CN204011371U - Wafer handler and reviewing board, technique board - Google Patents
Wafer handler and reviewing board, technique board Download PDFInfo
- Publication number
- CN204011371U CN204011371U CN201420393867.3U CN201420393867U CN204011371U CN 204011371 U CN204011371 U CN 204011371U CN 201420393867 U CN201420393867 U CN 201420393867U CN 204011371 U CN204011371 U CN 204011371U
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- Prior art keywords
- wafer
- block piece
- transmission window
- handler
- handling chamber
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model has disclosed a kind of wafer handler, comprising: handling chamber; For transmitting the transmitting device of described wafer, be arranged in described handling chamber; For described wafer transfer being gone out to the transmission window of described handling chamber, be arranged on the sidewall of described handling chamber; Movably block piece, is arranged in described handling chamber; When described wafer is spread out of described transmission window by described transmitting device, described block piece moves to just to described transmission window place.If there is the wafer being stuck to move with described transmitting device, the wafer being stuck is blocked by described block piece, thereby avoids the wafer clinging to drop in technique board, reduces production costs.
Description
Technical field
The utility model relates to semiconductor analysis technical field, particularly relates to a kind of wafer handler and reviewing board, technique board.
Background technology
In semiconductor technology manufacture process, need through a lot of steps, each processing step is to be responsible for by corresponding technique board.When a collection of (lot) wafer (wafer) is after the processing step of a technique board completes, the transmitting device (for example mechanical arm robot) of technique board can be put into wafer cassette (wafer pod) by this batch of wafer, then wafer cassette is moved to warehousing system.
General, transmitting device relies on pull of vacuum wafer is held and transmit, and when wafer is put into after wafer cassette, transmitting device is removed pull of vacuum, to be separated with wafer.But in the prior art, transmitting device is removed after pull of vacuum, transmitting device tends to cling wafer, and in the time that transmitting device leaves wafer cassette, the wafer being stuck moves with transmitting device, and drop in technique board, cause the damage of wafer, expend a large amount of production costs.
Utility model content
The purpose of this utility model is, a kind of wafer handler and reviewing board, technique board are provided, and can avoid wafer to move with transmitting device and drops, and reduces the damage of wafer.
For solving the problems of the technologies described above, the utility model provides a kind of wafer handler, for by wafer transfer to wafer cassette, comprising:
Handling chamber;
For transmitting the transmitting device of described wafer, be arranged in described handling chamber;
For described wafer transfer being gone out to the transmission window of described handling chamber, be arranged on the sidewall of described handling chamber;
Movably block piece, is arranged in described handling chamber; And
When described wafer is spread out of described transmission window by described transmitting device, described block piece moves to just to described transmission window place.
Optionally, in described wafer handler, described block piece comprises two baffle plates, two described baffle plates are arranged at respectively described transmission window and are positioned at the both sides of first direction, described first direction is positioned at the plane at described wafer place, and described first direction is parallel to the plane at described transmission window place.
Optionally, in described wafer handler, described wafer handler also comprises a moving track, and described moving track is arranged in described handling chamber, and described moving track extends at described first direction, and two described baffle plates slide on described moving track.
Optionally, in described wafer handler, described baffle plate is arranged on described moving track by a support.
Optionally, in described wafer handler, described support comprises that one for regulating the adjusting portion of described stent length.
Optionally, in described wafer handler, when described block piece moves to just to described transmission window place, the distance between two described baffle plates is greater than the width of described transmitting device at described first direction.
Optionally, in described wafer handler, described block piece comprises the cambered surface of mating described wafer, and described cambered surface is towards described window.
Optionally, in described wafer handler, described block piece comprises multiple for supporting the supporting bracket of described wafer, and described wafer cassette comprises multiple for supporting the support component of described wafer, and described supporting bracket is corresponding with the position of described support component.
Optionally, in described wafer handler, the outer wall of described block piece comprises posterior limiting.
Optionally, in described wafer handler, the height of described block piece is more than or equal to 225mm.
Optionally, in described wafer handler, in the time that described block piece moves to just to described transmission window place, the distance of described block piece and transmission window is less than or equal to 20cm.
Optionally, in described wafer handler, described wafer handler also comprises that one for surveying the detection system of described wafer position.
Optionally, in described wafer handler, described wafer handler also comprises a warning system, and described warning system connects described detection system.
Optionally, in described wafer handler, described wafer handler also comprises that one for placing the platform of described wafer cassette, and described platform is arranged at outside described handling chamber, and just to described transmission window.
According to another side of the present utility model, a kind of reviewing board is also provided, comprise any one wafer handler as above.
According to another side of the present utility model, a kind of technique board is also provided, comprise any one wafer handler as above.
Compared with prior art, the wafer handler that the utility model provides and reviewing board, technique board have the following advantages:
In the wafer handler providing at the utility model, described wafer handler comprises handling chamber, transmitting device, transmission window, block piece, when described wafer is spread out of described transmission window by described transmitting device, described block piece moves to just to described transmission window place, if there is the wafer being stuck to move with described transmitting device, the wafer being stuck is blocked by described block piece, thereby avoids the wafer clinging to drop in technique board, reduces production costs.
Brief description of the drawings
Fig. 1 is the stereogram of wafer handler in the time omitting the top cover of handling chamber in the utility model one embodiment;
Fig. 2 is the vertical view of wafer handler in the time omitting the top cover of handling chamber in the utility model one embodiment;
Fig. 3 is the schematic diagram of baffle plate in the utility model one embodiment;
Fig. 4 is schematic diagram when baffle plate blocks the wafer being stuck in the utility model one embodiment.
Embodiment
Below in conjunction with schematic diagram, wafer handler of the present utility model is described in more detail, wherein represent preferred embodiment of the present utility model, should be appreciated that those skilled in the art can revise the utility model described here, and still realize advantageous effects of the present utility model.Therefore, following description is appreciated that extensively knowing for those skilled in the art, and not as to restriction of the present utility model.
For clear, whole features of practical embodiments are not described.They in the following description, are not described in detail known function and structure, because can make the utility model chaotic due to unnecessary details.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details to realize developer's specific objective, for example, according to about system or about the restriction of business, change into another embodiment by an embodiment.In addition, will be understood that this development may be complicated and time-consuming, but be only routine work to those skilled in the art.
In the following passage, with way of example, the utility model is more specifically described with reference to accompanying drawing.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of aid illustration the utility model embodiment lucidly.
Core concept of the present utility model is, a kind of wafer handler is provided, and comprising: handling chamber; For transmitting the transmitting device of described wafer, be arranged in described handling chamber; For described wafer transfer being gone out to the transmission window of described handling chamber, be arranged on the sidewall of described handling chamber; Movably block piece, is arranged in described handling chamber; When described wafer is spread out of described transmission window by described transmitting device, described block piece moves to just to described transmission window place.If there is the wafer being stuck to move with described transmitting device, the wafer being stuck is blocked by described block piece, thereby avoids the wafer clinging to drop in technique board, reduces production costs.
Below in conjunction with Fig. 1-Fig. 4, the wafer handler in the present embodiment is described.Wherein, Fig. 1 is the stereogram of wafer handler in the time omitting the top cover of handling chamber in the utility model one embodiment; Fig. 2 is the vertical view of wafer handler in the time omitting the top cover of handling chamber in the utility model one embodiment; Fig. 3 is the schematic diagram of baffle plate in the utility model one embodiment; Fig. 4 is schematic diagram when baffle plate blocks the wafer being stuck in the utility model one embodiment.
As shown in Figure 1, described wafer handler 1 comprises handling chamber 100, transmitting device 200, transmission window 111, block piece 300.In order clearly to illustrate the structure of described wafer handler 1, in Fig. 1, the top cover of described handling chamber 100 does not draw, but in actual device, described handling chamber 100 also comprises top cover, to form the chamber of relative sealing, this is for persons of ordinary skill in the art may appreciate that therefore not to repeat here.
Described transmitting device 200 is for transmitting described wafer, and described transmitting device 200 is arranged in described handling chamber 100.The structure of described transmitting device 200 is not done concrete restriction, the structure such as the mechanical arm (robot) that can understand for those of ordinary skill in the art.
On the sidewall 110 of described handling chamber 100, comprise a transmission window 111, described transmission window 111 goes out described handling chamber 100 for described wafer transfer, and can import described wafer into described handling chamber 100 from described transmission window 111.
Preferably, in the present embodiment, described wafer handler 1 also comprises that one for placing the platform 400 of described wafer cassette 500, described platform 400 is arranged at outside described handling chamber 100, and just to described transmission window 111, described wafer cassette 500 is positioned on described platform 400, to facilitate described transmitting device 200 that described wafer is spread out of after described transmission window 111, described wafer is positioned in described wafer cassette 500.
Described block piece 300 is arranged in described handling chamber 100, and can be in described handling chamber 100 interior movements.In the time that described wafer is spread out of described transmission window 111 by described transmitting device 200, described block piece 300 moves to just to described transmission window 111 places.In the present embodiment, described block piece 300 comprises two baffle plates: baffle plate 310 and baffle plate 320, described baffle plate 310 and baffle plate 320 are arranged at respectively described transmission window 111 and are positioned at the both sides of first direction X.As shown in Figure 4, described first direction X is positioned at the plane (being horizontal plane) at described wafer 600 places, and described first direction X is parallel to the plane at described transmission window 111 places.Wherein, second direction Y is positioned at the plane (being horizontal plane) at described wafer 600 places, and perpendicular to described first direction X, third direction Z is perpendicular to the plane at described wafer 600 places.
Preferably, as shown in Figure 1, described wafer handler 1 also comprises a moving track 340, and described moving track 340 is arranged in described handling chamber 100, described moving track 100 extends at described first direction X, and described baffle plate 310 and baffle plate 320 can slide on described moving track 100.In the present embodiment, described baffle plate 310 and baffle plate 320 are arranged on described moving track 330 by a support 340 respectively.Described support 340 comprises that one for regulating the adjusting portion (at Fig. 1 for specifically illustrating) of described support 340 length, regulates described baffle plate 310 and baffle plate 320 position at third direction Z to facilitate.
With reference to figure 3, taking described baffle plate 310 as example, the structure of described block piece 300 is described.As shown in Figure 3, described baffle plate 310 comprises the cambered surface 301 of mating described wafer, and preferably, in the time that described cambered surface 301 is blocked described wafer, described cambered surface 301 fits with the edge of described wafer, can reduce to impact the stress causing, and avoids fragment.As shown in Figure 1, described cambered surface 301, towards described window 111, can be blocked described wafer with the cambered surface 301 that makes described baffle plate 310.As shown in Figure 3, preferably, the height H 1 of described block piece (described baffle plate 310) is more than or equal to 225mm, can block described wafer completely.
Preferably, described baffle plate 310 also comprises multiple for supporting the supporting bracket 302 of described wafer, and in the time that described cambered surface 301 is blocked described wafer, described supporting bracket 302, for described wafer support is lived, avoids described wafer to drop.The shape of described supporting bracket 302 is not done concrete restriction, can arrange as required.As shown in Figure 1, described wafer cassette 500 comprises multiple for supporting the support component 510 of described wafer, and when described wafer is positioned in described wafer cassette 500, described wafer is supported fixing by the described support component 510 of correspondence respectively.Wherein said supporting bracket 302 is corresponding with the position of described support component 510, be described in each support component 510 all have one with it in the identical described supporting bracket 302 of the height of third direction Z, to make the wafer on support component 510 described in each all have a corresponding described supporting bracket 302.
In the present embodiment, the outer wall of described block piece 300 comprises posterior limiting, for example Teflon elastic layer etc., and described elastic layer has cushioning effect, and is not easy to produce the impurity such as particle (particle).Described elastic layer can only be positioned at the outer wall of described block piece 300, can also not only be positioned at the outer wall of described block piece 300, and the material of whole described block piece 300 can be all the material of described elastic layer.
Described wafer handler 1 also comprises that one for surveying detection system and a warning system of described wafer position, and described warning system connects described detection system.
In the present embodiment, in the time that described wafer imports described handling chamber 100 into from described transmission window 111, described baffle plate 310 and baffle plate 320 are arranged at respectively described transmission window 111 and are positioned at the both sides of first direction X.When described wafer is spread out of described transmission window 111 by described transmitting device 200, as shown in Figure 4, described baffle plate 310 and baffle plate 320 towards each other close direction move, and move to just to described transmission window 111 places.If when the wafer being stuck 600 is taken back described handling chamber 100 by described transmitting device 200 from described wafer cassette 500, the cambered surface 301 of described baffle plate 310 and baffle plate 320 is blocked described wafer 600, prevent that described wafer 600 from entering described handling chamber 100, described wafer 600 is supported by the described supporting bracket 302 of institute's correspondence position, prevents described wafer 600 landings.Meanwhile, described detection system detects the wafer 600 being stuck and reenters described handling chamber 100, notifies described transmitting device 200 thereby send a signal, described transmitting device 200 transmission work; And described detection system is sent another signal to described warning system, described warning system is sent an alarm.
Now, the distance between described baffle plate 310 and baffle plate 320 is greater than the width of described transmitting device 200 at described first direction, to facilitate described transmitting device 200 to retract to reset between described baffle plate 310 and baffle plate 320.And described baffle plate 310 and baffle plate 320 are all less than or equal to 20cm with the distance of transmission window 111, thereby can prevent described wafer 600 landings.Certainly, described baffle plate 310 and baffle plate 320 are not limited to be less than or equal to 20cm with the distance of transmission window 111, described baffle plate 310 and baffle plate 320 can specifically arrange according to the size of described wafer 600 with the distance of transmission window 111, be generally less than described wafer 600 radius (be for example less than or equal to described wafer 600 radius 2/3rds), all can finely reach the effect that prevents described wafer 600 landings.
Described wafer handler 1 in the present embodiment can be applied to reviewing board, or is applied to technique board, for realizing the transmission of described wafer 600 between described reviewing board (or technique board) and described wafer cassette 500.By the foregoing description of the present embodiment, the concrete application process of described wafer handler 1 in described reviewing board or technique board is what those having ordinary skill in the art will appreciate that, and therefore not to repeat here.
Preferred embodiment of the present utility model is described above, and for example: described block piece 300 is not limited to comprise two baffle plates, described block piece 300 can also only include a baffle plate; And, described baffle plate is not limited to move on described first direction X, can also on third direction Z, move etc., as long as can realize in the time that described wafer 600 is spread out of described transmission window 111 by described transmitting device 200, described block piece 300 can move to just to described transmission window 111 places, also within thought range of the present utility model.
In sum, the utility model provides a kind of wafer handler, comprising: handling chamber; For transmitting the transmitting device of described wafer, be arranged in described handling chamber; For described wafer transfer being gone out to the transmission window of described handling chamber, be arranged on the sidewall of described handling chamber; Movably block piece, is arranged in described handling chamber; When described wafer is spread out of described transmission window by described transmitting device, described block piece moves to just to described transmission window place.If there is the wafer being stuck to move with described transmitting device, the wafer being stuck is blocked by described block piece, thereby avoids the wafer clinging to drop in technique board, reduces production costs.
Obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model the utility model.Like this, if these amendments of the present utility model and within modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to comprise these changes and modification interior.
