CN102569328A - 感光成像装置、半导体器件的制作方法 - Google Patents
感光成像装置、半导体器件的制作方法 Download PDFInfo
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- CN102569328A CN102569328A CN2012100719078A CN201210071907A CN102569328A CN 102569328 A CN102569328 A CN 102569328A CN 2012100719078 A CN2012100719078 A CN 2012100719078A CN 201210071907 A CN201210071907 A CN 201210071907A CN 102569328 A CN102569328 A CN 102569328A
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H—ELECTRICITY
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H—ELECTRICITY
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
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Abstract
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Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN201210071907.8A CN102569328B (zh) | 2012-03-16 | 2012-03-16 | 感光成像装置、半导体器件的制作方法 |
US13/836,346 US8945967B2 (en) | 2012-03-16 | 2013-03-15 | Photosensitive imaging device and method for forming semiconductor device |
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CN201210071907.8A CN102569328B (zh) | 2012-03-16 | 2012-03-16 | 感光成像装置、半导体器件的制作方法 |
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CN102569328A true CN102569328A (zh) | 2012-07-11 |
CN102569328B CN102569328B (zh) | 2015-05-13 |
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CN (1) | CN102569328B (zh) |
Cited By (15)
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CN103066093A (zh) * | 2013-01-14 | 2013-04-24 | 陆伟 | 一种用深槽隔离制造影像传感器的方法及影像传感器结构 |
CN104576662A (zh) * | 2013-10-23 | 2015-04-29 | 豪威科技(上海)有限公司 | 一种高量子转换效率的堆叠式cmos传感器及其制备方法 |
CN104659040A (zh) * | 2013-11-20 | 2015-05-27 | 上海华虹宏力半导体制造有限公司 | 一种全隔离背照式图像传感器及其制造方法 |
CN104795418A (zh) * | 2015-04-24 | 2015-07-22 | 上海丽恒光微电子科技有限公司 | 感光成像装置及其制造方法 |
CN102938410B (zh) * | 2012-12-03 | 2017-06-23 | 上海集成电路研发中心有限公司 | 一种cmos图像传感器制造方法 |
CN106910746A (zh) * | 2017-03-08 | 2017-06-30 | 长江存储科技有限责任公司 | 一种3d nand存储器件及其制造方法、封装方法 |
CN109065561A (zh) * | 2018-09-13 | 2018-12-21 | 德淮半导体有限公司 | 图像传感器及其形成方法 |
CN109244095A (zh) * | 2018-09-13 | 2019-01-18 | 德淮半导体有限公司 | Bsi图像传感器及其形成方法 |
WO2019037403A1 (en) * | 2017-08-21 | 2019-02-28 | Yangtze Memory Technologies Co., Ltd. | THREE-DIMENSIONAL STABLE MEMORY DEVICES AND METHODS OF FORMING THE SAME |
CN110634892A (zh) * | 2018-06-22 | 2019-12-31 | 中芯集成电路(宁波)有限公司 | 光电探测器及其制造方法、图像传感器 |
CN113130525A (zh) * | 2021-03-15 | 2021-07-16 | 常州大学 | 一种三极管图像传感器 |
US11101311B2 (en) | 2018-06-22 | 2021-08-24 | Ningbo Semiconductor International Corporation | Photodetector and fabrication method, and imaging sensor |
CN114171475A (zh) * | 2021-11-29 | 2022-03-11 | 微龛(广州)半导体有限公司 | 具有散热结构的soi晶圆及其制备方法 |
WO2022133642A1 (zh) * | 2020-12-21 | 2022-06-30 | 中芯国际集成电路制造(北京)有限公司 | 半导体结构的形成方法 |
WO2023178907A1 (zh) * | 2022-03-24 | 2023-09-28 | 上海芯物科技有限公司 | 一种背照式传感器深沟槽隔离制造工艺及结构 |
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US9099623B2 (en) * | 2013-08-30 | 2015-08-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Manufacture including substrate and package structure of optical chip |
CN105261623A (zh) * | 2014-07-16 | 2016-01-20 | 中芯国际集成电路制造(上海)有限公司 | 芯片、其制备方法、及包括其的图像传感器 |
US10177127B2 (en) * | 2015-09-04 | 2019-01-08 | Hong Kong Beida Jade Bird Display Limited | Semiconductor apparatus and method of manufacturing the same |
US10032757B2 (en) | 2015-09-04 | 2018-07-24 | Hong Kong Beida Jade Bird Display Limited | Projection display system |
US10304811B2 (en) | 2015-09-04 | 2019-05-28 | Hong Kong Beida Jade Bird Display Limited | Light-emitting diode display panel with micro lens array |
US10297629B2 (en) | 2017-09-11 | 2019-05-21 | Semiconductor Components Industries, Llc | Image sensors with in-pixel lens arrays |
US10283543B2 (en) | 2017-09-28 | 2019-05-07 | Semiconductor Components Industries, Llc | Image sensors with diffractive lenses |
US10312280B2 (en) | 2017-09-28 | 2019-06-04 | Semiconductor Components Industries, Llc | Image sensors with diffractive lenses for stray light control |
US10483309B1 (en) | 2018-09-07 | 2019-11-19 | Semiductor Components Industries, Llc | Image sensors with multipart diffractive lenses |
US10957727B2 (en) | 2018-09-26 | 2021-03-23 | Semiconductor Components Industries, Llc | Phase detection pixels with diffractive lenses |
EP3817071B1 (en) * | 2019-10-31 | 2023-11-29 | Imec VZW | Optical sensor and thin film photodiode |
CN113764443B (zh) * | 2020-06-05 | 2024-01-02 | 联华电子股份有限公司 | 感光元件 |
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CN101483184A (zh) * | 2008-01-07 | 2009-07-15 | 东部高科股份有限公司 | 图像传感器及其制造方法 |
CN101640213A (zh) * | 2008-07-29 | 2010-02-03 | 东部高科股份有限公司 | 图像传感器及其制造方法 |
CN101840925A (zh) * | 2009-03-19 | 2010-09-22 | 索尼公司 | 半导体装置及其制造方法和电子设备 |
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2012
- 2012-03-16 CN CN201210071907.8A patent/CN102569328B/zh active Active
-
2013
- 2013-03-15 US US13/836,346 patent/US8945967B2/en active Active
Patent Citations (6)
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US20040266053A1 (en) * | 2003-06-30 | 2004-12-30 | Varghese Ronnie P | Method of utilizing a top conductive layer in isolating pixels of an image sensor array |
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US20090085135A1 (en) * | 2007-09-27 | 2009-04-02 | Bang Sun Kyung | Image Sensor and Manufacturing Method Thereof |
CN101483184A (zh) * | 2008-01-07 | 2009-07-15 | 东部高科股份有限公司 | 图像传感器及其制造方法 |
CN101640213A (zh) * | 2008-07-29 | 2010-02-03 | 东部高科股份有限公司 | 图像传感器及其制造方法 |
CN101840925A (zh) * | 2009-03-19 | 2010-09-22 | 索尼公司 | 半导体装置及其制造方法和电子设备 |
Cited By (28)
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CN102938410B (zh) * | 2012-12-03 | 2017-06-23 | 上海集成电路研发中心有限公司 | 一种cmos图像传感器制造方法 |
CN103066093B (zh) * | 2013-01-14 | 2015-12-09 | 武汉新芯集成电路制造有限公司 | 一种用深槽隔离制造影像传感器的方法及影像传感器结构 |
CN103066093A (zh) * | 2013-01-14 | 2013-04-24 | 陆伟 | 一种用深槽隔离制造影像传感器的方法及影像传感器结构 |
