CN102569138B

CN102569138B - Wafer case

Info

Publication number: CN102569138B
Application number: CN201010588762.XA
Authority: CN
Inventors: 王立潮; 李震宇; 赵国胜; 孙接华; 韩商标; 尚安; 邓群; 姜春瑞
Original assignee: Taiwan Semiconductor Manufacturing Co TSMC Ltd
Current assignee: Taiwan Semiconductor Manufacturing Co TSMC Ltd
Priority date: 2010-12-10
Filing date: 2010-12-10
Publication date: 2016-05-11
Anticipated expiration: 2030-12-10
Also published as: CN102569138A

Abstract

A kind of wafer case, in order to receive multiple wafers, comprises a box body, card casket and a buffer cover. Card casket is located among this box body, and wherein, this card casket has an opening, and described multiple wafer storages are among this card casket. Buffer cover is located at this opening, and this buffer cover connects this card casket, and wherein, this buffer cover is formed with multiple limited impressions, and described multiple wafers insert among described multiple limited impressions, to limit the position of described multiple wafers. The damage that the present invention can avoid wafer to occur because of sliding friction.

Description

Wafer case

Technical field

The present invention relates to a kind of wafer case, relate in particular to a kind of wafer case that prevents wafer friction.

Background technology

Known wafer case generally comprises the elements such as box body, card casket and lid, in order to receive multiple wafers.Card casket is accommodated among box body and lid. On card casket, be formed with multiple storage lattice, and described multiple wafer is insertedBe located among described multiple storage lattice. In known technology, because the gap of card casket storage lattice is very large, because ofThis wafer, in the process of carrying, can in storage lattice, slide, thereby easy frictionally damage is to wafer.

But, if the gap of storage lattice is dwindled, produce the difficult problem of contraposition, cause wafer to existInsert and in the process of card casket, easily bump and cracked.

Summary of the invention

A kind of wafer case that the present invention provides for wish solves the problem of known technology is many in order to receiveIndividual wafer, comprises a box body, card casket and a buffer cover. Card casket is located among this box body, wherein,This card casket has an opening, and described multiple wafer storages are among this card casket. Buffer cover is located at this opening,This buffer cover connects this card casket, and wherein, this buffer cover is formed with multiple limited impressions, described multiple wafersInsert among described multiple limited impression, to limit the position of described multiple wafers.

A kind of wafer case, in order to receive multiple wafers, comprising: a box body, is formed with a slope towards one theOne direction tilts; And one card casket, be located among this box body and be placed on this slope, wherein, this cardCasket has an opening, and described multiple wafer storages are among this card casket, and described multiple wafers are subject to gravity and doWith, tilt towards this first direction.

Application embodiments of the invention, because wafer inserts among limited impression, to limit described multiple crystalline substanceThe position of sheet. Therefore the damage that can avoid wafer to occur because of sliding friction.

Brief description of the drawings

Fig. 1 shows a kind of wafer case of the embodiment of the present invention;

The partial structurtes of Fig. 2 display buffer lid;

Fig. 3 shows the wafer case of second embodiment of the invention;

Fig. 4 a and Fig. 4 b show in the second embodiment, the partial structurtes of buffer cover 140 ';

Fig. 4 c shows the A part enlarged drawing in Fig. 4 b;

Fig. 5 shows the fixed arm of one embodiment of the invention; And

Fig. 6 shows the VI-VI direction sectional view in Fig. 3.

Wherein, description of reference numerals is as follows:

10～horizontal plane

20～wafer

100,100 '～wafer case

110～box body

111～slope

120～lid

130～card casket

131～opening

140,140 '～buffer cover

141～first side

142～Second Edge

143～limited impression

144～fixed arm

145～elastic element

146～V-arrangement recess

150～door bolt firmware

Detailed description of the invention

With reference to Fig. 1, it shows a kind of wafer case 100 of the embodiment of the present invention, in order to receive multiple wafers.This wafer case 100 comprises a box body 110, card casket 130, a lid 120 and a buffer cover 140.Card casket 130 is located among this box body 110. Wherein, this card casket 130 has an opening 131, described manyIndividual wafer storage is among this card casket 130. Buffer cover 140 is located at this opening 131, this buffer cover 140Connect this card casket 130. This lid 120 connects this box body 110, and wherein, this card casket 130 is accommodated in thisBetween lid 120 and this box body 110. This buffer cover 140 be positioned at this lid 120 and this card casket 130 itBetween.

With reference to Fig. 2, the partial structurtes of its display buffer lid 140, this buffer cover 140 is formed with multiple limitsPosition groove 143, described multiple wafers insert among described multiple limited impressions 143, described many to limitThe position of individual wafer. It is 140 rectangular that this punching is covered, and has a first side 141 and a Second Edge 142,This first side 141 is parallel to this Second Edge 142, and wherein, described multiple limited impressions 143 are side by side symmetricalOn this first side 141 and this Second Edge 142. This buffer cover 140 also has multiple fixed arms144, described multiple fixed arms 144 extend to the sidewall of this card casket 130 from this buffer cover 140, and withThis card casket 130 fastens, and described multiple fixed arms 144 are located at this first side 141 and this Second Edge 142On.

In first embodiment of the invention, because wafer inserts among limited impression, described multiple to limitThe position of wafer. Therefore the damage that can avoid wafer to occur because of sliding friction.

With reference to Fig. 3, it shows the wafer case 100 ' of second embodiment of the invention, in order to receive multiple wafers.With the first embodiment, this wafer case 100 ' comprise a box body 110, a card casket 130, a lid 120 withAn and buffer cover 140 '. Card casket 130 is located among this box body 110. Wherein, this card casket 130 has oneOpening, described multiple wafer storages are among this card casket 130. Buffer cover 140 ' is located at this opening, and this is slowPunching is covered 140 ' and is connected this card casket 130. This lid 120 connects this box body 110, wherein, and this card casket 130Be accommodated between this lid 120 and this box body 110. This buffer cover 140 ' is positioned at this lid 120 and this cardBetween casket 130.

With reference to Fig. 3, in a second embodiment, wafer case 100 ' also comprises door bolt firmware 150, this door bolt firmware150 connect this lid 120 and this box body 110, to fix position each other.

With reference to Fig. 4 a and Fig. 4 b, it shows in the second embodiment, the partial structurtes of buffer cover 140 '.Collocation is with reference to Fig. 4 c, and it shows the A part enlarged drawing in Fig. 4 b, and buffer cover 140 ' has multiple elastic forceElement 145, the described multiple stopper slots of corresponding formation, described multiple elastic elements 145 limit described multipleThe position of wafer. Each elastic element 145 has a V-arrangement recess 146. Described multiple elastic element 145Material be rubber.

With reference to Fig. 5, it shows the fixed arm 144 ' of one embodiment of the invention, in embodiments of the present invention,The design of fixed arm can suitably change, and it does not limit the present invention.

With reference to Fig. 6, it shows the VI-VI direction sectional view in Fig. 3. Wherein, box body 110 is formed withOne slope 111 tilts towards a first direction X. Card casket 130 is located among this box body 110 and is placed in that this is obliqueOn slope 111, wherein, described multiple wafers 20 are accommodated among this card casket 130, described multiple crystalline substancesSheet 20 is subject to Action of Gravity Field, tilts towards this first direction X. In this embodiment, this slope 111 withBetween one horizontal plane 10, have a tiltangleθ, this tiltangleθ is 5 °. Meanwhile, wafer 20 is inserted inAmong the limited impression forming between elastic element 145, to limit the position of described multiple wafer 20.

In second embodiment of the invention, owing to forming limited impression by elastic element, described in limitingThe position of multiple wafers. Therefore can provide more firm protection for wafer.

Although the present invention discloses as above with concrete preferred embodiment, so it is not in order to limit thisBright, any those of ordinary skill in the art, without departing from the spirit and scope of the present invention, still can do someChange and the retouching of being permitted, therefore protection scope of the present invention is when the scope defining depending on appended claimBe as the criterion.

Claims

1. a wafer case, in order to receive multiple wafers, comprising:

One box body;

One card casket, is located among this box body, and wherein, this card casket has an opening, and described multiple wafers are receivedBe contained among this card casket;

One buffer cover, is located at this opening, and this buffer cover connects this card casket, and wherein, this buffer cover is formed withMultiple limited impressions, described multiple wafers insert among described multiple limited impressions, described multiple to limitThe position of wafer, wherein, this buffer cover is rectangular, has a first side and a Second Edge, and this is first years oldLimit is parallel to this Second Edge, and wherein, described multiple limited impression symmetries are listed in this first side and thisOn two limits, wherein, this buffer cover has multiple fixed arms, and described multiple fixed arms prolong from this buffer coverStretch to the sidewall of this card casket, and fasten with this card casket; And

One lid, this lid connects this box body, and wherein, this card casket is accommodated between this lid and this box body.

2. wafer case as claimed in claim 1, wherein, described multiple fixed arms be located at this first side withAnd on this Second Edge.

3. wafer case as claimed in claim 1, wherein, this buffer cover be positioned at this lid and this card casket itBetween.

4. wafer case as claimed in claim 1, it also comprises at least one door bolt firmware, this door bolt firmware connectsThis lid and this box body.

5. wafer case as claimed in claim 1, wherein, this buffer cover has multiple elastic elements, rightShould form described multiple stopper slot, the position of the described multiple wafers of described multiple elastic element restriction.

6. wafer case as claimed in claim 5, wherein, each elastic element has a V-arrangement recess.

7. wafer case as claimed in claim 5, wherein, the material of described multiple elastic elements is rubber.

8. a wafer case, in order to receive multiple wafers, comprising:

One box body, is formed with a slope and tilts towards a first direction;

One card casket, is located among this box body and is placed on this slope, and wherein, this card casket has an opening,Described multiple wafer storage is among this card casket, and described multiple wafers are subject to Action of Gravity Field, towards this first partyTo inclination; And

One buffer cover, is located at this opening, and this buffer cover connects this card casket, and wherein, this buffer cover is formed withMultiple limited impressions, described multiple wafers insert among described multiple limited impressions, described multiple to limitThe position of wafer, wherein, this buffer cover is rectangular, has a first side and a Second Edge, and this is first years oldLimit is parallel to this Second Edge, and wherein, described multiple limited impression symmetries are listed in this first side and thisOn two limits, wherein, this buffer cover has multiple fixed arms, and described multiple fixed arms prolong from this buffer coverStretch to the sidewall of this card casket, and fasten with this card casket.

9. wafer case as claimed in claim 8, wherein, has and inclines between this slope and a horizontal planeOblique angle, this inclination angle is 5 °.

10. wafer case as claimed in claim 8, wherein, described multiple fixed arms are located at this first sideAnd on this Second Edge.

11. wafer case as claimed in claim 8, it also comprises a lid, this lid connects this box body,Wherein, this card casket is accommodated between this lid and this box body.

12. wafer case as claimed in claim 11, wherein, this buffer cover is positioned at this lid and this card casketBetween.

13. wafer case as claimed in claim 11, it also comprises at least one door bolt firmware, this door bolt firmware connectsConnect this lid and this box body.

14. wafer case as claimed in claim 8, wherein, this buffer cover has multiple elastic elements,Corresponding described multiple stopper slots, the position of the described multiple wafers of described multiple elastic element restriction of forming.

15. wafer case as claimed in claim 14, wherein, each elastic element has a V-arrangement recess.

16. wafer case as claimed in claim 14, wherein, the material of described multiple elastic elements is rubberGlue.