CN101191937A - Apparatus for attaching substrates - Google Patents
Apparatus for attaching substrates Download PDFInfo
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- CN101191937A CN101191937A CNA2007101820370A CN200710182037A CN101191937A CN 101191937 A CN101191937 A CN 101191937A CN A2007101820370 A CNA2007101820370 A CN A2007101820370A CN 200710182037 A CN200710182037 A CN 200710182037A CN 101191937 A CN101191937 A CN 101191937A
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- lower chambers
- upper chamber
- equipment according
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- chamber
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Liquid Crystal (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
An apparatus for attaching substrates is provided with a buffering member between an upper chamber and a lower chamber. The buffering member reduces a load applied to a lifting device during vacuum exhaustion of a sealing space between the chambers. Therefore, it is possible to reduce a force applied to a lifting screw and a frame supporting a chamber, thereby extending the lifetime of the substrate attaching apparatus and component replacement. Also, it is possible to increase a lower chamber supporting force of a lifting part by coupling the lifting part to an external frame with a fixing device. As the result, the lower chamber is stably fixed and thus it is possible to reduce failures in a substrate attaching process.
Description
Technical field
The disclosure relates to a kind of being used for be attached to each other together equipment of two substrates more particularly, is related to a kind of equipment that is used for attaching substrates, and this equipment is provided with bolster between upper chamber and lower chambers.
Background technology
Recently, along with the development of information society, the demand of display device is constantly increased.Therefore, developed the display device of number of different types, such as LCD (LCD), Plasmia indicating panel (PDP) etc.The customer requirements video quality excellence of these display device, in light weight and size is big.Therefore, recently developed size greater than 50 inches oversize LCD.
LCD display be utilize liquid-crystal refractive-index anisotropy and on its screen the display device of display message.Manufacturing forms LCD display by adding liquid crystal and be attached to each other these two substrates together between two substrates.One in these two substrates is the drive unit array base palte, and another is color filter (CF) substrate.Be formed with a plurality of pixels on the drive unit array base palte, and each pixel is formed with the driving element such as thin film transistor (TFT) (TFT).The color filter layer that is used to realize color is formed at colour filtering chip basic board together with pixel electrode, common electrode and the aligning film (alignment film) that is used to aim at liquid crystal molecule.
In the process of making this display device, the process that two substrates are attached to each other together is very important.Along with the increase of sized display, the size that is used to adhere to the equipment of these two substrates also increases.
Substrate attachment equipment is designed to form sealing and adheres to the space.In attaching process, this space is evacuated to form vacuum.Along with the change of substrate attachment equipment is big, also increase owing to adhering to the load that pressure differential between chamber inside and outside puts on adhesion equipment.This loading and can cause the distortion of chamber on the wall of chamber body.This deformation force can also apply extra power to the jacking gear that is used for half chamber of lifting.
The jacking gear of this adhesion equipment is provided with lifting motor, and this lifting motor is provided for the driving force of lifting chamber.Lifting screw (lifting screw) axially rotates to raise and to reduce the framework that is used to support a part of chamber.Usually, jacking gear lifting lower chambers is connected with upper chamber until lower chambers and adheres to the space with sealing.Then chamber is carried out vacuum exhaust.The vacuum state that adheres in the space makes lower chambers upwards be drawn owing to pressure differential.When lower chambers was upwards drawn, masterpiece was used on the framework that supports chamber, the lifting screw etc.Therefore, the other parts of framework, lifting screw and jacking gear may be out of shape.And then this will be easy to cause the serviceable life of the frequent replacing of parts and substrate attachment equipment shorter.
And, in attaching process, importantly adjust the gap between the substrate, have uniform gap between the substrate thereby make, thereby and also very important two substrates of the relative position of align substrates be attached to each other together at accurate desired locations place.This gap adjustment process and position alignment process only can be carried out after lower chambers has been raised and has been fixed in upper chamber exactly.
Owing to the increase of adhesion equipment along with substrate size becomes greatly, so when display sizes increased, lower chambers and the weight that is positioned over the substrate of bottom chamber also became heavier.Therefore, the load that puts on lifting and support the Lift Part of lower chambers also increases.The more heavy load of bigger adhesion equipment can cause the lifting screw elastic deformation.As a result, may in gap adjustment process or position alignment process error appear.
Summary of the invention
In order to solve relevant with prior art above-mentioned and other problem, the present invention has been proposed.The invention is characterized in provides a kind of equipment that is used for attaching substrates, and this equipment is provided with bolster between upper chamber and lower chambers, thereby can reduce to act on when chamber is carried out vacuum exhaust the load on the jacking gear.
Another feature of the present invention is to provide a kind of equipment that is used for attaching substrates, this equipment comprises stationary installation, this stationary installation is connected in the Lift Part that is used for lifting and supports lower chambers, and utilizes magnetic force to be attached to outside framework, has increased the lower chambers anchorage force of Lift Part in this equipment.
In order to realize feature of the present invention, a kind of equipment that is used for attaching substrates is provided, this equipment comprises: main frame; Upper chamber is installed on the main frame, and this upper chamber keeps upper substrate; Lower chambers is installed on the main frame, and this lower chambers keeps infrabasal plate, and wherein, at least one chamber in upper chamber and the lower chambers can move, and adheres to the space thereby upper chamber and lower chambers can lump together to form sealing; And bolster, be arranged between upper chamber and the lower chambers, wherein, bolster provides elastic force, and this elastic force is easy to (being tending towards) keeps separately upper chamber and lower chambers.
In addition, provide a kind of equipment that is used for attaching substrates, this equipment comprises: main frame; Upper chamber is installed on the main frame that keeps upper substrate; Lower chambers is installed on the main frame that keeps infrabasal plate; Mobile device, at least one chamber in mobile upper chamber and the lower chambers adheres to the space thereby upper chamber and lower chambers can lump together to form sealing between upper chamber and lower chambers; And at least one stationary installation, be attached to the movable part of mobile device, wherein, described at least one stationary installation optionally is connected in main frame with the movable part of mobile device.
Description of drawings
Describe embodiment with reference to the accompanying drawings in detail, identical reference number is represented identical parts in the accompanying drawing, in the accompanying drawing:
Fig. 1 shows the sectional view of first embodiment of the equipment that is used for attaching substrates;
Fig. 2 shows and be used for the bolster that cushions between the upper chamber of equipment shown in Figure 1 and lower chambers;
Fig. 3 A to 3C shows the view of the lower chambers that how to raise in attaching process;
Fig. 4 shows the sectional view of another embodiment of the equipment that is used for attaching substrates;
Fig. 5 A shows stationary installation;
Fig. 5 B shows and how stationary installation is installed in the lifting table of Lift Part;
Fig. 5 C shows the planimetric map that how magnetic part of stationary installation is attached to outside framework; And
Fig. 6 shows the magnetic part that how to utilize magnetic force will be used for the equipment of attaching substrates according to another embodiment of the present invention and is attached to outside framework.
Embodiment
Some embodiments of the present invention are described with reference to the accompanying drawings in more detail.
Fig. 1 shows the sectional view of first embodiment of the equipment that is used for attaching substrates.With reference to Fig. 1, this equipment is provided with outside framework 10.Upper chamber 20 and lower chambers 30 form the substrate attachment space.Lift Part 40 provides lifting power, makes it to engage with upper chamber 20 so that lower chambers 30 is moved up.Bolster 60 is arranged between upper chamber 20 and the lower chambers 30.
Outside framework 10 is provided with the door 11 that is used to insert and shift out substrate.Preferably, this door 11 is only just opened when inserting and shifting out substrate, thereby can not enter the inside of substrate attachment equipment such as the impurity of dust.The insertion of substrate and shift out by the transfer robot (not shown) and undertaken.This transfer robot is provided with the one or more mechanical arms that are used for upper substrate S1 and infrabasal plate S2 are transported in the equipment and slave unit transports.
Though vacuum and reception pin that this embodiment uses vacuum pump to produce keep substrate, other embodiment can utilize other holding device.For example, this holding device can be the device of electrostatic chuck or other type.
Substrate receives pin 22 and also is arranged in the lower chambers 30, so that receive and maintenance infrabasal plate S2.Usually, substrate reception pin 22 can be recessed in the top surface of lower chambers.
The one or more video cameras 23 that are arranged at the top place of upper chamber 20 detect alignment mark on upper substrate S1 and the infrabasal plate S2 by the photograph hole of passing upper chamber 20.The image that video camera produces is used for determining whether substrate is suitably aimed at each other.One or more lighting devices 33 are arranged at the bottom place of lower chambers 30, and providing light by the illumination holes of passing lower chambers 30, thereby video camera 23 can detect alignment mark.
In case substrate is installed on upper chamber and the lower chambers, lower chambers 30 is just by upwards liftings of Lift Part 40, and is connected to form to seal with upper chamber 20 and adheres to the space.Then, can adhere to the space by 51 pairs of sealings of first vacuum pump and carry out vacuum exhaust to form vacuum.
The alignment device that is used for mobile lower chambers 30 is arranged between lower chambers 30 and the horizontal frame.Preferably, alignment device 34 can make lower chambers 30 move along X, Y direction and rotation direction.Usually, a plurality of cams are used as alignment device 34.The upside of cam is in abutting connection with the lower end of lower chambers 30, and the downside of cam is fixed in horizontal frame.The rotating force that the upside in abutting connection with lower chambers 30 of cam utilizes drive motor to provide is come mobile lower chambers 30.Lower chambers makes upper chamber and lower chambers relative to each other suitably aim at along X, Y direction and rotation direction with respect to moving of upper chamber.
Though not shown, this adhesion equipment can also comprise and is used for supercharging device that substrate is promoted towards each other.Can use mechanical hook-up directly to promote substrate, perhaps can utilize gaseous tension to exert pressure.If using gases pressure, then supercharging device can comprise and is used to supply such as the gas tank and the air supply pipe of the inert gas of nitrogen and is used for gaseous emission to the gas boosting hole of adhering in the space.
In this embodiment, bolster 60 comprises compression helical spring.In alternative embodiment, bolster can be leaf spring, air spring and other similar elastic component.With reference to Fig. 2 bolster 60 is described in more detail.
With reference to Fig. 2, bolster 60 is provided with the elastic body 62 with predetermined elastic force.Upper frame 61 is arranged on an end place of elastic body 62, thereby upper frame can contact the lower end of upper chamber 20.Underframe 63 is arranged on the other end place of elastic body 62, and contacts with the upper end of lower chambers 30.
As shown in the figure, in this embodiment, bolster 60 is installed in the periphery place of lower chambers 30.The underframe 63 of bolster 60 is fixed in lower chambers 30.When upper chamber and lower chambers lumped together, upper frame 61 was in abutting connection with the downside of upper chamber 20.Preferably, a plurality of bolsters 60 center on the periphery of lower chambers 30 and are provided with, so that provide uniform anchorage force between upper chamber 20 and lower chambers 30.
Adhere to the space by vacuum exhaust when being formed between upper chamber 20 and the lower chambers 30, and then lower chambers 30 is because vacuum power and when upwards being drawn, elastic body 62 deforms.Elastomeric distortion helps the power of disperseing vacuum to produce, and and then reduces the distortion of upper chamber and lower chambers.Elastic body 62 can be by making such as the metal material of heat-treated steel, phosphor bronze, nickel alloy etc.
Compression helical spring shown in Figure 2 is by making such as the metal material of round steel (round bar), square steel etc., and reeled spirally.In alternative embodiment, the leaf spring with a plurality of flat boards of being made by spring steel can be stacked, to form elastic body.In another embodiment, the air spring that comprises corrugated tube shape (bellows-like) container that wherein is injected with air can be used as elastic body.
Fig. 3 A to Fig. 3 C shows each step of the process of being undertaken by the equipment that is used for attaching substrates.Shown in Fig. 3 A is that upper substrate S1 and infrabasal plate S2 have been installed on upper chamber and the lower chambers.Shown in Fig. 3 B is that lower chambers 30 is adhered to the space by lifting upwards to form sealing.Shown in Fig. 3 C is to adhere to the equipment of space after being attached to each other together by vacuum exhaust and then upper substrate S1 and infrabasal plate S2.
With reference to Fig. 3 A to Fig. 3 C, in the beginning of this process,, lower chambers 30 is moved down for substrate is inserted in the adhesion equipment, make lower chambers and upper chamber 20 separate maximum distance, and open the door 11 of outside framework 10.By the door of opening 11, transfer robot is transported to upper substrate S1 the inside of adhesion equipment.Upper substrate S1 is kept by mechanical arm.After upper substrate S1 was transported to inside, the substrate of upper chamber 20 received pin 22 vacuum suction upper substrate S1 to keep upper substrate S1.Then, the substrate that keeps upper substrate S1 is received pin 22 upwards liftings, so that upper substrate S1 is located in the upper chamber 20.At this moment, the upper chuck 21 of upper chamber 20 will apply confining force on upper substrate S1.
In case upper substrate S1 is kept by upper chamber 20, the mechanical arm of transfer robot just shifts out from adhesion equipment, and transfer robot is transported to infrabasal plate S2 the inside of adhesion equipment.Infrabasal plate S2 is kept by mechanical arm.The substrate reception pin 22 of lower chambers 30 is made progress lifting with reception infrabasal plate S2, and the mechanical arm of transfer robot shifts out from adhesion equipment.Then, substrate receives pin 22 and moves down, so that infrabasal plate S2 is located on the lower chambers 30.At this moment, the lower chuck 31 of lower chambers 30 will apply confining force on infrabasal plate S2, and close the door 11 of outside framework 10.
After this, by Lift Part 40 lifting lower chambers 30 upwards, and lower chambers is connected in upper chamber 20 adheres to the space to form sealing.When upper chamber 20 is connected with lower chambers 30, the impact between bolster 60 buffering upper chamber 20 and the lower chambers 30, and and then minimizing upper chamber and lower chambers upper substrate S1 that may cause when lumping together and any the rocking on the infrabasal plate S2.At this moment, upper substrate S1 and infrabasal plate S2 are located adjacent one another, shown in Fig. 3 B.
Then, shown in Fig. 3 C, first vacuum pump 51 is discharged to the outside with air from adhering to the space, is in vacuum state to keep the adhering to space.At this moment, bolster 60 provides elastic force between upper chamber 20 and lower chambers 30, and this elastic force overcomes the power that puts on lower chambers 30 owing to vacuum state.Therefore, can prevent that Lift Part 40 from bearing extra power owing to the caused power of vacuum state on the direction that makes progress.
Then, video camera 23 detects the alignment mark of upper substrate S1 and infrabasal plate S2, to determine the alignment of substrate.If the alignment of substrate is not good enough, then alignment device 34 moves lower chambers 30, makes upper substrate S1 and infrabasal plate S2 suitably aim at.
In case the alignment of substrate is good, then remove the electrostatic force of the upper chuck 21 that keeps upper substrate S1, thereby upper substrate S1 drops on the infrabasal plate S2.At this moment, upper substrate S1 and infrabasal plate S2 tentatively adhere to by sealant.Then, can substrate be pushed to together, and then upper substrate S1 can be attached to each other more firmly with infrabasal plate S2 and is in the same place by supercharging device.In certain embodiments, in adhering to the space, introduce gas, and by be incorporated into adhere to the gas in the space and be present in upper substrate and infrabasal plate between the space in vacuum state between pressure differential, upper substrate S1 and infrabasal plate S2 are pushed to together.
Then, lower chambers 30 moves down, thereby lower chambers is separated with upper chamber 20.At this moment, bolster 60 utilizes less energy and makes upper chamber 20 and lower chambers 30 separately.Then, open the door 11 of outside framework 10, and transfer robot catches the substrate after adhering to, and they are shifted out from chamber.
Though the foregoing description has by upwards lifting and the lower chambers 30 that reduces downwards of Lift Part 40, in alternative embodiment, upper chamber 20 can be moved up and down by Lift Part 40, and perhaps upper chamber 20 and lower chambers 30 boths can move up and down.
Fig. 4 shows the sectional view of another embodiment of the equipment that is used for attaching substrates.This embodiment and the foregoing description are closely similar.Therefore, no longer same parts is described.
With reference to Fig. 4, in this embodiment, a plurality of jacking gears 400 provide lifting power and anchorage force to lower chambers 300.This embodiment also comprises a plurality of stationary installations 600 that are connected in jacking gear 400.Stationary installation can be utilized magnetic force and be connected in framework 100 alternatively, to increase the lower chambers anchorage force of jacking gear 400.
Fig. 5 A shows the structure of an embodiment of stationary installation 600.Fig. 5 B shows and how stationary installation is installed on the lifting table of Lift Part.Fig. 5 C shows the planimetric map of the magnetic part that is attached to outside framework of stationary installation.
With reference to Fig. 5 A to Fig. 5 C, stationary installation 600 comprises magnetic part 610, and this magnetic part utilizes magnetic force to be attached to outside framework 100.Mobile device 620 moves magnetic part 610.And stationary installation 600 may further include the power supply part 630 (referring to Fig. 5 A) that is used for magnetropism parts 610 supply electric power.This stationary installation 600 can be installed in the lifting table 430 of jacking gear 400, shown in Fig. 5 B.
Replacedly, mobile device 620 can be a spring.When mobile device 620 was spring, mobile device 620 only was used for along the direction pulling magnetic part 610 away from outside framework 100.When magnetropism parts 610 supply of current, because magnetic force is greater than spring force, so magnetic part 610 will be attached to himself outside framework 100 automatically.When cut-out was supplied to the electric current of magnetic part 610, magnetic force was removed, and magnetic part 610 automatically returns to lifting table 430 under the promotion of spring.Therefore, can utilize spring with low cost structure mobile device 620.
Below, description is provided with the operation of the substrate attachment equipment of stationary installation 600.Fig. 6 shows and utilizes magnetic force the magnetic part of a plurality of stationary installations to be attached to the embodiment of outside framework.
When substrate attachment equipment be mounted with substrate and lower chambers by lifting when engaging with upper chamber, then carry out the aligning of substrate.When alignment procedures finished, the magnetic part 610 of stationary installation 600 utilized mobile device 620 and reaches outside the lifting table 430, made magnetic part contact outside framework 100.If magnetic part 610 closely contacts with outside framework 100, then, make magnetic part 610 be fixedly connected to outside framework 100 by polarity by power supply part 630 magnetropism parts 610 supply electric power.Because outside framework 100 is rigid bodies, thus the lower chambers anchorage force increase owing to lifting table is connected in outside framework 100, as shown in Figure 6.After this, first vacuum pump 510 is discharged the air that adheres in the space to form vacuum state.In certain embodiments, make the process adhere to the space and become vacuum state before carrying out alignment procedures, to carry out.Thereby in certain embodiments, before carrying out alignment procedures, stationary installation can engage with outside framework.
At the above-mentioned equipment that is used for attaching substrates, owing between upper chamber and lower chambers, be provided with bolster, so reduced the load that acts on when vacuum exhaust is carried out in the space on the stationary installation adhering to.Therefore, can reduce the power on the framework that acts on lifting screw and support chamber, thereby prolong the serviceable life of adhesion equipment, and reduce the trouble of frequent replacing parts.
And, by utilizing one or more stationary installations Lift Part is connected in outside framework, can increase the lower chambers anchorage force of Lift Part.As a result, lower chambers is fixed with being stabilized, and then can reduce the defective in the substrate attachment process.
In this manual, any argumentation for " embodiment ", " embodiment ", " exemplary embodiment " etc. means that all described in conjunction with the embodiments concrete feature, structure or characteristic comprise at least one embodiment of the present invention.Each local these terms that occur needn't all relate to same embodiment in this instructions.In addition, when describing concrete feature, structure or characteristic, be pointed out that in those skilled in the art's limit of power, can realize these features, structure or characteristic in conjunction with other embodiment in conjunction with arbitrary embodiment.
Although described a plurality of exemplary embodiments, should be appreciated that those skilled in the art it is contemplated that out multiple other modification and embodiment, these modification and embodiment will drop in spirit of the present disclosure and the principle scope.More particularly, can carry out various changes and modification to parts and/or layout, these change and modification will drop in the scope of the disclosure, accompanying drawing and claims.Except change and modification that parts and/or layout are carried out, replace that to use also be obviously for a person skilled in the art.
Claims (21)
1. equipment that is used for attaching substrates, described equipment comprises:
Main frame;
Upper chamber is installed on the described main frame, and described upper chamber keeps upper substrate;
Lower chambers is installed on the described main frame, and described lower chambers keeps infrabasal plate, and wherein, at least one chamber in described upper chamber and the described lower chambers can move, and adheres to the space thereby described upper chamber and described lower chambers can lump together to form sealing; And
Bolster is arranged between described upper chamber and the described lower chambers, and wherein, described bolster provides elastic force, and described elastic force is easy to make described upper chamber and described lower chambers to keep separately.
2. equipment according to claim 1, wherein, when described upper chamber with described lower chambers is joined together and described sealing when adhering to the space and being evacuated, described bolster overcomes by the atmosphere of described device external and described sealing and adheres to the power that pressure differential produced between the vacuum in the space.
3. equipment according to claim 1, wherein, described bolster is arranged on the periphery place of described upper chamber and described lower chambers.
4. equipment according to claim 1, wherein, described bolster comprises:
Upper frame;
Underframe; And
Elastic body is installed between described upper frame and the described underframe.
5. equipment according to claim 4, wherein, at least one chamber in described upper chamber and described lower chambers of at least one frame fixation in described upper frame and the described underframe.
6. equipment according to claim 5, wherein, at least one chamber in described upper chamber and the described lower chambers is provided with the groove that is used for installing therein described bolster.
7. equipment according to claim 1, wherein, described bolster is a kind of in compression helical spring, leaf spring and the air spring.
8. equipment according to claim 1, wherein, the periphery that centers at least one chamber in described upper chamber and the described lower chambers is equipped with a plurality of bolsters.
9. equipment according to claim 1 further comprises at least one stationary installation, and described at least one stationary installation optionally is connected in described main frame with at least one chamber in described upper chamber and the described lower chambers.
10. equipment according to claim 9, wherein, described at least one stationary installation comprises magnetic part, described magnetic part can optionally be connected in described main frame by magnetic force.
11. equipment according to claim 10, wherein, described magnetic part comprises electromagnet.
12. equipment according to claim 11, wherein, described at least one stationary installation further comprises power supply part, and described power supply part optionally applies electric power to described electromagnet.
13. equipment according to claim 10, wherein, described at least one stationary installation further comprises moving-member, and described moving-member optionally moves described magnetic part and makes it to engage with described main frame or separate.
14. equipment according to claim 13, wherein, described moving-member comprises spring, and described spring provides and is easy to spur described magnetic part and makes it the elastic force of separating with described main frame.
15. equipment according to claim 9 further comprises mobile device, described mobile device moves up and down described lower chambers in described main frame, and wherein, described at least one stationary installation is connected in the moving-member of described mobile device.
