CN102510681A - Manufacturing method for golden finger and circuit board with golden finger - Google Patents
Manufacturing method for golden finger and circuit board with golden finger Download PDFInfo
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- CN102510681A CN102510681A CN2011103544668A CN201110354466A CN102510681A CN 102510681 A CN102510681 A CN 102510681A CN 2011103544668 A CN2011103544668 A CN 2011103544668A CN 201110354466 A CN201110354466 A CN 201110354466A CN 102510681 A CN102510681 A CN 102510681A
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- golden finger
- circuit board
- groove
- inwall
- surperficial
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Abstract
The invention discloses a manufacturing method for a golden finger. The manufacturing method comprises the following steps of: forming a groove at a first position on a circuit board, wherein the first position is adjacent to a second position and a manufactured surface golden finger is arranged at the second position; and electroplating the inner wall of the groove and forming a side golden finger connected with the surface golden finger, on the inner wall. The embodiment of the invention also provides a corresponding circuit board with the golden finger. According to the technical scheme disclosed by the invention, the side golden finger can be formed on the side surface of the circuit board; the requirements on the area and the space of the golden finger are reduced; the packaging density of the circuit board is increased; and the size of the circuit board is reduced.
Description
Technical field
The present invention relates to the circuit board technology field, be specifically related to a kind of method for manufacturing gold finger and a kind of circuit board with golden finger.
Background technology
Along with circuit board towards littler, thinner trend development, be applied in the factor that golden finger that circuit board connects has become the development of restriction circuit board.For guaranteeing the reliability of welding, routing; Golden finger often need guarantee the width of certain size; Two adjacent golden fingers also need guarantee the center distance of certain size, and the packaging density that this has just limited circuit board has hindered circuit board and developed to trend toward miniaturization.
Summary of the invention
The embodiment of the invention provides a kind of method for manufacturing gold finger and a kind of circuit board with golden finger; Can form the side golden finger in the side of circuit board; Reduction improves the packaging density of circuit board to the requirement of golden finger size and spacing, reduces the size of circuit board.
A kind of method for manufacturing gold finger comprises:
Primary importance is offered groove on circuit board, and the said primary importance and the second place are adjacent, has the surperficial golden finger of making on the said second place;
Inwall to said groove is electroplated, and on said inwall, forms the side golden finger that is connected with said surperficial golden finger.
A kind of circuit board with golden finger comprises:
This circuit board surface has the adjacent primary importance and the second place; Has surperficial golden finger on the said second place; Said primary importance is positioned at the edge of circuit board or has the groove of offering, and has the side golden finger that is connected with said surperficial golden finger on the inwall of the sidewall at said edge or said groove.
The embodiment of the invention is employed in and offers groove on the circuit board; The groove inwall is electroplated the technical scheme that forms the side golden finger, make the circuit board golden finger expand to the circuit board side, so that effectively utilize the side space of circuit board to weld perhaps routing connection etc. from circuit board surface; Also can satisfy package requirements even if the area of golden finger is less, spacing is less; So, can reduce the area of golden finger and spacing each other during making, produce more golden finger in littler space; Thereby improve the packaging density of circuit board, reduce the size of circuit board.
Description of drawings
Fig. 1 is the flow chart of the method for manufacturing gold finger that provides of the embodiment of the invention;
Fig. 2 a-2b is respectively circuit board front view and an end view of having made surperficial golden finger;
Fig. 2 c-2d is offering the circuit board front view and the end view of groove;
Fig. 3 a and 3b are the front view and the end views of the circuit board with golden finger of the embodiment of the invention respectively.
Embodiment
The embodiment of the invention provides a kind of method for manufacturing gold finger; Be employed in and offer groove on the circuit board; The groove inwall is electroplated the technical scheme that forms the side golden finger, can reduce the size of golden finger and spacing each other, produce more golden finger in littler space; Thereby improve the packaging density of circuit board, reduce the size of circuit board.The embodiment of the invention also provides the circuit board that has golden finger accordingly.Below be elaborated respectively.
Embodiment one,
Please refer to Fig. 1, the embodiment of the invention provides a kind of method for manufacturing gold finger, comprising:
101, primary importance is offered groove on circuit board, and the said primary importance and the second place are adjacent, has the surperficial golden finger of making on the said second place.
Shown in Fig. 2 a and 2b, has the surperficial golden finger of making 302 on the second place 202 of said circuit board 200.General, the second place 202 is positioned at the edge of circuit board 200 surfaces near its four edges.When the jigsaw that circuit board 200 is made up of two above veneers, the second place is positioned at the edge of each veneer surface near its four edges.Make surperficial golden finger in the said second place 202 and can adopt common process; Comprise: at the anti-plated film of circuit board 200 surface-coated; Through the exposure and the formation figure that develops; The position of formed figure covering board 200 surface except that the second place 202 through electroplating, forms surperficial golden finger 302 in the second place 202 then.
Shown in Fig. 2 c and 2d, primary importance 201 generally is positioned at the end of the second place 202 near board edge; When the jigsaw that circuit board 200 is made up of two above veneers, primary importance 201 in the second place 202 near an end of board edge or wherein between two veneers.Can adopt the dark miller skill of control to offer groove in primary importance 201.Said groove has certain degree of depth, but does not run through circuit board, the size decision of the side golden finger that this degree of depth forms according to the thickness of circuit board and needs, and the circuit board of a N layer for example, this groove can arrive at the N-1 layer the most deeply, and N is the integer greater than 2.
Under the ideal situation, the inwall of the groove of offering should be a plane.But in fact, in the dark miller of control skill, be that corresponding, the inwall of the groove of formation will be a curved surface with the milling cutter machined grooves, the size of this curved surface radian is definite by the diameter of milling cutter.For example can adopt the milling cutter machined grooves of 0.75mm diameter.
102, the inwall of said groove is electroplated, on said inwall, formed the side golden finger that is connected with said surperficial golden finger.
Can adopt the blind hole electroplating technology that the inwall of said groove is electroplated.General, after the circuit board blind hole is electroplated, generally also need consent, blind hole is filled and led up.And in the present embodiment, only need the inwall plating of groove is got final product, need not filling groove after the plating.
If said groove is positioned at the edge of circuit board, the electrodeposited coating that is positioned on the groove inwall after then electroplating directly forms available side golden finger, and this side golden finger is connected with the surperficial golden finger of circuit board surface.
The jigsaw that ifs circuit plate 200 is made up of two above veneers; And groove is between two veneers the time; After the groove inwall electroplated, also need said jigsaw be divided into one by one independently veneer, make said side golden finger be positioned at the side of said veneer.
Plating finishes, and the circuit board 200 that has surperficial golden finger 302 and side golden finger 301 in the time of formation is shown in Fig. 3 a and 3b.General, surperficial golden finger 302 is uniformly distributed in the edge of circuit board surface near its four faces, and side golden finger 302 is uniformly distributed in circuit board side all around, and surperficial golden finger 302 connects one to one with side golden finger 301.Surface golden finger 302 is identical with the width of side golden finger 301.Said circuit board can be the camera substrate, and the width of its side golden finger can be 750 microns, and the center distance of two adjacent surperficial golden fingers 302 can be 900 microns.Said circuit board can also be the other products circuit board, and described width and center distance can also be other greater or lesser sizes.
To sum up, the embodiment of the invention provides a kind of method for manufacturing gold finger, is employed in and offers groove on the circuit board; The groove inwall is electroplated the technical scheme that forms the side golden finger, make the circuit board golden finger expand to the circuit board side, so that effectively utilize the side space of circuit board to weld perhaps routing connection etc. from circuit board surface; Also can satisfy package requirements even if the area of golden finger is less, spacing is less; So, can reduce the area of golden finger and spacing each other during making, produce more golden finger in littler space; Thereby improve the packaging density of circuit board, reduce the size of circuit board.
Embodiment two,
Please refer to Fig. 3 a and 3b, the embodiment of the invention provides a kind of circuit board with golden finger.
These circuit board 200 surfaces have the adjacent primary importance 201 and the second place 202; Has surperficial golden finger 302 on the said second place 202; Said primary importance 201 is positioned at the edge of circuit board 200 or has the groove of offering, and has the side golden finger 301 that is connected with said surperficial golden finger 302 on the inwall of the sidewall at said edge or said groove.
Wherein, said side golden finger 301 is identical with the width of said surperficial golden finger 302.
Said circuit board can be the camera substrate, and the width of its side golden finger can be 750 microns, and the center distance of two adjacent surperficial golden fingers can be 900 microns.Said circuit board can also be the other products circuit board, and described width and center distance can also be other greater or lesser sizes.
To sum up; The embodiment of the invention provides a kind of circuit board with golden finger; This circuit board not only has submarginal surperficial golden finger, also has to be positioned at the side golden finger circuit board side, that be connected with surperficial golden finger, can effectively utilize the side space of circuit board to weld or the routing connection; Also can satisfy package requirements even if the area of golden finger is less, spacing is less, thereby this kind circuit board can have higher packaging density and littler size.
More than method for manufacturing gold finger that the embodiment of the invention provided and the circuit board with golden finger have been carried out detailed introduction; But the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof, should not be construed as limitation of the present invention.Those skilled in the art are in the technical scope that the present invention discloses, and the variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.
Claims (7)
1. a method for manufacturing gold finger is characterized in that, comprising:
Primary importance is offered groove on circuit board, and the said primary importance and the second place are adjacent, has the surperficial golden finger of making on the said second place;
Inwall to said groove is electroplated, and on said inwall, forms the side golden finger that is connected with said surperficial golden finger.
2. method according to claim 1 is characterized in that, said on circuit board primary importance offer groove and comprise:
Adopt the dark miller skill of control primary importance on circuit board to offer groove.
3. method according to claim 1 is characterized in that, said inwall to said groove is electroplated and comprised:
Adopt the blind hole electroplating technology that the inwall of said groove is electroplated.
4. according to claim 1,2 or 3 described methods, it is characterized in that:
The said second place is positioned at the edge of said circuit board.
5. according to claim 1,2 or 3 described methods, it is characterized in that:
The jigsaw that said circuit board is made up of two above veneers, the said second place are at the edge of said jigsaw or wherein between two veneers;
Said inwall to said groove is electroplated, on said inwall, form with side golden finger that said surperficial golden finger is connected after also comprise:
Said jigsaw is divided into two above veneers, makes said side golden finger be positioned at the side of said veneer.
6. circuit board with golden finger is characterized in that:
This circuit board surface has the adjacent primary importance and the second place; Has surperficial golden finger on the said second place; Said primary importance is positioned at the edge of circuit board or has the groove of offering, and has the side golden finger that is connected with said surperficial golden finger on the inwall of the sidewall at said edge or said groove.
7. the circuit board with golden finger according to claim 6 is characterized in that:
Said side golden finger is identical with the width of said surperficial golden finger, and this width is 750 microns, and the center distance of two adjacent surperficial golden fingers is 900 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110354466.8A CN102510681B (en) | 2011-11-10 | 2011-11-10 | Manufacturing method for golden finger and circuit board with golden finger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110354466.8A CN102510681B (en) | 2011-11-10 | 2011-11-10 | Manufacturing method for golden finger and circuit board with golden finger |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102510681A true CN102510681A (en) | 2012-06-20 |
| CN102510681B CN102510681B (en) | 2015-05-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110354466.8A Active CN102510681B (en) | 2011-11-10 | 2011-11-10 | Manufacturing method for golden finger and circuit board with golden finger |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
| CN103412663A (en) * | 2013-03-30 | 2013-11-27 | 深圳欧菲光科技股份有限公司 | Golden finger and touch screen |
| US9179547B2 (en) | 2013-03-30 | 2015-11-03 | Shenzhen O-Film Tech Co., Ltd. | Gold finger and touch screen |
| CN107770952A (en) * | 2016-08-16 | 2018-03-06 | 新华三技术有限公司 | PCB preparation method and PCB construction |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0926935A1 (en) * | 1997-12-23 | 1999-06-30 | Aerospatiale Societe Nationale Industrielle | Device and process for interconnecting between two electronic devices |
| JP2004259995A (en) * | 2003-02-26 | 2004-09-16 | Kyocera Corp | Circuit board mounted with electronic component and manufacturing method thereof |
| CN201937955U (en) * | 2010-11-26 | 2011-08-17 | 比亚迪股份有限公司 | Circuit board and module |
-
2011
- 2011-11-10 CN CN201110354466.8A patent/CN102510681B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0926935A1 (en) * | 1997-12-23 | 1999-06-30 | Aerospatiale Societe Nationale Industrielle | Device and process for interconnecting between two electronic devices |
| JP2004259995A (en) * | 2003-02-26 | 2004-09-16 | Kyocera Corp | Circuit board mounted with electronic component and manufacturing method thereof |
| CN201937955U (en) * | 2010-11-26 | 2011-08-17 | 比亚迪股份有限公司 | Circuit board and module |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103153000A (en) * | 2013-02-01 | 2013-06-12 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
| CN103153000B (en) * | 2013-02-01 | 2015-07-22 | 东莞生益电子有限公司 | Manufacture method for gold finger circuit board and circuit board manufactured by method |
| CN103412663A (en) * | 2013-03-30 | 2013-11-27 | 深圳欧菲光科技股份有限公司 | Golden finger and touch screen |
| CN103412663B (en) * | 2013-03-30 | 2014-10-29 | 深圳欧菲光科技股份有限公司 | Golden finger and touch screen |
| US9179547B2 (en) | 2013-03-30 | 2015-11-03 | Shenzhen O-Film Tech Co., Ltd. | Gold finger and touch screen |
| CN107770952A (en) * | 2016-08-16 | 2018-03-06 | 新华三技术有限公司 | PCB preparation method and PCB construction |
| CN107770952B (en) * | 2016-08-16 | 2020-03-06 | 新华三技术有限公司 | PCB manufacturing method and PCB structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102510681B (en) | 2015-05-20 |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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