CN102463717A - 高导热型无胶覆铜基板的制备方法 - Google Patents
高导热型无胶覆铜基板的制备方法 Download PDFInfo
- Publication number
- CN102463717A CN102463717A CN2010105419206A CN201010541920A CN102463717A CN 102463717 A CN102463717 A CN 102463717A CN 2010105419206 A CN2010105419206 A CN 2010105419206A CN 201010541920 A CN201010541920 A CN 201010541920A CN 102463717 A CN102463717 A CN 102463717A
- Authority
- CN
- China
- Prior art keywords
- dianhydride
- preparation
- glue
- base plate
- diamines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 12
- 239000010949 copper Substances 0.000 title claims abstract description 12
- 239000000758 substrate Substances 0.000 title abstract description 5
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims abstract description 21
- 150000004985 diamines Chemical class 0.000 claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 9
- 229920001721 polyimide Polymers 0.000 claims abstract description 8
- 239000011889 copper foil Substances 0.000 claims abstract description 7
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000002798 polar solvent Substances 0.000 claims abstract description 7
- 239000009719 polyimide resin Substances 0.000 claims abstract description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000011265 semifinished product Substances 0.000 claims abstract description 6
- 238000003756 stirring Methods 0.000 claims abstract description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 5
- 238000001035 drying Methods 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 24
- 239000004020 conductor Substances 0.000 claims description 11
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 9
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 6
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 6
- 229940018564 m-phenylenediamine Drugs 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 claims description 3
- NLWCWEGVNJVLAX-UHFFFAOYSA-N 1-methoxy-2-phenylbenzene Chemical compound COC1=CC=CC=C1C1=CC=CC=C1 NLWCWEGVNJVLAX-UHFFFAOYSA-N 0.000 claims description 3
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical group CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- -1 amido diphenyl-methanes Chemical class 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 3
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 206010013786 Dry skin Diseases 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 239000006185 dispersion Substances 0.000 claims description 2
- WFKAJVHLWXSISD-UHFFFAOYSA-N isobutyramide Chemical compound CC(C)C(N)=O WFKAJVHLWXSISD-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 239000000047 product Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000007363 ring formation reaction Methods 0.000 abstract 1
- 239000000454 talc Substances 0.000 abstract 1
- 229910052623 talc Inorganic materials 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010541920.6A CN102463717B (zh) | 2010-11-12 | 2010-11-12 | 高导热型无胶覆铜基板的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010541920.6A CN102463717B (zh) | 2010-11-12 | 2010-11-12 | 高导热型无胶覆铜基板的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102463717A true CN102463717A (zh) | 2012-05-23 |
CN102463717B CN102463717B (zh) | 2014-07-02 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201010541920.6A Active CN102463717B (zh) | 2010-11-12 | 2010-11-12 | 高导热型无胶覆铜基板的制备方法 |
Country Status (1)
Country | Link |
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CN (1) | CN102463717B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1422881A (zh) * | 2001-12-05 | 2003-06-11 | 长春人造树脂厂股份有限公司 | 含氮的难燃性环氧树脂及其组合物 |
JP2007230019A (ja) * | 2006-02-28 | 2007-09-13 | Kaneka Corp | 金属張積層板の製造方法 |
CN101415296A (zh) * | 2008-11-24 | 2009-04-22 | 广东汕头超声电子股份有限公司覆铜板厂 | 一种覆铜板结构 |
CN101457012A (zh) * | 2008-12-31 | 2009-06-17 | 广东生益科技股份有限公司 | 一种树脂组合物及使用该树脂组合物涂覆金属箔、使用其制作的覆铜板 |
-
2010
- 2010-11-12 CN CN201010541920.6A patent/CN102463717B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1422881A (zh) * | 2001-12-05 | 2003-06-11 | 长春人造树脂厂股份有限公司 | 含氮的难燃性环氧树脂及其组合物 |
JP2007230019A (ja) * | 2006-02-28 | 2007-09-13 | Kaneka Corp | 金属張積層板の製造方法 |
CN101415296A (zh) * | 2008-11-24 | 2009-04-22 | 广东汕头超声电子股份有限公司覆铜板厂 | 一种覆铜板结构 |
CN101457012A (zh) * | 2008-12-31 | 2009-06-17 | 广东生益科技股份有限公司 | 一种树脂组合物及使用该树脂组合物涂覆金属箔、使用其制作的覆铜板 |
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Publication number | Publication date |
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CN102463717B (zh) | 2014-07-02 |
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Owner name: SUZHOU CITY-STATE DALI MATERIAL TECHNOLOGY CO., LT Free format text: FORMER OWNER: KUNSHAN YONGXIANG PHOTOELECTRIC TECHNOLOGY CO., LTD. Effective date: 20141202 |
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Free format text: CORRECT: ADDRESS; FROM: 215300 SUZHOU, JIANGSU PROVINCE TO: 215311 SUZHOU, JIANGSU PROVINCE |
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Effective date of registration: 20141202 Address after: 215311, Jiangsu, Suzhou, Kunshan, Pakistan Town West Yingbin Road South Patentee after: SUZHOU CHENGBANGDALI MATERIAL TECHNOLOGY Co.,Ltd. Address before: 215300, Jiangsu, Suzhou, Kunshan City, Pakistan Town, Zheng Ting Ting Road North Patentee before: KUNSHAN YONGXIANG OPTOELECTRONIC TECHNOLOGY Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |
Address after: 215311 South of Yingbin West Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Chengbang Dayi Material Technology Co.,Ltd. Address before: 215311 South of Yingbin West Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: SUZHOU CHENGBANGDALI MATERIAL TECHNOLOGY Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
CB03 | Change of inventor or designer information |
Inventor after: Yan Yong Inventor after: Xu Qing Inventor before: Zhang Peng Inventor before: Li Chengli Inventor before: Xu Qing Inventor before: Yan Yong |
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Effective date of registration: 20230328 Address after: 215300 room 2, No. 399, Dongping Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: KUNSHAN ZHUOYUE LANTIAN ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 215311 South of Yingbin West Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Chengbang Dayi Material Technology Co.,Ltd. |
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