US20140174705A1 - Heat sink assembly - Google Patents

Heat sink assembly Download PDF

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Publication number
US20140174705A1
US20140174705A1 US13/787,845 US201313787845A US2014174705A1 US 20140174705 A1 US20140174705 A1 US 20140174705A1 US 201313787845 A US201313787845 A US 201313787845A US 2014174705 A1 US2014174705 A1 US 2014174705A1
Authority
US
United States
Prior art keywords
heat sink
grease
sink assembly
bottom plate
grease cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/787,845
Inventor
Yao-Ting Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hon Hai Precision Industry Co Ltd
Original Assignee
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Precision Industry Co Ltd filed Critical Hon Hai Precision Industry Co Ltd
Assigned to HON HAI PRECISION INDUSTRY CO., LTD. reassignment HON HAI PRECISION INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, YAO-TING
Publication of US20140174705A1 publication Critical patent/US20140174705A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/22—Fastening; Joining by using magnetic effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present disclosure relates to a heat sink assembly.
  • a layer of thermal grease is generally attached to a bottom of a heat sink to improve heat conductivity between an electronic component and the heat sink.
  • a grease cover is mounted to a bottom plate of the heat sink and covers the thermal grease, to protect the thermal grease. The grease cover engages with the bottom plate of the heat sink. However, the grease cover is easily deformed, so the grease cover cannot be recycled.
  • FIG. 1 is an exploded, isometric view of an exemplary embodiment of a heat sink assembly, wherein the heat sink assembly includes a heat sink.
  • FIG. 2 is an inverted view of the heat sink of FIG. 1 .
  • FIG. 3 is an assembled, isometric view of FIG. 1 .
  • FIGS. 1 and 2 show an exemplary embodiment of a heat sink assembly.
  • the heat sink assembly includes a heat sink 20 and a grease cover 10 .
  • the grease cover 10 includes a rectangular main body 11 .
  • the main body 11 includes two opposite sidewalls 12 .
  • a receiving recess 13 is defined in a top surface of the main body 11 .
  • Two blocks 15 extend from opposite ends of each sidewall 12 .
  • a recess 16 is defined in a top surface of each block 15 .
  • a magnet 18 is pasted on a bottom wall of each recess 16 .
  • the heat sink 20 includes a substantially H-shaped bottom plate 21 .
  • a layer of thermal grease 22 is attached to a center of a bottom surface of the bottom plate 21 .
  • Four ferromagnetic fasteners 23 such as four screws, are respectively mounted to four corners of the bottom plate 21 , with bottom ends of the fasteners 23 extending out of the bottom surface of the bottom plate 21 .
  • FIG. 3 shows in assembly.
  • the bottom plate 21 is placed on the top surface of the main body 11 .
  • the thermal grease 22 is received in the receiving recess 13 .
  • the bottom ends of the fasteners 23 are received in the recesses 16 and attracted to the magnets 18 .
  • the grease cover 10 is attracted to the heat sink 20 by the magnets 18 .
  • the grease cover 10 will not be damaged. Therefore, the grease cover 10 can be recycled.

Abstract

A heat sink assembly includes a heat sink and a grease cover. The heat sink includes a bottom plate. A layer of thermal grease is attached to a bottom surface of the bottom plate. A number of fasteners are mounted to the bottom plate. The grease cover defines a receiving recess for receiving the thermal grease. A number of magnets are fastened to the grease cover and attract the fasteners.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to a heat sink assembly.
  • 2. Description of Related Art
  • A layer of thermal grease is generally attached to a bottom of a heat sink to improve heat conductivity between an electronic component and the heat sink. A grease cover is mounted to a bottom plate of the heat sink and covers the thermal grease, to protect the thermal grease. The grease cover engages with the bottom plate of the heat sink. However, the grease cover is easily deformed, so the grease cover cannot be recycled.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an exploded, isometric view of an exemplary embodiment of a heat sink assembly, wherein the heat sink assembly includes a heat sink.
  • FIG. 2 is an inverted view of the heat sink of FIG. 1.
  • FIG. 3 is an assembled, isometric view of FIG. 1.
    •  DETAILED DESCRIPTION
  • The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
  • FIGS. 1 and 2 show an exemplary embodiment of a heat sink assembly. The heat sink assembly includes a heat sink 20 and a grease cover 10.
  • The grease cover 10 includes a rectangular main body 11. The main body 11 includes two opposite sidewalls 12. A receiving recess 13 is defined in a top surface of the main body 11. Two blocks 15 extend from opposite ends of each sidewall 12. A recess 16 is defined in a top surface of each block 15. A magnet 18 is pasted on a bottom wall of each recess 16.
  • The heat sink 20 includes a substantially H-shaped bottom plate 21. A layer of thermal grease 22 is attached to a center of a bottom surface of the bottom plate 21. Four ferromagnetic fasteners 23, such as four screws, are respectively mounted to four corners of the bottom plate 21, with bottom ends of the fasteners 23 extending out of the bottom surface of the bottom plate 21.
  • FIG. 3 shows in assembly. The bottom plate 21 is placed on the top surface of the main body 11. The thermal grease 22 is received in the receiving recess 13. The bottom ends of the fasteners 23 are received in the recesses 16 and attracted to the magnets 18.
  • The grease cover 10 is attracted to the heat sink 20 by the magnets 18. When the grease cover 10 is detached from the heat sink 20, the grease cover 10 will not be damaged. Therefore, the grease cover 10 can be recycled.
  • Even though numerous characteristics and advantages of the embodiments have been set forth in the foregoing description, together with details of the structure and the functions of the embodiments, the disclosure is illustrative only, and changes may be made in details, especially in the matters of shape, size, and arrangement of parts within the principles of the embodiments to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (5)

What is claimed is:
1. A heat sink assembly, comprising:
a heat sink comprising a bottom plate, a layer of thermal grease attached to a bottom surface of the bottom plate, a plurality of fasteners mounted to the bottom plate; and
a grease cover defining a receiving recess for receiving the thermal grease, a plurality of magnets fastened to the grease cover and attracting the plurality of fasteners.
2. The heat sink assembly of claim 1, wherein a plurality of recesses is defined in the grease cover and receives the plurality of magnets.
3. The heat sink assembly of claim 2, wherein the plurality of magnets is pasted on bottom walls of the plurality of recesses.
4. The heat sink assembly of claim 2, wherein the grease cover comprises a rectangular main body, the receiving recess is defined in a top surface of the main body, four blocks are formed on four corners of the main body, the plurality of recesses is defined in top surfaces of the blocks.
5. The heat sink assembly of claim 1, wherein each fastener is a screw.
US13/787,845 2012-12-26 2013-03-07 Heat sink assembly Abandoned US20140174705A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW101150273A TW201426263A (en) 2012-12-26 2012-12-26 Thermal grease cover
TW101150273 2012-12-26

Publications (1)

Publication Number Publication Date
US20140174705A1 true US20140174705A1 (en) 2014-06-26

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ID=50973305

Family Applications (1)

Application Number Title Priority Date Filing Date
US13/787,845 Abandoned US20140174705A1 (en) 2012-12-26 2013-03-07 Heat sink assembly

Country Status (2)

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US (1) US20140174705A1 (en)
TW (1) TW201426263A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160143127A1 (en) * 2014-11-19 2016-05-19 Giga-Byte Technology Co., Ltd. Slat fastening assembly
USD892753S1 (en) * 2018-10-31 2020-08-11 Bitmain Technologies Inc. Heat sink
US20210159145A1 (en) * 2019-11-26 2021-05-27 Mitsubishi Electric Corporation Semiconductor device and method of manufacturing radiation fin
US11145568B2 (en) * 2018-12-10 2021-10-12 Intel Corporation Magnetically affixed heat spreader

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI583296B (en) * 2015-02-03 2017-05-11 鴻準精密工業股份有限公司 Heat dissipation device
CN105992489A (en) * 2015-02-04 2016-10-05 富瑞精密组件（昆山）有限公司 Heat dissipation device

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5175613A (en) * 1991-01-18 1992-12-29 Digital Equipment Corporation Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
US5288203A (en) * 1992-10-23 1994-02-22 Thomas Daniel L Low profile fan body with heat transfer characteristics
US5394936A (en) * 1993-03-12 1995-03-07 Intel Corporation High efficiency heat removal system for electric devices and the like
US20030030982A1 (en) * 2001-08-08 2003-02-13 David Shia Heat sink retention frame
US20040047130A1 (en) * 2002-09-09 2004-03-11 Liu Houben Heat sink clip assembly
US20040252461A1 (en) * 2003-06-11 2004-12-16 Wow Wu Heat sink assembly incorporating mounting frame
US20060037735A1 (en) * 2002-01-03 2006-02-23 Connors Matthew J Bi-level heat sink
US7319592B2 (en) * 2006-04-11 2008-01-15 Inventec Corporation Recyclable protective cover for a heat-conductive medium
US20080277094A1 (en) * 2007-05-10 2008-11-13 Industrial Technology Research Institute Miniature heat-dissipating fan device
US20120312345A1 (en) * 2011-06-10 2012-12-13 Perpetua Power Source Technologies, Inc. System and method for thermal protection of an electronics module of an energy harvester

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5175613A (en) * 1991-01-18 1992-12-29 Digital Equipment Corporation Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
US5288203A (en) * 1992-10-23 1994-02-22 Thomas Daniel L Low profile fan body with heat transfer characteristics
US5394936A (en) * 1993-03-12 1995-03-07 Intel Corporation High efficiency heat removal system for electric devices and the like
US20030030982A1 (en) * 2001-08-08 2003-02-13 David Shia Heat sink retention frame
US20060037735A1 (en) * 2002-01-03 2006-02-23 Connors Matthew J Bi-level heat sink
US20040047130A1 (en) * 2002-09-09 2004-03-11 Liu Houben Heat sink clip assembly
US20040252461A1 (en) * 2003-06-11 2004-12-16 Wow Wu Heat sink assembly incorporating mounting frame
US7319592B2 (en) * 2006-04-11 2008-01-15 Inventec Corporation Recyclable protective cover for a heat-conductive medium
US20080277094A1 (en) * 2007-05-10 2008-11-13 Industrial Technology Research Institute Miniature heat-dissipating fan device
US20120312345A1 (en) * 2011-06-10 2012-12-13 Perpetua Power Source Technologies, Inc. System and method for thermal protection of an electronics module of an energy harvester

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160143127A1 (en) * 2014-11-19 2016-05-19 Giga-Byte Technology Co., Ltd. Slat fastening assembly
USD892753S1 (en) * 2018-10-31 2020-08-11 Bitmain Technologies Inc. Heat sink
US11145568B2 (en) * 2018-12-10 2021-10-12 Intel Corporation Magnetically affixed heat spreader
US20210159145A1 (en) * 2019-11-26 2021-05-27 Mitsubishi Electric Corporation Semiconductor device and method of manufacturing radiation fin
US11557527B2 (en) * 2019-11-26 2023-01-17 Mitsubishi Electric Corporation Semiconductor device and method of manufacturing radiation fin

Also Published As

Publication number Publication date
TW201426263A (en) 2014-07-01

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Legal Events

Date Code Title Description
AS Assignment

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:CHANG, YAO-TING;REEL/FRAME:029936/0898

Effective date: 20130306

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION