CN102412229B - 半导体器件中的金属塞结构 - Google Patents
半导体器件中的金属塞结构 Download PDFInfo
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- CN102412229B CN102412229B CN 201110355617 CN201110355617A CN102412229B CN 102412229 B CN102412229 B CN 102412229B CN 201110355617 CN201110355617 CN 201110355617 CN 201110355617 A CN201110355617 A CN 201110355617A CN 102412229 B CN102412229 B CN 102412229B
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CN 201110355617 CN102412229B (zh) | 2011-11-11 | 2011-11-11 | 半导体器件中的金属塞结构 |
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CN 201110355617 CN102412229B (zh) | 2011-11-11 | 2011-11-11 | 半导体器件中的金属塞结构 |
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CN102412229A CN102412229A (zh) | 2012-04-11 |
CN102412229B true CN102412229B (zh) | 2013-12-18 |
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Publication number | Priority date | Publication date | Assignee | Title |
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AU2187397A (en) * | 1996-03-22 | 1997-10-10 | Telefonaktiebolaget Lm Ericsson (Publ) | Semiconductor device shielded by an array of electrically conducting pins and a method to manufacture such a device |
CN1253939C (zh) * | 2002-02-10 | 2006-04-26 | 台湾积体电路制造股份有限公司 | 半导体基底上的接合垫结构 |
KR100673112B1 (ko) * | 2005-08-05 | 2007-01-22 | 주식회사 하이닉스반도체 | 퓨즈박스의 가아드링 |
KR100776167B1 (ko) * | 2006-12-20 | 2007-11-12 | 동부일렉트로닉스 주식회사 | 반도체 소자의 가드링 |
JP5034740B2 (ja) * | 2007-07-23 | 2012-09-26 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140108 |
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Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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Effective date of registration: 20140108 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |