CN203774270U - Wafer restriction module and front open unit pod (FOUP) - Google Patents
Wafer restriction module and front open unit pod (FOUP) Download PDFInfo
- Publication number
- CN203774270U CN203774270U CN201420147528.7U CN201420147528U CN203774270U CN 203774270 U CN203774270 U CN 203774270U CN 201420147528 U CN201420147528 U CN 201420147528U CN 203774270 U CN203774270 U CN 203774270U
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- Prior art keywords
- wafer
- restraint module
- wafer contact
- box body
- front open
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- Expired - Lifetime
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- 235000012431 wafers Nutrition 0.000 claims abstract description 188
- 239000002245 particle Substances 0.000 abstract description 12
- 238000013467 fragmentation Methods 0.000 description 5
- 238000006062 fragmentation reaction Methods 0.000 description 5
- 238000011109 contamination Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a wafer restriction module and a front open unit pod (FOUP), wherein the wafer restriction module comprises a connection frame and a plurality of wafer contact heads. One side of each of the plurality of wafer contact heads is fixedly connected with the connection frame; the other side of each of the plurality of wafer contact heads is provided with an internally-concave arc surface; and no gap is formed between the plurality of wafer contact heads. According to the wafer restriction module and the front open unit pod, the wafer restriction module utilizes the wafer contact heads with the internally-concave arc surfaces so as to prevent the wafers from being scratched; besides, no gap is formed between the adjacent wafer contact heads, so that the wafers cannot stretch into the gaps of the wafer contact heads and also can automatically return even if the wafers shift positions, the problem of wafer breaking due to position shift of the wafers is solved, the risk of damaging the wafers is reduced, and the generation of particles is prevented.
Description
Technical field
The utility model relates to field of semiconductor manufacture, particularly a kind of wafer restraint module and the front open type wafer box that comprises described wafer restraint module.
Background technology
Wafer all needs to carry out particle (particle) in each stage of manufacturing, process, transporting and storing and controls.In order to avoid being subject to extraneous pollution in facilitating wafer carrying, conventionally can utilize an airtight container to carry for automation equipment.At present, front open type wafer box (Front Open Unit Pod is called for short FOUP) is the airtight container that carrying wafer generally adopts.
Please refer to Fig. 1, the structural representation of its front open type wafer box that is prior art.As shown in Figure 1, existing front open type wafer box 100 comprises a box body 110 and a lid 120, one side of described box body 110 has an opening, described lid 120 combines to protect its inner wafer with the opening of described box body 110, wherein, in described box body 110, be provided with multiple slots 111 in order to the accommodating multiple wafers of level, the inner surface of described lid 120 is provided with wafer restraint module 130 in order to limit the position of described wafer, described wafer restraint module 130 has V-type draw-in groove, utilize described V-type draw-in groove to withstand its relative wafer, to limit the position of described wafer.
Please refer to Fig. 2, the structural representation of the wafer restraint module that it is prior art.As shown in Figure 2, described wafer restraint module 130 comprises multiple wafer contact heads 132, between adjacent wafer contact head 132, there is gap, the side that described wafer contact head 132 is faced wafer has V-type draw-in groove, described V-type draw-in groove is limited and is formed by two crossing planes, utilize described V-type draw-in groove to withstand the wafer that it is faced, can limit the position of described wafer.
But, find in actual use, utilize described front open type wafer box 100 to transport wafer and easily produce particle.Reason is, the wafer contact head 132 of described wafer restraint module 130 easily and wafer rub, cause the edge of wafer to scratch and produce particle.Once there is particle, particle can rest on crystal column surface or polluting wafer, causes yield to decline.On the other hand, wafer can be mobile at described front open type wafer box 100, and position is easily offset.As shown in Figure 3, just cannot get back to correct position once wafer stretches in the gap of adjacent wafer contact head 132, in the time that robotic arm takes out wafer, the generation that fragmentation causes particle easily occur.
Therefore, the wafer contact head that how to solve the front open type wafer box of prior art easily scratches wafer and produces particle contamination wafer, and cannot reply and cause the problem of fragmentation to become the current technical problem of needing solution badly after the skew of the position of wafer.
Utility model content
The purpose of this utility model is to provide a kind of wafer restraint module and front open type wafer box, easily scratch wafer and produce particle contamination wafer to solve the wafer contact head of existing front open type wafer box, and cannot reply the problem that causes fragmentation after the skew of the position of wafer.
For solving the problems of the technologies described above, the utility model provides a kind of wafer restraint module, and described wafer restraint module comprises: link and multiple wafer contact head;
One side of described multiple wafer contact heads is all fixed with described link, and the opposite side of described multiple wafer contact heads has the curved surfaces of indent;
Tight between described multiple wafer contact head.
Preferably, in described wafer restraint module, the centre of described curved surfaces is provided with a groove.
Preferably, in described wafer restraint module, the arc that is shaped as V-arrangement or symmetry of described groove.
Preferably, in described wafer restraint module, the opening size of described groove is greater than the edge thickness of wafer.
Preferably, in described wafer restraint module, the cross sectional shape of described wafer contact head is zhou duicheng tuxing.
Preferably, in described wafer restraint module, described link has multiple connecting portions, and described multiple connecting portions are parallel to each other and equidistantly distribute.
Preferably, in described wafer restraint module, the quantity of described connecting portion equates with the quantity of described wafer contact head.
The utility model also provides a kind of front open type wafer box, and described front open type wafer box comprises: box body, lid and wafer restraint module as above;
The inside of described box body is provided with multiple slots that are parallel to each other, in order to accommodating multiple wafers;
One side of described box body has the input and output of an opening for described multiple wafers;
Described lid combines to protect the inner multiple wafers placed of described box body with the opening of described box body;
The link of described wafer restraint module is fixed on the inner surface of described lid, and multiple wafer contact heads of described wafer restraint are corresponding one by one with the position of described multiple slots.
In the wafer restraint module and front open type wafer box providing at the utility model, described wafer restraint module adopts the wafer contact head of the curved surfaces with indent to avoid scratching wafer, and, between adjacent wafer contact head and tight, therefore wafer can not stretch among the space of described wafer contact head, even if occurrence positions skew also can automatically reply, solve thus and be offset the fragmentation problem causing because of wafer position, thereby reduce the risk of wafer damage, and then avoided the generation of particle.
Brief description of the drawings
Fig. 1 is the structural representation of the front open type wafer box of prior art;
Fig. 2 is the structural representation of the wafer restraint module of prior art;
Fig. 3 is that the wafer that adopts the front open type wafer box of prior art to carry out conveyance is stuck in the structural representation in the space between wafer contact head;
Fig. 4 is the structural representation of the wafer restraint module of the utility model embodiment;
Fig. 5 a to Fig. 5 d is the structural representation of the wafer contact head of the utility model embodiment;
Fig. 6 is the structural representation of the front open type wafer box of the utility model embodiment.
Embodiment
Below in conjunction with the drawings and specific embodiments, wafer restraint module and the front open type wafer box that the utility model proposes are described in further detail.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of aid illustration the utility model embodiment lucidly.
Please refer to Fig. 4, it is the structural representation of the wafer restraint module of the utility model embodiment.As shown in Figure 4, described wafer restraint module 230 comprises: link 231 and multiple wafer contact head 232; One side of described multiple wafer contact heads 232 is all fixing with described link 231, and the opposite side of described multiple wafer contact heads 232 has the curved surfaces of indent; Tight between described multiple wafer contact head 232.
Concrete, described link 231 has multiple connecting portions, and the quantity of described connecting portion equates with the quantity of described wafer contact head 232, and described multiple connecting portions are parallel to each other and equidistantly distribute.One side of described multiple wafer contact heads 232 is all corresponding and fixing respectively one by one with multiple connecting portions of described link 231, and the opposite side of described multiple wafer contact heads 232 all has the curved surfaces of indent.Visible, described multiple wafer contact heads 232 are also parallel to each other and equidistantly distribute.And directly contact, does not have space between adjacent wafer contact head 232.
Please refer to Fig. 5 a to Fig. 5 d, it is the structural representation of the wafer contact head of the utility model embodiment.As shown in Fig. 5 a to Fig. 5 d, the shape of the curved surfaces of described wafer contact head 232 is not unique, as long as whole curved surfaces forms the structure of indent, can insert wafer as draw-in groove.Preferably, the cross sectional shape of described wafer contact head 232 is zhou duicheng tuxing.
Preferably, the centre of described curved surfaces is provided with a miniature groove 233, and described groove 233 provides the fulcrum of a fixing wafer.The direction that the sectional area of described groove 233 inserts along wafer diminishes gradually.Please continue to refer to Fig. 5 a, 5b or Fig. 5 c, 5d, the cross sectional shape of described groove 233 is zhou duicheng tuxing, for example, and the symmetrical arcs such as V-arrangement or semicircle.The opening size d1 of described groove 233 is suitable, common with the thickness of wafer, and the opening size d1 of described groove is greater than the edge thickness of described wafer.
In addition, the utility model also provides a kind of front open type wafer box.Please refer to Fig. 6, it is the structural representation of the front open type wafer box of the utility model embodiment.As shown in Figure 6, described front open type wafer box 200 comprises: box body 210, lid 220 and wafer restraint module 230 as above;
The inside of described box body 210 is provided with multiple slots that are parallel to each other 211, in order to accommodating multiple wafers;
One side of described box body 210 has the input and output of an opening for described multiple wafers;
Described lid 220 combines to protect the inner multiple wafers placed of described box body 210 with the opening of described box body 210;
The link 231 of described wafer restraint module 230 is fixed on the inner surface of described lid 220, and multiple wafer contact heads 232 of described wafer restraint module 230 are corresponding one by one with described multiple slots 211.
Concrete, described multiple wafer contact heads 232 are identical with the quantity of described multiple slots 211, and position correspondence.The sectional view of described multiple wafer contact heads 232 is zhou duicheng tuxing, and the symmetry axis of described zhou duicheng tuxing overlaps with the center line of described slot 211.
