CN102446844B - 一种导电聚合物凝胶填充硅通孔的方法 - Google Patents
一种导电聚合物凝胶填充硅通孔的方法 Download PDFInfo
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- CN102446844B CN102446844B CN201110359862XA CN201110359862A CN102446844B CN 102446844 B CN102446844 B CN 102446844B CN 201110359862X A CN201110359862X A CN 201110359862XA CN 201110359862 A CN201110359862 A CN 201110359862A CN 102446844 B CN102446844 B CN 102446844B
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JP6390728B2 (ja) * | 2017-02-22 | 2018-09-19 | Tdk株式会社 | 磁気センサとその製造方法 |
CN108943972B (zh) * | 2018-07-09 | 2020-06-16 | 业成科技(成都)有限公司 | 多层感测薄膜结构的填胶方法 |
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TW508738B (en) * | 2001-05-22 | 2002-11-01 | United Microelectronics Corp | Partial gap fill polymer procedure for dual damascene process |
JP2006169291A (ja) * | 2004-12-13 | 2006-06-29 | Yokohama Rubber Co Ltd:The | 変性導電性高分子並びにそれを用いた導電性部材 |
US7538434B2 (en) * | 2005-03-08 | 2009-05-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Copper interconnection with conductive polymer layer and method of forming the same |
US8187972B2 (en) * | 2008-07-01 | 2012-05-29 | Teledyne Scientific & Imaging, Llc | Through-substrate vias with polymer fill and method of fabricating same |
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Inventor after: Zhang Yu Inventor after: Li Cheng Inventor after: Li Quanbo Inventor after: Yang Yushu Inventor before: Zhou Jun |
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CB03 | Change of inventor or designer information |
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COR | Change of bibliographic data |
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