CN102479729A - 导线键合机的导线馈送装置 - Google Patents
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Abstract
本发明公开了一种导线键合机,其包含有:键合工具,其用于形成导线键合;气动设备,其用于将导线馈送至键合工具;上夹具和下夹具,该上夹具和下夹具沿着位于气动设备和键合工具之间的导线馈送路径对齐定位,以在各自的夹持点处夹持导线;以及固定的中间引导室,其大体从上夹具延伸至下夹具,该中间引导室沿着导线馈送路径将导线封闭并被使用来保护和引导导线。
Description
技术领域
本发明涉及导线键合机,特别是涉及在导线键合机中用于馈送和引导导线的导线馈送装置和方法。
背景技术
在半导体装配和封装过程中,导线键合机被用来在晶粒和衬底上的电气接触盘(contact pads)之间或者在不同晶粒的电气接触盘之间形成电性导线连接。导线从包含有键合导线,通常为金线或铜线,的线圈(wire spool)处被馈送至键合工具,如尖管(capillary),以在该键合工具处完成导线键合。
沿着位于线圈和尖管之间的导线馈送路径,导线穿越不同的设备,其可能包括用于在导线键合期间控制导线馈送的气动设备和导线夹具。图1所示为传统的导线键合机的侧视示意图。键合导线100,如金线或铜线,从线圈(图中未示)处被馈送进入气动设备102,该气动设备被使用来施加向上或向下的垂直方向上的真空吸附力,以促使键合导线100在这些方向上移动。导线引导器104被设置离开该气动设备102一段距离,其具有小孔以便于键合导线100沿着馈送路径延伸和引导。导线夹具106设置在导线引导器104的下方,以当键合导线100的移动将要被限制时而夹持在键合导线100上。其后,键合导线100穿过设置在换能器角体(transducer horn)110一端的尖管108。在该尖管108的底部末端处开始进行导线键合。
这种传统的导线键合机结构的缺点是:气动设备102和导线引导器104之间的相对很长的一段导线100暴露在汹涌的空气流中,这引起导线弯曲和形成扭结(kinks)。另外,导线也暴露在键合区域中的污染物下。结果,出现了不良的导线回圈状况(wire looping performance),这导致了有缺陷的导线键合。
图2是包含有上导线夹具112和下导线夹具106的传统的导线键合机的侧视示意图,其表明了空气中不期望的干扰对馈送通过导线夹具的导线100的影响。在导线键合过程中,馈送通过并固定在导线夹具之间的导线100被暴露,因此遭受到汹涌的空气流和污染。而且,由于导线键合过程中导线键合机的移动,所以导线100还承受加速力。如果其足够大,那么该加速力在上导线夹具112和下导线夹具106之间暴露的一段导线100中引起导线100弯曲和形成扭结。这可能影响导线回圈,和导线键合可能不会良好地形成。
图3是传统的导线键合机的侧视示意图,其表明了在导线键合过程中已经被馈送进入导线键合机的导线偏离了垂直的馈送路径。导线引导器104和导线夹具106布置在一起,而该导线夹具106设置在导线引导器104和尖管108之间。这样在导线引导器104和尖管108之间形成了巨大的间隙,以致于导线100明显地偏离了垂直的馈送路径,影响了导线回圈和以后所形成的导线键合。因此,减小导线100自垂直的馈送路径的偏离以改善导线键合的性能,这是令人期望的。在没有由于使用如上所述的引起汹涌空气流和污染的传统导线键合机而出现的不便的干扰的情形下,提高导线键合机的性能也同样是令人期望的。
发明内容
因此,本发明的目的在于提供一种导线键合系统和方法,其高效地将导线馈送至导线键合机,减少了导线键合操作的中断和提高了良好质量的导线键合的形成。
于是,本发明提供一种导线键合机,其包含有:键合工具,其用于形成导线键合;气动设备,其用于将导线馈送至键合工具;上夹具和下夹具,该上夹具和下夹具沿着位于气动设备和键合工具之间的导线馈送路径对齐定位,以在各自的夹持点处夹持导线;以及固定的中间引导室,其大体从上夹具延伸至下夹具,该中间引导室沿着导线馈送路径将导线封闭并被使用来保护和引导导线。
参阅后附的描述本发明实施例的附图,随后来详细描述本发明是很方便的。附图和相关的描述不能理解成是对本发明的限制,本发明的特点限定在权利要求书中。
附图说明
通过参考根据本发明所述导线键合机的较佳实施例具体实施方式的详细介绍,并参考附图很容易理解本发明。
其中: 图1所示为传统的导线键合机的侧视示意图。
图2是包含有上导线夹具和下导线夹具的传统的导线键合机的侧视示意图,其表明了空气中不期望的干扰对馈送通过导线夹具的导线的影响。
图3是传统的导线键合机的侧视示意图,其表明了在导线键合过程中已经被馈送进入导线键合机的导线偏离了垂直的馈送路径。
图4是根据本发明较佳实施例所述的包含有导线馈送装置的晶粒键合机的立体示意图。
图5是图4中的导线键合机的侧视示意图,其表明了环绕固定于该导线键合机中的键合导线周围的不期望的干扰。
图6是图4中的导线键合机的侧视示意图,其表明了导线键合期间和垂直的馈送路径对齐定位的导线。
图7A至图7C所示为用于将键合导线馈送进入导线键合机内的气动设备的侧视示意图。
具体实施方式
图4是根据本发明较佳实施例所述的包含有导线馈送装置的晶粒键合机10的立体示意图。上导线夹具12和下导线夹具14沿着一段键合导线18的导线馈送路径设置,以在它们各自的夹持点处夹持键合导线18。气动设备16沿着该导线馈送路径布置,并相邻于上导线夹具12和在上导线夹具12上方设置。键合导线18,例如金线或铜线,从导线供应如线圈(图中未示)处被提供,并被馈送进入气动设备16。气动设备16被操作来施加垂直方向上的力以促使键合导线18向上移动而在键合导线18上施加拉力,或者向下移动而将键合导线18朝向键合工具或尖管20馈送通过气动设备16的出口以形成导线键合。从尖管20的较低的端部凸伸的键合导线18被用来完成在尖管20端部的导线键合。
下导线夹具14和设置在诸如超声波换能器之类的换能器26上方的导线引导器24一起沿着导线馈送路径布置。导线引导器24可装配在下导线夹具14的基座上,并具有小孔以便于键合导线18沿着导线馈送路径通过该小孔延伸和引导至尖管20。这种布置减小了导线引导器24和尖管20之间的间隙,以便于键合导线18自垂直的馈送路径偏离得更少(参见图6)。在这种布置下,改善后的导线回圈和更好的导线键合是可能的。
上导线夹具12和下导线夹具14是可有效地在它们各自的夹持点处夹持在键合导线18上,以在导线键合期间限制导线的移动。当气动设备16被激活时,向下的吸附力被施加在键合导线18上以促使键合导线朝向尖管20馈送通过下导线夹具14的夹持点。
包含有固定的上导线引导室28、固定的中间导线引导室30和固定的下导线引导室32的多个腔室分别设置在气动设备16和上导线夹具12,上导线夹具12和下导线夹具14,下导线夹具14和导线引导器24之间。上导线引导室28大体上从气动设备16处延伸至上导线夹具12,中间导线引导室30大体上从上导线夹具12处延伸至下导线夹具14,下导线引导室32大体上从下导线夹具14处延伸至尖管20。
这些均是导线引导的腔室,其为键合导线18提供了封闭的导线馈送路径,否则沿着导线馈送路径键合导线将会暴露在不期望的干扰下。也就是说,当键合导线18从气动设备16处被馈送在上导线夹具12、下导线夹具14和尖管20之间时,该键合导线18被保护和引导。结果,该键合导线18与环境隔离,并且基本上没有暴露在汹涌的空气流和键合头处出现的污染中。同时键合导线18也由多个腔室所引导,不会出现弯曲或形成扭结。
使用导线引导室28、30、32隔离和引导键合导线18的好处参见图5所示。图5是本发明较佳实施例所述的导线键合机10的侧视示意图,其表明了环绕固定于该导线键合机10中的键合导线18周围的不期望的干扰。这些导线引导室,尤其是中间导线引导室30,不仅被设计来在导线馈送期间引导键合导线18以纵向地围绕键合导线所有侧面的方式沿着导线馈送路径进入尖管20。它们同样也提供有由中间导线引导室30的内壁所封闭的足够的空间,以使得导线在没有由于导线键合工序所引起的键合导线18的操控而出现的障碍的情形下自由地振动。在导线键合期间,由于这些腔室不会妨碍振动的键合导线18的移动,因此在引导导线馈送之后,这些腔室不需要被移去。
在前述的隔离状态、引导和自动导线馈送的情形下,由于增强了导线键合期间从导线破损中自动恢复的加工能力,机器停工的需要得以减少。通过这种方式,导线键合机10的操作员不必中断导线键合机10的操作,这显著地减少了机器空闲时间。导线引导室28、30、32隔离和引导键合导线18的作用有助于导线馈送和增大整个导线键合工序的产能。
图6是讨论中的导线键合机10的侧视示意图,其表明了导线键合期间和垂直的馈送路径相对齐定位的导线18。导线引导室28、30、32限制了其中的键合导线18的偏离,导线引导器24直接相邻于尖管20设置的布置形式进一步减少了任何导线偏离的程度。中间导线引导室30包含有朝向下导线夹具14向内逐渐变窄的底壁(lower wall),以同相邻于上导线夹具12相比,相邻于下导线夹具14侧变得更窄,以致于导线馈送至下导线夹具14能够被完成得更为精确。
由于键合导线18弯曲和扭结的形成得以避免以及导线延伸可以在更少出现错误可能性的情形下更为平滑地完成,所以包含有上述的导线引导室28、30、32和导线引导器24这种布置形式的导线键合机10实质上改善了导线回圈状况。
图7A至图7C所示为用于将键合导线18馈送进入导线键合机10中的气动设备16的侧视示意图。图7A表明了气动设备16可以以通过上通道34提供真空吸附力和通过中间通道36将空气流输入进入气动设备16的方式作为双致动器(dual actuator)而起作用,其是一个正压产生器以将向下的驱动力提供至键合导线18上。作用在键合导线18上的向下的驱动力促使键合导线18朝向尖管20向下通过导线引导器24。在通过气动设备16合适地施加这种向下的驱动力的情形下,在键合导线18从尖管20的端部凸伸以前,键合导线18被馈送通过导线引导器24的孔洞和尖管20。所以,在使用者对键合导线馈送至尖管20不进行任何干预的情形下,可以完成导线键合。
图7B和图7C表明了减少作用在位于底部出口40处气动设备16下方附近露出的键合导线18上的力的波动的装置。当通过中间通道36引入以用来向下吹动键合导线18的排气空气流在出口40之外从气动设备16处露出时,如图7B所示,其在气动设备16的出口40周围的区域A中的空气中产生了干扰。这引起区域A中的键合导线18出现波动,其反过来影响导线回圈的状况和导线键合的质量。
下通道38,其是一个负压产生器,设置在中间通道36的下方并相邻于出口40。在排气空气流从气动设备16处出现以前,在下通道38处产生的负压有助于转移部分排气空气流通过下通道38离开,以便于任一的导线波动得以减少,如图7C所示。而且,中间导线引导室30几乎完全填满了上导线夹具12和下导线夹具14之间的间隙。将中间导线引导室30紧接着相邻于上导线夹具12设置同样也有助于抑制导线在具有改善后的导线键合和回圈结果情形下的波动。类似地,上导线引导室28几乎完全填满了气动设备16和上导线夹具12之间的间隙,而下导线引导室32几乎完全填满了下导线夹具14和尖管20之间的间隙。
值得欣赏的是,在导线键合期间,根据本发明较佳实施例所述的包含有导线引导室28、30、32的导线馈送系统加快了导线进送,并导致改良后的导线回圈状况。当导线引导室28、30、32提供支撑来平滑导线键合期间导线上所承受的加速度时,这是可能的。导线引导室28、30、32同样也可以被配置来隔离和保护导线,避免空气乱流和键合区域中的污染,以及在馈送进入尖管20期间引导导线。此外,提供在导线引导室28、30、32内的内部空间是充足的,以在将导线馈送进入尖管20之后不必首先将这些多个腔室移离导线的情形下允许进行导线键合。所以,导线键合工序能被加快,更好的导线回圈和导线键合能被形成。
此处描述的本发明在所具体描述的内容基础上很容易产生变化、修正和/或补充,可以理解的是所有这些变化、修正和/或补充都包括在本发明的上述描述的精神和范围内。
Claims (11)
1.一种导线键合机,其包含有:
键合工具,其用于形成导线键合;
气动设备,其用于将导线馈送至键合工具;
上夹具和下夹具,该上夹具和下夹具沿着位于气动设备和键合工具之间的导线馈送路径对齐定位,以在各自的夹持点处夹持导线;以及
固定的中间引导室,其大体从上夹具延伸至下夹具,该中间引导室沿着导线馈送路径将导线封闭并被使用来保护和引导导线。
2.如权利要求1所述的导线键合机,其中,该中间导线引导室几乎完全填满了上夹具和下夹具之间的间隙。
3.如权利要求1所述的导线键合机,该导线键合机还包含有:
固定的上导线引导室,其大体从气动设备延伸至上夹具,该上导线引导室沿着导线馈送路径将导线封闭并被使用来保护和引导导线。
4.如权利要求3所述的导线键合机,其中,该上导线引导室几乎完全填满了气动设备和上夹具之间的间隙。
5.如权利要求1所述的导线键合机,该导线键合机还包含有:
固定的下导线引导室,其大体从下夹具延伸至键合工具,该下导线引导室沿着导线馈送路径将导线封闭并被使用来保护和引导导线。
6.如权利要求5所述的导线键合机,其中,该下导线引导室几乎完全填满了下夹具和键合工具之间的间隙。
7.如权利要求5所述的导线键合机,该导线键合机还包含有:
导线引导器,其设置在下导线引导室和键合工具之间,该导线引导器还包含有孔洞,以通过该孔洞延伸和引导导线。
8.如权利要求1所述的导线键合机,其中,该中间导线引导室沿着导线馈送路径纵向地包围该导线的所有侧面。
9.如权利要求1所述的导线键合机,其中,该中间导线引导室包含有由该中间导线引导室的内壁所包围的充足的空间,以允许导线在导线键合工序过程中没有妨碍的情形下自由地振动。
10.如权利要求1所述的导线键合机,其中,该中间导线引导室包含有底壁,该底壁朝向下夹具逐渐变窄,以同相邻于上夹具相比,相邻于下夹具侧变得更窄。
11.如权利要求1所述的导线键合机,其中,该气动设备还包含有:
底部出口,导线通过该底部出口延伸于气动设备之外;
正压通道,用于引入空气流进入该气动设备,以将导线吹出该底部出口之外;以及
负压通道,位于正压通道下方,并相邻于底部出口设置,在空气流从底部出口退出以前,该负压通道被使用来从气动设备处收集和排出通过正压通道引入的部分空气流。
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US12/956,068 US20120132695A1 (en) | 2010-11-30 | 2010-11-30 | Wire feeding apparatus for wire bonders |
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KR (1) | KR101320918B1 (zh) |
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CN106505002A (zh) * | 2016-10-20 | 2017-03-15 | 北方电子研究院安徽有限公司 | 一种引线键合设备的通用放线器 |
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US8540136B1 (en) * | 2012-09-06 | 2013-09-24 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods for stud bump formation and apparatus for performing the same |
CN105895543B (zh) * | 2014-12-01 | 2019-09-13 | 恩智浦美国有限公司 | 接合引线进给系统及其方法 |
US11717912B2 (en) * | 2019-03-18 | 2023-08-08 | Shinkawa Ltd. | Capillary guide device and wire bonding apparatus |
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JPH11312707A (ja) * | 1998-04-28 | 1999-11-09 | Kaijo Corp | ワイヤボンディング装置 |
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US5402927A (en) * | 1994-06-09 | 1995-04-04 | Kulicke And Soffa Investments, Inc. | Adjustable wire tensioning apparatus |
US5685476A (en) * | 1995-08-03 | 1997-11-11 | Kaijo Corporation | Wire guiding apparatus, wire guiding method and a wire bonder equipped with said apparatus |
JPH09191023A (ja) * | 1996-01-09 | 1997-07-22 | Toshiba Corp | ワイヤボンディング装置 |
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CN106505002A (zh) * | 2016-10-20 | 2017-03-15 | 北方电子研究院安徽有限公司 | 一种引线键合设备的通用放线器 |
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SG181253A1 (en) | 2012-06-28 |
KR20120059374A (ko) | 2012-06-08 |
KR101320918B1 (ko) | 2013-10-21 |
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