CN102483642B - 为快速热循环提供低热不均匀的热块组件和仪器 - Google Patents

为快速热循环提供低热不均匀的热块组件和仪器 Download PDF

Info

Publication number
CN102483642B
CN102483642B CN201080038911.3A CN201080038911A CN102483642B CN 102483642 B CN102483642 B CN 102483642B CN 201080038911 A CN201080038911 A CN 201080038911A CN 102483642 B CN102483642 B CN 102483642B
Authority
CN
China
Prior art keywords
thermal
block assembly
sample
block
thermal block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080038911.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN102483642A (zh
Inventor
J.沃托维奇
G.达尔霍夫
D.W.格鲁内瓦尔德
T.A.康纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Life Technologies Corp
Original Assignee
Life Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Life Technologies Corp filed Critical Life Technologies Corp
Publication of CN102483642A publication Critical patent/CN102483642A/zh
Application granted granted Critical
Publication of CN102483642B publication Critical patent/CN102483642B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L7/00—Heating or cooling apparatus; Heat insulating devices
    • B01L7/52—Heating or cooling apparatus; Heat insulating devices with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0809—Geometry, shape and general structure rectangular shaped
    • B01L2300/0829—Multi-well plates; Microtitration plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/18—Means for temperature control
    • B01L2300/1805—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks
    • B01L2300/1822—Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks using Peltier elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Devices For Use In Laboratory Experiments (AREA)
CN201080038911.3A 2009-09-01 2010-09-01 为快速热循环提供低热不均匀的热块组件和仪器 Expired - Fee Related CN102483642B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23901209P 2009-09-01 2009-09-01
US61/239012 2009-09-01
PCT/US2010/047573 WO2011028834A2 (en) 2009-09-01 2010-09-01 Thermal block assemblies and instruments providing low thermal non-uniformity for rapid thermal cycling

Publications (2)

Publication Number Publication Date
CN102483642A CN102483642A (zh) 2012-05-30
CN102483642B true CN102483642B (zh) 2014-12-24

Family

ID=43646772

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080038911.3A Expired - Fee Related CN102483642B (zh) 2009-09-01 2010-09-01 为快速热循环提供低热不均匀的热块组件和仪器

Country Status (7)

Country Link
US (2) US10049895B2 (https=)
EP (1) EP2473893B1 (https=)
JP (2) JP5781513B2 (https=)
CN (1) CN102483642B (https=)
IN (1) IN2012DN02105A (https=)
SG (1) SG178411A1 (https=)
WO (1) WO2011028834A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10137452B2 (en) 2010-04-09 2018-11-27 Life Technologies Corporation Thermal uniformity for thermal cycler instrumentation using dynamic control

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204625602U (zh) * 2013-09-16 2015-09-09 生命科技股份有限公司 热框组件和热循环系统
EP3401016A1 (en) 2014-02-18 2018-11-14 Life Technologies Corporation Apparatuses, systems and methods for providing scalable thermal cyclers and isolating thermoelectric devices
US11003808B2 (en) * 2015-09-30 2021-05-11 Siemens Industry Software Inc. Subtractive design for heat sink improvement
WO2018132896A1 (en) * 2017-01-18 2018-07-26 Bigz Tech Inc. Transient heat absorption and delayed dissipation by high heat capacity material
GB201812192D0 (en) * 2018-07-26 2018-09-12 Ttp Plc Variable temperature reactor, heater and control circuit for the same
EP3912199B1 (en) * 2019-01-14 2025-08-20 Bio-Rad Laboratories, Inc. Heat pump device and assembly
KR102651375B1 (ko) * 2019-03-18 2024-03-26 주식회사 씨젠 샘플 홀더 어셈블리를 포함하는 써멀 사이클러
CN212084987U (zh) * 2020-07-09 2020-12-04 宁波市哈雷换热设备有限公司 一种承压能力强的芯片冷却器
KR20240056761A (ko) * 2021-10-29 2024-04-30 주식회사 씨젠 열블록

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1458510A (zh) * 2002-05-17 2003-11-26 阿特拉斯材料测试技术有限责任公司 动态温度控制加速风化试验设备
US6703236B2 (en) * 1990-11-29 2004-03-09 Applera Corporation Thermal cycler for automatic performance of the polymerase chain reaction with close temperature control
US6962821B2 (en) * 1993-10-20 2005-11-08 Stratagene California Thermal cycler including a temperature gradient block
US7133726B1 (en) * 1997-03-28 2006-11-07 Applera Corporation Thermal cycler for PCR

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3566959A (en) * 1969-07-17 1971-03-02 Controlled Power Corp Heat sink
US3841853A (en) * 1972-09-05 1974-10-15 Owens Corning Fiberglass Corp Apparatus for production of thermoplastic materials
US4602651A (en) * 1978-05-30 1986-07-29 Roppatte Jr Michael Liquid applicator device with hair-parting wand
US4345837A (en) 1980-06-27 1982-08-24 Farrand Optical Co., Inc. Enhanced fluorescent emission
US5038852A (en) 1986-02-25 1991-08-13 Cetus Corporation Apparatus and method for performing automated amplification of nucleic acid sequences and assays using heating and cooling steps
GB8606641D0 (en) * 1986-03-18 1986-04-23 British Petroleum Co Plc Testing device
US4753290A (en) * 1986-07-18 1988-06-28 Unisys Corporation Reduced-stress heat sink device
KR100236506B1 (ko) * 1990-11-29 2000-01-15 퍼킨-엘머시터스인스트루먼츠 폴리머라제 연쇄 반응 수행 장치
US5318361A (en) * 1993-06-01 1994-06-07 Bell Communications Research, Inc. Rapid temperature cycling for accelerated stress testing
CA2130013C (en) 1993-09-10 1999-03-30 Rolf Moser Apparatus for automatic performance of temperature cycles
US5849208A (en) 1995-09-07 1998-12-15 Microfab Technoologies, Inc. Making apparatus for conducting biochemical analyses
US6039471A (en) * 1996-05-22 2000-03-21 Integrated Device Technology, Inc. Device for simulating dissipation of thermal power by a board supporting an electronic component
EP2156892B1 (en) 1997-03-28 2013-05-08 Applera Corporation Thermal cycler for PCR
US6301779B1 (en) * 1998-10-29 2001-10-16 Advanced Thermal Solutions, Inc. Method for fabricating a heat sink having nested extended surfaces
GB9826237D0 (en) * 1998-11-30 1999-01-20 Hybaid Ltd Thermal cycler
EP1045038A1 (en) * 1999-04-08 2000-10-18 Hans-Knöll-Institut Für Naturstoff-Forschung E.V. Rapid heat block thermocycler
US6337435B1 (en) 1999-07-30 2002-01-08 Bio-Rad Laboratories, Inc. Temperature control for multi-vessel reaction apparatus
US6657169B2 (en) 1999-07-30 2003-12-02 Stratagene Apparatus for thermally cycling samples of biological material with substantial temperature uniformity
US6496373B1 (en) * 1999-11-04 2002-12-17 Amerasia International Technology, Inc. Compressible thermally-conductive interface
TW487298U (en) * 2000-12-19 2002-05-11 Global Win Technology Co Ltd Non-uniform heat dissipation fins
US6677151B2 (en) 2002-01-30 2004-01-13 Applera Corporation Device and method for thermal cycling
US6730883B2 (en) 2002-10-02 2004-05-04 Stratagene Flexible heating cover assembly for thermal cycling of samples of biological material
US7079394B2 (en) * 2003-01-08 2006-07-18 Lenovo (Singapore) Pte. Ltd. Compact cooling device
US20040241048A1 (en) 2003-05-30 2004-12-02 Applera Corporation Thermal cycling apparatus and method for providing thermal uniformity
US6874566B1 (en) 2003-09-19 2005-04-05 Dell Products L.P. Heat sink with intermediate fan element
US7051536B1 (en) * 2004-11-12 2006-05-30 Bio-Rad Laboratories, Inc. Thermal cycler with protection from atmospheric moisture
US7274571B2 (en) * 2005-03-08 2007-09-25 Intel Corporation Heatsink
US7213636B2 (en) * 2005-03-15 2007-05-08 Delphi Technologies, Inc. Cooling assembly with impingement cooled heat sink
ES2401437T3 (es) * 2005-04-04 2013-04-19 Roche Diagnostics Gmbh Termociclado de un bloque que comprende múltiples muestras
US7472742B2 (en) * 2005-12-01 2009-01-06 General Electric Company Heat sink assembly
US7251136B2 (en) 2005-12-29 2007-07-31 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a ventilating duct
JP2007329253A (ja) * 2006-06-07 2007-12-20 Toyota Industries Corp 電子機器の冷却構造
US7629124B2 (en) * 2006-06-30 2009-12-08 Canon U.S. Life Sciences, Inc. Real-time PCR in micro-channels
US8962306B2 (en) * 2006-09-08 2015-02-24 Thermo Fisher Scientific Oy Instruments and method relating to thermal cycling
US20080128118A1 (en) * 2006-12-01 2008-06-05 Foxconn Technology Co., Ltd. Heat dissipation device with a heat pipe
US9920939B2 (en) 2007-01-22 2018-03-20 Klas C. Haglid Dehumidifer/cooler and method
KR20100019409A (ko) 2007-01-22 2010-02-18 웨이퍼젠, 인크. 고효율 화학 반응을 위한 장치 및 방법
US20080266806A1 (en) * 2007-04-27 2008-10-30 Lakin Eric D Electronic assembly that includes a heat sink which cools multiple electronic components
US20090139311A1 (en) * 2007-10-05 2009-06-04 Applied Biosystems Inc. Biological Analysis Systems, Devices, and Methods
EP2255010B1 (en) * 2008-02-20 2018-05-30 Streck Inc. Thermocycler and sample vessel for rapid amplification of dna
CN201230438Y (zh) * 2008-07-07 2009-04-29 鸿富锦精密工业（深圳）有限公司 散热装置组合
TWI465885B (zh) * 2010-01-18 2014-12-21 古河電氣工業股份有限公司 heat sink
US20130032323A1 (en) * 2011-08-02 2013-02-07 Hsu Takeho Heat sink structure
FR3062460B1 (fr) * 2017-02-01 2020-11-13 Valeo Vision Module lumineux pour projecteur de vehicule

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6703236B2 (en) * 1990-11-29 2004-03-09 Applera Corporation Thermal cycler for automatic performance of the polymerase chain reaction with close temperature control
US6962821B2 (en) * 1993-10-20 2005-11-08 Stratagene California Thermal cycler including a temperature gradient block
US7133726B1 (en) * 1997-03-28 2006-11-07 Applera Corporation Thermal cycler for PCR
CN1458510A (zh) * 2002-05-17 2003-11-26 阿特拉斯材料测试技术有限责任公司 动态温度控制加速风化试验设备

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10137452B2 (en) 2010-04-09 2018-11-27 Life Technologies Corporation Thermal uniformity for thermal cycler instrumentation using dynamic control

Also Published As

Publication number Publication date
WO2011028834A3 (en) 2011-07-07
US10049895B2 (en) 2018-08-14
EP2473893A4 (en) 2017-03-01
US20110056661A1 (en) 2011-03-10
JP5781513B2 (ja) 2015-09-24
JP2014158505A (ja) 2014-09-04
IN2012DN02105A (https=) 2015-08-21
EP2473893A2 (en) 2012-07-11
US20180350628A1 (en) 2018-12-06
CN102483642A (zh) 2012-05-30
JP2013504181A (ja) 2013-02-04
EP2473893B1 (en) 2021-07-28
WO2011028834A2 (en) 2011-03-10
SG178411A1 (en) 2012-04-27

Similar Documents

Publication Publication Date Title
CN102483642B (zh) 为快速热循环提供低热不均匀的热块组件和仪器
CN103411996B (zh) 固体材料导热系数测量装置及测量方法
JP5248503B2 (ja) サーマルサイクリングに関する機器及び方法
US6923570B2 (en) Thermal interface material characterizing system
CN108136401A (zh) 热控设备及其使用方法
JP2013523165A (ja) 動的制御を用いた熱サイクラ器具に対する熱均一性改良
Lampio et al. Optimization of convectively cooled heat sinks
Zhang et al. SPEED: an integrated, smartphone-operated, handheld digital PCR Device for point-of-care testing
Das Estimation of parameters in a fin with temperature-dependent thermal conductivity and radiation
Luo et al. Feature analysis aided design of lightweight heat sink from network structures
JP5846969B2 (ja) 温度計測方法
Crews et al. Flow-induced thermal effects on spatial DNA melting
Lin et al. Optimum design and heat transfer correlation equation of a mini radiator with jet impingement cooling
Selva et al. Integration of a uniform and rapid heating source into microfluidic systems
Sobamowo Optimum design and performance analyses of convective‐radiative cooling fin under the influence of magnetic field using finite element method
Mathew et al. Experimental validation of a thermal model of counterflow microchannel heat exchangers subjected to external heat flux
Li et al. Multi-factor coupled thermal simulation of flat-panel digital PCR structure
Mihai et al. Modeling of heat transfer in microchannels of a CPU-heat sink cooling system
KR20080102736A (ko) 미세유로 열흡수 장치 설계 방법
Tarcin et al. Rapid heating and cooling chamber for a photonics junction measurement system
Paepe et al. Experimental determination of the heat transfer coefficient of a plate-fin heat exchanger
CN118090819A (zh) 一种基于导热硅胶的导热性能测试方法及系统
CN118010796A (zh) 一种针对超声导航设备的导热硅胶性能测试方法及系统
CN119780149A (zh) 一种自动导热系数测量装置及方法
Li et al. Simulation analysis of temperature field characteristics of fast nucleic acid analyzer based on finite element method

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141224

Termination date: 20180901

CF01 Termination of patent right due to non-payment of annual fee