16. an equipment that is used for attaching substrates, described equipment comprises:
Main frame;
Upper chamber is installed on the described main frame, and described upper chamber keeps upper substrate;
Lower chambers is installed on the described main frame, and described lower chambers keeps infrabasal plate;
Mobile device moves at least one chamber in described upper chamber and the described lower chambers, adheres to the space thereby described upper chamber and described lower chambers can lump together to form sealing between described upper chamber and described lower chambers; And
At least one stationary installation is attached to the movable part of described mobile device, and wherein, described at least one stationary installation optionally is connected in described main frame with the described movable part of described mobile device.
17. equipment according to claim 16, wherein, described at least one stationary installation comprises magnetic part, and described magnetic part can optionally be connected in described main frame by magnetic force.
18. equipment according to claim 17, wherein, described magnetic part comprises electromagnet.
19. equipment according to claim 18, wherein, described at least one stationary installation further comprises power supply part, and described power supply part optionally applies electric power to described electromagnet.
20. equipment according to claim 17, wherein, described at least one stationary installation further comprises moving-member, and described moving-member optionally moves described magnetic part and makes it to engage with described main frame or separate.
21. equipment according to claim 20, wherein, described moving-member comprises spring, and described spring provides and is easy to spur described magnetic part and makes it the elastic force of separating with described main frame.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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KR1020060118841 | 2006-11-29 | ||
KR1020060118841A KR101395821B1 (en) | 2006-11-29 | 2006-11-29 | Apparatus for joining of substrate |
KR1020060125005 | 2006-12-08 |
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CN101191937A true CN101191937A (en) | 2008-06-04 |
CN100562784C CN100562784C (en) | 2009-11-25 |
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CNB2007101820370A Expired - Fee Related CN100562784C (en) | 2006-11-29 | 2007-10-24 | The equipment that is used for attaching substrates |
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KR (1) | KR101395821B1 (en) |
CN (1) | CN100562784C (en) |
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CN103426774A (en) * | 2012-05-23 | 2013-12-04 | 乐金显示有限公司 | Substrate-bonding apparatus for display device and method for manufacturing bonded substrate |
CN104183468A (en) * | 2013-05-24 | 2014-12-03 | 乐金显示有限公司 | Carrier substrate separating system and method |
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US11829077B2 (en) | 2020-12-11 | 2023-11-28 | Kla Corporation | System and method for determining post bonding overlay |
US11782411B2 (en) | 2021-07-28 | 2023-10-10 | Kla Corporation | System and method for mitigating overlay distortion patterns caused by a wafer bonding tool |
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---|---|---|---|---|
JPH1140492A (en) * | 1997-07-18 | 1999-02-12 | Dainippon Screen Mfg Co Ltd | Wafer treating device |
KR20030021493A (en) * | 2001-09-06 | 2003-03-15 | 삼성전자주식회사 | Wafer treatment apparatus having lift pin and apparatus for manufacturing semiconductor device including the same |
KR100550803B1 (en) * | 2004-06-17 | 2006-02-09 | 주식회사 에이디피엔지니어링 | Plasma etcher |
-
2006
- 2006-11-29 KR KR1020060118841A patent/KR101395821B1/en not_active IP Right Cessation
-
2007
- 2007-10-24 CN CNB2007101820370A patent/CN100562784C/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102386118A (en) * | 2010-09-02 | 2012-03-21 | 丽佳达普株式会社 | Substrate binding apparatus and substrate binding method |
CN102386118B (en) * | 2010-09-02 | 2016-03-23 | 丽佳达普株式会社 | Substrate bonding apparatus and base plate bonding method |
CN103426774A (en) * | 2012-05-23 | 2013-12-04 | 乐金显示有限公司 | Substrate-bonding apparatus for display device and method for manufacturing bonded substrate |
CN104183468A (en) * | 2013-05-24 | 2014-12-03 | 乐金显示有限公司 | Carrier substrate separating system and method |
Also Published As
Publication number | Publication date |
---|---|
KR20080048637A (en) | 2008-06-03 |
CN100562784C (en) | 2009-11-25 |
KR101395821B1 (en) | 2014-05-16 |
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