While using described front open type wafer box 200 to carry wafer, first wafer is positioned in the slot 211 of described box body 210 to closed described lid 220 afterwards by the opening of described box body 210.After described lid 220 combines with the opening of described box body 210, set wafer restraint module 230 wafer of fixed placement in described box body 210 effectively on the inner surface of described lid 220.
And the wafer contact head 232 of described wafer restraint module 230 has the curved surfaces of indent, described wafer restraint module 230 contacts with wafer and can not cause crystal round fringes to scratch.Further, due between adjacent wafer contact head 232 and tight, wafer causes position skew among can not stretching into the space of described wafer contact head 232.The centre of described curved surfaces is also provided with miniature groove 233, even if the skew of wafer occurrence positions also can automatically revert to middle groove location along curved surfaces.
To sum up, in the wafer restraint module and front open type wafer box providing at the utility model embodiment, the wafer contact head of described wafer restraint module has the curved surfaces of indent and can avoid wafer to scratch, and, between adjacent wafer contact head and tight, therefore wafer can not stretch among the space of described wafer contact head, the groove location in the middle of even the skew of wafer occurrence positions also can automatically revert to along the curved surfaces of described wafer contact head, thereby avoid occurring fragmentation, reduce thus the risk of wafer damage, and then avoid the generation of particle.
Foregoing description is only the description to the utility model preferred embodiment; the not any restriction to the utility model scope; any change, modification that the those of ordinary skill in the utility model field does according to above-mentioned disclosure, all belong to the protection range of claims.
Claims (8)
1. a wafer restraint module, is characterized in that, comprising: link and multiple wafer contact head;
One side of described multiple wafer contact heads is all fixed with described link, and the opposite side of described multiple wafer contact heads has the curved surfaces of indent;
Tight between described multiple wafer contact head.
2. wafer restraint module as claimed in claim 1, is characterized in that, the centre of described curved surfaces is provided with a groove.
3. wafer restraint module as claimed in claim 2, is characterized in that, the arc that is shaped as V-arrangement or symmetry of described groove.
4. wafer restraint module as claimed in claim 3, is characterized in that, the opening size of described groove is greater than the edge thickness of wafer.
5. wafer restraint module as claimed in claim 1, is characterized in that, the cross sectional shape of described wafer contact head is zhou duicheng tuxing.
6. wafer restraint module as claimed in claim 1, is characterized in that, described link has multiple connecting portions, and described multiple connecting portions are parallel to each other and equidistantly distribute.
7. wafer restraint module as claimed in claim 6, is characterized in that, the quantity of described connecting portion equates with the quantity of described wafer contact head.
8. a front open type wafer box, is characterized in that, comprising: box body, lid and the wafer restraint module as described in any one in claim 1 to 7;
The inside of described box body is provided with multiple slots that are parallel to each other, in order to accommodating multiple wafers;
One side of described box body has the input and output of an opening for described multiple wafers;
Described lid combines to protect the inner multiple wafers placed of described box body with the opening of described box body;
The link of described wafer restraint module is fixed on the inner surface of described lid, and multiple wafer contact heads of described wafer restraint are corresponding one by one with the position of described multiple slots.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420147528.7U CN203774270U (en) | 2014-03-28 | 2014-03-28 | Wafer restriction module and front open unit pod (FOUP) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420147528.7U CN203774270U (en) | 2014-03-28 | 2014-03-28 | Wafer restriction module and front open unit pod (FOUP) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203774270U true CN203774270U (en) | 2014-08-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420147528.7U Expired - Lifetime CN203774270U (en) | 2014-03-28 | 2014-03-28 | Wafer restriction module and front open unit pod (FOUP) |
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| CN (1) | CN203774270U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119369A (en) * | 2017-06-23 | 2019-01-01 | 上海微电子装备（集团）股份有限公司 | Wafer transfer box and wafer automatic transfer system |
| US10261109B2 (en) | 2017-05-17 | 2019-04-16 | Globalfoundries Inc. | Probe card support insert, container, system and method for storing and transporting one or more probe cards |
| CN113451183A (en) * | 2020-06-03 | 2021-09-28 | 重庆康佳光电技术研究院有限公司 | Wafer box |
| CN114379830A (en) * | 2022-03-23 | 2022-04-22 | 南京伟测半导体科技有限公司 | Wafer position detection device in wafer carrier |
-
2014
- 2014-03-28 CN CN201420147528.7U patent/CN203774270U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10261109B2 (en) | 2017-05-17 | 2019-04-16 | Globalfoundries Inc. | Probe card support insert, container, system and method for storing and transporting one or more probe cards |
| CN109119369A (en) * | 2017-06-23 | 2019-01-01 | 上海微电子装备（集团）股份有限公司 | Wafer transfer box and wafer automatic transfer system |
| CN113451183A (en) * | 2020-06-03 | 2021-09-28 | 重庆康佳光电技术研究院有限公司 | Wafer box |
| CN114379830A (en) * | 2022-03-23 | 2022-04-22 | 南京伟测半导体科技有限公司 | Wafer position detection device in wafer carrier |
| CN114379830B (en) * | 2022-03-23 | 2022-06-10 | 南京伟测半导体科技有限公司 | Wafer position detection device in wafer carrier |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |