CN102393863B - 金丝键合线的阻抗匹配方法 - Google Patents
金丝键合线的阻抗匹配方法 Download PDFInfo
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CN102393863B true CN102393863B (zh) | 2013-06-12 |
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Families Citing this family (21)
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CN103278701B (zh) * | 2013-04-24 | 2015-06-17 | 东南大学 | 一种测量键合金丝散射参数的装置及其使用方法 |
CN104377416A (zh) * | 2014-11-07 | 2015-02-25 | 江苏博普电子科技有限责任公司 | 一种适用于C波段GaN微波大功率器件的宽带匹配电路 |
CN104767103B (zh) | 2015-03-30 | 2017-12-19 | 青岛海信宽带多媒体技术有限公司 | 一种激光器用连接结构及激光器组件 |
CN104836619B (zh) * | 2015-03-30 | 2017-08-29 | 青岛海信宽带多媒体技术有限公司 | 一种光器件 |
CN106100761A (zh) * | 2016-06-07 | 2016-11-09 | 上海传英信息技术有限公司 | 射频电路调试方法 |
CN106413259B (zh) * | 2016-08-31 | 2019-08-02 | 宇龙计算机通信科技(深圳)有限公司 | 射频传输线的失配补偿方法及失配补偿装置 |
CN107330184B (zh) * | 2017-06-29 | 2020-03-24 | 南通大学 | 电气组件中的键合线的仿真测试方法及存储介质和设备 |
CN107480397B (zh) * | 2017-08-29 | 2019-09-10 | 西安电子科技大学 | 考虑双根金丝键合线互感的微波器件路耦合传输性能预测方法 |
CN107577860B (zh) * | 2017-08-29 | 2019-09-10 | 西安电子科技大学 | 基于单根金丝键合的微波器件路耦合传输性能预测方法 |
CN108363825A (zh) * | 2017-12-01 | 2018-08-03 | 长芯半导体有限公司 | 一种封装键合线阻抗匹配设计方法、电子设备及存储介质 |
CN108763703B (zh) * | 2018-05-18 | 2021-12-21 | 上海交通大学 | 一种基于阶梯阻抗传输线的键合线阻抗匹配方法 |
CN109921854B (zh) * | 2019-03-22 | 2021-11-02 | 中山大学 | 一种用于可见光通信系统的led阻抗匹配方法 |
CN110717256B (zh) * | 2019-09-23 | 2023-04-25 | 博微太赫兹信息科技有限公司 | 一种利用浮岛和金丝进行阻抗匹配的方法及系统 |
CN110932693B (zh) * | 2019-12-16 | 2023-03-24 | 广东工业大学 | 宽带差分式输入匹配网络设计方法和lc巴伦电路失配方法 |
CN111834720A (zh) * | 2020-07-10 | 2020-10-27 | 北京邮电大学 | 一种基于多枝节匹配的金丝键合结构和多芯片微波电路 |
CN112307413B (zh) * | 2020-11-11 | 2023-03-21 | 电子科技大学 | 一种键合线的矩形等效电路计算方法 |
CN113191036B (zh) * | 2021-03-19 | 2023-03-14 | 西安电子科技大学 | 一种共面波导等效电路结构及其参数提取方法 |
CN113569854B (zh) * | 2021-07-01 | 2022-05-03 | 南京航空航天大学 | 一种芯片焊接金丝跨距测量方法 |
CN114372435B (zh) * | 2021-12-22 | 2023-04-07 | 南京冉思电子科技有限公司 | 一种基于键合金丝模型的补偿电路设计方法 |
CN116780136B (zh) * | 2023-07-19 | 2024-02-27 | 泓林微电子(昆山)有限公司 | 一种基于金丝键合技术的耦合强度可调谐薄膜滤波器 |
CN118364771B (zh) * | 2024-06-19 | 2024-09-20 | 深圳飞骧科技股份有限公司 | 阻抗电路自匹配优化方法、系统及相关设备 |
Citations (4)
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US6201454B1 (en) * | 1999-03-30 | 2001-03-13 | The Whitaker Corporation | Compensation structure for a bond wire at high frequency operation |
CN1826671A (zh) * | 2003-07-23 | 2006-08-30 | 皇家飞利浦电子股份有限公司 | 压缩型阻抗变换电路 |
US7303113B2 (en) * | 2003-11-28 | 2007-12-04 | International Business Machines Corporation | Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers |
CN101998763A (zh) * | 2010-09-02 | 2011-03-30 | 华为技术有限公司 | 裸芯片与印制电路板的连接结构及印制电路板、通信设备 |
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2011
- 2011-06-15 CN CN 201110161083 patent/CN102393863B/zh not_active Expired - Fee Related
Patent Citations (4)
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US6201454B1 (en) * | 1999-03-30 | 2001-03-13 | The Whitaker Corporation | Compensation structure for a bond wire at high frequency operation |
CN1826671A (zh) * | 2003-07-23 | 2006-08-30 | 皇家飞利浦电子股份有限公司 | 压缩型阻抗变换电路 |
US7303113B2 (en) * | 2003-11-28 | 2007-12-04 | International Business Machines Corporation | Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers |
CN101998763A (zh) * | 2010-09-02 | 2011-03-30 | 华为技术有限公司 | 裸芯片与印制电路板的连接结构及印制电路板、通信设备 |
Non-Patent Citations (8)
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DiegoMarti等.WidebandDistributedAmplifiersinaHybridMicrostrip-Environmentusing0.1um(Al Ga)N/GaN HEMTs grown on Silicon.《Proceedings of the 4th European Microwave Integrated Circuits Conference》.2009 |
Wideband Distributed Amplifiers in a Hybrid Microstrip-Environment using 0.1um(Al,Ga)N/GaN HEMTs grown on Silicon;Diego Marti等;《Proceedings of the 4th European Microwave Integrated Circuits Conference》;20090929;全文 * |
基于LTCC技术的Ku波段T_R组件设计研究;李伟;《中国优秀硕士学位论文全文数据库》;20101130;全文 * |
张红影,徐金平,陈墨.毫米波微带键合金丝宽带匹配互连分析设计.《2009年全国微波毫米波会议论文集(上册)》.2009, * |
徐鸿飞, 殷晓星, 孙忠良.毫米波微带键合金丝互连模型的研究.《电子学报》.2003,第31卷(第12A期), |
曾耿华,唐高弟.微波多芯片组件中键合线的参数提取和优化.《信息与电子工程》.2007,第5卷(第1期),全文. * |
李伟.基于LTCC技术的Ku波段T_R组件设计研究.《中国优秀硕士学位论文全文数据库》.2010, |
毫米波微带键合金丝互连模型的研究;徐鸿飞, 殷晓星, 孙忠良;《电子学报》;20031231;第31卷(第12A期);全文 * |
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