CN102555402A - Prebonding process of metal-base copper-clad plate - Google Patents
Prebonding process of metal-base copper-clad plate Download PDFInfo
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- CN102555402A CN102555402A CN2012100127183A CN201210012718A CN102555402A CN 102555402 A CN102555402 A CN 102555402A CN 2012100127183 A CN2012100127183 A CN 2012100127183A CN 201210012718 A CN201210012718 A CN 201210012718A CN 102555402 A CN102555402 A CN 102555402A
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Abstract
The invention relates to a prebonding process of a metal-base copper-clad plate. The prebonding process comprises the following steps that: 1, a metal base plate, a glue film and an isolation film are sequentially overlapped from bottom to top; 2, an overlapped lamination is put into a pair roller type hot press for primary prebonding; 3, the isolation film on the primarily prebonded lamination is taken down, a copper foil is covered, and then, the isolation film is attached; 4, the overlapped lamination is put into the pair roller type hot press for secondary prebonding; and 5, the isolation film on the secondarily prebonded lamination is taken down, and the prebonding is completed. The prebonding process has the beneficial effects that the secondary prebonding process is adopted, air and water vapor among the metal base plate, the glue film and the copper foil can be thoroughly eliminated, the bubble generated in the high-temperature pressing process is avoided, meanwhile, because the metal base plate, the glue film and the copper foil are primarily bonded, the product quality influence caused by the water vapor in the air is avoided, and the overlapping and the pressing by loading into a press are also convenient.
Description
Technical field
The present invention relates to a kind of preparatory adhesion technique of Metal Substrate copper-clad plate, relate in particular to the preparatory adhesion technique that the field is made in a kind of copper-clad plate.
Background technology
Along with the power density and the packaging density of electronic product constantly improves, the heat radiation of wiring board is required also constantly to improve, so the application of metal base circuit board constantly enlarges, the demand of Metal Substrate copper-clad plate also enlarges.
The manufacture craft of metal current base copper-clad plate is before getting into press, and is successively superimposed good the product of preparing compacting, puts into press then, under HTHP, carries out pressing and solidifies.The lamination process more complicated, fixing relatively difficulty between the lamination.
Because lamination process is carried out at normal temperatures and pressures, therefore between metal base plate, glued membrane and Copper Foil, inevitably there is free G&W vapour to bring into; After getting into press though a process that vacuumizes is arranged, because superimposed good between the various materials at this moment, and owing to the reason of gravity; The material of lower floor is by tight compacting, and the effect that very difficult assurance vacuumizes causes the pressure when needing to improve pressing; Unstable product quality, qualification rate is low.
Summary of the invention
The object of the invention is exactly to solve the problem that exists in the above-mentioned background technology, and the preparatory adhesion technique of a kind of copper-clad plate steady quality that makes and stitching operation Metal Substrate copper-clad plate easily is provided.
To achieve these goals, the technical scheme taked of the present invention is:
A kind of preparatory adhesion technique of Metal Substrate copper-clad plate, form by following steps:
1,, carry out superimposed from down to up in order with metal base plate, glued membrane and barrier film;
2, superimposed good lamination is put into to carry out the first time in the pair roller type hot press bonding in advance, bonding temperature is 100～170 ℃ in advance for the first time, and bonding lamination fltting speed is 0.05m～1.0m/min in advance for the first time;
3, take off the barrier film on the bonding good lamination for the first time in advance, be covered with Copper Foil, and then be covered with barrier film;
4, superimposed good lamination is put into to carry out the second time in the pair roller type hot press bonding in advance, bonding temperature is 100～180 ℃ in advance for the second time, and bonding lamination fltting speed is 0.05m～1.0m/min in advance for the second time;
5, take off the barrier film on the bonding good lamination for the second time in advance, adhesion process is accomplished in advance.
Preferably, the metal base plate in the said step 1 can be aluminium sheet, copperplate or iron plate.
Preferably, for the first time preparatory bonding temperature is 140～160 ℃ in the said step 2, and bonding lamination fltting speed is preferably 0.1m～0.5m/min in advance for the first time.
Preferably, for the second time preparatory bonding temperature is 140～170 ℃ in the said step 4, and bonding lamination fltting speed is preferably 0.1m～0.5m/min in advance for the second time.
Beneficial effect of the present invention is: adopted the preparatory adhesion technique of secondary, can more completely air between metal base plate, glued membrane and Copper Foil and steam have been driven out of, avoided in high temperature pressing process, producing bubble, improved the quality of product; Simultaneously, because that metal base plate, glued membrane is tentatively bonding with Copper Foil, avoided of the influence of airborne steam, also conveniently carried out superimposedly carrying out pressing with the press of packing into to product quality.
Description of drawings
Fig. 1 is the preparatory bonding superimposed sketch map first time of the present invention;
Fig. 2 is the preparatory bonding superimposed sketch map second time of the present invention;
Fig. 3 is the sketch map after the preparatory bonding completion;
Label among the figure: 1-metal base plate, 2-glued membrane, 3-Copper Foil, 4-barrier film.
The specific embodiment
Through specific embodiment the present invention is done further explain below, but be not restriction protection domain of the present invention.
Embodiment 1
Like Fig. 1,2, shown in 3, a kind of preparatory adhesion technique of Metal Substrate copper-clad plate, form by following steps:
1, in order with metal base plate 1, glued membrane 2 and barrier film 4, carry out superimposed from down to up;
2, superimposed good lamination is put into to carry out the first time in the pair roller type hot press bonding in advance, bonding temperature is 100～170 ℃ in advance for the first time, and bonding lamination fltting speed is 0.05m～1.0m/min in advance for the first time;
3, take off the barrier film 4 on the bonding good lamination for the first time in advance, be covered with Copper Foil 3, and then enclose barrier film 4;
4, superimposed good lamination is put into to carry out the second time in the pair roller type hot press bonding in advance, bonding temperature is 100～180 ℃ in advance for the second time, and bonding lamination fltting speed is 0.05m～1.0m/min in advance for the second time;
5, take off the barrier film 4 on the bonding good lamination for the second time in advance, adhesion process is accomplished in advance.
Metal base plate in the said step 1 can be aluminium sheet, copperplate or iron plate.
For the first time preparatory bonding temperature is 140～160 ℃ in the said step 2, and bonding lamination fltting speed is preferably 0.1m～0.5m/mi in advance for the first time.
For the second time preparatory bonding temperature is 140～170 ℃ in the said step 4, and bonding lamination fltting speed is preferably 0.1m～0.5m/min in advance for the second time.
A kind of preparatory adhesion technique of aluminium base copper-clad plate from down to up carries out superimposed by order shown in Figure 1 ready aluminium sheet, glued membrane and barrier film; Superimposed good lamination put into to carry out the first time in the pair roller type hot press bonding in advance, temperature is 150 ℃, and the fltting speed of lamination is 0.2m/min; Take off the barrier film on the bonding good lamination for the first time in advance, be covered with Copper Foil, and then enclose barrier film; Superimposed good lamination for the second time put into to carry out the second time in the pair roller type hot press bonding in advance, temperature is 155 ℃, and the fltting speed of lamination is 0.15m/min; Take off the barrier film on the bonding good lamination for the second time in advance, adhesion process is accomplished in advance.
Claims (4)
1. the preparatory adhesion technique of a Metal Substrate copper-clad plate is characterized in that: be made up of following steps:
The first step in order with metal base plate, glued membrane and barrier film, is carried out superimposed from down to up;
Second step, superimposed good lamination put into to carry out first time in the pair roller type hot press bonding in advance, bonding temperature is 100～170 ℃ in advance for the first time, for the first time preparatory bonding lamination fltting speed is 0.05m～1.0m/min;
The 3rd step, take off the barrier film on the preparatory bonding good lamination for the first time, be covered with Copper Foil, and then enclose barrier film;
The 4th step, superimposed good lamination put into to carry out second time in the pair roller type hot press bonding in advance, bonding temperature is 100～180 ℃ in advance for the second time, for the second time preparatory bonding lamination fltting speed is 0.05m～1.0m/min;
In the 5th step, take off adhesion process completion in advance to the barrier film on the bonding good lamination for the second time in advance.
2. according to the preparatory adhesion technique of the said Metal Substrate copper-clad plate of claim 1, it is characterized in that: the metal base plate in the said step 1 can be aluminium sheet, copperplate or iron plate.
3. according to the preparatory adhesion technique of the said Metal Substrate copper-clad plate of claim 1, it is characterized in that: for the first time preparatory bonding temperature is 140～160 ℃ in the said step 2, and bonding lamination fltting speed is preferably 0.1m～0.5m/min in advance for the first time.
4. according to the preparatory adhesion technique of the said Metal Substrate copper-clad plate of claim 1, it is characterized in that: for the second time preparatory bonding temperature is 140～170 ℃ in the said step 4, and bonding lamination fltting speed is preferably 0.1m～0.5m/min in advance for the second time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210012718.3A CN102555402B (en) | 2012-01-17 | 2012-01-17 | Prebonding process of metal-base copper-clad plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210012718.3A CN102555402B (en) | 2012-01-17 | 2012-01-17 | Prebonding process of metal-base copper-clad plate |
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| CN102555402A true CN102555402A (en) | 2012-07-11 |
| CN102555402B CN102555402B (en) | 2014-12-03 |
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| CN201210012718.3A Active CN102555402B (en) | 2012-01-17 | 2012-01-17 | Prebonding process of metal-base copper-clad plate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102912955A (en) * | 2012-11-12 | 2013-02-06 | 朱志迁 | Indoor suspended ceiling gusset plate and cladding process thereof |
| CN112911807A (en) * | 2021-01-19 | 2021-06-04 | 中国电子科技集团公司第二十九研究所 | Bottom graphical blind groove structure machining method and device |
| CN112911806A (en) * | 2021-01-19 | 2021-06-04 | 中国电子科技集团公司第二十九研究所 | Method and device for processing bottom-patterned multi-layer board blind groove structure |
Citations (3)
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|---|---|---|---|---|
| US20080073025A1 (en) * | 2006-09-21 | 2008-03-27 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing copper-clad laminate for VOP application |
| CN102029745A (en) * | 2010-08-31 | 2011-04-27 | 广东生益科技股份有限公司 | High-heat-conductivity metal-base copper foil coated laminated board and making method thereof |
| CN201937963U (en) * | 2011-01-04 | 2011-08-17 | 铜陵浩荣电子科技有限公司 | Pre-coating device for aluminum base plate |
-
2012
- 2012-01-17 CN CN201210012718.3A patent/CN102555402B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080073025A1 (en) * | 2006-09-21 | 2008-03-27 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing copper-clad laminate for VOP application |
| CN102029745A (en) * | 2010-08-31 | 2011-04-27 | 广东生益科技股份有限公司 | High-heat-conductivity metal-base copper foil coated laminated board and making method thereof |
| CN201937963U (en) * | 2011-01-04 | 2011-08-17 | 铜陵浩荣电子科技有限公司 | Pre-coating device for aluminum base plate |
Non-Patent Citations (3)
| Title |
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| 《印刷电路信息》 20031231 辜信实 "覆铜板技术（2）" 第16页 1-4 , 第6期 * |
| 辜信实: ""覆铜板技术（2）"", 《印刷电路信息》, no. 6, 31 December 2003 (2003-12-31), pages 16 * |
| 辜信实: "《印刷电路用覆铜箔层压板》", 28 February 2002, article "金属基覆铜板的结构与特性", pages: 366 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102912955A (en) * | 2012-11-12 | 2013-02-06 | 朱志迁 | Indoor suspended ceiling gusset plate and cladding process thereof |
| CN112911807A (en) * | 2021-01-19 | 2021-06-04 | 中国电子科技集团公司第二十九研究所 | Bottom graphical blind groove structure machining method and device |
| CN112911806A (en) * | 2021-01-19 | 2021-06-04 | 中国电子科技集团公司第二十九研究所 | Method and device for processing bottom-patterned multi-layer board blind groove structure |
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| Publication number | Publication date |
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| CN102555402B (en) | 2014-12-03 |
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