CN102386118A - Substrate binding apparatus and substrate binding method - Google Patents
Substrate binding apparatus and substrate binding method Download PDFInfo
- Publication number
- CN102386118A CN102386118A CN201110255380XA CN201110255380A CN102386118A CN 102386118 A CN102386118 A CN 102386118A CN 201110255380X A CN201110255380X A CN 201110255380XA CN 201110255380 A CN201110255380 A CN 201110255380A CN 102386118 A CN102386118 A CN 102386118A
- Authority
- CN
- China
- Prior art keywords
- following table
- panel
- table panel
- base plate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to a substrate binding apparatus and a substrate binding method, wherein the substrate binding apparatus comprises a cavity; an upper surface plate arranged inside the cavity and provided with a binding component used for binding an upper substrate and a diaphragm for expanding to separate the upper substrate and the binding component; a lower surface plate arranged inside the cavity, wherein the lower surface plate is opposite to the upper surface plate, the supporter of the lower surface plate is bond to the lower substrate of the upper substrate; an elevating driver for driving the lower surface plate to move up and down; and a controller for controlling the elevating driver to move for binding the upper and lower substrates, wherein when the diaphragm expands the elevating driver is controlled to enable the lower surface plate to move downwards with a gradually-changed speed. Therefore, when the substrate bond to a bind clamping disc is separated from the binding clamping disc, the separating speed of the upper substrate bond on the binding clamping disc is controlled to stably keep the binding position of the upper substrate, thereby increasing the binding efficiency of the substrate.
Description
Technical field
The invention provides a kind of base plate bonding device and method, and more particularly, relate to a kind of base plate bonding device and method of using the bonding chuck to come adhesive base plate.
Background technology
The application requires to enjoy the korean patent application that the application number of submitting on September 2nd, 2010 is No.10-2010-0085999 and the application number of submitting on March 29th, 2011 is the priority of the korean patent application of No.10-2011-0027968, and their all the elements integrally are incorporated into this with the mode of quoting as proof.
The base plate bonding device is a kind of device that is used for bonding two substrates with the manufacturing two-d display panel; This device is used to make various two-d display panels, for example LCD (LCD), plasma display (PDP), Organic Light Emitting Diode (OLED) etc.
For adhesive base plate, this base plate bonding device comprises the substrate chuck that is used for supporting substrate.Usually use multiple substrate chuck and electrostatic chuck.Electrostatic chuck uses electrostatic force to block this substrate.Therefore, this electrostatic chuck consumed power is to produce electrostatic force.This electrostatic chuck needs power supply, and makes and control very difficulty of electrostatic chuck.In addition, the manufacturing cost of electrostatic chuck is very high.In order to solve the problems of electrostatic chuck, developed with a kind of alternative chuck of chuck that bond as electrostatic chuck.
As the routine techniques of bonding chuck, the Korean Patent that has disclosed publication number and be No.10-2006-0133942 is open.In this routine techniques, this bonding chuck uses a kind of being used for bonding parts and a kind of barrier film that be formed from a resin (diaphragm) that substrate and bond chuck separated of substrate bonding to the bonding chuck.Thereby this barrier film makes the substrate that has bondd separate with the bonding parts through expanding from extraneous air supplied.Applying this expansive force separates from the bonding parts with the substrate that will bond.
Yet the resin that is used for this barrier film is the low-down material of a kind of coefficient of friction.Same, substrate also is a kind of glass material with low-friction coefficient.Therefore, the contact surface place coefficient of friction between substrate and barrier film is very low.Correspondingly, separate with the bonding parts and simultaneously by the substrate of this barrier film extruding can with the contact surface of barrier film on slide, and therefore upper substrate and infrabasal plate possibly lose standard.
Summary of the invention
Therefore; Envision the present invention for addressing the above problem; And one aspect of the present invention is used to provide base plate bonding device and method; Said base plate bonding device and method can prevent that substantially substrate from sliding, thereby prevent that substantially upper substrate and infrabasal plate from losing standard when bonding two substrates on the barrier film of bonding chuck when substrate that will be bonding is separated with the bonding chuck.
