CN102447039A - Integrated high-power LED (Light-Emitting Diode) light source module heat-conducting substrate - Google Patents
Integrated high-power LED (Light-Emitting Diode) light source module heat-conducting substrate Download PDFInfo
- Publication number
- CN102447039A CN102447039A CN2010105056325A CN201010505632A CN102447039A CN 102447039 A CN102447039 A CN 102447039A CN 2010105056325 A CN2010105056325 A CN 2010105056325A CN 201010505632 A CN201010505632 A CN 201010505632A CN 102447039 A CN102447039 A CN 102447039A
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- heat
- conducting substrate
- conducting
- light source
- shaped cavity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
An integrated high-power LED (Light-Emitting Diode) light source module heat-conducting substrate comprises a heat-conducting substrate and a closed screw rod-shaped cavity. A PCB (Printed Circuit Board) thin film and a support frame for fixedly connecting an LED module chip are arranged on the heat-conducting substrate; the closed screw rod-shaped cavity fixedly connected with the heat-conducting substrate into a whole is arranged below the heat-conducting substrate; and heat-conducting oil is filled inside the screw rod-shaped cavity. The invention has the beneficial effects that a flat plate type heat-conducting substrate is improved into the heat-conducting substrate fixedly connected with the screw rod-shaped cavity below a flat plate; and as the heat-conducting oil is filled inside the screw rod-shaped cavity of the heat-conducting substrate, the heat is transmitted to the surface of the whole heat-conducting substrate by utilizing the excellent heat-conducting physical property of the heat-conducting oil and then is taken away by an additional heat sink fin as well as heat exchange with air, so that the service life of an integrated high-power and high-brightness LED light source module is effectively improved.
Description
Technical field
The present invention relates to a kind of led light source module heat-conducting substrate, particularly a kind of integrated form high-power LED light source module heat-conducting substrate that mainly transmits the heat radiating and cooling with conduction oil.
Background technology
Mostly existing high-power and high-luminance LED light source module heat-conducting substrate is flat heat-conducting substrate; The led light source module directly is encapsulated on a slice copper coin; And smear heat conductive silica gel, dispel the heat on the temperature of led light source module installs heat transferred additional by heat conductive silica gel to outward the radiator.Because itself and the factor of radiator contact area, and the reason of heat radiator fin arrangement have directly influenced heat conduction and radiating effect, cause the distribution of substrate temperature and radiator temperature seriously inhomogeneous.This is to cause the principal element that the high-power LED light source module life-span shortens.
Summary of the invention
In view of the problem that present high-power LED light source module heat dissipation technology exists, the objective of the invention is to design a kind of simple in structure, can be fast, the high-power and high-luminance LED light source module heat-conducting substrate of equably heat transferred being gone out.
The present invention has realized above-mentioned purpose of design through the structure of the novelty taked.The present invention is a kind of integrated form high-power LED light source module heat-conducting substrate; It is characterized in that this heat-conducting substrate comprises the screw shaped cavity of heat-conducting substrate and sealing; The PCB film is arranged above the heat-conducting substrate and be used for fixing the support that is connected the LED module chip; The screw shaped cavity that a sealing that is fixed with one is with it arranged below the heat-conducting substrate, screw shaped cavity inside falling heat-transfer oil.
The present invention changes flat heat-conducting substrate into the heat-conducting substrate of the screw shaped cavity that is connected below the flat board; In the screw shaped cavity of heat-conducting substrate, add conduction oil; Utilize the superior heat conduction physical characteristic of conduction oil, promptly heat is spread all over whole heat-conducting substrate surface, radiator fins and the air exchange heat through adding again; Take away heat, thus the useful life of effectively improving integrated form high-power and high-luminance LED light source module.
Description of drawings
Fig. 1 is the structural representation of high-power LED light source module heat-conducting substrate of the present invention.
Fig. 2 is the radiating principle figure that adds radiator.
Embodiment
As shown in Figure 1; High-power LED light source module heat-conducting substrate of the present invention comprises the screw shaped cavity 4 of heat-conducting substrate 1 and sealing; PCB film 2 is arranged above the heat-conducting substrate 1 and be used for fixing the support 3 that is connected the led light source module chip; Screw shaped cavity 4 with sealing below the heat-conducting substrate 1 is fixed with one, screw shaped cavity inside falling heat-transfer oil 5.
Shown in Figure 2, be that this high-power LED light source module heat-conducting substrate and radiator 6 are assembled together, give high-power LED light source module 7 radiating and coolings.High-power LED light source module 7 is fixed on the heat-conducting substrate 1 by support 3; The heat that its work produces passes to the conduction oil in the screw cavity through PCB film 2 and heat-conducting substrate 1; Physical characteristic by conduction oil; Heat spreads all over conduction oil and the whole heat-conducting substrate surface in the cavity rapidly, equably, and passes to radiator 6 via the cored screw surface, carries out heat exchange by the fin and the air of radiator; Heat is dispersed in the air, thus the useful life of effectively improving integrated form high-power and high-luminance LED light source module.
In the present embodiment: conduction oil adopts No. 45 transformer cold oils.Its performance characteristics: solidifying point is low, of light color, has good low temperature properties, cooling property, good insulating properties and anti-oxidative stability.
Claims (1)
1. integrated form high-power LED light source module heat-conducting substrate; It is characterized in that this led light source module heat-conducting substrate comprises the screw shaped cavity of heat-conducting substrate and sealing; The PCB film is arranged above the heat-conducting substrate and be used for fixing the support that is connected the led light source chip; Screw shaped cavity with sealing below the heat-conducting substrate is fixed with one, screw shaped cavity inside falling heat-transfer oil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105056325A CN102447039A (en) | 2010-10-13 | 2010-10-13 | Integrated high-power LED (Light-Emitting Diode) light source module heat-conducting substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105056325A CN102447039A (en) | 2010-10-13 | 2010-10-13 | Integrated high-power LED (Light-Emitting Diode) light source module heat-conducting substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102447039A true CN102447039A (en) | 2012-05-09 |
Family
ID=46009335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105056325A Pending CN102447039A (en) | 2010-10-13 | 2010-10-13 | Integrated high-power LED (Light-Emitting Diode) light source module heat-conducting substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102447039A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106066003A (en) * | 2016-06-22 | 2016-11-02 | 东莞市闻誉实业有限公司 | LED illumination lamp |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2842745Y (en) * | 2005-10-20 | 2006-11-29 | 富准精密工业(深圳)有限公司 | Package structure for LED |
| CN201265842Y (en) * | 2008-10-08 | 2009-07-01 | 官有占 | LED packaging heat radiating device |
| CN101598282A (en) * | 2009-06-23 | 2009-12-09 | 深圳市阳光富源科技有限公司 | The LED street lamp |
| US20100225219A1 (en) * | 2009-03-05 | 2010-09-09 | Guichao Hua | LED Lamp System Utilizing A Hollow Liquid-Cooled Device |
| CN201845809U (en) * | 2010-10-13 | 2011-05-25 | 罗业富 | Heat conducting substrate for integral type large-power LED (light-emitting diode) light source module |
-
2010
- 2010-10-13 CN CN2010105056325A patent/CN102447039A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2842745Y (en) * | 2005-10-20 | 2006-11-29 | 富准精密工业(深圳)有限公司 | Package structure for LED |
| CN201265842Y (en) * | 2008-10-08 | 2009-07-01 | 官有占 | LED packaging heat radiating device |
| US20100225219A1 (en) * | 2009-03-05 | 2010-09-09 | Guichao Hua | LED Lamp System Utilizing A Hollow Liquid-Cooled Device |
| CN101598282A (en) * | 2009-06-23 | 2009-12-09 | 深圳市阳光富源科技有限公司 | The LED street lamp |
| CN201845809U (en) * | 2010-10-13 | 2011-05-25 | 罗业富 | Heat conducting substrate for integral type large-power LED (light-emitting diode) light source module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106066003A (en) * | 2016-06-22 | 2016-11-02 | 东莞市闻誉实业有限公司 | LED illumination lamp |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120509 |