CN104576662A (zh) * | 2013-10-23 | 2015-04-29 | 豪威科技(上海)有限公司 | 一种高量子转换效率的堆叠式cmos传感器及其制备方法 |
CN104659040A (zh) * | 2013-11-20 | 2015-05-27 | 上海华虹宏力半导体制造有限公司 | 一种全隔离背照式图像传感器及其制造方法 |
CN104795418A (zh) * | 2015-04-24 | 2015-07-22 | 上海丽恒光微电子科技有限公司 | 感光成像装置及其制造方法 |
CN104795418B (zh) * | 2015-04-24 | 2018-09-18 | 上海珏芯光电科技有限公司 | 感光成像装置及其制造方法 |
US10593690B2 (en) | 2017-03-08 | 2020-03-17 | Yangtze Memory Technologies Co., Ltd. | Hybrid bonding contact structure of three-dimensional memory device |
CN106910746A (zh) * | 2017-03-08 | 2017-06-30 | 长江存储科技有限责任公司 | 一种3d nand存储器件及其制造方法、封装方法 |
US11758732B2 (en) | 2017-03-08 | 2023-09-12 | Yangtze Memory Technologies Co., Ltd. | Hybrid bonding contact structure of three-dimensional memory device |
US11527547B2 (en) | 2017-03-08 | 2022-12-13 | Yangtze Memory Technologies Co., Ltd. | Hybrid bonding contact structure of three-dimensional memory device |
US10923491B2 (en) | 2017-03-08 | 2021-02-16 | Yangtze Memory Technologies Co., Ltd. | Hybrid bonding contact structure of three-dimensional memory device |
CN110121779B (zh) * | 2017-08-21 | 2020-09-25 | 长江存储科技有限责任公司 | 三维存储器器件及用于形成其的方法 |
CN110121779A (zh) * | 2017-08-21 | 2019-08-13 | 长江存储科技有限责任公司 | 三维存储器器件及用于形成其的方法 |
WO2019037403A1 (en) * | 2017-08-21 | 2019-02-28 | Yangtze Memory Technologies Co., Ltd. | THREE-DIMENSIONAL STABLE MEMORY DEVICES AND METHODS OF FORMING THE SAME |
US11805646B2 (en) | 2017-08-21 | 2023-10-31 | Yangtze Memory Technologies Co., Ltd. | Three-dimensional memory devices and methods for forming the same |
US11211397B2 (en) | 2017-08-21 | 2021-12-28 | Yangtze Memory Technologies Co., Ltd. | Three-dimensional memory devices and methods for forming the same |
CN110634892A (zh) * | 2018-06-22 | 2019-12-31 | 中芯集成电路(宁波)有限公司 | 光电探测器及其制造方法、图像传感器 |
US11101311B2 (en) | 2018-06-22 | 2021-08-24 | Ningbo Semiconductor International Corporation | Photodetector and fabrication method, and imaging sensor |
CN110634892B (zh) * | 2018-06-22 | 2022-02-15 | 中芯集成电路(宁波)有限公司 | 光电探测器及其制造方法、图像传感器 |
US11764245B2 (en) | 2018-06-22 | 2023-09-19 | Ningbo Semiconductor International Corporation | Fabrication method of photodetector and imaging sensor |
CN109244095A (zh) * | 2018-09-13 | 2019-01-18 | 德淮半导体有限公司 | Bsi图像传感器及其形成方法 |
CN109065561A (zh) * | 2018-09-13 | 2018-12-21 | 德淮半导体有限公司 | 图像传感器及其形成方法 |
WO2022133642A1 (zh) * | 2020-12-21 | 2022-06-30 | 中芯国际集成电路制造(北京)有限公司 | 半导体结构的形成方法 |
CN113130525B (zh) * | 2021-03-15 | 2023-02-28 | 常州大学 | 一种三极管图像传感器 |
CN113130525A (zh) * | 2021-03-15 | 2021-07-16 | 常州大学 | 一种三极管图像传感器 |
CN114171475A (zh) * | 2021-11-29 | 2022-03-11 | 微龛(广州)半导体有限公司 | 具有散热结构的soi晶圆及其制备方法 |
WO2023178907A1 (zh) * | 2022-03-24 | 2023-09-28 | 上海芯物科技有限公司 | 一种背照式传感器深沟槽隔离制造工艺及结构 |
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CN102569328B (zh) | 2015-05-13 |
US8945967B2 (en) | 2015-02-03 |
US20130240962A1 (en) | 2013-09-19 |
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