In one aspect, a kind of base plate bonding device, this base plate bonding device comprises: cavity; Upper surface panel, said upper surface panel is disposed in said inside cavity, and said upper surface panel comprises the bonding parts of the upper substrate that is used to bond and expands so that the barrier film of said upper substrate and said bonding isolation of components; The following table panel, said following table panel is disposed in said inside cavity, and said following table panel is relative with said upper surface panel, and said following table panel support will be adhered to the infrabasal plate of said upper substrate; Following table panel up-down driver, the said following table panel of said following table panel up-down driver drives; And controller, said controller is controlled said following table panel up-down driver to begin after the expansion said following table panel being moved down at said barrier film.
When said membrane becomes expanded, the said up-down driver of said controller may command so that said following table panel begin to move down.When said following table panel moved down, the said upper surface panel of said controller may command moved up.
When said membrane becomes expanded; The said following table panel of said controller may command moves down predetermined amount of time with first speed; And after having passed through said predetermined amount of time, the said following table panel of said controller may command is to move down than the said first fireballing second speed.The scope of said first speed can be for from 0.05mm/sec to 0.5mm/sec, and the scope of said second speed can be for from 0.6mm/sec to 1.5mm/sec.
Before said membrane becomes expanded, the said upper surface panel of said controller may command moves down towards said following table panel, and after said upper surface panel moved down preset distance, said controller was controlled said barrier film and expanded.
In yet another aspect, a kind of base plate bonding method may further comprise the steps: upper substrate is bonded to the upper surface panel that comprises the parts that bond, and infrabasal plate is fixed on the following table panel; Make chamber vacuumization; And begin to make and be arranged on the membrane becomes expanded in the said upper surface panel, and after said barrier film begins to expand, said following table panel is moved down so that the upper substrate that has bondd separates with said upper surface panel.
Said following table panel can begin to move down when said membrane becomes expanded.Said upper surface panel can move up when said following table panel moves down.When said membrane becomes expanded, said following table panel can move down predetermined amount of time with first speed, and after having passed through said predetermined amount of time, said following table panel can be to move down than the said first fireballing second speed.The scope of said first speed can be for from 0.05mm/sec to 0.5mm/sec, and the span of said second speed can be for from 0.6mm/sec to 1.5mm/sec.Before said membrane becomes expanded, said upper surface panel can move down towards said following table panel, and said barrier film is inflatable after said upper surface panel moves down preset distance.
As stated; In base plate bonding device and method according to a kind of illustrative embodiments of the present invention; When the substrate that is glued to the bonding chuck is separated with the bonding chuck; The separating rate of the upper substrate that is bonded to this bonding chuck is controlled stably to keep the bond locations of this upper substrate, therefore improved base plate bonding efficient.
Description of drawings
Fig. 1 and Fig. 2 show the view according to the structure of the base plate bonding device of a kind of illustrative embodiments of the present invention.
Fig. 3 shows bonding chuck and the tacky state according to the base plate bonding device of a kind of illustrative embodiments of the present invention.
Fig. 4 shows the substrate that makes according to the base plate bonding device of a kind of illustrative embodiments of the present invention to be separated with the bonding chuck.
Fig. 5 is used to explain the flow chart according to a kind of base plate bonding method of a kind of illustrative embodiments of the present invention.
Fig. 6 is used to explain the flow chart according to a kind of base plate bonding method of another kind of illustrative embodiments of the present invention.
Fig. 7 is used to explain the flow chart according to a kind of base plate bonding method of another illustrative embodiments of the present invention.
Embodiment
Hereinafter, with the illustrative embodiments that invention will be described in detail with reference to the attached drawing.In the illustrative embodiments below, a kind of base plate bonding device will be described.Yet illustrative embodiments of the present invention can be applied to Etaching device, precipitation equipment and other device, and is applied to the base plate bonding device substrate is bondd and separate.
As depicted in figs. 1 and 2, comprise cavity according to the base plate bonding device of a kind of illustrative embodiments of the present invention.This cavity comprises upper chamber 100 and lower cavity 200, respectively upper substrate S1 and infrabasal plate S2 is fixed in upper chamber 100 and the lower cavity 200.Lower cavity 200 is fixed on the pedestal (not shown), and makes upper chamber 100 risings and decline through cavity lift 300.
In addition, this following table panel 210 can be equipped with a plurality of pickers that run through following table panel 210 and substrate chuck 220 and turnover in following table panel 210 and substrate chuck 220.Picker moves up towards the bottom of infrabasal plate S2, and the infrabasal plate S2 on will being fixed on substrate chuck 220 when being carried picker support this infrabasal plate, and picker moves down so that infrabasal plate S2 is fixed on the substrate chuck 220 thereafter.In addition, bonded when forming panel as upper substrate S1 and infrabasal plate S2, picker is used to make this panel to move up so that outwards transport this panel.
In addition, upper chamber 100 can be provided with the camera (not shown), thereby the alignment mark that this camera is taken on upper substrate S1 and the infrabasal plate S2 confirms whether substrate is placed on the correct bond locations.This camera is taken the alignment mark on upper substrate S1 and the infrabasal plate S2 through a shooting hole of running through upper chamber 100.At this moment, can be under lower cavity 200 the mounting light emitting device (not shown), and this light-emitting device provides illumination so that camera can be taken alignment mark.
Space between upper chamber 100 and the lower cavity 200 has formed a processing space.In order to make this processing space evacuation, can turbomolecular pump (TMP) and dry pump be connected to lower cavity 200.
Disposed outside below lower cavity 200 following table panel alignment device 230, and following table panel alignment device 230 is connected to this following table panel 210.Following table panel alignment device 230 can be the UVW platform.In addition, up-down driver 240 is arranged in the below of following table panel alignment device 230, and drive following table panel alignment device 230 with following table panel 210 so that following table panel alignment device 230 and 210 risings of following table panel and decline.Up-down driver 240 can comprise linear electric machine or hydraulic actuator.Therefore, as shown in Figure 2, when upper substrate S1 and infrabasal plate S2 were bonded, this following table panel 210 can move down or move up towards upper surface panel 110.
In this illustrative embodiments, the base plate bonding device is equipped with bonding chuck air supply device 400 to supply air to bonding chuck 120.In addition, provide controller 500 so that the operation of bonding chuck air supply device 400 and up-down driver 240 is controlled.The overall operation of controller 500 may command base plate bonding devices.
Below, with the structure of this bonding chuck 120 of more detailed description.Like Fig. 3 and shown in Figure 4, this bonding chuck 120 comprises the housing 121 that is inserted in the first surface plate 110.In addition; Bonding chuck 120 comprises and is inserted in the housing 121 and is arranged in the support unit 124 in the housing 121; And support unit 124 is formed with the air vent hole 123 that is communicated with the connecting hole 111 that extends from bonding chuck air supply device 400, makes air to be inhaled into and to discharge.
In addition, on the inner peripheral of housing 121 of bonding chuck 120, formed protuberance 125, and formed support protuberance 126 on the outer peripheral edges of the support unit in will being inserted into housing 121 124.Therefore, the support protuberance 126 that is inserted into the support unit 124 in the housing 121 hangs on the protuberance 125 and by protuberance 125 and supports.
And barrier film 127 closely is arranged in the basal surface of support unit 124.The end of barrier film 127 is inserted into and is fixed on protuberance 125 and supports between the protuberance 126.Air through discharging from air vent hole 123 makes barrier film 127 expand towards upper substrate S1; And when the air supply through air vent hole 123 is cut off or carries out suction operation through air vent hole 123, make barrier film 127 revert to the surface of tight contact support unit 124.
Be formed from a resin and be disposed in the periphery of the part that the barrier film 127 of housing 121 expands with the bonding parts 128 that upper substrate S1 is bonded to.In order to arrange bonding parts 128, can on the surface of position that is furnished with bonding parts 128 of housing 121, form a plurality of layout groove (not shown), thereby can be in arranging groove in the (not shown) part insert and arrange each bonding parts 128.
Simultaneously; Be cured through the silicon rubber composite material to side reaction sclerosis and make bonding parts 128, the main component of the silicon rubber composite material of side reaction sclerosis comprises organic hydrogen polysiloxanes (5 to 30 weight portion), side reaction catalyst, includes the organopolysiloxane (10 to 75 weight portion) of the thiazolinyl that will combine with a spot of silicon atom etc.And, can through compression molded, slip-casting, injection molding, stamping-out etc. directly form the bonding parts 128 external shape.
In addition, in case of necessity, can apply with other surface of 129 pairs of bondings of diaphragm seal parts 128 except being used for the surface that upper substrate S1 is bonded to.Diaphragm seal 129 can comprise liquid silastic (LSR), room temperature vulcanization (RTV) elastomer, high-consistency silicon rubber (HCR), organic (SMO) elastic emulsion of silicon modification or be used for the similar material of sealing function.
Fig. 5 is used to explain the flow chart according to a kind of base plate bonding method of a kind of illustrative embodiments of the present invention.With reference to Fig. 5; Under upper chamber 100 and lower cavity 200 state separated from one another; A manipulator (not shown) is transported to the space between upper chamber 100 and the lower cavity 200 with upper substrate S1, and on the bonding chuck 120 that upper substrate S1 is bonded to be arranged on the upper surface panel 110.At this moment, can realize bonding, make upper substrate S1 can be glued to upper substrate S1, perhaps can bond to upper substrate S1 through making picker move up through the vacuum chuck or the vacuum bonding hole that are arranged on the upper surface panel 110 to upper substrate S1.
Next, transport infrabasal plate S2, and when picker moved up and support infrabasal plate S2, this manipulator left by manipulator.Then, picker moves down and makes infrabasal plate S2 can be fixed on the following table panel 210.Therefore, come clamping infrabasal plate S2 (S10) by substrate chuck 220.
Then, cavity lift 300 moves down with tight contact lower cavity 200 upper chamber 100, thereby has formed processing space.If formed processing space, then make this processing space evacuation through dry pump and turbomolecular pump.
Then, following table panel 210 moves up so that upper substrate S1 and infrabasal plate S2 (S11) aligned with each other.If upper substrate S1 and infrabasal plate S2 are fully aimed at; The driver 240 that then goes up and down rises so that upper substrate S1 closely contacts with infrabasal plate S2 each other following table panel 210; And controller 500 is to bonding chuck air supply device 400 supply air, makes barrier film 127 expand (S12) thus.
Simultaneously or through after the scheduled time, controller 500 control up-down drivers 240 are so that following table panel 210 moves down (S13) with the low speed of first speed.Here, the low speed that following table panel 210 is moved down can be 0.05mm/sec～0.5mm/sec.The low like this speed of moving down has prevented that the upper substrate S1 that has separated from bonding chuck 120 from sliding at the friction surface with barrier film 127.Therefore, can keep aligning between upper substrate S1 and the infrabasal plate S2.
In addition, if if barrier film 127 complete expansions or first speed of moving down have continued predetermined amount of time, then controller 500 moves down the signal of speed to 240 transmissions second of up-down driver.Second speed is faster than first speed.Correspondingly, following table panel 210 moves down (S14) at a high speed.Here, second speed can be 0.6mm/sec～1.5mm/sec.If moved down predetermined amount of time with second speed, then following table panel 210 has been accomplished and has been moved down (S15).
If accomplished above operation, upper chamber 100 is separated with lower cavity 200, and the picker of lower cavity 200 moved up.Then, manipulator gets into and bonding panel is taken out, thereby has accomplished adhesion process.
Alternately, the speed of moving down of following table panel 210 can be different from aforementioned speed.In addition, can handle the velocity variations of following table panel 210 through two perhaps more steps.
Fig. 6 is used to explain the flow chart according to a kind of base plate bonding method of another kind of illustrative embodiments of the present invention.With reference to Fig. 6; Under upper chamber 100 and lower cavity 200 state separated from one another; A manipulator (not shown) is transported to the space between upper chamber 100 and the lower cavity 200 with upper substrate S1, and on the bonding chuck 120 that upper substrate S1 is bonded to be arranged on the upper surface panel 110.At this moment, can realize bonding, make upper substrate S1 can be glued to upper substrate S1, perhaps can bond to upper substrate S1 through making picker move up through the vacuum chuck or the vacuum bonding hole that are arranged on the upper surface panel 110 to upper substrate S1.
Next, transport infrabasal plate S2, and when picker moved up and support infrabasal plate S2, this manipulator left by manipulator.Then, picker moves down and makes infrabasal plate S2 can be fixed on the following table panel 210.Therefore, come clamping infrabasal plate S2 (S20) by substrate chuck 220.
Then, cavity lift 300 moves down with tight contact lower cavity 200 upper chamber 100, thereby has formed processing space.If formed processing space, then make this processing space evacuation through dry pump and turbomolecular pump.
Then, make upper surface panel 110 move down (S21) by upper surface panel up-down driver 101.Therefore, upper substrate S1 and infrabasal plate S2 are aligned with each other.If upper substrate S1 and infrabasal plate S2 aim at fully, then controller 500 is to bonding chuck air supply device 400 supply air, makes barrier film 127 expand (S22) thus.
Simultaneously or passed through after the predetermined amount of time, controller 500 control up-down drivers 240 are so that following table panel 210 moves down (S23) with the low speed of first speed.Here, the low speed that following table panel 210 is moved down can be 0.05mm/sec～0.5mm/sec.The low like this speed of moving down has prevented that the upper substrate S1 that has separated from bonding chuck 120 from sliding at the friction surface with barrier film 127.Therefore, can keep aligning between upper substrate S1 and the infrabasal plate S2.
In addition, if if barrier film 127 complete expansions or first speed of moving down have continued predetermined amount of time, then controller 500 moves down the signal of speed to 240 transmissions second of up-down driver.Second speed is faster than first speed.Correspondingly, following table panel 210 at full speed moves down (S24).Here, second speed can be 0.6mm/sec～1.5mm/sec.If moved down predetermined amount of time with second speed, then following table panel 210 has been accomplished and has been moved down (S25).
If accomplished above operation, upper chamber 100 is separated with lower cavity 200, and the picker of lower cavity 200 moved up.Then, manipulator gets into and bonding panel is taken out, thereby has accomplished adhesion process.Alternately, the speed of moving down of following table panel 210 can be different from aforementioned speed.In addition, can handle the velocity variations of following table panel 210 through two perhaps more steps.
Fig. 7 is used to explain the flow chart according to a kind of base plate bonding method of another illustrative embodiments of the present invention.With reference to Fig. 7; Under upper chamber 100 and lower cavity 200 state separated from one another; A manipulator (not shown) is transported to the space between upper chamber 100 and the lower cavity 200 with upper substrate S1, and on the bonding chuck 120 that upper substrate S1 is bonded to be arranged on the upper surface panel 110.At this moment, can realize bonding, make upper substrate S1 can be glued to upper substrate S1, perhaps can bond to upper substrate S1 through making picker move up through the vacuum chuck or the vacuum bonding hole that are arranged on the upper surface panel 110 to upper substrate S1.
Next, transport infrabasal plate S2, and when picker moved up and support infrabasal plate S2, this manipulator left by manipulator.Then, picker moves down and makes infrabasal plate S2 can be fixed on the following table panel 210.Therefore, come clamping infrabasal plate S2 (S30) by substrate chuck 220.
Then, cavity lift 300 moves down with tight contact lower cavity 200 upper chamber 100, thereby has formed processing space.If formed processing space, then make this processing space evacuation through dry pump and turbomolecular pump.
Then, following table panel 210 moves up so that upper substrate S1 and infrabasal plate S2 are aligned with each other.If upper substrate S1 and infrabasal plate S2 aim at fully, the driver 240 that then goes up and down rises so that upper substrate S1 closely contacts with infrabasal plate S2 each other following table panel 210.If upper substrate S1 and infrabasal plate S2 closely contact each other and be bonded to each other, then controller 500 is to bonding chuck air supply device 400 supply air, makes barrier film 127 expand (S31) thus.
Simultaneously or passed through after the predetermined amount of time, controller 500 control upper surface panel up-down drivers 101 are so that upper surface panel 110 moves, and control up-down driver 240 is so that following table panel 210 moves down (S33) with the low speed of first speed.Here, the low speed that following table panel 210 is moved down can be 0.05mm/sec～0.5mm/sec.The low like this speed of moving down has prevented that the upper substrate S1 that has separated from bonding chuck 120 from sliding at the friction surface with barrier film 127.Therefore, can keep aligning between upper substrate S1 and the infrabasal plate S2.
In addition, if if barrier film 127 complete expansions or first speed of moving down have continued predetermined amount of time, then controller 500 moves down the signal of speed to 240 transmissions second of up-down driver.Second speed is faster than first speed.Correspondingly, following table panel 210 at full speed moves down (S34).Here, second speed can be 0.6mm/sec～1.5mm/sec.If following table panel 210 has moved down predetermined amount of time with second speed, then upper surface panel 110 has been accomplished and has been moved up and following table panel 210 has been accomplished and moved down (S35).
If accomplished above operation, upper chamber 100 is separated with lower cavity 200, and the picker of lower cavity 200 moved up.Then, manipulator gets into and bonding panel is taken out, thereby has accomplished adhesion process.
Alternately, the speed of moving down of following table panel 210 can be different from aforementioned speed.In addition, can handle the velocity variations of following table panel 210 through two perhaps more steps.
As stated, base plate bonding apparatus and method according to an illustrative embodiment of the invention can be applied to bonding color filter substrate and array base palte to make the LCD substrate, perhaps can be applied to bonding OLED deposition substrate and the array base palte that is used for oled substrate.
Though specifically illustrated the present invention; And the present invention has been described with reference to illustrative embodiments of the present invention; But it will be appreciated by those skilled in the art that; Under the situation of the spirit and scope of the present invention that do not break away from accompanying claims and limited, can carry out various changes with regard to form and details in the present invention.It only is purpose illustrative but not in order to limit that illustrative embodiments should be regarded as.Therefore, scope of the present invention is not limited detailed description of the present invention, but is limited accompanying claims, and whole different example in this scope will be interpreted as and be included in the present invention.
Claims (12)
1. base plate bonding device, this base plate bonding device comprises:
Cavity;
Upper surface panel, said upper surface panel is disposed in said inside cavity, and said upper surface panel comprises the bonding parts of the upper substrate that is used to bond and expands so that the barrier film of said upper substrate and said bonding isolation of components;
The following table panel, said following table panel is disposed in said inside cavity, and said following table panel is relative with said upper surface panel, and said following table panel support will be adhered to the infrabasal plate of said upper substrate;
Following table panel up-down driver, the said following table panel of said following table panel up-down driver drives; And
Controller, said controller are controlled said following table panel up-down driver to begin after the expansion said following table panel being moved down at said barrier film.
2. base plate bonding device according to claim 1, wherein, when said membrane becomes expanded, said controller is controlled said up-down driver so that said following table panel begins to move down.
3. base plate bonding device according to claim 2, wherein, when said following table panel moved down, said controller was controlled said upper surface panel and is moved up.
4. base plate bonding device according to claim 1; Wherein, When said membrane becomes expanded; Said controller is controlled said following table panel and is moved down predetermined amount of time with first speed, and after having passed through said predetermined amount of time, said controller is controlled said following table panel to move down than the said first fireballing second speed.
5. base plate bonding device according to claim 4, wherein, the scope of said first speed is from 0.05mm/sec to 0.5mm/sec, and the scope of said second speed is from 0.6mm/sec to 1.5mm/sec.
6. base plate bonding device according to claim 1; Wherein, Before said membrane becomes expanded; Said controller is controlled said upper surface panel and is moved down towards said following table panel, and after said upper surface panel moved down preset distance, said controller was controlled said barrier film and expanded.
7. base plate bonding method, this base plate bonding method may further comprise the steps:
Upper substrate is bonded to the upper surface panel that comprises the parts that bond, and infrabasal plate is fixed on the following table panel;
Make chamber vacuumization; And
Begin to make to be arranged on the membrane becomes expanded in the said upper surface panel, and after said barrier film begins to expand, said following table panel is moved down so that the upper substrate that has bondd separates with said upper surface panel.
8. base plate bonding method according to claim 7, wherein, said following table panel begins to move down when said membrane becomes expanded.
9. base plate bonding method according to claim 8, wherein, said upper surface panel moves up when said following table panel moves down.
10. base plate bonding method according to claim 7; Wherein, when said membrane becomes expanded, said following table panel moves down predetermined amount of time with first speed; And after having passed through said predetermined amount of time, said following table panel is to move down than the said first fireballing second speed.
11. base plate bonding method according to claim 10, wherein, the scope of said first speed is from 0.05mm/sec to 0.5mm/sec, and the scope of said second speed is from 0.6mm/sec to 1.5mm/sec.
12. base plate bonding method according to claim 7, wherein, before said membrane becomes expanded, said upper surface panel moves down towards said following table panel, and after said upper surface panel moves down preset distance said membrane becomes expanded.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20100085999 | 2010-09-02 | ||
| KR10-2010-0085999 | 2010-09-02 | ||
| KR1020110027968A KR101261491B1 (en) | 2010-09-02 | 2011-03-29 | Substrate bonding apparatus and substrate bonding method |
| KR10-2011-0027968 | 2011-03-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102386118A true CN102386118A (en) | 2012-03-21 |
| CN102386118B CN102386118B (en) | 2016-03-23 |
Family
ID=45825401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110255380.XA Expired - Fee Related CN102386118B (en) | 2010-09-02 | 2011-08-10 | Substrate bonding apparatus and base plate bonding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102386118B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364455A (en) * | 2018-03-26 | 2019-10-22 | 捷进科技有限公司 | The manufacturing method of chip attachment device and semiconductor device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101101860A (en) * | 2006-05-26 | 2008-01-09 | 爱德牌工程有限公司 | Adhesive chuck, and apparatus and method for assembling substrates using the same |
| CN101191937A (en) * | 2006-11-29 | 2008-06-04 | 爱德牌工程有限公司 | Apparatus for attaching substrates |
| CN101382683A (en) * | 2007-09-03 | 2009-03-11 | 爱德牌工程有限公司 | Substrate bonding apparatus and method |
| CN101430446A (en) * | 2007-11-07 | 2009-05-13 | 爱德牌工程有限公司 | Substrate bonding apparatus |
| KR20100054959A (en) * | 2008-11-17 | 2010-05-26 | 엘아이지에이디피 주식회사 | Apparatus for joining of substrate and method for joining of substrateusing the same |
-
2011
- 2011-08-10 CN CN201110255380.XA patent/CN102386118B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101101860A (en) * | 2006-05-26 | 2008-01-09 | 爱德牌工程有限公司 | Adhesive chuck, and apparatus and method for assembling substrates using the same |
| CN101191937A (en) * | 2006-11-29 | 2008-06-04 | 爱德牌工程有限公司 | Apparatus for attaching substrates |
| CN101382683A (en) * | 2007-09-03 | 2009-03-11 | 爱德牌工程有限公司 | Substrate bonding apparatus and method |
| CN101430446A (en) * | 2007-11-07 | 2009-05-13 | 爱德牌工程有限公司 | Substrate bonding apparatus |
| KR20100054959A (en) * | 2008-11-17 | 2010-05-26 | 엘아이지에이디피 주식회사 | Apparatus for joining of substrate and method for joining of substrateusing the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364455A (en) * | 2018-03-26 | 2019-10-22 | 捷进科技有限公司 | The manufacturing method of chip attachment device and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102386118B (en) | 2016-03-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI596761B (en) | Method and apparatus for manufacturing display device | |
| JP3917651B2 (en) | Adhesive chuck device | |
| CN102177010B (en) | Device and method for thermoforming by hot-plate heating | |
| CN101387797B (en) | Adhesive chuck and substrate bonding apparatus | |
| TWI443428B (en) | Substrate bonding apparatus and susbtrate bonding method | |
| JP5337620B2 (en) | Workpiece adhesive holding device and vacuum bonding machine | |
| JP2018167537A (en) | Lamination device | |
| TWI662651B (en) | Support chuck and substrate treating apparatus | |
| JP6384342B2 (en) | Film-coated component manufacturing apparatus and method | |
| KR101457044B1 (en) | Apparatus and method for attaching substrates | |
| KR20120124810A (en) | Panel bonding apparatus for bonding touch panel and display panel | |
| CN102386118A (en) | Substrate binding apparatus and substrate binding method | |
| WO2018173258A1 (en) | Film adhesion device, electroluminescent device manufacturing device, method for manufacturing electroluminescent device, and controller | |
| KR20140123832A (en) | Panel bonding appratus and method of driving the same | |
| KR20150140222A (en) | Peeling apparatus and peeling method for laminate, and manufacturing method of electronic device | |
| KR101288864B1 (en) | Substrate bonding apparatus | |
| KR20130054307A (en) | Substrate bonding apparatus and substrate bonding method | |
| CN106066555B (en) | Box aligning device | |
| TWI415781B (en) | Disk drive device | |
| CN220536047U (en) | Film sticking machine for display panel | |
| KR20220139412A (en) | Workpiece Adhesive Chuck Device and Workpiece Pasting Machine | |
| KR101457043B1 (en) | Apparatus and method for attaching substrates | |
| KR101292212B1 (en) | Substrate bonding apparatus | |
| KR101456692B1 (en) | Apparatus and method for attaching substrates | |
| KR20160031329A (en) | Sheet member for display apparatus chucking and dechucking apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160323 Termination date: 20190810 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |