CN201729422U - Wafer packing box - Google Patents
Wafer packing box Download PDFInfo
- Publication number
- CN201729422U CN201729422U CN2010202464559U CN201020246455U CN201729422U CN 201729422 U CN201729422 U CN 201729422U CN 2010202464559 U CN2010202464559 U CN 2010202464559U CN 201020246455 U CN201020246455 U CN 201020246455U CN 201729422 U CN201729422 U CN 201729422U
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- wafer
- packaging box
- fixed mechanism
- base
- wafer packaging
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Abstract
The utility model discloses a wafer packing box, which comprises a base, an upper cover and a box body, wherein the upper cover is covered and connected with the base; the box body is arranged in the base; a plurality of slots for plugging wafers are arranged at the side wall of the box body; a fixing mechanism is arranged in the base and comprises a main body and a plurality of location notches arranged on the main body; and the location notches are matched with the slots. The fixing mechanism can be used for fixing the lower parts of the wafers effectively to ensure the wafers not to swing in the box body when the box body swings, so as to ensure the safety of the wafers.
Description
Technical field
The utility model relates to integrated circuit and makes the field, particularly relates to a kind of wafer packaging box.
Background technology
In integrated circuit manufacturing process; the manufacturing process of entire wafer is finished jointly by a plurality of process work bench usually; therefore wafer need be transported on the different process work bench and process or detect; in the process of transporting; if wafer is not protected or is isolated; airborne particulate will be deposited in wafer surface, causes the pollution of wafer, thereby reduces the yield of wafer.Therefore, need to use the wafer packaging box to carry and transport wafer,, avoid damaged and pollution with safety storing, the carrying of guaranteeing wafer.
Specifically, existing wafer packaging box is made up of base, loam cake and box body three parts usually, described loam cake can cover with described base and be connected, described box body is arranged in the described base, the parallel sidewalls of described box body is provided with a plurality of slots that are used to insert wafer, and described slot is in order to the both sides of positions wafer.General, described base and loam cake roughly are square, and therefore, described wafer packaging box is also referred to as square box.Yet, in actual production, find, state in the use in the process that the wafer packaging box transports wafer, because the vibrations that the carrying personnel rocked or transported machine on foot, often cause described box body to rock, and the both sides that described slot only can fixed wafer, the below of wafer is not effectively fixed, make the below of the wafer that inserts in the box body rock, and then cause wafer cracked.When especially utilizing storage of above-mentioned wafer packaging box or transportation thickness, be more prone to occur the phenomenon of wafer breakage less than the wafer of 15mil (mil).
The problem of rocking for the wafer that solves in the wafer packaging box, application number transports the box structure for the Chinese patent of " 200620004551.6 " also proposes a kind of wafer, this wafer transports box and is provided with detent mechanism, this detent mechanism is placed in the disposal area of box body and the zone between the loam cake, described disposal area is for placing the zone of wafer, described detent mechanism is provided with several fins in the face of the surface of wafer position, be formed with positioning groove between each described fin, in order to the top of fixing described wafer, the top of described wafer is the part of wafer near loam cake.But, because this wafer transports the top that box only can fixed wafer, and in the process of actual storage and transportation wafer, because the wafer below relative with the top effectively do not fixed, and cause the wafer below to be collided and breakage mutually often.
The utility model content
The utility model provides a kind of wafer packaging box, solving effectively fixed wafer of existing wafer packaging box, and causes the problem of wafer breakage.
For solving the problems of the technologies described above, the utility model provides a kind of wafer packaging box, comprising: base; Loam cake covers with described base and to be connected; Box body is arranged in the described base, and described box side wall is provided with a plurality of slots that are used to insert wafer; Be arranged at the fixed mechanism in the described base, described fixed mechanism comprises main body and is arranged at a plurality of positioning grooves on the described main body that described positioning groove mates with described slot.
Optionally, in described wafer packaging box, the sidewall of described base is provided with strip projected parts.
Optionally, in described wafer packaging box, described fixed mechanism also comprises clamping part, and described clamping part is connected with described main body and is sticked in described strip projected parts.
Optionally, in described wafer packaging box, described fixed mechanism and described base are integrated.
Optionally, in described wafer packaging box, described fixed mechanism and described box body are integrated.
Optionally, in described wafer packaging box, described fixed mechanism also comprises the top, and described top is connected with described main body and replaces described base.
Optionally, in described wafer packaging box, the degree of depth of described positioning groove is less than 3mm.
Optionally, in described wafer packaging box, the material of described fixed mechanism is a polyvinylchloride.
Optionally, in described wafer packaging box, the material of described base is a polyvinylchloride.
Optionally, in described wafer packaging box, the material of described loam cake is transparent organic material.
Compared with prior art, the wafer packaging box that provides of the utility model has the following advantages:
Described wafer packaging box comprises fixed mechanism, described fixed mechanism comprises main body and is arranged at a plurality of positioning grooves on the described main body, the slot coupling of described positioning groove and box body, described fixed mechanism can effectively be fixed the below of described wafer, guarantee when described box body rocks, wafer in the described box body can not rock, thereby guarantees the safety storing and the carrying of wafer.
Description of drawings
The scheme drawing of the wafer packaging box that Fig. 1 provides for the utility model embodiment.
The specific embodiment
Below in conjunction with the drawings and specific embodiments the wafer packaging box that the utility model proposes is described in further detail.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the purpose of aid illustration the utility model embodiment lucidly.
Core concept of the present utility model is, a kind of wafer packaging box is provided, described wafer packaging box comprises fixed mechanism, described fixed mechanism comprises main body and is arranged at a plurality of positioning grooves on the described main body, described positioning groove and slot coupling, described fixed mechanism can effectively be fixed the below of described wafer, guarantees when described box body rocks, wafer in the described box body can not rock, thereby guarantees the safety storing and the carrying of wafer.
Please refer to Fig. 1, the scheme drawing of the wafer packaging box that it provides for the utility model embodiment.Need to prove, box body is not shown among Fig. 1, but understand its actual principle of work easily by diagram and explanation.As shown in Figure 1, wafer packaging box 100 comprises: base 110, loam cake 120, fixed mechanism 130 and box body.Wherein, described loam cake 120 covers with described base 110 and is connected; Described box body is arranged in the described base 110, and described box side wall is provided with a plurality of slots (not shown) that are used to insert wafer 140; Described fixed mechanism 130 is arranged in the described base 110, and described fixed mechanism 130 comprises main body 131 and is arranged at a plurality of positioning grooves 132 on the described main body 131, described positioning groove 132 and described slot coupling.Described fixed mechanism 130 can actv. fixed wafer 140 the below, guarantee that when described box body rocks the wafer 140 in the described box body can not rock, thereby guarantee the safety storing and the carrying of wafer 140.
In a specific embodiment of the present invention, described base 110 is provided with strip projected parts (not shown), described fixed mechanism 130 also comprises clamping part 133, described clamping part 133 is connected with described main body 131 and is sticked in described strip projected parts, described clamping part 133 can be fixed on described fixed mechanism 130 in the described base 110, guarantees that described fixed mechanism 130 can not rock in described base 110.And,, when needs clean described fixed mechanism 130, also can easily described fixed mechanism 130 be disassembled in base 110 because described fixed mechanism 130 is to be connected with described base 110 detouchables by clamping part 133.
In another specific embodiment of the present invention, described fixed mechanism 130 also can be integrated with described base 110, so that the described wafer packaging box 100 of processing and fabricating.
In another specific embodiment of the present invention, described fixed mechanism 130 can be integrated with described box body also, and promptly described positioning groove 130 can be wholely set with cooresponding slot.
Preferable, described fixed mechanism 130 also comprises top 134, and described top 134 is connected with described main body 131 and replaces described base 110.Because described top 134 is replaced the sidewall of described base 110 just, can further fix described fixed mechanism 130, avoids described fixed mechanism 130 to rock.
Optionally, the degree of depth of the positioning groove 132 of described wafer packaging box 100 is less than 3mm, influences the yield rate of device to prevent that area that wafer 140 contacts with main body 131 is too big.
The material of described fixed mechanism 130 is preferably polyvinylchloride, described polyvinylchloride has comparatively ideal intensity, the fixed mechanism of being made by polyvinylchloride 130 is difficult for breaking, and be difficult for producing particle, can avoid polluting wafer, in addition, the fixed mechanism of being made by polyvinylchloride 130 has desirable electrostatic-proof function.
The material of described base 110 is preferably polyvinylchloride, to avoid producing particle and electrostatic prevention.Yet will be appreciated that described base 110 and described fixed mechanism 130 also can be made by the material of other wear-resisting and difficult pollution wafer, for example, the material of described base 110 and fixed mechanism 130 also can be a teflon.
Further, the material of described loam cake 120 is preferably transparent organic material, so that operating personal is observed quantity and the model that inserts the wafer 140 in described box body.
The working process of the wafer packaging box 100 that the utility model embodiment is provided is as follows: at first, fixed mechanism 130 is placed in the described base 110; Then, wafer 140 is inserted in the slot of box body; Then, the box body that wafer 140 is housed is put in the base 110, and the below of described wafer 140 is inserted into respectively in the cooresponding positioning groove 132, at this moment, the both sides of described wafer 140 are fixed by the slot of box body, and the be fixed positioning groove 132 of mechanism 130 of the below of described wafer 140 is fixing; At last, loam cake 120 is covered on described base 110, described wafer 140 is sealed in the described wafer packaging box 100.Because the existence of described fixed mechanism 130 can make the below of described wafer 140 and both sides all be fixed firmly, even described box body rocks, the wafer 140 in the box body also can not collide and breakage mutually, can guarantee the safety storing and the carrying of wafer 140.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (10)
1. wafer packaging box comprises:
Base;
Loam cake covers with described base and to be connected;
Box body is arranged in the described base, and described box side wall is provided with a plurality of slots that are used to insert wafer;
It is characterized in that, also comprise: be arranged at the fixed mechanism in the described base, described fixed mechanism comprises main body and is arranged at a plurality of positioning grooves on the described main body that described positioning groove mates with described slot.
2. wafer packaging box as claimed in claim 1 is characterized in that the sidewall of described base is provided with strip projected parts.
3. wafer packaging box as claimed in claim 2 is characterized in that described fixed mechanism also comprises clamping part, and described clamping part is connected with described main body and is sticked in described strip projected parts.
4. wafer packaging box as claimed in claim 1 is characterized in that, described fixed mechanism and described base are integrated.
5. wafer packaging box as claimed in claim 1 is characterized in that, described fixed mechanism and described box body are integrated.
6. wafer packaging box as claimed in claim 1 is characterized in that described fixed mechanism also comprises the top, and described top is connected with described main body and replaces described base.
7. as any described wafer packaging box in the claim 1 to 6, it is characterized in that the degree of depth of described positioning groove is less than 3mm.
8. wafer packaging box as claimed in claim 7 is characterized in that, the material of described fixed mechanism is a polyvinylchloride.
9. wafer packaging box as claimed in claim 7 is characterized in that, the material of described base is a polyvinylchloride.
10. wafer packaging box as claimed in claim 7 is characterized in that, the material of described loam cake is transparent organic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202464559U CN201729422U (en) | 2010-06-30 | 2010-06-30 | Wafer packing box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202464559U CN201729422U (en) | 2010-06-30 | 2010-06-30 | Wafer packing box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201729422U true CN201729422U (en) | 2011-02-02 |
Family
ID=43520578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202464559U Expired - Fee Related CN201729422U (en) | 2010-06-30 | 2010-06-30 | Wafer packing box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201729422U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102390625A (en) * | 2011-07-19 | 2012-03-28 | 华北电网有限公司计量中心 | Special electric power standard turnover box for transformers |
| CN102431725A (en) * | 2011-10-09 | 2012-05-02 | 常熟市华海电子有限公司 | Chip packaging bag |
| CN102837869A (en) * | 2011-06-23 | 2012-12-26 | 苏州五方光电科技有限公司 | Lens cylindrical strip storing box |
| CN104210747A (en) * | 2013-05-28 | 2014-12-17 | 康宁精密素材株式会社 | Box for carrying substrates |
| CN104724401A (en) * | 2015-03-31 | 2015-06-24 | 宁波广瑞通信技术有限公司 | Optical splitter packing box |
| CN104960797A (en) * | 2015-07-01 | 2015-10-07 | 刘磊 | Metal electric heating bar storage rack |
| CN106697512A (en) * | 2017-01-23 | 2017-05-24 | 苏州诺纳可电子科技有限公司 | Iron sheet hand-off holder |
| CN109703876A (en) * | 2018-12-26 | 2019-05-03 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wet transponder and semiconductor producing system out |
-
2010
- 2010-06-30 CN CN2010202464559U patent/CN201729422U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102837869A (en) * | 2011-06-23 | 2012-12-26 | 苏州五方光电科技有限公司 | Lens cylindrical strip storing box |
| CN102390625A (en) * | 2011-07-19 | 2012-03-28 | 华北电网有限公司计量中心 | Special electric power standard turnover box for transformers |
| CN102431725A (en) * | 2011-10-09 | 2012-05-02 | 常熟市华海电子有限公司 | Chip packaging bag |
| CN104210747A (en) * | 2013-05-28 | 2014-12-17 | 康宁精密素材株式会社 | Box for carrying substrates |
| CN104724401A (en) * | 2015-03-31 | 2015-06-24 | 宁波广瑞通信技术有限公司 | Optical splitter packing box |
| CN104960797A (en) * | 2015-07-01 | 2015-10-07 | 刘磊 | Metal electric heating bar storage rack |
| CN106697512A (en) * | 2017-01-23 | 2017-05-24 | 苏州诺纳可电子科技有限公司 | Iron sheet hand-off holder |
| CN109703876A (en) * | 2018-12-26 | 2019-05-03 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Wet transponder and semiconductor producing system out |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130219 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130219 Address after: 100176 No. 18 Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110202 Termination date: 20180630 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |