is connected with external equipment, the module enters a working state, the different filters are packaged in the same module to form a multiplexer shared by multiple frequency band antennas, the number of the antennas is reduced, the filtering effect is achieved, the space is saved, the space utilization rate is improved, and the packaging mode is more flexible.
Preferably, the first filter 2 is a surface acoustic wave filter, and a closed cavity 5 is formed between the first filter 2 and the organic component 8, and the cavity 5 is interposed between the plurality of signal pads 4 of the first filter 2. Because of the filtering characteristic of the surface acoustic wave filter, a cavity 5 is required between the filter and the substrate carrier plate, the requirement that sound waves are transmitted in the cavity 5 is met, the molding compound 6 is combined with the surface acoustic wave filter, the module is subjected to adaptive structural change (the cavity 5 is manufactured on the substrate carrier plate by adopting a photoetching process), and the requirement that the filtering can be smoothly carried out only when the cavity 5 is formed between the surface acoustic wave filter and the organic component 8 is met.
Preferably, the cavity 5 is rectangular in cross-section, and the length-to-width ratio of the rectangle is between 5:4 and 4: 3. The acoustic surface wave propagation efficiency of the cavity 5 set in the range is higher, and further, the module has a better filtering effect.
Preferably, the ratio of the height of the signal pads 4 of the first filter 2 to the height of the molding compound 6 is between 1:5 and 1: 4. The height of the cavity 5 can be deduced from the signal pad 4 arranged at the height, the height of the signal pad 4 is equal to that of the cavity 5, the surface acoustic wave has better propagation efficiency due to the structure of the cavity 5 with the height, and further, the module has better filtering effect.
Preferably, the second filter 3 is an integrated passive device filter, the second filter 3 is connected with the organic component 8 through the signal pad 4, and the signal pad 4 is formed with an external pin 7 through the organic component 8. The signal pad 4 penetrates through the organic component 8 to form an external pin 7, and the external pin 7 is connected with an external device, so that the module enters a filtering working state.
As shown in fig. 3, the present invention further provides a packaging method corresponding to the aforementioned packaging module, the packaging method includes the following steps:
a substrate carrier plate preparation step: taking an artificial wafer as a substrate carrier plate, and manufacturing a cavity 5 on the substrate carrier plate by adopting a photoetching process;
a filter mounting step: the first filter 2 is pasted on the area of the cavity 5, and the second filter 3 is pasted on the other area different from the area of the cavity 5;
and (3) a molding step: enclosing a molding die cavity 1 and a substrate carrier plate, filling molding plastic 6 into the enclosed space when a filter is positioned in the enclosed space, heating the molding plastic 6 to melt the molding plastic 6, filling the molding plastic 6 into the molding die cavity 1 under the action of pressure, and cooling and curing;
removing the loading plate: removing part of the substrate carrier plate processed by the molding step to expose the surface of the signal bonding pad 4 of the filter;
redistribution and bump process steps: the other side of the substrate carrier plate, which is far away from the filter, is connected with an organic component 8, the substrate carrier plate after the step of unloading is subjected to redistribution and bump technology, and the signal bonding pad 4 is led out of the outer side of the organic component 8 to form an external pin 7.
The module packaged by the steps can be directly used for wafer level performance test, a single filter test is not needed, and the performance test efficiency is greatly shortened.
The invention not only seals the SAW filter and the IPD filter together, but also uses the wafer level packaging technology. On the basis of the technology of sealing various filters, the packaging process is simplified, the processing period is shortened, and the testing efficiency is improved.
Modification example
As shown in fig. 2, the module packaging process of the modified example is basically the same as that described above, except that the modified example is three filter packages, the external pins are replaced with bottom-mounted balls from pads, and the final package form is BGA.
In the invention, a plurality of filter packages can be selected according to the limitation of package size, and the package form is BGA and the like. The packaging form is diversified, and different packaging forms can be selected according to the final application environment of the product. If the packaging method is applied to miniaturization and the board level space is relatively tight, the packaging form of the LGA can be used; if product solderability is to be provided, the BGA package format may be selected.
The above-mentioned embodiments only express a certain implementation mode of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention; it should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which are within the protection scope of the present invention; therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (6)
1. A wafer level hybrid package module based on SAW and IPD, the module comprising:
a first filter that filters a received signal in a first frequency band;
a second filter that filters the received signal at a second frequency band different from the first frequency band;
the filter comprises an organic component and a molding compound, wherein the filter is arranged in the molding compound, the film plastic provides a first space for the first filter, and the molding compound provides a second space different from the first space for the second filter;
the molding compound is connected with the organic component, and the signal bonding pad of the filter penetrates through the organic component and is outwards formed with an external pin.
2. The SAW and IPD based wafer-level hybrid package module of claim 1, wherein the first filter is a surface acoustic wave filter, a closed cavity is formed between the first filter and the organic component, and the cavity is between the signal pads of the first filter.
3. The SAW and IPD based wafer level hybrid package module of claim 2, wherein the cross section of the cavity is rectangular and the length to width ratio of the rectangle is between 5:4 and 4: 3.
4. The SAW and IPD based wafer level hybrid package module of claim 3, wherein the ratio of the height of the signal pad of the first filter to the height of the molding compound is between 1:5-1: 4.
5. The SAW and IPD based wafer level hybrid package module of claim 4, wherein the second filter is an integrated passive device filter, the second filter is connected to the organic component through a signal pad, the signal pad is formed with an external pin out through the organic component.
6. A wafer level hybrid packaging method based on SAW and IPD is characterized by comprising the following steps:
a substrate carrier plate preparation step: taking an artificial wafer as a substrate carrier plate, and manufacturing a cavity on the substrate carrier plate by adopting a photoetching process;
a filter mounting step: attaching a first filter to the cavity region and attaching a second filter to a region other than the cavity region;
and (3) a molding step: enclosing a molding die cavity and the substrate carrier plate, wherein the filter is positioned in the enclosed space, filling molding plastic into the space, heating the molding plastic to melt the molding plastic, filling the molding plastic into the molding die cavity under the action of pressure, and cooling and curing;
removing the loading plate: removing the substrate carrier plate part processed by the molding step to expose the surface of the signal bonding pad of the filter;
redistribution and bump process steps: and the other side of the substrate carrier plate, which is far away from the filter, is connected with an organic assembly, the substrate carrier plate processed by the step of unloading is subjected to redistribution and bump processes, and the signal bonding pad is led out of the outer side of the organic assembly to form an external pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110643619.4A CN113346865A (en) | 2021-06-09 | 2021-06-09 | Wafer-level hybrid packaging module and method based on SAW and IPD |
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| CN202110643619.4A CN113346865A (en) | 2021-06-09 | 2021-06-09 | Wafer-level hybrid packaging module and method based on SAW and IPD |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113793846A (en) * | 2021-09-28 | 2021-12-14 | 苏州科阳半导体有限公司 | Filter wafer-level packaging structure integrated with passive device and method thereof |
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2021
- 2021-06-09 CN CN202110643619.4A patent/CN113346865A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113793846A (en) * | 2021-09-28 | 2021-12-14 | 苏州科阳半导体有限公司 | Filter wafer-level packaging structure integrated with passive device and method thereof |
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