WO2010050929A1

WO2010050929A1 - Wire threading tensioner for a wire bonding machine

Info

Publication number: WO2010050929A1
Application number: PCT/US2008/081439
Authority: WO
Inventors: Gary Gillotti
Original assignee: Kulicke And Soffa Industries, Inc.
Priority date: 2008-10-28
Filing date: 2008-10-28
Publication date: 2010-05-06

Abstract

A wire bonding machine for bonding a wire to a bonding location is provided. The wire bonding machine includes a wire feed system including a wire supply. The wire bonding machine also includes a wire tensioner for receiving wire from the wire feed system. The wire bonding machine further includes a bondhead assembly having a wire clamp assembly, a transducer, and a bonding tool. A tube is engaged with a supply end of the wire tensioner to receive the wire from the wire tensioner, the tube guiding the wire from the wire tensioner toward the bondhead assembly.

Description

KSI-494WO PATENT

- 1 -

WIRE THREADING TENSIONER FOR A WIRE BONDING MACHINE

FIELD OF THE INVENTION

[0001] The present invention relates to wire tensioners and, more particularly, to improved wire tensioners for wire bonding machines.

BACKGROUND OF THE INVENTION

[0002] In the processing and packaging of semiconductor devices, wire bonding continues to be the primary method of providing electrical interconnection between two locations within a package (e.g., between a die pad of a semiconductor die and a lead of a leadframe). More specifically, using a wire bonder (also known as a wire bonding machine) wire loops are formed between respective locations to be electrically interconnected.

[0003] Such wire bonding machines (e.g., ball bonding machines, wedge bonding machines, etc.) typically include a wi re feed system for feeding a wire on a wire spool to a bondhead of the wire bonding machine. The bondhead of the wire bonding machine typically carries a transducer (e.g., an ultrasonic transducer) and a bonding tool (e.g., a capillary tool, a wedge tool, etc.).

[0004] One function of the wire feed system of a wire bonding machine is to apply air pressure (or the like) to the wire for controlling the wire, for example, to prevent wire damage and the like during high speed motions. The wire typically extends from the wire feed system to a wire tensioning device (also referred to as a wire tensioner) adjacent the bondhead.

[0005] United States Patent Application Publication No. US 2006/0091181 entitled "Wire Tensioner for a Wire Bonder," United States Patent No. 5,402,927 entitled "Adjustable Wire Tensioning Apparatus," United States Patent Application Publication No. US 2006/0065695 entitled "Wire Feed System For A Wire Bonding Apparatus," and International Publication No. WO 2008/057091 (corresponding to International Application No. PCT/US2006/043760) entitled "Wire Feed System for a Wire Bonding Machine and Configured to Apply a Variable Tension to the Wire; Method KSI-494WO PATENT

- 2 - of Operating the Same" relate to wire bonding technology and, in particular, to wire feed and tensioning systems, and are herein incorporated by reference in their entirety.

[0006] FIG. 1 is an illustration of a prior art wire bonding machine. In FIG. 1, wire bonding machine 100 includes wire feed system 102 (sometimes referred to as the "upper console"), optics assembly 104, and bondhead assembly 106 (wire feed system 102, optics assembly 104, and bondhead assembly 106 are partially covered by a microscope in FIG. 1). Conventional wire tensioner 108 (see FIG. 2) may be mounted to optics assembly 104 (not shown in FIG. 2). Various other components of wire bonding machine 100 are not shown in FIG. 1 for simplicity.

[0007] FIG. 2 is a more detailed view of certain components of wire bonding machine 100 including (1) wire feed system 102, (2) wire tensioner 108, and (3) components of bondhead assembly 106. It is emphasized that, according to common practice, the various features of FIG. 2 are not to scale. On the contrary, the dimensions of the various features (e.g., wire tensioner 108) are arbitrarily expanded or reduced for clarity. The illustrated components of bondhead assembly 106 include eyelet 110, wire clamp assembly 112, ultrasonic transducer 114, and wire bonding tool 116 (other components of bondhead assembly 106, including certain components providing interconnection between the illustrated components of bondhead assembly 106, are not shown in FIG. 2).

[0008] A wire bonding sequence is generally accomplished along an X-Y-Z coordinate system (see X-Y-Z axis convention denoted in FIG. 2 and consistent throughout FIGS. 2 - 6D, with the X axis extending in and out of the page of FIGS. 2 and 4A - 6D.). Generally, X axis and Y axis movement of bondhead assembly 106 is accomplished using the XY table of the wire bonding machine. Z axis movement of bondhead assembly 106 (including bonding tool 116) is generally accomplished via a Z axis motor or the like which moves bonding tool 116 along a substantially vertical arc along the Z axis.

[0009] Wire feed system 102 (of which certain components are omitted for clarity) includes a wire supply 120 (such as a wire spool 120), wire guide bar 122 (e.g., diverter bar), and air guide 124. As a unit, these components are stationary elements of wire bonding machine 100 and do not travel with bondhead assembly 106. Wire spool 120 is directly driven by a motor (not shown) to rotate in order to move wire 118 from wire spool 120 to air guide 124. As illustrated in FIG. 2, wire 118 extends from wire spool 120 and rides along wire guide bar 122 and through air guide 124, KSI-494WO PATENT

- 3 - ultimately being routed downward to wire bonding tool 116 through wire tensioner 108. Wire 118 is typically urged from air guide 124 to wire tensioner 108 via air pressure such as a vacuum.

[0010] Wire tensioner 108, in conjunction with air guide 124, provides wire tension, as desired. More specifically, for example, a flow of air (via (1) the injection of pressurized air, (2) a vacuum, or (3) a combination thereof) is directed along wire 118 within a central bore of wire tensioner 108 to provide wire tension. In other words, an axial flow of air along wire 118 results in a drag force causing tension in the portion of wire 118 positioned below wire tensioner 108. The portion of wire 118 positioned below wire tensioner 108 extends through eyelet 110, which is mounted above wire clamp assembly 112. Eyelet 110 guides wire 118 from wire tensioner 108 to wire clamp assembly 112.

[0011] In general, during use of conventional wire bonding machine 100, an operator manually threads wire 118 from wire tensioner 108 through eyelet 110, through wire clamp assembly 112, and through bonding tool 116. The diameter of wire 118 may be as low as 0.7 mils and, in some cases, 0.6 mils or less. Due to the relatively small size of wire 118 and its inherent lack of stiffness, it is understood that threading eyelet 110, wire clamp assembly 112, and bonding tool 116 are extremely difficult and time-consuming tasks. Such a manual wire threading technique (1) requires a particular level of operator skill, (2) is susceptible to human error, (3) is undesirably time consuming, and (4) adds to the cost of the overall wire bonding operation.

[0012] Thus, it would be desirable to provide an improved wire tensioner for a wire bonding machine to overcome one or more of the deficiencies of the prior art.

SUMMARY OF THE INVENTION

[0013] According to an exemplary embodiment of the present invention, a wire bonding machine for bonding a wire to a bonding location includes a wire feed system having a wire supply. The wire bonding machine also includes a wire tensioner for receiving wire from the wire feed system. The wire bonding machine further includes a bondhead assembly having a wire clamp assembly, a transducer, and a bonding tool. A tube is engaged with a supply end of the wire tensioner to receive the wire from the wire tensioner, the tube guiding the wire from the wire tensioner toward the bondhead assembly. KSI-494WO PATENT

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[0014] According to another exemplary embodiment of the present invention, a method of operating a wire bonding machine is provided. The method includes a step of feeding a wire to a receiving end of a wire tensioner. The method also includes a step of operating an air system to urge the wire through the wire tensioner and through a tube engaged with a supply end of the wire tensioner to guide the wire toward a bondhead assembly of the wire bonding machine.

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The invention is best understood from the following detailed description when read in connection with the accompanying drawing. It is emphasized that, according to common practice, the various features of the drawing are not to scale. On the contrary, the dimensions of the various features are arbitrarily expanded or reduced for clarity. Included in the drawing are the following figures:

FIG. 1 is a front elevation of a conventional wire bonding machine;

FIG. 2 is a detail view of certain components of the wire bonding machine of FIG. 1;

FIG. 3 is a front right perspective view of a portion of a wire bonding machine including a wire tensioner and a bondhead assembly in accordance with an exemplary embodiment of the present invention;

FIG. 4A is right side view of a portion of a wire bonding machine including the wire tensioner and bondhead assembly of FIG. 3, showing the bondhead assembly in a substantially horizontal position;

FIG. 4B is right side view of a portion of a wire bonding machine including the wire tensioner and bondhead assembly of FIG. 3, showing the bondhead assembly in an elevated position relative to that represented in FIG. 4A;

FIG. 4C is right side view of a portion of a wire bonding machine including the wire tensioner and bondhead assembly of FIG. 3, showing the bondhead assembly in an elevated position relative to that represented in FIG. 4B;

FIG. 5 is a front right perspective view of a portion of a wire bonding machine including a wire tensioner and a bondhead assembly in accordance with another exemplary embodiment of the present invention, showing the bondhead assembly in a substantially horizontal position; KSI-494WO PATENT

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FIG. 6A is right side view of a portion of a wire bonding machine including the wire tensioner and bondhead assembly of FIG. 3, showing the bondhead assembly in a substantially horizontal position and showing a wire being fed into a receiving end of the wire tensioner;

FIG. 6B is right side view of the wire tensioner and bondhead assembly of FIG. 6A, showing a wire being fed toward a receiving end of a wire clamp assembly;

FIG. 6C is right side view of the wire tensioner and bondhead assembly of FIG. 6A, showing a wire being fed toward a receiving end of a bonding tool; and

FIG. 6D is right side view of the wire tensioner and bondhead assembly of FIG. 6A, showing a wire being fed through the bonding tool.

DETAILED DESCRIPTION OF THE INVENTION

[0016] As explained above, an improved wire tensioner for a wire bonding machine is desirable in the processing of semiconductor devices. Generally, as wire is fed through a conventional wire tensioner, an operator manually threads wire from the wire tensioner through an eyelet, through a wire clamp assembly, and through a bonding tool. According to certain exemplary embodiments of the present invention, an improved wire tensioner provides a mechanism that automatically threads the wire towards (and in some embodiments, through) the wire clamp assembly and the bonding tool and, in some cases, automatically threads the wire through the bonding tool directly from the wire tensioner. A telescoping tube engaged with the wire tensioner, in conjunction with an air system or the like (e.g., blown air/gas, a vacuum, etc.), may be used to urge the wire through the wire tensioner into the area of the wire clamp assembly and the bonding tool. Such an improved wire tensioner may improve the overall performance of the wire bonding machine by, for example, helping to ensure that a constant tension is maintained on the wire for normal wire bonding operation.

[0017] As is known to those skilled in the art, there are numerous techniques for using air (or another gas) in connection with a wire tensioner. For example, the wire tensioner may have one or more air inlet ports on the side of the tensioner, where an air supply (or gas supply) is drawn into (or pulled out of) the ports. Additionally, such wire tensioners typically have a receiving end for receiving the wire, and a supply end (or exit end) through which the wire exits. The openings at each of these ends may be used in connection with the inlet ports on the side of the transducer in connection with the wire tensioner operation. Because of the various different potential configurations KSI-494WO PATENT

- 6 - the inlet ports are not shown or described in a high level of detail herein. In general terms, during a wire bonding operation, it may be desirable to have an upward flow of air through the wire tensioner to seat free air balls at the tip of a bonding tool prior to bonding the free air balls (amongst other functions of such an upward, positive, air pressure). Such an upward flow of air may be provided, for example, from a positive air flow into the inlet port(s) on the wire tensioner. However, in other situations it may be desirable to have the opposite air flow. For example, when threading the wire into the receiving end of the wire tensioner it may be desirable for the air flow to draw the wire through the wire tensioner (and perhaps, to the receiving end of the wire clamp, to the receiving end of the bonding tool, and/or through the bonding tool). In such a case a downward flow of air (e.g., a vacuum air pressure) may be used as is known to those skilled in the art. Such a downward flow of air for threading the wire may be included as a feature on a wire bonding machine.

[0018] Referring to FIG. 3, a portion of a wire bonding machine is shown for bonding wire to a bonding location including a wire feed system (not shown) having a wire supply. The wire bonding machine also includes optics assembly 204. Receiving end 226 of wire tensioner 208 is pivotally connected at pivot point 228 to optics assembly 204 (end 226 is called "receiving" end 226 because it receives the wire from the wire feed system). The wire bonding machine further includes bondhead assembly 206 having wire clamp assembly 212, transducer 214, and bonding tool 216, all supported by linkage support mechanism 244 of bondhead assembly 206. EFO (electronic flame-off) assembly 246 extends toward bonding tool 216 and is represented more clearly in FIGS. 4A - 4C.

[0019] Tube 230 is slideably engaged with supply end 232 of wire tensioner 208 to receive wire from wire tensioner 208 (end 232 is called "supply" end because it supplies the wire from wire tensioner 208 to tube 230). Supply end 234 of tube 230 is pivotally connected to bondhead assembly 206 at pivot point 236 via tube support structure 238 (end 234 is called "supply" end because it supplies the wire from tube 230 to wire clamp 212). As shown, a portion of tube 230 slides outside of wire tensioner 208. As will be explained in greater detail below, tube 230 guides wire from wire tensioner 208 toward the various components of bondhead assembly 206.

[0020] Wire bonding machine is configured to use air pressure or the like to urge wire from receiving end 226 of wire tensioner 208 toward bondhead assembly 206. More specifically, and as will be explained in greater detail below, air pressure or the like is used to urge wire from receiving end 226 of wire tensioner 208 toward receiving KSI-494WO PATENT

- 7 - end 240 of wire clamp assembly 212 (end 240 is called "receiving" end because it receives the wire from tube 230), toward receiving end 242 of bonding tool 216 (end 242 is called "receiving" end because it receives the wire from wire clamp assembly 212), and perhaps through bonding tool 216.

[0021] Each of FIGS. 4A - 4C is a right side view of wire tensioner 208 and bondhead assembly 206 of FIG. 3, with FIG. 4A showing bondhead assembly 206 in a substantially horizontal position (also referred to as a bonding position), FIG. 4B showing bondhead assembly 206 in an elevated position relative to that represented in FIG. 4A (also referred to as an intermediate position or a free air ball formation position), and FIG. 4C showing bondhead assembly 206 in an elevated position relative to that represented in FIG. 4B (also referred to as a hard-stop position).

[0022] Optics assembly 204 is not part of bondhead assembly 206, and as such, optics assembly 204 does not move in a vertical direction along the Z axis with bondhead assembly 206. As explained above, receiving end 226 of wire tensioner 208 is pivotally connected to optics assembly 204 at pivot point 228. Similarly, supply end 234 of slideable tube 230 is pivotally connected at pivot point 236 to bondhead assembly 206 via tube support structure 238. Referring to FIGS. 4A - 4C in sequence, as bondhead assembly 206 is raised along the Z axis, pivot point 228 remains stationary with respect to the Z axis and pivot point 236 moves upward along the Z axis. In other words, although wire tensioner 208 pivots at pivot point 228 and tube 230 pivots at pivot point 236, only pivot point 236 (and, consequently, tube 230) travels in a vertical, upward (and downward) motion along the Z axis (of course, this motion may include components other than vertical). Pivot point 228 does not travel in a vertical, upward (or downward) motion along the Z axis because it is pivotally secured to optics assembly 204. Due to (1) the fixed nature of pivot point 228 (with respect to the Z axis), (2) the movement of pivot point 236 along the Z axis when bondhead assembly 206 is raised, and (3) the slideable engagement of tube 230 with supply end 232 of wire tensioner 208, a portion of tube 230 slides up along an outside surface of wire tensioner 208 in a telescoping fashion, encasing a greater portion of wire tensioner 208 as bondhead assembly 206 is raised (as shown in the sequence of FIGS. 4A, 4B, and 4C). Similarly, when bondhead assembly 206 is lowered, a portion of tube 230 slides down along an outside surface of wire tensioner 208, exposing a greater portion of wire tensioner 208 as shown in the sequence of FIGS. 4C, 4B, and 4A. KSI-494WO PATENT

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[0023] FIG. 5 is a front right perspective view of another exemplary embodiment of wire tensioner 308 and bondhead assembly 306 showing bondhead assembly 306 in a substantially horizontal position. The configuration and operation of wire tensioner 308 and bondhead assembly 306 are similar to those of wire tensioner 208 and bondhead assembly 206 described above with reference to FIGS. 3 - 4C and below with reference to FIGS. 6A - 6D, with the exception of the engagement of wire tensioner 308 within tube 330. More specifically, tube 330 is slideably engaged with supply end 332 of wire tensioner 308 such that a portion of tube 330 slides inside wire tensioner 308 (rather than outside wire tensioner 308).

[0024] Similar to wire tensioner 208 and bondhead assembly 206 described above with reference to FIGS. 3 - 4C, receiving end 326 of wire tensioner 308 is pivotally connected to optics assembly 304 at pivot point 328, and supply end 334 of slideable tube 330 is pivotally connected at pivot point 336 to bondhead assembly 306 via tube support structure 338. Due to (1) the fixed nature of pivot point 328 (with respect to the Z axis), (2) the movement of pivot point 336 along the Z axis when bondhead assembly 306 is raised, and (3) the slideable engagement of tube 330 with supply end 332 of wire tensioner 308, a portion of tube 330 slides up inside wire tensioner 308 in a telescoping fashion such that a greater portion of tube 330 is encased within wire tensioner 308 as bondhead assembly 306 is raised. Similarly, when bondhead assembly 306 is lowered, a portion of tube 330 slides down from within wire tensioner 308, exposing a greater portion of tube 330. The raising and lowering of bondhead assembly 306 is not shown for simplicity, but the principles are consistent with those represented in FIGS. 4A - 4C except that tube 330, which is pivotally connected to bondhead assembly 306, is slideably engaged within wire tensioner 308 (rather than outside wire tensioner 308).

[0025] Each of pivot points 228, 236, 328, 336 is generally illustrated as a pin

228, 236, 328, 336 or the like, around which wire tensioner 208, 308 and tube 230, 330 respectively rotates. The illustrated pivot points are merely representative of a pivotal connection and it is understood that they may not represent a desirable pivoting structure. Each of pivot points 228, 236, 328, 336 may, for example, consist of a hinge, a linkage, or any other mechanism that facilitates the motion described above.

[0026] Tube 230, 330 may formed from a number of materials such as, for example, anodized aluminum, titanium, a composite material, or any other lightweight material capable of providing the above-described functions, amongst others. KSI-494WO PATENT

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[0027] FIGS. 6A - 6D represent an exemplary sequence of wire tensioner 208 of

FIGS. 3 - 4C in use. The raising and lowering of bondhead assembly 206 is not shown for simplicity, but the principles are consistent with those represented in FIGS. 4A - 4C. Furthermore, although FIGS. 6A - 6D show the bondhead assembly 206 in a substantially horizontal position, the movement of wire 218 described below with reference to FIGS. 6A - 6D may apply in any position (e.g., raised, lowered, horizontal, etc.) of bondhead assembly 206.

[0028] Referring to FIG. 6A, wire 218 is shown being fed (e.g., by an operator) into receiving end 226 of wire tensioner 208. In order to feed the wire down through and past wire tensioner 208, a flow of air activated inside wire tensioner 208 may be the result of (1) the injection of pressurized air, (2) a vacuum, or (3) a combination thereof. The flow of air is directed downward along wire 218 within a central bore of wire tensioner 208 to provide wire tension. The flow of air inside wire tensioner 208 urges wire 218 downward through tube 230.

[0029] The downward flow of air inside wire tensioner 208 continues through tube 230 and is expelled through supply end 234 of tube 230. In accordance with various exemplary embodiments of the present invention, this expelled flow of air from supply end 234 of tube 230 may continue to feed wire 218. For example, in one exemplary embodiment the flow of air feeds wire 218 from tube 230 to receiving end 240 of wire clamp assembly 212 as represented in FIG. 6B (in such a case, the wire may then be fed through wire clamp and bonding tool 216 manually or otherwise). In another exemplary embodiment, the flow of air feeds wire 218 from tube 230, through wire clamp assembly 212 as represented in FIG. 6C, and to the receiving end 242 of bonding tool 216 (in such a case, the wire may then be fed through bonding tool 216 manually or otherwise). In yet another exemplary embodiment, the flow of air feeds wire 218 from tube 230, through wire clamp assembly 212, and all the way through bonding tool 216 as represented in FIG. 6D. Thus, in accordance with the present invention, the time consuming task of manually feeding the wire through the components of the bondhead assembly may be reduced or even omitted entirely.

[0030] In summary, air pressure from wire tensioner 208 is used to automatically urge wire 218 from receiving end 226 of wire tensioner 208 toward receiving end 240 of wire clamp assembly 212 (and possibly toward receiving end 242 of bonding tool 216, and even possibly through bonding tool 216). Such an improved wire tensioner 208, 308 may improve the overall performance of the wire bonding machine by, for example, helping to ensure that a constant tension is maintained on KSI-494WO PATENT

- 10 - wire for normal wire bonding operation. Furthermore, as compared to manual wire threading techniques of conventional wire tensioners, the automatic wire threading feature of improved wire tensioner 208, 308 is not susceptible to human error and does not require a particular level of operator skill. Moreover, the present invention saves valuable time during the wire bonding operation and, therefore, reduces the cost of the overall wire bonding operation.

[0031] As used herein in connection with a wire tensioner, the term "air" is not intended to be limited to ambient air but is intended to refer to any gas that may be used in connection with the operation of a wire tensioner.

[0032] The present invention has been described and illustrated in connection with a tube slideably engaged with a wire tensioner of a wire bonding machine. In the various figures, the internal length of the wire tensioner that extends into the tube (or vice versa in FIG. 5) is not shown since the length may be optimized for a given wire bonding machine. It is understood that this length may be configured, as desired, in a given application.

[0033] Although the present invention has been illustrated and described primarily with respect to a ball bonding operation it is not limited thereto. For example, the wire feed system disclosed herein may be applicable to other types of wire bonding such as, for example, wedge bonding operations.

[0034] Although the invention is illustrated and described herein with reference to specific embodiments, the invention is not intended to be limited to the details shown. Rather, various modifications may be made in the details within the scope and range of equivalents of the claims and without departing from the invention.

Claims

KSI-494WO PATENT- 11 -What is Claimed:

1. A wire bonding machine for bonding a wire to a bonding location, the wire bonding machine comprising:

a wire feed system including a wire supply;

a wire tensioner for receiving wire from the wire feed system;

a bondhead assembly including

a wire clamp assembly,

a transducer, and

a bonding tool; and

a tube engaged with a supply end of the wire tensioner to receive the wire from the wire tensioner, the tube guiding the wire from the wire tensioner toward the bondhead assembly.

2. The wire bonding machine of claim 1, wherein the tube is slideably engaged with the supply end of the wire tensioner.

3. The wire bonding machine of claim 2, wherein the tube is slideably engaged with the supply end of the wire tensioner such that a portion of the tube slides outside of the wire tensioner.

4. The wire bonding machine of claim 2, wherein the tube is slideably engaged with the supply end of the wire tensioner such that a portion of the tube slides inside of the wire tensioner.

5. The wire bonding machine of claim 1, wherein a supply end of the tube is pivotally connected to a receiving end of the bondhead assembly.

6. The wire bonding machine of claim 1, further comprising an optics assembly, wherein a receiving end of the wire tensioner is pivotally connected to the optics assembly. KSI-494WO PATENT

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7. The wire bonding machine of claim 1, wherein the wire bonding machine is configured to use air pressure to urge the wire from a receiving end of the wire tensioner toward the bondhead assembly.

8. The wire bonding machine of claim 1, wherein the wire bonding machine is configured to use air pressure to urge the wire from a receiving end of the wire tensioner toward a receiving end of the wire clamp assembly.

9. The wire bonding machine of claim 1, wherein the wire bonding machine is configured to use air pressure to urge the wire from a receiving end of the wire tensioner toward a receiving end of the bonding tool.

10. The wire bonding machine of claim 1, wherein the wire bonding machine is configured to use air pressure to urge the wire from a receiving end of the wire tensioner through the bonding tool.

11. A method of operating a wire bonding machine, the method comprising the steps of:

(1) feeding wire to a receiving end of a wire tensioner; and

(2) operating an air system to urge the wire through the wire tensioner and through a tube engaged with a supply end of the wire tensioner to guide the wire toward a bondhead assembly of the wire bonding machine.

12. The method of claim 11, wherein the tube is slideably engaged with the supply end of the wire tensioner.

13. The method of claim 12, wherein the tube is slideably engaged with the supply end of the wire tensioner such that a portion of the tube slides outside of the wire tensioner.

14. The method of claim 12, wherein the tube is slideably engaged with the supply end of the wire tensioner such that a portion of the tube slides inside of the wire tensioner.

15. The method of claim 11, wherein a supply end of the tube is pivotally connected to a receiving end of the bondhead assembly. KSI-494WO PATENT

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16. The method of claim 11, further comprising an optics assembly, wherein a receiving end of the wire tensioner is pivotally connected to the optics assembly.

17. The method of claim 11, wherein step (2) comprises operating the air system to urge the wire from a receiving end of the wire tensioner toward a receiving end of a wire clamp assembly of the bondhead assembly.

18. The method of claim 11, wherein step (2) comprises operating the air system to urge the wire from a receiving end of the wire tensioner toward a receiving end of a bonding tool of the bondhead assembly.

19. The method of claim 11, wherein step (2) comprises operating the air system to urge the wire from a receiving end of the wire tensioner through a bonding tool of the bondhead assembly.