CN102497767A - Heat absorbing pump for surface mounting component - Google Patents
Heat absorbing pump for surface mounting component Download PDFInfo
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- CN102497767A CN102497767A CN2011104231853A CN201110423185A CN102497767A CN 102497767 A CN102497767 A CN 102497767A CN 2011104231853 A CN2011104231853 A CN 2011104231853A CN 201110423185 A CN201110423185 A CN 201110423185A CN 102497767 A CN102497767 A CN 102497767A
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- radiator
- surface mount
- printed circuit
- circuit board
- mount component
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Abstract
The invention discloses a heat absorbing pump for a surface mounting component comprising a heat radiating body and at least one PCB weld spot. The heat radiating body adopts a metal wire with any shape and high heat conducting coefficient; one end of the metal wire is welded at the weld spot of the PCB, and the other end of the metal wire is exposed in a space in a contactless manner; and the weld spot of the PCB is located on a heat source pin of the surface mounting component or a copper clad communicated with the most close heat source pin. The invention has the advantages of supper high heat radiating efficiency, the selection of the heat radiating body is convenient, the mount process is simple, the cost is low; and besides, the thermal resistance between the heat source and the heat radiating body is close to zero, and the temperature of a power type surface mounting component can be effectively lowered.
Description
Technical field
The present invention relates to the heat abstractor of Surface Mount Component, in a kind of electronic product.
Background technology
Strong functions is more held in the consumer electronics product market demands in more and more little space.Adopting surface mounting technology is the effective ways that improve packaging density.Compare with square type flat packaging device in the past, the size of physical form and size has significant different, Surface Mount Component, more become miniaturization, microminiaturization; Compare with the via devices that is adopted in the past, more being becoming tight and gathering in Surface Mount Component, shared space on printed circuit board (PCB), has further increased heat density, thereby increased the complexity and the degree of difficulty of thermal design.As everyone knows, high temperature can produce very injurious effects to the performance of electronic devices and components.According to reliability theory, 10 ℃ of the every risings of the surface temperature of components and parts, the life-span will reduce half the.Therefore, the cooling of heating components and parts is the vital task of product design always.
In order to improve the hot property of surface mount device; Can carry out comprehensive thermal design to device assembling itself handles; Increase the area and the heat transfer path that increases in the assembly of leadframe; Other is such as increasing die-size, increase the power line that copper material processes and the area of earth connection, and reduces and seal the thick or the like of plastics, also can improve the heat dispersion of surface mount device.Yet all surface mounts the inner thermal design measure that is increased of components and parts, will cause expense to increase, and also has influence on reliability of structure.
For the outside cooling measure of power-type Surface Mount Component,, in general the application, the main area that strengthens the printed circuit board Copper Foil that is connected with these components and parts that relies on solves.But under the condition of high assembled density, the printed circuit board Copper Foil area that can increase is extremely limited.When more radiating requirements, can on these components and parts, be coated with the insulation silicone grease of heat conduction usually earlier, install suitable metal heat sink again additional.The heat dissipating method of this usual employing, not only processing technology is complicated, and cost is higher, and more owing to be indirect contact between the thermal source of heat abstractor and components and parts, the thermal resistance of being introduced causes radiating efficiency to reduce.The unit of thermal resistance is ℃/W.Thermal resistance is bigger, and it is poorer to dispel the heat.
Surface-pasted power device is when work, and usually, the heat of tube core is transmitted to shell through encapsulating material earlier, passes to printed circuit board through shell and covers Copper Foil or radiator heat-dissipation face, is passed in the surrounding air by radiating surface again.Conducting path according to this heat; If tube core is transmitted to the thermal resistance θ JC of shell; Shell passes to the thermal resistance θ CS that printed circuit board covers Copper Foil or radiator; Printed circuit board covers the thermal resistance θ SA that Copper Foil or radiator heat-dissipation face pass to surrounding air, and then the entire thermal resistance θ JA from the tube core to the surrounding air equals the thermal resistance sum of heat transfer process, that is: θ JA=θ JC+θ CS+θ SA.Reduce the raising that entire thermal resistance means radiating efficiency.
Common heat radiation thinking is to manage components and parts are dispersed into surrounding space effectively in the temperature of its package surface.
Summary of the invention
Technical problem to be solved by this invention is the absorption heat pump that a kind of Surface Mount Component, of high efficiency and heat radiation will be provided, and utilizes the heat pump effect, makes direct subsides be welded in printed circuit board and covers the Surface Mount Component, ability high efficiency and heat radiation on the Copper Foil.
In order to solve above technical problem; The invention provides a kind of absorption heat pump of Surface Mount Component,, include radiator and at least one printed circuit board solder joint, said radiator is the metal wire rod of the high thermal conductivity coefficient of arbitrary shape; One end of metal wire rod is welded on the pad of printed circuit board; The contactless space that is exposed to of the other end, said printed circuit board solder joint is positioned at Surface Mount Component, thermal source pin or the printed circuit board that is communicated with near the thermal source pin and covers on the Copper Foil.
Described radiator has at least an end points directly to be welded on Surface Mount Component, thermal source pin or the printed circuit board that is communicated with near the thermal source pin to cover on the Copper Foil.
Described heat radiation system adopts copper, and aluminium or iron have the metal wire rod of good heat conductive performance and processes.
Described radiator is exposed to the position, space, adopts the copper wire in suitable line footpath to be processed into linear pattern, or shaped form, or spiral type, or in the surface wire drawing of circular metal line, or with the surface area of its flattening with the heat radiation of increase radiator.
The heat radiation of heater has four kinds of approach usually: (1) sends the heat loss through conduction of the low object of temperature to through contact; (2) rely on the heat loss through convection of air flow heat-shift; (3) pass to the evaporative heat loss that heat loss through radiation and (4) heater liquid evaporation through the surface in the lower surrounding environment of temperature dispels the heat with the heat ray form.
When improving heat loss through conduction efficient, make the radiator except the metal material of selecting high thermal conductivity coefficient for use, manage to reduce the thermal resistance of conduction path exactly.The present invention is implementing when directly being mounted on the heat radiation of the surface-pasted components and parts of power-type on the printed circuit board; The printed circuit board that does not painstakingly strengthen corresponding site covers the thickness and the area of Copper Foil; Be not employed on the components and parts body of heating yet and install radiator additional through the coating thermal conductive insulation glue; But with the metal wire rod of high thermal conductivity coefficient; The copper cash of one section suitable diameter for example; With heating components and parts thermal source or be welded on printed circuit board and cover on the pad that Copper Foil communicates near the leading foot of thermal source, make radiator be approximately zero contact heat resistance and directly be communicated with thermal source, the heat of heater conducts to the lower radiator of temperature with the highest efficient through pump efficiency with should having no to stop.
Adopt this mode that Surface Mount Component, is dispelled the heat, radiator is so long as conductive coefficient preferred metal wire rod gets final product, and it is very convenient therefore to draw materials.According to the requirement of heat dissipation capacity, choose suitable line footpath and length.The shape of radiator can be a linear pattern, also can bend to various shaped forms, or is processed into spiral type, and secondary forming process is simple.If further increase the surface area of radiator, can be employed in circular wire surface and carry out the wire drawing processing.The installation of radiator can adopt the machine plug-in unit to enhance productivity easily.
Advantage of the present invention: the metal wire rod by the thermal resistance of appropriate size is less is made radiator; Directly being welded on needs on the printed circuit board on heat radiation elements and the pin that its pyrotoxin communicates; Because the thermal resistance between pyrotoxin and the radiator approaches zero; Answer through pump efficiency, can effectively the heat that produces on the components and parts be distributed.Facts have proved, adopt this absorption heat pump, the surface temperature that can make the power-type Surface Mount Component, easily is than reducing more than 10 ℃ originally.This absorption heat pump is particularly suitable for covering the Copper Foil area and comprising that increasing the quantity of covering copper vias still is not enough to obtain enough heat radiations by strengthening printed circuit board; And on the encapsulating housing of Surface Mount Component,, install the inconvenient occasion of external radiator additional; Also can be used to bigger with volume; The higher via devices of cost changes surface mount device into, to dwindle small product size and to reduce cost; Radiating efficiency extra-high-speed, radiator are drawn materials conveniently, and mounting process is simple, and is with low cost.
Description of drawings
Fig. 1 is the structural representation of the absorption heat pump of linear pattern radiator Surface Mount Component;
Fig. 2 is the structural representation of the absorption heat pump of shaped form radiator Surface Mount Component;
Fig. 3 is the structural representation of the absorption heat pump of spiral type type radiator Surface Mount Component;
Fig. 4 with the circular metal line (in) surperficial wire drawing (right side) or flatten (left side) and can increase the radiator cooling surface area;
Label declaration among the figure
1a-linear pattern radiator; 1b-shaped form radiator;
1c-spiral type radiator; 2-printed circuit plate insulating layer;
3-printed circuit board covers Copper Foil radiator pad; 4-Surface Mount Component, thermal source pin welding cover Copper Foil;
5-Surface Mount Component, thermal source pin; 6-Surface Mount Component.
Embodiment
See also shown in the accompanying drawing, the present invention is done further description.
The invention provides a kind of absorption heat pump of Surface Mount Component; Include radiator and at least one printed circuit board solder joint; Said radiator is the metal wire rod of the high thermal conductivity coefficient of arbitrary shape, and an end of metal wire rod is welded on the pad of printed circuit board, the contactless space that is exposed to of the other end; Said printed circuit board solder joint is positioned at Surface Mount Component, thermal source pin or the printed circuit board that is communicated with near the thermal source pin and covers on the Copper Foil.
Described radiator has at least an end points directly to be welded on Surface Mount Component, thermal source pin or the printed circuit board that is communicated with near the thermal source pin to cover on the Copper Foil.
Described heat radiation system adopts copper, and aluminium or iron have the metal wire rod of good heat conductive performance and processes.
Like Fig. 1-shown in Figure 4, described radiator is exposed to the position, space, adopts the copper wire in suitable line footpath to be processed into linear pattern 1a, or shaped form 1b, or spiral type 1c, or in the surface wire drawing of circular metal line, or it is flattened to increase the surface area of radiator heat radiation.
When improving heat loss through conduction efficient, make the radiator except the metal material of selecting high thermal conductivity coefficient for use, manage to reduce the thermal resistance of conduction path exactly.The present invention is implementing when directly being mounted on the heat radiation of the surface-pasted components and parts of power-type on the printed circuit board; The printed circuit board that does not painstakingly strengthen corresponding site covers the thickness and the area of Copper Foil; Be not employed on the components and parts body of heating yet and install radiator additional through the coating thermal conductive insulation glue; But with the metal wire rod of high thermal conductivity coefficient; The copper cash of one section suitable diameter for example; With heating components and parts thermal source or be welded on printed circuit board and cover on the pad that Copper Foil communicates near the leading foot of thermal source, make radiator be approximately zero contact heat resistance and directly be communicated with thermal source, the heat of heater conducts to the lower radiator of temperature with the highest efficient through pump efficiency with should having no to stop.
Adopt this mode that Surface Mount Component, is dispelled the heat, radiator is so long as conductive coefficient preferred metal wire rod gets final product, and it is very convenient therefore to draw materials.According to the requirement of heat dissipation capacity, choose suitable line footpath and length.The shape of radiator can be a linear pattern, also can bend to various shaped forms, or is processed into spiral type, and secondary forming process is simple.If further increase the surface area of radiator, can be employed in circular wire surface and carry out the wire drawing processing.The installation of radiator can adopt the machine plug-in unit to enhance productivity easily.
The present invention carries out as follows:
At first prepare the radiator processed by the high-thermal conductive metal material.The end of said radiator should be suitable for and can on the pad of printed circuit board, be welded.According to the copper cash of one section suitably thick fine line diameter of the big or small intercepting of heat dissipation capacity and suitable length, and, be processed into linear pattern (1a among Fig. 1) or shaped form (1b among Fig. 2) or spiral type required forms such as (1c among Fig. 3) according to the situation in space capable of using.
Next is on printed circuit board, to find out the thermal source of the Surface Mount Component, that needs heat radiation or near the pin 5 of thermal source.The thermal source of said Surface Mount Component, or refer near the pin of thermal source: arbitrary pin of pellet resistance or semiconductor diode; Bipolar transistor collector electrode pin, field-effect transistor drain lead, the liner plate of controllable silicon or other semiconductor device (substrate) pin.
Then, on the printed circuit board with the thermal source of the Surface Mount Component, of needs heat radiations or near pin 5 welding of thermal source cover that Copper Foil 4 is connected and as far as possible near the position at least one pad 3 is set.
On the pad 3 near the position as far as possible that at last pin of said radiator is welded on the thermal source of above-mentioned setting and the Surface Mount Component, needs heat radiation or is connected near the pin of thermal source, constitute the absorption heat pump of high efficiency and heat radiation.The heat that Surface Mount Component, produced that needs heat radiation is from thermal source or be transmitted to radiator and distribute in the space towards periphery to be approximately zero thermal resistance near the pin of thermal source.
Claims (4)
1. the absorption heat pump of a Surface Mount Component; Include radiator and at least one printed circuit board solder joint; It is characterized in that: said radiator is the metal wire rod of the high thermal conductivity coefficient of arbitrary shape, and an end of metal wire rod is welded on the pad of printed circuit board, the contactless space that is exposed to of the other end; Said printed circuit board solder joint is positioned at Surface Mount Component, thermal source pin or the printed circuit board that is communicated with near the thermal source pin and covers on the Copper Foil.
2. by the absorption heat pump of the described a kind of Surface Mount Component, of claim 1, it is characterized in that: described radiator has at least an end points directly to be welded on Surface Mount Component, thermal source pin or the printed circuit board that is communicated with near the thermal source pin to cover on the Copper Foil.
3. by the absorption heat pump of the described a kind of Surface Mount Component, of claim 1, it is characterized in that: described heat radiation system adopts copper, and aluminium or iron have the metal wire rod of good heat conductive performance and processes.
4. press the absorption heat pump of the described a kind of Surface Mount Component, of claim 3; It is characterized in that: described radiator is exposed to the position, space; Adopt the copper wire in suitable line footpath to be processed into linear pattern, or shaped form, or spiral type; Or in the surface wire drawing of circular metal line, or with the surface area of its flattening with the heat radiation of increase radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104231853A CN102497767A (en) | 2011-12-16 | 2011-12-16 | Heat absorbing pump for surface mounting component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104231853A CN102497767A (en) | 2011-12-16 | 2011-12-16 | Heat absorbing pump for surface mounting component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102497767A true CN102497767A (en) | 2012-06-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104231853A Pending CN102497767A (en) | 2011-12-16 | 2011-12-16 | Heat absorbing pump for surface mounting component |
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| CN (1) | CN102497767A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102752994A (en) * | 2012-07-24 | 2012-10-24 | 珠海市凡信科技有限公司 | Driver |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020131240A1 (en) * | 2001-03-16 | 2002-09-19 | Lg Electronics Inc. | Heat dissipation structure of integrated circuit (IC) |
| CN2515799Y (en) * | 2001-11-09 | 2002-10-09 | 岳亨科技股份有限公司 | Radiator |
| CN101106894B (en) * | 2007-08-01 | 2010-06-09 | 锐德科无线通信技术(上海)有限公司 | Heat dispersion structure for RF power amplifier circuit |
-
2011
- 2011-12-16 CN CN2011104231853A patent/CN102497767A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020131240A1 (en) * | 2001-03-16 | 2002-09-19 | Lg Electronics Inc. | Heat dissipation structure of integrated circuit (IC) |
| CN2515799Y (en) * | 2001-11-09 | 2002-10-09 | 岳亨科技股份有限公司 | Radiator |
| CN101106894B (en) * | 2007-08-01 | 2010-06-09 | 锐德科无线通信技术(上海)有限公司 | Heat dispersion structure for RF power amplifier circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102752994A (en) * | 2012-07-24 | 2012-10-24 | 珠海市凡信科技有限公司 | Driver |
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Application publication date: 20120613 |