Claims (16)
1. a wafer handler, for by wafer transfer to wafer cassette, it is characterized in that, comprising:
Handling chamber;
For transmitting the transmitting device of described wafer, be arranged in described handling chamber;
For described wafer transfer being gone out to the transmission window of described handling chamber, be arranged on the sidewall of described handling chamber;
Movably block piece, is arranged in described handling chamber;
When described wafer is spread out of described transmission window by described transmitting device, described block piece moves to just to described transmission window place.
2. wafer handler as claimed in claim 1, it is characterized in that, described block piece comprises two baffle plates, two described baffle plates are arranged at respectively described transmission window and are positioned at the both sides of first direction, described first direction is positioned at the plane at described wafer place, and described first direction is parallel to the plane at described transmission window place.
3. wafer handler as claimed in claim 2, it is characterized in that, described wafer handler also comprises a moving track, and described moving track is arranged in described handling chamber, described moving track extends at described first direction, and two described baffle plates slide on described moving track.
4. wafer handler as claimed in claim 3, is characterized in that, described baffle plate is arranged on described moving track by a support.
5. wafer handler as claimed in claim 4, is characterized in that, described support comprises that one for regulating the adjusting portion of described stent length.
6. wafer handler as claimed in claim 2, is characterized in that, when described block piece moves to just to described transmission window place, the distance between two described baffle plates is greater than the width of described transmitting device at described first direction.
7. wafer handler as claimed in claim 1, is characterized in that, described block piece comprises the cambered surface of mating described wafer, and described cambered surface is towards described window.
8. wafer handler as claimed in claim 1, it is characterized in that, described block piece comprises multiple for supporting the supporting bracket of described wafer, and described wafer cassette comprises multiple for supporting the support component of described wafer, and described supporting bracket is corresponding with the position of described support component.
9. wafer handler as claimed in claim 1, is characterized in that, the outer wall of described block piece comprises posterior limiting.
10. wafer handler as claimed in claim 1, is characterized in that, the height of described block piece is more than or equal to 225mm.
11. wafer handlers as claimed in claim 1, is characterized in that, in the time that described block piece moves to just to described transmission window place, the distance of described block piece and transmission window is less than or equal to 20cm.
12. wafer handlers as described in any one in claim 1 to 11, is characterized in that, described wafer handler also comprises that one for surveying the detection system of described wafer position.
13. wafer handlers as claimed in claim 12, is characterized in that, described wafer handler also comprises a warning system, and described warning system connects described detection system.
14. wafer handlers as described in any one in claim 1 to 11, it is characterized in that, described wafer handler also comprises that one for placing the platform of described wafer cassette, and described platform is arranged at outside described handling chamber, and just to described transmission window.
15. 1 kinds of reviewing boards, is characterized in that, comprise the wafer handler as described in any one in claim 1 to 14.
16. 1 kinds of technique boards, is characterized in that, comprise the wafer handler as described in any one in claim 1 to 14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420393867.3U CN204011371U (en) | 2014-07-16 | 2014-07-16 | Wafer handler and reviewing board, technique board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420393867.3U CN204011371U (en) | 2014-07-16 | 2014-07-16 | Wafer handler and reviewing board, technique board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204011371U true CN204011371U (en) | 2014-12-10 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420393867.3U Expired - Fee Related CN204011371U (en) | 2014-07-16 | 2014-07-16 | Wafer handler and reviewing board, technique board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204011371U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246792A (en) * | 2019-07-10 | 2019-09-17 | 江苏七维测试技术有限公司 | A kind of wafer cassette |
| CN114400199A (en) * | 2022-03-25 | 2022-04-26 | 南京伟测半导体科技有限公司 | Wafer dividing and guiding equipment and working method thereof |
-
2014
- 2014-07-16 CN CN201420393867.3U patent/CN204011371U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110246792A (en) * | 2019-07-10 | 2019-09-17 | 江苏七维测试技术有限公司 | A kind of wafer cassette |
| CN114400199A (en) * | 2022-03-25 | 2022-04-26 | 南京伟测半导体科技有限公司 | Wafer dividing and guiding equipment and working method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 Termination date: 20190716 |